Contents 1. Product Code Information Luminous Flux Characteristics Characteristics

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1 ISSUE NO : NTI16 Rev: 004 Product Family Data Sheet LM362A LED PKG Introduction Features Beam Angle: 120 Precondition : JEDEC Level 2a Dimension : 3.6 x 2.3 x 0.6 mm ESD withstand Voltage : up to ±5KV [HBM] Reliability Test : Refer to page 25 Applications INDOOR LIGHTING : Ambient Light, L-tube, Down light, LED bulbs and Ceiling Light SAMSUNG ELECTRONICS 95, Samsung2-Ro, Giheung-Gu, Yongin-City, Gyeonggi-Do , KOREA Copyright SAMSUNG ELECTRONICS Co.,Ltd. All rights reserved. The information in this document is subject to change without notice. SAMSUNG, is a registered trademark of SAMSUNG ELECTRONICS. 1 / 52

2 Contents 1. Product Code Information Luminous Flux Characteristics Characteristics Typical Characteristics Graph Outline Drawing & Dimension Reliability Test Items & Conditions Solder Conditions Tape & Reel Label Structure Packing Structure Precaution For Use Hazard Substance Analysis Report Revision History / 52

3 1. Product Code Information 1) Luminous Intensity Bins (Ts = 25 ) Nominal CCT Product Code Intensity Rank Sorting Condition cd@100ma Intensity Bin Intensity Range (cd) S ~ 18.9 SPMWHT325AD5YBW0S0 S0 S ~ K S ~ 25.5 S ~ 20.8 SPMWHT325AP4YBW0S0 S0 S ~ 22.8 S ~ 26.1 S ~ K SPMWHT325AD5YBV0S0 S0 S ~ 22.8 S ~ 26.1 S ~ K SPMWHT325AD5YBU0S0 S0 S ~ 23.8 S ~ 27.1 S ~ K SPMWHT325AD5YBT0S0 S0 S ~ 24.5 S ~ 27.7 S ~ 24.5 SPMWHT325AD3Y0R0S0 S0 S ~ K S ~ 34.3 S ~ 21.5 SPMWHT325AD5YBR0S0 S0 S ~ 24.8 S ~ 28.1 S ~ K SPMWHT325AD5YBQ0S0 S0 S ~ 24.5 S ~ 27.7 S ~ K SPMWHT325AD5YBP0S0 S0 S ~ 24.5 S ~ 27.7 Notes: Luminous Intensity(I v, cd) values are for representative reference only 3 / 52

4 2) Luminous Flux Bins (Ts = 25 ) Nominal CCT Product Code Flux Rank SPMWHT325AD5YBW0S0 S0 2700K SPMWHT325AP4YBW0S0 S0 3000K SPMWHT325AD5YBV0S0 S0 3500K SPMWHT325AD5YBU0S0 S0 4000K SPMWHT325AD5YBT0S0 S0 SPMWHT325AD3Y0R0S0 S0 5000K SPMWHT325AD5YBR0S0 S0 5700K SPMWHT325AD5YBQ0S0 S0 6500K SPMWHT325AD5YBP0S0 S0 Sorting Condition lm@100ma Flux Bin Flux Range (lm) S1 51 ~ 58 S2 58 ~ 68 S3 68 ~ 78 S1 58 ~ 64 S2 64 ~ 70 S3 70 ~ 80 S1 51 ~ 60 S2 60 ~ 70 S3 70 ~ 80 S1 51 ~ 63 S2 63 ~ 73 S3 73 ~ 83 S1 55 ~ 65 S2 65 ~ 75 S3 75 ~ 85 S1 63 ~ 75 S2 75 ~ 88 S3 88 ~ 105 S1 55 ~ 66 S2 66 ~ 76 S3 76 ~ 86 S1 55 ~ 65 S2 65 ~ 75 S3 75 ~ 85 S1 55 ~ 65 S2 65 ~ 75 S3 75 ~ 85 Notes: SAMSUNG ELECTRONICS maintains a tolerance of ±5% on Luminous Flux measurements 4 / 52

5 3) Color Bins (Ts = 25 ) 1) Color Binning Nominal CCT 2700K Product Code Color Rank Chromaticity Bins SPMWHT325AD5YBW0S0 W0 (Whole Bin) W1,W2,W3,W4,W5,W6,W7,W8, W9,WA,WB,WC,WD,WE,WF,WG SPMWHT325AD5YBWHS0 WH (Half Bin) W5,W6,W7,W8,W9,WA,WB,WC SPMWHT325AD5YBWMS0 WM (M4 Bin) W6,W7,WA,WB 3000K SPMWHT325AD5YBV0S0 V0 (Whole Bin) V1,V2,V3,V4,V5,V6,V7,V8, V9,VA,VB,VC,VD,VE,VF,VG SPMWHT325AD5YBVHS0 VH (Half Bin) V5,V6,V7,V8,V9,VA,VB,VC SPMWHT325AD5YBVMS0 VM (M4 Bin) V6,V7,VA,VB 3500K SPMWHT325AD5YBU0S0 U0 (Whole Bin) U1,U2,U3,U4,U5,U6,U7,U8, U9,UA,UB,UC,UD,UE,UF,UG SPMWHT325AD5YBUHS0 UH (Half Bin) U5,U6,U7,U8,U9,UA,UB,UC SPMWHT325AD5YBUMS0 UM (M4 Bin) U6,U7,UA,UB 4000K SPMWHT325AD5YBT0S0 T0 (Whole Bin) T1,T2,T3,T4,T5,T6,T7,T8, T9,TA,TB,TC,TD,TE,TF,TG SPMWHT325AD5YBTHS0 TH (Half Bin) T5,T6,T7,T8,T9,TA,TB,TC SPMWHT325AD5YBTMS0 TM (M4 Bin) T6,T7,TA,TB 5000K SPMWHT325AD3Y0R0S0 SPMWHT325AD5YBR0S0 SPMWHT325AD3Y0RMS0 SPMWHT325AD5YBRMS0 R0 (Whole Bin) RM (M7 Bin) R1,R2,R3,R4,R5,R6,R7,R8, R1,R2,R3,R4 5700K 6500K SPMWHT325AD5YBQ0S0 Q0 (Whole Bin) Q1,Q2,Q3,Q4,Q5,Q6,Q7,Q8, SPMWHT325AD5YBQMS0 QM (M7 Bin) Q1,Q2,Q3,Q4 SPMWHT325AD5YBP0S0 P0 (Whole Bin) P1,P2,P3,P4,P5,P6,P7,P8, SPMWHT325AD5YBPMS0 PM (M7 Bin) P1,P2,P3,P4 5 / 52

6 2) Chromaticity Region & Coordinates 6 / 52

7 2) Chromaticity Region & Coordinates (Continued) Region CIE X CIE Y Region CIE X CIE Y W rank (2700K) W1 W2 W3 W4 W5 W6 W7 W W WA WB WC WD WE WF WG Region CIE X CIE Y Region CIE X CIE Y V rank (3000K) V1 V2 V3 V4 V5 V6 V7 V V VA VB VC VD VE VF VG / 52

8 2) Chromaticity Region & Coordinates (Continued) Region CIE X CIE Y Region CIE X CIE Y U rank (3500K) U1 U2 U3 U4 U5 U6 U7 U U UA UB UC UD UE UF UG Region CIE X CIE Y Region CIE X CIE Y T rank (4000K) T1 T2 T3 T4 T5 T6 T7 T T TA TB TC TD TE TF TG / 52

9 2) Chromaticity Region & Coordinates (Continued) Region CIE X CIE Y Region CIE X CIE Y R rank (5000K) R1 R2 R3 R4 Q1 Q2 Q3 Q R R R R Q rank (5700K) Q Q Q Q Region CIE X CIE Y Region CIE X CIE Y P rank (6500K) P1 P2 P3 P P P P P Notes: SAMSUNG ELECTRONICS maintains ±0.005 tolerance of Cx, Cy 9 / 52

10 2. Luminous Flux Characteristics (Ts = 25 ) Nominal CCT Minimum CRI 1) If(mA) Vf(V) Power(W) Flux(lm) lm/w K K / 52

11 Nominal CCT Minimum CRI 1) If(mA) Vf(V) Power(W) Flux(lm) lm/w K K / 52

12 Nominal CCT Minimum CRI 1) If(mA) Vf(V) Power(W) Flux(lm) lm/w K K / 52

13 Nominal CCT Minimum CRI 1) If(mA) Vf(V) Power(W) Flux(lm) lm/w K K / 52

14 Nominal CCT Minimum CRI 1) If(mA) Vf(V) Power(W) Flux(lm) lm/w K / 52

15 3. Characteristics 1) Absolute Maximum Rating Item Symbol Rating Condition Operating temperature range Top -40 ~ Storage temperature range Tstg -40 ~ LED junction temperature TJ Forward Current IF 200 ma - Peak Pulsed Forward Current IFP 400 ma Duty 1/10 pulse width 10ms Thermal resistance Rth, j-s 15 /W Junction to solder point Assembly Process Temperature - 260, < 10sec - ESD - 5kV HBM 2) Electro-optical Characteristics - Voltage and CRI Item Unit Rank Min Typ Max A A Forward Voltage (@100 ma, Tj = 25 ) V YB A A A Reverse Voltage (@5 ma, Tj = 25 ) V Color Rendering Index Ra Notes: 1)~2) SAMSUNG ELECTRONICS maintains a tolerance of V F:±0.1 V, R a :±3.0 on measurements 15 / 52

16 Notes: 3) Electro-optical Characteristics - Luminous Intensity and Flux Item Unit CCT Rank Min Typ Max Luminous Intensity (@100 ma, Ts = 25 ) Luminous Flux (@100 ma, Ts = 25 ) cd lm 2700K (Ra 80) 2700K (Ra 78) 3000K 16 / 52 S0 S0 S0 S S S S S S S S S K S0 4) S S S K 5700K 6500K 5000K (Ra 68) 5000K (Ra 80) 2700K (Ra 80) 2700K (Ra 78) 3000K S0 S0 S0 S0 S0 S0 S S S S S S S S S S S S S S S S S S K S0 4) S S S K 5700K 6500K 5000K (Ra 68) 5000K (Ra 80) Luminous Intensity(I v, cd) values are for representative reference only S0 S0 S0 S S S S S S S S S

17 4. Typical Characteristics Graph 1) Spectrum Distribution (Ts = 25 ) 2700K 3000K 17 / 52

18 3500K 4000K 18 / 52

19 5000K - CRI K - CRI / 52

20 5700K 6500K 20 / 52

21 2700K - CRI76 (T s = 25 ) 21 / 52

22 2) Forward Current Characteristics (Ts = 25 ) Relative Flux vs. Forward Current Forward Current vs. Forward Voltage 22 / 52

23 3) Temperature Characteristics Relative Flux vs. Ts(solder 100mA Forward Voltage vs. Ts(solder 100mA 23 / 52

24 4) Color shift Characteristics Color x,y vs. Forward Current 24 / 52

25 5) Derating Curve (T a = 25 ) Rj-a = 30 /W Rj-a = 21 /W Rj-a = 12 /W 6) Viewing Angle Characteristics Viewing Angle 25 / 52

26 5. Outline Drawing and Dimension Anode Cathode Recommended Land Pattern 1. Tolerance is ±0.1 mm 2. The maximum compressing force is 15N on the silicone a 3. Do not place pressure on the encapsulation resin b Notes: 1) This LED has built-in ESD protection device(s) connected in parallel to LED Chip(s). 2) Ts point & measurement method 1 Measure the nearest point to the thermal pad as shown above. If necessary, remove PSR of PCB to reach Ts point. 2 Thermal pad must be soldered to the PCB to dissipate heat properly. Otherwise, LED can be damaged. 3) Precautions 1 The pressure on the LEDs will influence to the reliability of the LEDs. Precautions should be taken to avoid the strong pressure on the LEDs. Do not put stress on the LEDs during heating. 2 Re-soldering should not be done after the LEDs have been soldered. If re-soldering is unavoidable, LED`s characteristics should be carefully checked before and after such repair. 3 Do not stack assembled PCBs together. Since materials of LEDs is soft, abrasion between two PCB assembled with LED might cause catastrophic failure of the LEDs / 52

27 6. Reliability Test Items and Conditions 1) Test Items and Results Test Item Test Conditions Test Hours/Cycles Sample No MSL Test hrs drying 60, 60 %RH 120hrs sec 3 cycles 1 cycle 11 Room Temperature life test High Temperature life test High Temperature humidity life test Low Temperature life test Power Temperature Cycle Thermal Shock High Temperature Storage Low Temperature Storage 25 ±3, DC200mA 1,000 hrs ±3, DC200 ma 1,000 hrs ±3, 85 %±2 %RH, DC200 ma 1,000 hrs ±3, DC200 ma 1,000 hrs /20 min 85 /20 min, Temp. change within 100min, on/off 5 min -45 /15 min 125 /15 min, Temp. change within 5min Hot plate cycles cycles 100 Ta=120 ± hrs 11 Ta=-40 ± hrs 11 ESD(HBM) R1:10 MΩ, R2:1.5 kω, C:100 pf, V = ±5 kv 5 times 10 ESD(MM) R1:10 MΩ, R2:0, C:200 pf, V = ±0.5 kv 5 times 10 Vibration Test 100~2000~100 Hz, 200 m/s2, Sweep 4 min, X, Y, Z 3 direction, each 1 cycle 4 cycles 11 Mechanical Shock Test 1500G, 0.5 ms, 3 shocks each X-Y-Z axis 5 cycles 11 2) Criteria for Judging the Damage Item Symbol Test Condition Limit Min Max Forward Voltage VF IF = 100 ma Init. Value*0.9 Init. Value*1.1 Luminous Flux Im IF = 100 ma Init. Value*0.8 Init. Value* / 52

28 7. Solder Conditions 1) Reflow Conditions ( Pb Free ) Reflow Frequency : 2 times max. 2) For Manual Soldering Not more than 5 300, under soldering iron / 52

29 8. Tape And Reel Anode Cathode End Start More than 40 mm Mounted with More than (100~200)mm Leading part more than Unloaded tape Flash LED Unloaded tape (200~400)mm (1) Quantity : The quantity/reel to be 4,000 pcs. (2) Cumulative Tolerance : Cumulative tolerance/10 pitches to be ±0.2 mm (3) Adhesion Strength of Cover Tape : Adhesion strength to be N when the cover tape is turned off from the carrier tape at 10 angle to be the carrier tape. (4) Packaging : P/N, Manufacturing data code no. and quantity to be indicated on a damp proof package / 52

30 9. Label Structure 1) Label Structure abcdef A1W1S1 SPMWHT325AD5YBW0S0 A1W1S1 01 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII GLAW94001 / I001 / 4,000 pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII Rank Code Rank Code ab : Forward Voltage Rank cd : Chromaticity Coordinate Rank ef : Luminous Intensity Rank 2) LOT Number The Lot number is composed of the following characters A1W1S1 SPMWHT325AD5YBW0S0 A1W1S1 01 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII / Iabc / 4,000 pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII / Iabc / 4,000 PCS 1 : Production Site (S:SAMSUNG LED, G:GOSIN CHINA) 2 : L (LED) 3 : Product State (A:Normality, B:Bulk, C:First Production, R:Reproduction, S:Sample) 4 : Year (V:2011, W:2012, X: ) 5 : Month (1 ~ 9, A, B) 6 : Day (1 ~ 9, A, B ~ V) 789 : SAMSUNG LED Product number (1 ~ 999) abc : Reel Number (1 ~ 999) 30 / 52

31 10. Packing Structure 1) Packing Process Reel A1W1S1 SPMWHT325AD5YBW0S0 A1W1S1 01 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII GLAV94001 / 1001 / 4,000 pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII LEVEL 2a Aluminum Vinyl Bag A1W1S1 SPMWHT325AD5YBW0S0 A1W1S1 01 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII GLAV94001 / 1001 / 4,000 pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII Material : Paper(SW3B(B)) TYPE SIZE(mm) L W H 7inch SIDE A1W1S1 SPMWHT325AD5YBW0S0 A1W1S1 01 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII GLAV94001 / 1001 / 40,000 pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII [Box Label] H CHIP LED L W / 52

32 2) Aluminum Packing Bag A1W1S1 SPMWHT325AD5YBW0S0 A1W1S1 01 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII GLAW94001 / I001 / 4,000 pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII Silica gel & Humidity Indicator Card in Aluminum Vinyl Bag 32 / 52

33 11. Precaution for use 1) For over-current-proof function, customers are recommended to apply resistors to prevent sudden change of the current caused by slight shift of the voltage. 과전류 방지를 위해 전압의 미세한 이동에 의해 야기되는 전류의 순간 변화를 방지하기 위해 저항 등의 설치를 권장함. 2) This device should not be used in any type of fluid such as water, oil, organic solvent, etc. When washing is required, IPA is recommended to use. 제품은 물, 오일, 유기물과 같은 액체 타입에서의 사용은 제한되며, 세정이 필요할 시에는 IPA 사용을 권장함. 3) When the LEDs illuminate, operating current should be decided after considering the ambient maximum temperature. LED의 발광 시, 동작 전류는 주변 최고온도를 고려하여 결정되어야 함. 4) LEDs must be stored in a clean environment. If the LEDs are to be stored for 3 months or more after being shipped from Samsung Electronics, they should be packed by a sealed container with nitrogen gas injected.(shelf life of sealed bags: 12 months, temp. ~40, ~90%RH) LED의 보관은 청정한 환경에서 보존되어져야 하며, 만약 삼성전자로부터 공급받는 후 3개월 또는 그 이상 보관이 필요하다면 질소 가스를 동봉한 보존용기에 보관되어야 함. (보존 bag의 수명 : 12 개월, 보존 온도 ~40, 습도 ~90%RH) 5) After storage bag is open, device subjected to soldering, solder reflow, or other high temperature processes must be: 보존 Bag이 개봉된 후에, 납땜이나 reflow등의 높은 온도에 노출되는 제품은 다음의 사항에 부합되어야 함. a. Mounted within 672 hours(28 days) at an assembly line with a condition of no more than 30 /60%RH, a. 제품은 30 /60%RH보다 같거나 낮은 조립조건에서 672시간(28일)이내에 조립해야 함. b. Stored at <10%RH. b. 10% 이하의 상대습도에서 보관되어야 함. 6) Repack unused Products with anti-moisture packing, fold to close any opening and then store in a dry place. 사용하지 않은 제품은 방습팩에 넣어 개봉 부위를 닫아서 다시 포장한 후, 건조한 장소에서 보관할 것을 권장함 / 52

34 7) Devices require baking before mounting, if humidity card reading is >60% at 23±5. 만약 습도표시카드의 수치가 23±5 에서 60% 이상이라면, 제품 실장 전에 baking해야 함. 8) Devices must be baked for 1 hour at 65±5, if baking is required. 만약 baking이 필요하다면, 제품은 65±5 에서 1시간 정도 baking 되어야 함. 9) The LEDs are sensitive to the static electricity and surge. It is recommended to use a wrist band or anti-electrostatic glove when handling the LEDs. LED는 정전기 및 서지에 민감한 제품이므로, LED 제품을 다룰 시에는 정전기 방지장갑이나 손목밴드를 사용하기를 권장함. If voltage exceeding the absolute maximum rating is applied to LEDs, it may cause damage or even destruction to LED devices. 만약 절대 허용치를 초과하는 전압이 LED에 가해지면, LED 소자는 파괴되거나 손상될 수 있음. Damaged LEDs may show some unusual characteristics such as increase in leak current, lowered turn-on voltage, or abnormal lighting of LEDs at low current. 손상된 제품은 누설전류의 증가, Turn on 전압의 저하, 저 전류에서의 점등불량 등의 이상 거동을 보일 수 있음. 10) VOCs (Volatile Organic Compounds) can be generated from adhesives, flux, hardener or organic additives used in luminaires(fixtures). Transparent LED silicone encapsulant is permeable to those chemicals and they may lead a discoloration of encapsulant when they exposed to light and heat. VOCs(휘발성 유기 화합물)는 등기구에 사용되는 접착제, Flux, 경화제, 유기물 첨가제에서 발생하여 LED의 실리콘 봉지제를 투과하고, 빛 또는 열에 노출되었을 때 변색이 발생 할 수 있음. This phenomenon can cause a significant loss of light emitted(output) from the luminaires(fixture). 이러한 현상은 등기구로부터 나오는 빛의 중대한 손실을 줄 수 있음. In order to prevent these problems, we recommend you to know the physical properties of materials used in luminaires, They must be selected carefully. 이러한 문제 발생 방지를 위해서, 등기구에 사용되는 자재에 대한 물성을 알고 주의하여 선택 되어야함 / 52

35 11) Risk of Sulfurization(or Tarnishing) The LED from Samsung Electronics uses a silver-plated lead frame and its surface color may change to black(or dark colored) when it is exposed to sulfur (S), chlorine (Cl) or other halogen compound. 삼성전자의 LED는 Ag(은)을 도금한 리드프레임을 사용함. 이 리드프레임의 표면이 황(S), 염소(Cl), 또는 다른 할로겐 화합물들에 노출시 Ag(은)은 검정(또는 어두운색)으로 바뀔 수 있음. Sulfurization of lead frame may cause intensity degradation, change of chromaticity coordinates and, in extreme cases, open circuit. It requires caution. 리드 프레임의 황화(Sulfurization)는 광량 저하, 색좌표 변화 및 심한 경우 LED 무등(Open) 불량을 일으킬 수도 있으니 주의가 필요함. Due to possible sulfurization of lead frame, LED should not be used and stored together with oxidizing substances made of materials in a following list, : Rubber, plain paper, lead solder cream and so on. 리드 프레임 황화(Sulfurization)의 근원이 될 수 있으니 LED는 아래의 목록으로 만들어진 산화성 물질들과 함께 저장, 사용이 불가함 : 고무, 일반 종이, 납땜 크림 등 35 / 52

36 12. Hazard Substance Analysis Report 36 / 52

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52 Revision History Date No. Revision History Drawn Writer Approved New version J.W.PARK Y.T.KIM 기종명 변경 : MP36S LM362A J.W.PARK Y.T.KIM 유의사항에 VOCs 문구 추가 J.W.PARK Y.T.KIM Cx, Cy tol. 변경 : ±0.01 ±0.005 J.W.PARK Y.T.KIM CRI K 기종 추가 J.W.PARK Y.T.KIM 52 / 52

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