슬라이드 1

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1 WONIL IM WHITE LED SPECIFICATION Version of 1.0 PAGE : 1/ WHITE LED MODEL : WL-WA11B C U S T O M E R Approved by Approved by Approved by S U P P L I E R Drawn by Checked by Approved by 원일아이엠경기도시흥시정왕동 Tel : Fax :

2 WONIL IM WHITE LED SPECIFICATION Version of 1.0 PAGE : 2/16 - CONTENTS - 1. 개정이력 2. 제품특징 3. Package 외형치수및 Solder 패턴 4. 절대최대정격 5. 전기적 / 광학적특성 6. Ranks 7. 전기적 / 광학적특성그래프 8. 신뢰성 9. 구성재료 10. 포장사양 11. 품명정보 12. 사용시권장사항및주의사항

3 WONIL IM WHITE LED SPECIFICATION Version of 1.0 PAGE : 3/16 1. 개정이력 제목 문서번호 승인규격 WL-WA11B-0.3W Rev. No. 날짜개정내용요약비고 Ver 최초개정

4 WONIL IM WHITE LED SPECIFICATION Version of 1.0 PAGE : 4/16 2. 제품특징 Package 종류 : SMD Top View type ( 1 Chip 구조 ) Package 크기 : 5.4 ⅹ 5.0 ⅹ 1.6 mm ( L ⅹW ⅹH ) 넓은광지향각 ( 120 o ) InGaN 기반의 LED chip 사용 3. Package 외형치수및 Solder 패턴 Package 외형 회로구성도 Anode Solder Pad Cathode

5 WONIL IM WHITE LED SPECIFICATION Version of 1.0 PAGE : 5/16 4. 절대최대정격 ( Ta=25 o C ) Item Symbol Value Unit Forward current ( 순방향전류 ) I F 80 ma Peak Forward Current 1) ( 펄스구동시전류 ) I FP 200 ma Reverse voltage ( 역방향전압 ) V R 5 V Power dissipation ( 소비전력 ) P D 240 mw Operating temperature( 동작주변온도 ) T opr -30 to +85 o C Storage temperature( 보관온도 ) T stg -40 to +100 o C 1) Duty ratio(on / off 시간비 ) 1/10, Pulse Width( 펄스폭 ) 10msec 조건하에서가능한최대전류 5. 전기적 / 광학적특성 ( Ta 3) =25 o C ) Parameter Symbol Condition Min Typ. Max Unit Forward Voltage ( 순방향전압 ) Reverse Current ( 역방향전류 ) Wavelength ( 파장영역 ) V F I F =60mA V I R V R =5V μa W L I F =60mA nm Luminous Intensity ( 광도 ) 2) I V I F =60mA mcd 2) Luminous intensity 는 light sensor 및 filter 를사용하여 CIE eye-response curve 에따라측정됨. 3) Ta : 주변온도

6 WONIL IM WHITE LED SPECIFICATION Version of 1.0 PAGE : 6/16 6. Ranks (1) Intensity Ranks ( 광도 Rank Table ) I V Rank Condition Min Typ. Max Unit A 4,000-5,000 B 5,000-6,000 C I F = 60mA 6,000-7,000 mcd D 7,000-8,000 E 8,000-9,000 Measurement Uncertainty of the Luminous Intensity ( 광도측정허용오차 ) : ± 10% (2) Forward voltage Ranks ( 순방향전압 Rank Table ) V F Rank Condition Min Typ. Max Unit A B C I F = 60mA D V E F Measurement Uncertainty of the Forward Voltage ( 측정허용오차 ) : ± 0.05V

7 WONIL IM WHITE LED SPECIFICATION Version of 1.0 PAGE : 7/16 (3) Chromaticity Coordinates ranks ( 색좌표 Rank Table) : IF = 80mA C W Rank 150 Rank Rank Rank > ~ ~ ~ P W Rank 7080 Rank 6570 Rank 6065 Rank 5560 Rank ~ ~ ~ ~ ~ N W Rank 4550 Rank 4245 Rank 4042 Rank 3840 Rank ~ ~ ~ ~ ~ W W Rank 3436 Rank 3234 Rank 3032 Rank 2830 Rank ~ ~ ~ ~ ~

8 WONIL IM WHITE LED SPECIFICATION Version of 1.0 PAGE : 8/16 7. 전기적 / 광학적특성그래프 Relative Luminous intensity vs. Wavelength Forward voltage vs. Forward Current Forward Current vs. Relative Luminosity Forward Current vs. Directive angle

9 WONIL IM WHITE LED SPECIFICATION Version of 1.0 PAGE : 9/16 8. 신뢰성 (1) 시험종류와결과 Test items Condition Note Fail / Sample 1 Resistance to soldering heat (reflow soldering) T sld =250 o C, 10sec (Pre treatment 30 o C, 70%, 12hrs) 1 time 0 / 20 2 Solder ability (reflow soldering) T sld =215 o C ± 5 o C, 3sec ( Lead solder ) 1 time over 95% 0 / 20 3 Thermal shock ( 열충격테스트 ) -40 o C ~ 100 o C, 30min At each temp. 10 cycles 0/20 4 High temperature storage ( 고온작동테스트 ) Ta = 100 o C 500 hrs 0/20 5 Life time 1 ( 수명 ) 6 Life time 2( 수명 ) I F =60mA/one temp I F = 60mA/one o C, 90%RH 500hrs 0/20 500hrs 0/20 7 Temperature Humidity storage ( 항온항습테스트 ) Ta=60 o C, RH=90% 500hrs 0/20 (2) 합격 / 불합격판정기순 item symbol Test condition Min Failure Criteria Max Forward voltage V F IF = 60mA - U.S.L 4) ⅹ1.1 C.I.E x,y x, y IF = 60mA L.S.L 5) ⅹ0.8 U.S.L 4) ⅹ1.2 Luminous intensity I V IF = 60mA L.S.L 5) ⅹ0.5 4) U.S.L : Upper Standard Level ( 상한기준레벨 ) 5) L.S.L : Lower Standard Level ( 하한기준레벨 )

10 WONIL IM WHITE LED SPECIFICATION Version of 1.0 PAGE : 10/16 9. 구성재료 Item LED chip ( LED 칩 ) Material InGaN Wire ( 와이어 ) Gold ( purity : 99.99% ) Lead frame ( 리드프레임 ) Encapsulation ( 봉지재 ) Die adhesive ( 접착제 ) Copper alloy/ni/ag plating Silicon + phosphor Silicon 10. 포장사양 10.1 Carrier tape 치수 10.2 Reel 치수

11 WONIL IM WHITE LED SPECIFICATION Version of 1.0 PAGE : 11/ 라벨및포장방식 Model Name : WL-WA30B-XXX-X V F : 3.0 ~ 3.1 V I V : 6,000 ~ 6,500 mcd : 6,000 ~ 6,500 K QTY : 1,000ea / Lot No. : WH100205

12 WONIL IM WHITE LED SPECIFICATION Version of 1.0 PAGE : 12/ 품명정보 PART NO. : W L - - (1) (2) (3) (4) (5) (6) (7) (1) LED (2) EMISSION COLOR ( White : W / Red : R / Green : G / Blue : B ) (3) PACKAGE TYPE A 5450 top view, T=1.6mm B 3528 top view, T=1.9mm (4) NUNBER OF CHIP ( 1 chip : 1 / 2 chip : 2 / 3 chip : 3 / 4 chip : 4 / 5 chip : 5 / 6 chip : 6 ) (5) NUNBER OF ZENER ( No Zener : 0 / 1 Zener : 1 / 2 Zener : 2 / 3 Zener : 3 ) (6) LEAD FRAME TYPE B Bending type H Heatsink type (7) COLOR TEMPERATURE RANK : Refer to Chromaticity Coordinates ranks & Page 7

13 WONIL IM WHITE LED SPECIFICATION Version of 1.0 PAGE : 13/ 사용시권장사항및주의사항 SMT 및 Soldering 조건 (1) SMT 및 Hand Soldering 온도 Reflow soldering Hand soldering Step Lead solder Lead free solder Condition Spec. Pre heating 120~150 o C 150~200 o C Pre heating time Max 120 sec. Max 120 sec. Peak temp. Max 240 o C Max 260 o C Soldering time Max 10 sec. Max 10 sec Soldering Temp. Soldering Time Max 300 o C Max 3sec. (2) 권장 Reflow Soldering 온도프로파일 Lead Solder Lead Free Solder (3) Soldering 시주의사항 LED Package 내로습기가흡수되면, 습기로인하여 soldering 공정중팽창과기화가발생하게됩니다. 이러한현상은 LED package의광학특성에영향을줄수있으며봉지재의박리및크랙 (crack) 의원인이됩니다. 습기방지를위해 LED package 포장시습기방지백 (bag) 내부에흡습제 (Silica gel) 이담겨져있습니다. 포장개봉전보관조건 - 온도 5~30 o C, 습도 RH60% 이하의조건의주위환경을유지하여야하며 3개월이내에사용하여야합니다. - LED package는포장개봉후즉시 Soldering 및 SMT를실시하여야합니다.

14 WONIL IM WHITE LED SPECIFICATION Version of 1.0 PAGE : 14/16 (2) 보관 포장개봉전보관조건 - 온도 5~30 o C, 습도 RH60% 이하의조건의주위환경을유지하여야하며 3개월이내에사용하여야합니다. 개봉후만약사용하지않은 LED package가남아있다면, 습기방지포장 ( 흡습제를포함한밀봉된용기 ) 속에보관하거나기존에주어진습기방지백에넣어서재밀봉하시고하기의조건으로보관하여주십시오. - 온도 5~30 o C, 습도 30% 또는그이하의조건을유지하여주십시오. 상기의조건으로보관시에도소량의습기침투는계속진행되므로 LED package 내로침투된습기를제거하기위해 Baking을하기와같이실시하여야합니다. Baking( 건조 ) 시기와조건 - Baking 조건 : 온도 60 ± 5 o C 습도 RH10% 이하에서 24시간이상 - Baking 시기포장개봉후상기에명기된조건과방법으로보관하였을때 168시간 (7일) 이경과된경우포장개봉후습기방지보관을하지않은상태로 2시간이경과된경우포장개봉전보관조건에서 3개월이경과된경우 LED package의봉지재는연성의재질로써 LED package 봉지재에강한힘이가해지지않도록주의하여야합니다. 특히, SMT 공정중에자동마운트장치를사용한다면 Pick-Up 노즐이봉지재에직접닿지않도록하여야합니다. Reflow soldering 중에 LED package에충격이나힘, 진동이가해지지않도록하여야합니다. 급격하게온도를낮추어냉각시키는과정은피해주십시오 Reflow soldering은 2회이상반복하지말아주십시오 Soldering이완료된직후 PCB 온도가 80oC 이상인경우 PCB끼리적층하여쌓아놓지마십시오. PCB의높은열이 LED package를손상시켜심각한불량이발생할수있습니다. Soldering이완료된후 PCB 기판을휘거나비틀지마십시오 부득이하게 LED package solder를녹여다시분리하는작업이필요한경우에는 Double-head solder tip을사용하시고 LED package의전기적특성유무및외관변형상태등을확인하셔서손상여부를확인바랍니다 사용시주의사항 (1) 습기침투방지 LED Package 내로습기가흡수되면, 습기로인하여 soldering 공정동안팽창과기화가발생하게됩니다. 이러한현상은 LED package의광학특성에영향을줄수있으며봉지재의박리및크랙 (crack) 의원인이됩니다.

15 WONIL IM WHITE LED SPECIFICATION Version of 1.0 PAGE : 15/16 개봉후만약사용하지않은 LED package가남아있다면, 습기방지포장 ( 흡습제를포함한밀봉된용기 ) 속에보관하거나기존에주어진습기방지백에넣어서재밀봉하시고하기의조건으로보관하여주십시오. - 온도 5~30 o C, 습도 30% 또는그이하의조건을유지하여주십시오. 상기의조건으로보관시에도소량의습기침투는계속진행되므로 LED package 내로침투된습기를제거하기위해 Baking을하기와같이실시하여야합니다. Baking( 건조 ) 시기와조건 - Baking 조건 : 온도 60 ± 5 o C 습도 RH10% 이하에서 24시간이상 - Baking 시기포장개봉후상기에명기된조건과방법으로보관하였을때 168시간 (7일) 이경과된경우포장개봉후습기방지보관을하지않은상태로 2시간이경과된경우포장개봉전보관조건에서 3개월이경과된경우 온도가주기적혹은비주기적으로급속하게변하는환경과습기많은장소에는보관하지말아주시고반드시상기의보관조건및 baking 조건을따라주시기바랍니다. LED package 제품의내측과외측에는은도금이되어져있는부분이있습니다. 은도금부는부식성가스에의해변색이되기쉽습니다. 변색이발생되면 Soldering시장애를일으키며광특성저하를일으킬수있으므로부식성가스환경에 LED package를보관하거나방치하지마시고항상청결한보관환경을유지하여야합니다. LED package 제품은방수제품이아니며, 최대한주변환경의영향을받지않도록보호장치를해주어물, 습기및분무등에직접노출되지않도록하여주십시오. (3) 정전기 정전기와 surge voltage는 LED package에손상을주게됩니다. LED package 취급시에는장갑사용을통하여인체에의한정전기발생을방지하는것을권장합니다. 모든설비, 장치와장비는확실히그라운드되어져야합니다. (4) 세척 LED package를세척하기위해서는이소프로필알코올과같은솔벤트를사용하여주십시오. 다른종류의솔벤트사용은 LED package와봉지재를녹일수있으니주의가필요하며초음파크리닝은사용하지말아야합니다. (5) 취급시주의사항 LED 의봉지재 (Encapsulant) 는부드러운실리콘재질입니다. 따라서, 봉지재에직접적으로압력과

16 WONIL IM WHITE LED SPECIFICATION Version of 1.0 PAGE : 16/16 충격, 스크레치를유발할수있는작업은삼가하여주십시오. 치명적불량이발생할수있습니다. - 손으로봉지재를직접누르지마십시오 - 핀셋이나티저등의끝이날카로운부분이봉지재에닿지않도록하여주십시오. - LED를사용한기구물제작공정중봉지재에압력이나충격이가해지지않도록하여주십시오. - Pick-up 노즐이직접봉지재에닿지않도록하여주십시오. - SMT가완료된 PCB 기판을직접적층하여쌓는것은삼가하여주십시오. (5) 기타 제품의출하는양사담당자간의제품규격및시제품협의가완료된후에진행되는것으로한다. 불량 LED package 발견및발생시사용자는분해, 분석전에 원일아이엠에통보하여주시고특히 SMT 및 soldering 공정에서불량발생시자세한작업조건및환경을명시하여알려주시기바랍니다. 정식규격서는거래시양사간에교환및승인이되어져야합니다. (6) 품질보증및책임권한 사용시권장사항및주의사항을준수하지않을경우품질문제가발생할수있으며이러한경우반품이나제품교환이되지않습니다. 본제품의품질보증은단품 LED package의성능불량이발생하였을경우에만책임권한이제조회사에있음을알려드립니다.

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