Contents 1. Product Code Information Luminous Flux Characteristics Characteristics

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ISSUE NO : Rev: 001 Product Family Data Sheet LM362A - 3623 LED PKG Introduction Features View Angle: 120

6 mm ESD withstand Voltage : up to ±5KV [HBM] Reliability Test : Refer to page 25 Applications INDOOR

Samsung2-Ro, Giheung-Gu, Yongin-City, Gyeonggi-Do 446-711, KOREA Copyright 2009-2011 SAMSUNG ELECTRONICS Co.

1 ISSUE NO : Rev: 001 Product Family Data Sheet LM362A LED PKG Introduction Features View Angle: 120 Precondition : JEDEC Level 2a Dimension : 3.6 x 2.3 x 0.6 mm ESD withstand Voltage : up to ±5KV [HBM] Reliability Test : Refer to page 25 Applications INDOOR LIGHTING : Ambient Light, L-tube, Down light, LED bulbs and Ceiling Light SAMSUNG ELECTRONICS 95, Samsung2-Ro, Giheung-Gu, Yongin-City, Gyeonggi-Do , KOREA Copyright SAMSUNG ELECTRONICS Co.,Ltd. All rights reserved. The information in this document is subject to change without notice. SAMSUNG, is a registered trademark of SAMSUNG ELECTRONICS. 1 / 50

2 Contents 1. Product Code Information Luminous Flux Characteristics Characteristics Typical Characteristics Graph Outline Drawing & Dimension Reliability Test Items & Conditions Solder Conditions Tape & Reel Label Structure Packing Structure Precaution For Use Hazard Substance Analysis Report Revision History / 50

3 1. Product Code Information 1) Luminous Intensity Bins (T J = 25 ) Nominal CCT Product Code Intensity Rank Sorting Condition cd@100ma Intensity Bin Intensity Range (cd) S ~ K SPMWHT325AD5YBW0S0 S0 S ~ 22.6 S ~ 26.0 S ~ K SPMWHT325AD5YBV0S0 S0 S ~ 23.3 S ~ 26.6 S ~ K SPMWHT325AD5YBU0S0 S0 S ~ 24.3 S ~ 27.6 S ~ K SPMWHT325AD5YBT0S0 S0 S ~ 25.0 SPMWHT325AD3Y0R0S0 S0 S ~ 28.3 S ~ 25.0 S ~ K S ~ 35.0 S ~ 22.0 SPMWHT325AD5YBR0S0 S0 S ~ 25.3 S ~ 28.6 S ~ K SPMWHT325AD5YBQ0S0 S0 S ~ 25.0 S ~ 28.3 S ~ K SPMWHT325AD5YB0S0 S0 S ~ 25.0 S ~ / 50

4 2) Luminous Flux Bins (T J = 25 ) Nominal CCT Product Code Flux Rank 2700K SPMWHT325AD5YBW0S0 S0 3000K SPMWHT325AD5YBV0S0 S0 3500K SPMWHT325AD5YBU0S0 S0 4000K SPMWHT325AD5YBT0S0 S0 SPMWHT325AD3Y0R0S0 S0 5000K SPMWHT325AD5YBR0S0 S0 5700K SPMWHT325AD5YBQ0S0 S0 6500K SPMWHT325AD5YB0S0 S0 Sorting Condition lm@100ma Flux Bin Flux Range (lm) S1 51 ~ 58 S2 58 ~ 68 S3 68 ~ 78 S1 51 ~ 60 S2 60 ~ 70 S3 70 ~ 80 S1 51 ~ 63 S2 63 ~ 73 S3 73 ~ 83 S1 55 ~ 65 S2 65 ~ 75 S3 75 ~ 85 S1 63 ~ 75 S2 75 ~ 88 S3 88 ~ 105 S1 55 ~ 66 S2 66 ~ 76 S3 76 ~ 86 S1 55 ~ 65 S2 65 ~ 75 S3 75 ~ 85 S1 55 ~ 65 S2 65 ~ 75 S3 75 ~ 85 Notes: Luminous Flux(Φ v, lm) values are for representative reference only 4 / 50

5 3) Color Bins (T J = 25 ) 1) Color Binning Nominal CCT 2700K Product Code Color Rank Chromaticity Bins W1,W2,W3,W4,W5,W6,W7,W8, SPMWHT325AD5YBW0S0 W0 (Whole Bin) W9,WA,WB,WC,WD,WE,WF,WG SPMWHT325AD5YBWHS0 WH (Half Bin) W5,W6,W7,W8,W9,WA,WB,WC SPMWHT325AD5YBWMS0 WM (M4 Bin) W6,W7,WA,WB 3000K SPHWHTL3D305E6V0F5 V0 (Whole Bin) V1,V2,V3,V4,V5,V6,V7,V8, V9,VA,VB,VC,VD,VE,VF,VG SPHWHTL3D305E6VUF5 VU (Half Bin) V5,V6,V7,V8,V9,VA,VB,VC SPHWHTL3D305E6VPF5 VP (M4 Bin) V6,V7,VA,VB 3500K SPHWHTL3D305E6U0F5 U0 (Whole Bin) U1,U2,U3,U4,U5,U6,U7,U8, U9,UA,UB,UC,UD,UE,UF,UG SPHWHTL3D305E6UUF5 UU (Half Bin) U5,U6,U7,U8,U9,UA,UB,UC SPHWHTL3D305E6UPF5 UP (M4 Bin) U6,U7,UA,UB 4000K SPMWHT325AD5YBT0S0 T0 (Whole Bin) T1,T2,T3,T4,T5,T6,T7,T8, T9,TA,TB,TC,TD,TE,TF,TG SPMWHT325AD5YBTHS0 TH (Half Bin) T5,T6,T7,T8,T9,TA,TB,TC SPMWHT325AD5YBTMS0 TM (M4 Bin) T6,T7,TA,TB 5000K SPMWHT325AD3Y0R0S0 SPMWHT325AD5YBR0S0 SPMWHT325AD3Y0RMS0 SPMWHT325AD5YBRMS0 R0 (Whole Bin) RM (M7 Bin) R1,R2,R3,R4,R5,R6,R7,R8, R1,R2,R3,R4 5700K 6500K SPMWHT325AD5YBQ0S0 Q0 (Whole Bin) Q1,Q2,Q3,Q4,Q5,Q6,Q7,Q8, SPMWHT325AD5YBQMS0 QM (M7 Bin) Q1,Q2,Q3,Q4 SPMWHT325AD5YBP0S0 P0 (Whole Bin) P1,P2,P3,P4,P5,P6,P7,P8, SPMWHT325AD5YBPMS0 PM (M7 Bin) P1,P2,P3,P4 5 / 50

6 2) Chromaticity Region & Coordinates 6 / 50

7 2) Chromaticity Region & Coordinates (Continued) Region CIE X CIE Y Region CIE X CIE Y W rank (2700K) W1 W2 W3 W4 W5 W6 W7 W W WA WB WC WD WE WF WG Region CIE X CIE Y Region CIE X CIE Y V rank (3000K) V1 V2 V3 V4 V5 V6 V7 V V VA VB VC VD VE VF VG / 50

8 2) Chromaticity Region & Coordinates (Continued) Region CIE X CIE Y Region CIE X CIE Y U rank (3500K) U1 U2 U3 U4 U5 U6 U7 U U UA UB UC UD UE UF UG Region CIE X CIE Y Region CIE X CIE Y T rank (4000K) T1 T2 T3 T4 T5 T6 T7 T T TA TB TC TD TE TF TG / 50

9 2) Chromaticity Region & Coordinates (Continued) Region CIE X CIE Y Region CIE X CIE Y R rank (5000K) R1 R2 R3 R4 Q1 Q2 Q3 Q R R R R Q rank (5700K) Q Q Q Q Region CIE X CIE Y Region CIE X CIE Y P rank (6500K) P1 P2 P3 P P P P P Notes: SAMSUNG ELECTRONICS maintains ±0.01 tolerance of CCx, CCy 9 / 50

10 2. Luminous Flux Characteristics (T J = 25 ) Nominal CCT Minimum CRI 1) If(mA) Vf(V) Power(W) Flux(lm) Lm/W K K Notes: Luminous Flux(Φ v, lm) values are for representative reference only 10 / 50

11 Nominal CCT Minimum CRI 1) If(mA) Vf(V) Power(W) Flux(lm) Lm/W K K Notes: Luminous Flux(Φ v, lm) values are for representative reference only 11 / 50

12 Nominal CCT Minimum CRI 1) If(mA) Vf(V) Power(W) Flux(lm) Lm/W K K Notes: Luminous Flux(Φ v, lm) values are for representative reference only 12 / 50

13 Nominal CCT Minimum CRI 1) If(mA) Vf(V) Power(W) Flux(lm) Lm/W K K Notes: Luminous Flux(Φ v, lm) values are for representative reference only 13 / 50

14 3. Characteristics 1) Absolute Maximum Rating Item Symbol Rating Condition Operating temperature range Top -40 ~ Storage temperature range Tstg -40 ~ LED junction temperature T J Forward Current I F 200 ma - Peak Pulsed Forward Current IFP 400 ma Duty 1/10 pulse width 10ms Thermal resistance Rth, j-s 15 /W Junction to solder point Assembly Process Temperature - 260, < 10sec - ESD - 5kV HBM 2) Electro-optical Characteristics - Voltage and CRI Item Unit Rank Min Typ Max A A Forward Voltage (@100 ma, Tj = 25 ) V YB A A A Reverse Voltage (@5 ma, Tj = 25 ) V Color Rendering Index Ra Notes: SAMSUNG ELECTRONICS maintains a tolerance of ± 0.1V on Forward Voltage measurements 14 / 50

15 2) Electro-optical Characteristics - Luminous Intensity and Flux Item Unit CCT Rank Min Typ Max Luminous Intensity (@100 ma, Tj = 25 ) Luminous Flux (@100 ma, Tj = 25 ) cd lm 2700K S0 3000K S0 S S S S S S K S0 4) S S K 5700K 6500K 5000K (Ra 68) 5000K (Ra 80) S0 S0 S0 2700K S0 3000K S0 S S S S S S S S S S S S S S S S K S0 4) S S K 5700K 6500K 5000K (Ra 68) 5000K (Ra 80) S0 S0 S0 S S S S S S S S S S Notes: Luminous Flux(Φ v, lm) values are for representative reference only 15 / 50

16 4. Typical Characteristics Graph 1) Spectrum Distribution (T a = 25 ) 2700K 3000K 16 / 50

17 3500K 4000K 17 / 50

18 5000K - CRI68 500K - CRI / 50

19 5700K 6500K 19 / 50

20 2) Forward Current Characteristics (T a = 25 ) Relative Flux vs. Forward Current Forward Current vs. Forward Voltage 20 / 50

21 3) Temperature Characteristics Relative Flux vs. Ts(solder temp.) Forward Voltage vs. Ts(solder temp.) 21 / 50

22 4) Color shift Characteristics Color x,y vs. Forward Current 22 / 50

23 5) Derating Curve (T a = 25 ) Rj-a = 30 /W Rj-a = 21 /W Rj-a = 12 /W 6) Viewing Angle Characteristics Viewing Angle 23 / 50

5. Outline Drawing & Dimension Anode Cathode Recommended Land Pattern 1. Tolerance is ±0.1 mm 2. The maximum compressing force is 15N on the silicone a 3.

2) The thermal pad is electrically isolated from the anode and cathode contact pads. 3) Ts point & measurement method 1 Measure the nearest point to the thermal pad as shown below.

4) Precautions 1 The pressure on the LEDs will influence to the reliability of the LEDs. Precautions should be taken to avoid the strong pressure on the LEDs.

24 5. Outline Drawing & Dimension Anode Cathode Recommended Land Pattern 1. Tolerance is ±0.1 mm 2. The maximum compressing force is 15N on the silicone a 3. Do not place pressure on the encapsulation resin b Notes: 1) This LED has built-in ESD protection device(s) connected in parallel to LED Chip(s). 2) The thermal pad is electrically isolated from the anode and cathode contact pads. 3) Ts point & measurement method 1 Measure the nearest point to the thermal pad as shown below. If necessary, remove PSR of PCB to reach Ts point. 2 Thermal pad must be soldered to the PCB to dissipate heat properly. Otherwise, LED can be damaged. 4) Precautions 1 The pressure on the LEDs will influence to the reliability of the LEDs. Precautions should be taken to avoid the strong pressure on the LEDs. Do not put stress on the LEDs during heating. 2 Re-soldering should not be done after the LEDs have been soldered. If re-soldering is unavoidable, LED`s characteristics should be carefully checked before and after such repair. 3 Do not stack assembled PCBs together. Since materials of LEDs is soft, abrasion between two PCB assembled with LED might cause catastrophic failure of the LEDs / 50

25 6. Reliability Test Items and Conditions 1) Test Items and Results Test Item Test Conditions Test Hours/Cycles Sample No MSL Test hrs drying 60, 60%RH 120hrs sec 3 cycles 1 cycle 11 Room Temperature life test High Temperature life test High Temperature humidity life test Low Temperature life test Power Temperature Cycle Thermal Shock High Temperature Storage Low Temperature Storage 25 ±3, DC200 ma 1,000 hrs ±3, DC200 ma 1,000hrs ±3, 85%±2%RH, DC200 ma 1,000hrs ±3, DC200 ma 1,000hrs /20 min 85 /20 min, Temp. change within 100min, on/off 5 min -45 /15 min 125 /15 min, Temp. change within 5min => Reflow 260 Hot plate cycles cycle 100 Ta=120 ± hrs 11 Ta=-40 ± hrs 11 ESD(HBM) R1:10 MΩ, R2:1.5 kω, C:100 pf, V = ±5 kv 5times 10 ESD(MM) R1:10 MΩ, R2:0, C:200 pf, V = ±0.5 kv 5times 10 Vibration Test 100~2000~100 Hz, 200 m/s2, Sweep 4 min, 48 min, X, Y, Z 3 direction, each 1 cycle 4 cycles 11 Mechanical Shock Test 1500G, 0.5 ms, 3 shocks each X-Y-Z axis 5 cycles 11 2) Criteria for Judging the Damage Item Symbol Test Condition Limit Min Max Forward Voltage V F I F = 65 ma Init. Value*0.9 Init. Value*1.1 Luminous Intensity I V I F = 65 ma Init. Value*0.8 Init. Value*1.2 * USL : Upper Standard Level LSL : Lower Standard Level 25 / 50

26 7. Solder Conditions 1) Reflow Conditions ( Pb Free ) Reflow Frequency : 2 times max. 2) For Manual Soldering Not more than 5 300, under soldering iron / 50

27 8. Tape And Reel Anode Cathode End Start More than 40 mm Mounted with More than (100~200) mm Leading part more than Unloaded tape Flash LED Unloaded tape (200~400) mm (1) Quantity : The quantity/reel to be 4,000 pcs. (2) Cumulative Tolerance : Cumulative tolerance/10 pitches to be ±0.2 mm (3) Adhesion Strength of Cover Tape : Adhesion strength to be N when the cover tape is turned off from the carrier tape at 10 angle to be the carrier tape. (4) Packaging : P/N, Manufacturing data code no. and quantity to be indicated on a damp proof package / 50

28 9. Label Structure 1) Label Structure abcdef A1W1S1 SPMWHT325AD5YBW0S0 A1W1S1 01 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII GLAW94001 / I001 / 4,000pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII Rank Code Rank Code ab : Forward Voltage Rank cd : Chromaticity Coordinate Rank ef : Luminous Intensity Rank 2) LOT Number The Lot number is composed of the following characters A1W1S1 SPMWHT325AD5YBW0S0 A1W1S1 01 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII / Iabc / 4,000pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII / Iabc / 4,000 PCS 1 2 : L (LED) 3 4 : Year (V:2011, W:2012, X: ) 5 : Month (1 ~ 9, A, B) 6 : Day (1 ~ 9, A, B ~ V) 789 : SAMSUNG LED Product number (1 ~ 999) abc : Reel Number (1 ~ 999) : Production Site (S:SAMSUNG LED, G:GOSIN CHINA) : Product State (A:Normality, B:Bulk, C:First Production, R:Reproduction, S:Sample) 28 / 50

10. Packing Structure 1) Packing Process Reel A1W1S1 SPMWHT325AD5YBW0S0 A1W1S1 01 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII GLAV94001 / 1001 / 4,000pcs

1001 / 4,000pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII Material : Paper(SW3B(B)) TYPE SIZE(mm) L W H 7inch 245 220 182 1 SIDE A1W1S1 SPMWHT325AD5YBW0S0 A1W1S1 01

29 10. Packing Structure 1) Packing Process Reel A1W1S1 SPMWHT325AD5YBW0S0 A1W1S1 01 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII GLAV94001 / 1001 / 4,000pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII LEVEL 2a Aluminum Vinyl Bag A1W1S1 SPMWHT325AD5YBW0S0 A1W1S1 01 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII GLAV94001 / 1001 / 4,000pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII Material : Paper(SW3B(B)) TYPE SIZE(mm) L W H 7inch SIDE A1W1S1 SPMWHT325AD5YBW0S0 A1W1S1 01 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII GLAV94001 / 1001 / 40,000pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII [Box Label] H CHIP LED L W / 50

30 2) Aluminum Packing Bag A1W1S1 SPMWHT325AD5YBW0S0 A1W1S1 01 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII GLAW94001 / I001 / 4,000pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII Silica gel & Humidity Indicator Card in Aluminum Vinyl Bag 30 / 50

31 11. Precaution for use 1) For over-current-proof function, customers are recommended to apply resistors to prevent sudden change of the current caused by slight shift of the voltage. 과전류방지를위해전압의미세한이동에의해야기되는전류의순간변화를방지하기위해저항등의설치를권장함. 2) This device should not be used in any type of fluid such as water, oil, organic solvent, etc. When washing is required, IPA is recommended to use. 제품은물, 오일, 유기물과같은액체타입에서의사용은제한되며, 세정이필요할시에는 IPA 사용을권장함. 3) When the LEDs illuminate, operating current should be decided after considering the ambient maximum temperature. LED 의발광시, 동작전류는주변최고온도를고려하여결정되어야함. 4) LEDs must be stored in a clean environment. If the LEDs are to be stored for 3 months or more after being shipped from Samsung Electronics, they should be packed by a sealed container with nitrogen gas injected.(shelf life of sealed bags: 12 months, temp. ~40, ~90%RH) LED 의보관은청정한환경에서보존되어져야하며, 만약삼성전자로부터공급받는후 3 개월또는그이상보관이필요하다면질소가스를동봉한보존용기에보관되어야함. ( 보존 bag 의수명 : 12 개월, 보존온도 ~40, 습도 ~90%RH) 5) After storage bag is open, device subjected to soldering, solder reflow, or other high temperature processes must be: 보존 Bag 이개봉된후에, 납땜이나 reflow 등의높은온도에노출되는제품은다음의사항에부합되어야함. a. Mounted within 672 hours(28 days) at an assembly line with a condition of no more than 30 /60%RH, a. 제품은 30 /60%RH 보다같거나낮은조립조건에서 672 시간 (28 일 ) 이내에조립해야함. b. Stored at <10%RH. b. 10% 이하의상대습도에서보관되어야함. 6) Repack unused Products with anti-moisture packing, fold to close any opening and then store in a dry place. 사용하지않은제품은방습팩에넣어개봉부위를닫아서다시포장한후, 건조한장소에서보관할것을권장함 / 50

32 7) Devices require baking before mounting, if humidity card reading is >60% at 23±5. 만약습도표시카드의수치가 23±5 에서 60% 이상이라면, 제품실장전에 baking 해야함. 8) Devices must be baked for 1 hour at 65±5, if baking is required. 만약 baking 이필요하다면, 제품은 65±5 에서 1 시간정도 baking 되어야함. 9) The LEDs are sensitive to the static electricity and surge. It is recommended to use a wrist band or anti-electrostatic glove when handling the LEDs. LED 는정전기및서지에민감한제품이므로, LED 제품을다룰시에는정전기방지장갑이나손목밴드를사용하기를권장함. If voltage exceeding the absolute maximum rating is applied to LEDs, it may cause damage or even destruction to LED devices. 만약절대허용치를초과하는전압이 LED 에가해지면, LED 소자는파괴되거나손상될수있음. Damaged LEDs may show some unusual characteristics such as increase in leak current, lowered turn-on voltage, or abnormal lighting of LEDs at low current. 손상된제품은누설전류의증가, Turn on 전압의저하, 저전류에서의점등불량등의이상거동을보일수있음. 10) VOCs (Volatile Organic Compounds) emitted from materials such as Glue, Flux, Curing Agent and Organic Additives used in the construction of fixtures can penetrate silicone encapsulants of LEDs and discolor when exposed to heat and ultra-violet light. VOCs( 휘발성유기화합물 ) 는조명기구에사용되는접착제, Flux, 경화제, 유기물첨가제에서발생하여 LED의실리콘봉지제를투과하고, 자외선또는열에노출되었을때변색이발생할수있음. The result can be a significant loss of light output from the fixture. 이러한현상은조명기구로부터나오는빛의중대한손실을줄수있음. To prevent these issues, careful selection of the materials for the fixture construction relying on the knowledge of the material properties is recommended. 이러한문제발생방지를위해서, 조명기구에사용되는자재에대한물성을알고주의하여선택되어야함 / 50

33 11) Risk of Sulfurization (or Tarnishing) Samsung Electronic's lead frame based package products (such as mid power and HV AC) contain silver (Ag) plated lead frames. Silver may turn black (or tarnish) when exposed to substances such as sulfur, chlorine, or other halogen compounds. 삼성전자의리드프레임은 Ag( 은 ) 을도금한 Package 제품으로황 (S), 염소 (Cl), 또는다른할로겐화합물들에노출시 Ag( 은 ) 은검정 ( 또는어두운색 ) 으로바뀔수있으니이에대한주의가요구됨. Sulfurization of the lead frame may result in reduction of lumen output, color shift and an open circuit in some extreme cases. 리드프레임의황화 (Sulfurization) 는광량저하, 색좌표변화및심한경우회로내의 LED 무등 (Open) 불량을야기할수있음. Do not store or use such lead frame LED's together with oxidizing substances listed above. The following examples could be sources of such substances : rubber, corrugate paper, solder cream etc. 황화 (Sulfurization) 의근원이될수있으므로 LED 는아래의목록으로만들어진산화성물질들과함께저장 / 사용이불가함. : 고무, 일반종이, 남땜크림등 33 / 50

34 12. Hazard Substance Analysis Report 34 / 50

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40 16. Hazard Substance Analysis - SVHC(REACH) 40 / 50

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50 Revision History Writer Date Revision History Drawn Approved New version (rev. 000) J.W.PARK Y.T.KIM 유의사항에 VOCs 문구추가 (rev. 001) J.W.PARK Y.T.KIM 50 / 50

Contents 1. Product Outline Absolute Maximum Rating Character

Contents 1. Product Outline Absolute Maximum Rating Character Rev: ISSUE NO : DATE OF ISSUE : 2011. 08. 22 SPECIFICATION MODEL : SPMWHT521MD5WAW0S0 Approved rank : V F(A1, A2, A3, A4, A5) CIE(W1, W2, W3, W4, W5, W6, W7, W8, W9, WA, WB, WC, WD, WE, WF, WG) I V(S1,