The 11th Korea Test Conference June 29, 2010 TEL : (02) 313-3705 / FAX : (02) 363-8389 E-mail : info@koreatest.or.kr http://www.koreatest.or.kr
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06 _ The 11th korea Test Conference The 11th korea Test Conference _ 07 Tutorial 1 3D IC design and challenges A Memory Test(1) B Test Industry(1) C Reliability(1) D ATE Hardware & Software Massively Parallel Testing E Memory Test(2) F Test Industry(2) G Reliability(2) H Production Test Semiconductor for Society, Tester for Safety Tutorial 2 Tutorial 3 Mixed-signal IC component testing, DFT, relia bility and and BIST: its trend Trends and Principles I Memory Test(3) J SOC Design & Test(1) Mixed-signal IC component testing, DFT, relia bility and and BIST: its trend Trends and Principles M Memory Test(4) N SOC Design & Test(2) K Test Cost & Efficiency(1) O Test Cost & Efficiency(2) L Mixed Signal and Analog Test(1) P Mixed Signal and Analog Test(2)
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10 _ The 11th korea Test Conference The 11th korea Test Conference _ 11 A. Memory Test(1)
12 _ The 11th korea Test Conference The 11th korea Test Conference _ 13 B. Test Industry(1) C. Reliability(1)
14 _ The 11th korea Test Conference The 11th korea Test Conference _ 15 D. ATE Hardware & Software E. Memory Test(2)
16 _ The 11th korea Test Conference The 11th korea Test Conference _ 17 F. Test Industry(2) G. Reliability(2)
18 _ The 11th korea Test Conference The 11th korea Test Conference _ 19 H. Production Test I. Memory Test(3)
20 _ The 11th korea Test Conference The 11th korea Test Conference _ 21 J. SOC Design & Test(1) K. Test Cost & Efficiency
22 _ The 11th korea Test Conference The 11th korea Test Conference _ 23 L. Mixed Signal and Analog Test(1) M. Memory Test(4)
24 _ The 11th korea Test Conference The 11th korea Test Conference _ 25 N. SOC Design & Test(2) O. Test Cost & Efficiency(2)
26 _ The 11th korea Test Conference The 11th korea Test Conference _ 27 P. Mixed Signal and Analog Test(2)
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