歯칩저항자료(안내용)

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1 (Chip Resistor)

2 HISTORY - - Fixed Thick Film Resistor - System

3 ,,. ( ) RuO2 Supptering NiCr Carbon,,,,TCR HIGH POWER, TCR, Volumn chip

4 - (ohm's law) R = 1 1 = 1 + R1 R2 R = R1 + R2 = = 5 I = V R = 10/5 = 2 A V1 = 2A X 2= 4V V2 = 2A X 3= 6V - R(resistor), L(inductor), C(capacitor) ( test < 200MHz) L, C. R. Block.. R1 = 10/2 = 5A - JUMPER 0ohmJUMPER. JUMP.

PROCESS Al 2O 3 substrate For high insulation [ Conductor printing & firing ] Top & bottom conductor For high conductivity [ 2nd Glass/MK printing & firing ] To protect trimmed resistor, and to

6 PROCESS Al 2O 3 substrate For high insulation [ Conductor printing & firing ] Top & bottom conductor For high conductivity [ 2nd Glass/MK printing & firing ] To protect trimmed resistor, and to certify resistance value [ Termination printing & firing ] [ Resistor printing & firing ] Resistor blending, controll thickness [ Glass printing & firing ] To connect top and bottom conductor [ Plating (1st Ni, 2nd Sn or Sn-pb) ] To prevent worse solderability caused by oxidaton To protect resistor against trimming laser [ Taping ] [ Laser trimming ] Trimming the resistor for accurate resistance value For SMD (Surface Mounting Devices)

Chip Resistor () RESISTOR FOR General purpose Precision Low ohms Trimmable chip Array Array-precision Packaging Standard Resistance Value INTRODUCTION Thick Film Chip Resistor is general passive

7 Chip Resistor () RESISTOR FOR General purpose Precision Low ohms Trimmable chip Array Array-precision Packaging Standard Resistance Value INTRODUCTION Thick Film Chip Resistor is general passive component which is useful for derating voltage, current controlling in circuit. Surface Mounting is available. Production is increasing with demand for small size & light weight of Set product. We provide Ultra-small, High-Reliability, High-stability Resistors. APPLICATION Operating notes Example of land pattern design Recommended soldering About production process TECHNOLOGY TREND Pb-free GENERAL FEATURES - Very small, thin, and light weight. - Suitable size and packaging for surface mount assembly. - Both flow and reflow soldering are applicable. APPLICATIONS - Home Appliances (DVD, Digital TV, CAMCODER, VTR, Digital Camera, Audio,Tunner) - Computers & Cummunications (PC, Memory Module, Mobile, Network Equiment, TCXO, etc) SPECIFICATION

8 RN / RP RN type (Through-hole) RP type (Dipping). T. T W W Dimension L L W T L L W T 104P P P P / dipping / -. - (850)2 dipping type Soldering.

9 Array / Network Array Network - ICBoard, / / -, 1-1 Mounting - - (ex) 1608 X 4164P X 1 -

10 (Nominal Resistance Value). (Critical Resistance Value) (Working Temperature) 1608, 2012, 3216 : -55 ~ 155 : -55 ~ 125 (Rated Ambient Temperature).( 70),. (Maximum Working Voltage) ( ).,. (Maximum Overload Voltage) ( ). 2. (Dielectric Withstanding Voltage) body1.( ) (T.C.R. - Temperature Coefficient of Resistance), 1. () (Rated Power or Power Rating). W1/16, 1/10, 1/8, 1/4, 1/2, 1. (Rated Voltage) ( ).. = (W) ( Ω) (Power Derating Curve)..

11 MARKING Chip-R Marking - KS / JIS / IEC (,) - Marking: 3, 4 marking, code marking Marking Flow Marking system ( IEC, JIS, KS ) - / E, E3, E6, E12, E24, E48, E96, E192. n/24 ) E24 : 10 n = 1~24 E24, E96 series. Code Marking - 2 : E24 ( -, -10) ) C2 = C(1.2) X 10 2 = : E96 ( -, -10) ) 51B = 332 X 10 1 = 3320 = 3.32 Marking - 3 marking : 103 = 10 X 10 3 = = 10 R22 = marking : 5621 = 562 X 10 1 = 5620 = R48 = 3.48 Marking ~6432, array 3 X X O O 4 X X X O

IEC code system 1) 1 10. 2). 3)?. E-24, E-96 series 1) E-24 series 10.45 10.

153 154 155 16 1R6 160 161 162 163 164 165 18 1R8 180 181 182 183 184 185 20 2R0 200 201 202 203 204 205 22 2R2 220 221 222 223 224 225 24 2R4 240 241 242 243 244 245 27 2R7 270 271 272 273 274 275

12 IEC code system 1) ). 3)?. E-24, E-96 series 1) E-24 series ) E-96 series E-24 series Table R R R R R R R R R R R R R R R R R R R R R R R R R

Standard Resistance Value Tolerance code table Tolerance code D F G J K M IEC-code system E-192 E-96 E-48 E-24 E-12 E-6 Digit number 4 digit 3 digit Specification ±0.

13 Standard Resistance Value Tolerance code table Tolerance code D F G J K M IEC-code system E-192 E-96 E-48 E-24 E-12 E-6 Digit number 4 digit 3 digit Specification ±0.5% ±1% ±2% ±5% ±10% ±20% Significant figure of resistance value E-192 E-96 E-48 E-24 E-192 E-96 E-48 E-24 E-192 E-96 E-48 E24 E-192 E-96 E-48 E Example

14 Reel dimensions Packaging table

15 Technical trends SET 1. SET (SMD CHIP ) 2. ( CHIP, CHIP ) 3. (CHIP, CHIP ) ex) "F" "J" CHIP 1. SET, USER 2. (Pb ) LEAD FREE, (POLYMER) GLASS (1 ), (2 ), R PASTE (3 ) 3. SMT (CHIP ) Pattern, GLASS PASTE, Carrier tape 4. CHIP () (,, GAS, NOISE )

16 Technical trends υ υ υ 0603 (0201in) 1005 (0402in) 1608 (0603in) υ υ υ Sn/Pb Plating υ υ Sn 100% Plating υ υ

17 Technical trends

18 ROAD MAP ITEM ~ Miniaturization 0402 (RC1005) 0201 (RC0603) Ultra high ohms 10M ohm 1G ohm Multiple & Complex 0402X4pcs R array 0402X4pcs 5% 0402X4pcs 1% 0201 X 4pcs Parallel Network Low Noise RC series All type Pb-Free All type Done

19 World wide logistics Full process Taping process & Warehouse HUNGARY 1005 : : 1, : : 150 : 0 N/W : 0 Total : 2,380 World Wide CAPA (Mpcs/month) Chip Resistor Taping Capa Bulk Capa Korea TIAN JIN THAI KOREA PHILIPPINE MEXICO Philippine 3,200 3,600 Tian jin (China) 2,000 2,400 Mexico : : 2, : : 90 : 30 N/W : 130 Total : 3,620 Thai Hungary Total 6,000 6,000

20 Pb-free Pb-free - (Pb) Marketing ( : 2001 Recycle) - Pb-free solder (Sn/Pb Sn ) Pb-free (Sn/Pb) Pb-free(Sn) Solder Soldering ( reflow ) 185 (Sn63/Pb37) 220 (Sn/Ag/Cu ) Soldering (230) (240) peak 5 peak 30 Pb-free 1. Pb-free T/F: ' Pb-free : ' SONY (CR, MLCC) : ' Pb-free line Setup (SEMPHIL) : ' ( ) 5. Pb-free (4/, CR ) : ' Pb-free 1. / - Delphi : - Motorola : Ericsson : % - Siemens : Philips : NEC : Sanyo : Sharp : Hitachi : Fujitsu : Mastushita : Mitsubishi : 20023Pb-free solder [ soldering] [Pb-free soldering]

21 Reliability Test NO TEST ITEM TEST CONDITON CYCLE (months) 1 Vibration 2 Bending Strength Termination Strength Resistance To Soldering Heat High Temperature Storage Low Temperature Storage Temperature Cycle 8 Load Life 9 Humidity Load Short-time Over Load Intermittent Over Load 12 T. C. R 13 Solderability 14 V. C. R 15 Withstanding Voltage 16 NOISE 17 Insulation Resistance 18 Body Strength 19 Leaching Frequency : 10 ~ 55 ~ 10Hz Amplitude : 1.5 Frequency : 1oct/min Time : 2hr each of 3axis Bending force : 3 Time : 10sec Force: 2012,3216,3225 = more then ,1608,RC164P= more then 0.3 Temp.: 2605 Time : 101sec. solder: H63A(JIS Z 3282) / S63A(KSD 6704) Flux: rosin 25% + methanol 75% Temp.: 1252 Time : 1000Hr Temp.: -552 Time : 1000Hr Temp.: -55(30min)20(15min) 125(30min)20(15min) Cycle: 5 Temp.: 703 Load : Rate voltage (on for 90min and off for 30mim) Time : 1000Hr Temp.: 403 Humi.: 90~95%RH Load : Rate voltage (ON for 90min and OFF for 30mim) Time : 1000Hr Load : 2.5 times of the rate voltage Time : 5sec. Load : 2.5 times of the rate voltage Time : ON for 1sec and OFF for 25sec Cycle: 10,000 cycle Temp.: Time : 30min Computation : TCR( PPM /) = R - Ro 1 X X10 6 Ro T To Hear,R =resistance value for -55or 125 Ro=resistance value for 20 T =-55or 125 To= 20 Temp.: 2355 Time : 20.5sec solder: H63A(JIS Z 3282) / S63A(KSD 6704) Flux: rosin 25% + methanol 75% Apply Voltage: 1/10times of Rate voltage(v2) Rate voltage(v1) Computation : R1 R 2 1 Vc( PPM / V ) = X X 10 6 R 2 V 1 V 2 Hear, R1=resistance value for V1() R2=resistance value for V2() Apply Voltage : - AC 500V for more then 2012 size - AC 100V for low then 1608 size Time : 1min Apply Voltage : - AC 500V for more then 2012 size - AC 100V for low then 1608 size Time : 1min Measurement pressure : N Compress speed: 100mm/min Temp.: 2605 Time : 301sec. solder: H63A(JIS Z 3282) / S63A(KSD 6704) Flux: rosin 25% + methanol 75% SPL Q'TY (pcs) REFERENCE 6 6 JIS C JIS C (3) 6 6 JIS C (1) 3 6 JIS C JIS C JIS C JIS C JIS C JIS C JIS C JIS C JIS C JIS C EVT MVT EVT MVT EVT MVT EVT MVT EVT MVT EVT MVT 6 SEMCO 50-S-SCR001 JIS C SEMCO 50-S-SCR001 JIS C SEMCO 50-S-SCR001 JIS C SEMCO 50-S-SCR001 JIS C SEMCO 50-S-SCR001 JIS C SEMCO 50-S-SCR001

DC Link Application DC Link capacitor can be universally used for the assembly of low inductance DC buffer circuits and DC filtering, smoothing. They

DC Link Capacitor DC Link Application DC Link capacitor can be universally used for the assembly of low inductance DC buffer circuits and DC filtering, smoothing. They are Metallized polypropylene (SH-type)

歯칩저항자료(안내용)

歯칩저항자료(안내용)