2016 SEC X-ray Catalog

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1 X-ray Inspection Systems 2D AXI / 3D AXI / WAXI

반도체 / SMT 분석장비 X-eye SF160 Series 반도체 SMT 및전자 / 전기부품검사를위한비파괴분석설비 Micro-Open Tube 탑재하여반영구적사용가능 Dual CT 기능으로최상의 CT

8 µm Table Size AXIS CT Scan 방식 460 X 510 mm (option 550 X 650 mm) X, Y, Z, Tilt (70º), R, Y-aft, Cone beam R 1.

전기부품검사를위한비파괴분석설비 SMT 및전자 / 전기부품의양산검사지원 S/W 탑재가능 다양한편의기능으로쉬운사용 X-ray Tube 100 kv / 200 µa (option 130 kv / 200 µa)

2 반도체 / SMT 분석장비 X-eye SF160 Series 반도체 SMT 및전자 / 전기부품검사를위한비파괴분석설비 Micro-Open Tube 탑재하여반영구적사용가능 Dual CT 기능으로최상의 CT 이미지구현 / 고속스캔지원 X-ray Tube 160 kv / 200 µa (option 160 kv / 500 µa) Min. Resolution 0.8 µm Table Size AXIS CT Scan 방식 460 X 510 mm (option 550 X 650 mm) X, Y, Z, Tilt (70º), R, Y-aft, Cone beam R 1.6 M Pixel FPD Oblique CT / Cone beam CT 1,340(W) x 1,950(D) x 1,630(H)mm / 2,000kg X-eye 5100 Series 반도체 SMT 및전자 / 전기부품검사를위한비파괴분석설비 SMT 및전자 / 전기부품의양산검사지원 S/W 탑재가능 다양한편의기능으로쉬운사용 X-ray Tube 100 kv / 200 µa (option 130 kv / 200 µa) Min. Resolution 5 µm Table Size 460 X 340 mm (option 550 X 550 mm) AXIS X, Y, Z, Tilt (±50º) 1.6 M Pixel FPD 1,270(W) x 1,025(D) x 1,460(H)mm / 900kg 1

3 IMAGE GALLERY BGA Cold Solder Stacked Die QFP Camera Module 2

AXI Auto X-ray Inspection X-eye 6300 3D AXI 고속 3D In-Line 검사설비 (~4.

8 ~ 15 µm Table Size Min : 50 x 50 (mm), Max : 330 x 250 (mm) 10 M Pixel FPD 검사대상 검사항목 BGA, Through Hole, BGA, Chip, QFN, QFP BGA Short,

등다양한불량검사기능 Wire 불량검사기능 ( 단락, 휨, 미삽, 오삽등 ) X-ray Tube Min. Resolution 0.

4 AXI Auto X-ray Inspection X-eye D AXI 고속 3D In-Line 검사설비 (~4.3 sec/fov) 양면 PCB 의상태를검사하기위한최고의 Solution BGA, Chip 부품, 납충등의다양한불량검사가능 X-ray Tube 160 kv / 500 µa Min. Resolution 0.8 ~ 15 µm Table Size Min : 50 x 50 (mm), Max : 330 x 250 (mm) 10 M Pixel FPD 검사대상 검사항목 BGA, Through Hole, BGA, Chip, QFN, QFP BGA Short, Bridging, Open, De-wet, Void, 홀충진률 1,356(W) x 1,880(D) x 1,695(H)mm / 4,000kg X-eye D AXI / WAXI 고속 2D In-Line 검사설비 BGA, Chip, QFN, QFP 등다양한불량검사기능 Wire 불량검사기능 ( 단락, 휨, 미삽, 오삽등 ) X-ray Tube Min. Resolution 0.8 ~ 15 µm Table Size 검사대상 검사항목 160 kv / 500 µa (option 130 KV / 300 µa) Min : 50 x 50 (mm), Max : 330 x 250 (mm) 1.6 M Pixel FPD BGA, Chip, QFN, QFP, Wire Bonding BGA : Short, Bridging, Void Chip : Manhattan, Miss align, Short Wire Bonding : Sweep, Broken, Double Bonding, Missing 1,000(W) x 1,360(D) x 1,450(H)mm / 2,000kg 3

5 IMAGE GALLERY BGA Void / 3D Inspection Through Hole Filling / 3D Inspection SMT Chip BGA / 2D Inspection Wire Bonding / 2D Inspection 4

AXI Auto X-ray Inspection X-eye NF120 세계최고분해능 Wafer Level Packaging 검사를위한비파괴분석설비 Dual Type 의 CT 지원으로최상의이미지확보 TSV, Micro Bump, Pattern X-ray Tube 120 kv / 200 µa Min.

7M / 10M) Scan 방식 1,800(W) x 2,700(D) x 2,670(H)mm / 6,500kg Oblique CT / Cone beam CT X-eye 6000 POP POP 전용 3D AXI POP 제품전용의 3D In-Line 검사장비 3D CT 기술이적용된 POP 적층면의자동양

6 AXI Auto X-ray Inspection X-eye NF120 세계최고분해능 Wafer Level Packaging 검사를위한비파괴분석설비 Dual Type 의 CT 지원으로최상의이미지확보 TSV, Micro Bump, Pattern X-ray Tube 120 kv / 200 µa Min. Resolution Table Size AXIS 200 nm Max : 300 mm (Ø) Wafer 적용 X, Y, Z, Tilt (70º), R 3.2 M Pixel FPD (Option:6.7M / 10M) Scan 방식 1,800(W) x 2,700(D) x 2,670(H)mm / 6,500kg Oblique CT / Cone beam CT X-eye 6000 POP POP 전용 3D AXI POP 제품전용의 3D In-Line 검사장비 3D CT 기술이적용된 POP 적층면의자동양 / 불판독 검출시간 : Max. 5 sec/unit X-ray Tube 130 kv / 200 µa Min. Resolution 6~15 µm Chip Size 검사항목 8 M Pixel FPD Min : 8 x 6 (mm), Max : 20 x 20 (mm) Non-wet, Open, Short, Big / Small ball 2,300(W) x 2,400(D) x 2,120(H)mm / 4,800kg 5

7 IMAGE GALLERY Wafer Bump Void Wafer TSV Void Cu pillar Bump non wet POP Short non wet 6

High-power 3D X-ray Inspection System X-eye 7000B 대형부품검사를위한비파괴분석설비 대형금속제품 다양한 Power의 X-ray Tube 및 장착가능 제품특성에맞는고선량 X-ray Tube 선택가능 X-ray Tube 160 kv / 3 ma Min.

CT X-eye 7000R 대형금속제품양산형 자동차부품, 마그네슘, 다이캐스팅, 주조물검사용 간편한 Loading / Un Loading 으로전수검사에최적화 Porosity / Crack 자동검사지원 X-ray Tube Min.

8 High-power 3D X-ray Inspection System X-eye 7000B 대형부품검사를위한비파괴분석설비 대형금속제품 다양한 Power의 X-ray Tube 및 장착가능 제품특성에맞는고선량 X-ray Tube 선택가능 X-ray Tube 160 kv / 3 ma Min. Resolution 6 µm Table Size AXIS CT Scan 방식 Max : 600 mm (Ø) X 900L mm X, Y, Z, R, Tilt, Z-t, Z-d 1 M Pixel FPD 2,260(W) x 1,800(D) x 2,000(H) mm / 3,500kg Cone beam CT X-eye 7000R 대형금속제품양산형 자동차부품, 마그네슘, 다이캐스팅, 주조물검사용 간편한 Loading / Un Loading 으로전수검사에최적화 Porosity / Crack 자동검사지원 X-ray Tube Min. Resolution Table Size AXIS CT Scan 방식 160 kv / ma 0.4 mm Max : 400 mm (Ø) X 800L mm X, Y-t, Y-d, Z-t, Z-d, R, Tilt-t, Tilt-d 4.6 M Pixel FPD 2,550(W) x 3,150(D) x 2,450(H) mm / 6,000kg Cone beam CT 7

9 IMAGE GALLERY Wheel Porosity Power Steering Crack Air Intake Manifold Water Pump Porosity 8

High-power 3D X-ray Inspection System X-eye 7000BS 중소형부품검사를위한비파괴분석설비 Open Tube 사용으로고해상도영상획득 중소형제품 연속스캔으로 CT 영상획득가능 ( 약 5 분소요 ) X-ray Tube 160 kv / 1 ma Min.

6 M Pixel FPD 1,840(W) x 1,860(D) x 1,700(H)mm / 2,000kg Cone beam CT X-eye PCT 고선량 CT 전용 석정반베이스에탑재된고정밀구동축제어 제품특성에맞는고선량 X-ray Tube 선택가능 대형제품검사가능 X-ray Tube

10 High-power 3D X-ray Inspection System X-eye 7000BS 중소형부품검사를위한비파괴분석설비 Open Tube 사용으로고해상도영상획득 중소형제품 연속스캔으로 CT 영상획득가능 ( 약 5 분소요 ) X-ray Tube 160 kv / 1 ma Min. Resolution 6 µm Table Size AXIS CT Scan 방식 Max : 300 mm (Ø) X 300L mm X, Y, Z, R, T 1.6 M Pixel FPD 1,840(W) x 1,860(D) x 1,700(H)mm / 2,000kg Cone beam CT X-eye PCT 고선량 CT 전용 석정반베이스에탑재된고정밀구동축제어 제품특성에맞는고선량 X-ray Tube 선택가능 대형제품검사가능 X-ray Tube 225 kv / 3 ma (option 320 kv / 450 kv) Min. Resolution 6 µm (option 0.4 mm) Table Size AXIS CT Scan 방식 Max : 500 mm (Ø) X 1,000L mm X, X-d, Y-t, Y-d, Z, R 4 M Pixel FPD 2,700(W) x 1,800(D) x 2,200(H)mm / 10,000kg Cone beam CT 9

11 IMAGE GALLERY Connector Car Accelerator Plug Coil Die Casting 10

4 M Pixel FPD 750(W) x 830(D) x 1,450(H)mm / 700kg Cycle Time 9초 (Ø180 Reel 기준 ) Counting Accuracy >99.9% Scan Reel Diameter Max.

12 기타 AXI Auto X-ray Inspection X-eye 4000A 검사속도 9 초이내 Chip Counter Chip 및이형부품릴상태수량검사 별도의 Inspection Parameter Setting 없이검사가능 X-ray Tube. 100 kv / 200 µa Min. Resolution 5 µm Table Size 430 x 430 (mm) Z-AXIS Z축 Auto Moving 9.4 M Pixel FPD 750(W) x 830(D) x 1,450(H)mm / 700kg Cycle Time 9초 (Ø180 Reel 기준 ) Counting Accuracy >99.9% Scan Reel Diameter Max. Ø400 X-eye 9000 series 2 차전지전용 이차전지전수검사용 In-Line 검사기 각형, 원형, 파우치형전지내부극판검사 최대 180ppm 검사가능 X-ray Tube. 100 kv / 200 µa Min. Resolution 5 µm 검사능력 구성 120ppm, 150ppm, 180ppm Conveyor / Index / Pick&Place 방식 Loading 1,800(W) x 1,560(D) x 2,070(H)mm / 5,000kg 11

반도체 Packaging 설비 Flip Chip Bonder 고속, 고정밀 Linear Motor 적용 Vision Image UI 최적화 Auto 조명 Controller 적용 설비국산화로유지보수용이 FPC 공급방식 : Reel or

3sec / IC Temperature 30~550 C 30~550 C Bonding Force 10~343N 10~343N Wafer Size Φ6 inch (Φ150 mm) Φ8 inch (Φ200 mm) 2,680(W) x

개별제어 ) 정밀 Tape Indexing (Encoder Feedback) Needle Auto Calibration Auto 조명 Control 다양한모델적용가능 : 2 ~ 20 PF (0.

13 반도체 Packaging 설비 Flip Chip Bonder 고속, 고정밀 Linear Motor 적용 Vision Image UI 최적화 Auto 조명 Controller 적용 설비국산화로유지보수용이 FPC 공급방식 : Reel or Magazine Dispensing 기능 Model FCB-200 FCB-300 Accuracy 2.0 µm (3σ) 1.5 µm (3σ) Cycle Time 1.7sec / IC 1.3sec / IC Temperature 30~550 C 30~550 C Bonding Force 10~343N 10~343N Wafer Size Φ6 inch (Φ150 mm) Φ8 inch (Φ200 mm) 2,680(W) x 1,440(D) x 1,850(H)mm Φ8 inch (Φ200 mm) Φ12 inch (Φ300 mm) 2,894(W) x 1,624(D) x 1,840(H)mm TAB IC Potting System 안정된경화조건 (Heater Zone 개별제어 ) 정밀 Tape Indexing (Encoder Feedback) Needle Auto Calibration Auto 조명 Control 다양한모델적용가능 : 2 ~ 20 PF (0.5 PF 단위 ) 대상 Tape Tape 두께 Chip Size Chip 두께 Tape 재질 35 mm, 48 mm, 70 mm (Super, Wide) mm mm (TCP, COF) 1 x 1 to 20 x 20 mm mm Polyimide REEL 외경 Max. TAB Reel Ø620 (Spacer Reel Ø530) 12

14 기하학적선명도에대한이해 (Focal Spot) < 1 μm JIMA Small Focus > < 4 μm JIMA Large Focus > < Small Spot > < BGA / Small Focal Spot > < Large Spot > < BGA / Large Focal Spot> CT 시스템소개 < Cone beam CT > < Oblique CT > Rotation Center Rotation Center X-ray Source X-ray Source 대면적시료고배율촬영불가능 대면적시료고배율촬영가능 13

회사소개 최고를추구하며정도와신의를지킨다 Superior Service Exciting Challenge 회사명연혁소재지생산품

X-ray 국내시장점유율 1 위 세계최고분해능 X-ray 발생장치개발및제조 세계최고정밀 Flip Chip Bonder

Australia * Hungary * France * Italy * Spain * Mexico * Brazil * China

15 회사소개 최고를추구하며정도와신의를지킨다 Superior Service Exciting Challenge 회사명연혁소재지생산품 쎄크 1991년 3월쎄크엔지니어링창립 2000년 쎄크법인전환경기도수원시산업용 X-ray 검사기, Mini-SEM, FCB X-ray 국내시장점유율 1 위 세계최고분해능 X-ray 발생장치개발및제조 세계최고정밀 Flip Chip Bonder 개발및제조 해외주요대리점현황 * Korea * Japan * Vietnam * Philippine * India * Australia * Hungary * France * Italy * Spain * Mexico * Brazil * China * Malaysia * Russia * Germany * Canada * Taiwan * Indonesia * Israel * U.K * U.S 14

Vertical Probe Card Technology Pin Technology 1) Probe Pin Testable Pitch:03 (Matrix) Minimum Pin Length:2.67 High Speed Test Application:Test Socket

Vertical Probe Card for Wafer Test Vertical Probe Card Technology Pin Technology 1) Probe Pin Testable Pitch:03 (Matrix) Minimum Pin Length:2.67 High Speed Test Application:Test Socket Life Time: 500000