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1 Rev: 001 Product Family Data Sheet LM561B Middle Power LED for High CRI Introduction Features Beam Angle: 120 Precondition : JEDEC Level 2a Dimension : 5.6 x 3.0 x 0.8 mm ESD withstand Voltage : up to ± 5KV [HBM] Applications INDOOR LIGHTING : Ambient Light, LED tube, Down light, LED bulb and Ceiling Light SAMSUNG ELECTRONICS 95, Samsung2-Ro, Giheung-Gu, Yongin-City, Gyeonggi-Do , KOREA 1 / 47

8 mm ESD withstand Voltage : up to ± 5KV [HBM] Applications INDOOR LIGHTING : Ambient Light, LED tube, Down

2 Contents 1. Product Code Information Characteristics Typical Characteristics Graph Outline Drawing & Dimension Reliability Test Items & Conditions Solder Conditions Tape & Reel Label Structure Packing Structure Precaution For Use Hazard Substance Analysis Report Revision History / 47

Reliability Test Items & Conditions ----------------------- 14 6. Solder Conditions ----------------------- 15 7. Tape & Reel ----------------------- 16 8.

3 1. Product Code Information 1) Luminous Flux Bins (T s = 25 ) Nominal CCT Product Code Flux Rank Sorting Condition Flux Range (Φv, lm) SY 20.0 ~ K SPMWHT541MD7WAW S0 SZ 22.0 ~ 24.0 S ~ 26.0 SY 20.5 ~ K SPMWHT541MD7WAV S0 SZ 22.5 ~ 24.5 S ~ 26.5 SY 22.0 ~ K SPMWHT541MD7WAU S0 SZ 24.0 ~ 26.0 S ~ 28.0 SY 23.0 ~ K SPMWHT541MD7WAT S0 SZ 25.0 ~ 27.0 S ~ 29.0 Notes: 1)SAMSUNG ELECTRONICS maintains a tolerance of ±5% on Luminous Flux measurements. 2)Warm white : " " can be "0"(Whole Bin), "H"(Half Bin) or "M"(Quarter Bin) of the color binning. 3 / 47

0 ~ 26.0 S1 26.0 ~ 28.0 SY 23.0 ~ 25.0 4000K SPMWHT541MD7WAT S0 SZ 25.0 ~ 27.0 S1 27.0 ~ 29.

4 2) Color Bins (T s = 25 ) 2-1) Color Binning Nominal CCT Product Code Color Rank Chromaticity Bins SPMWHT541MD7WAW0S0 W0(Whole bin) W1, W2, W3, W4, W5, W6, W7, W8, W9, WA, WB, WC, WD, WE, WF, WG 2700K SPMWHT541MD7WAWHS0 WH(Half bin) W5, W6, W7, W8 W9, WA, WB, WC SPMWHT541MD7WAWMS0 WM(Quarter bin) W6, W7, WA, WB SPMWHT541MD7WAV0S0 V0(Whole bin) V1, V2, V3, V4, V5, V6, V7, V8, V9, VA, VB, VC, VD, VE, VF, VG 3000K SPMWHT541MD7WAVHS0 VH(Half bin) V5, V6, V7, V8 V9, VA, VB, VC SPMWHT541MD7WAVMS0 VM(Quarter bin) V6, V7, VA, VB SPMWHT541MD7WAV0S0 U0(Whole bin) U1, U2, U3, U4, U5, U6, U7, U8, U9, UA, UB, UC, UD, UE, UF, UG 3500K SPMWHT541MD7WAVHS0 UH(Half bin) U5, U6, U7, U8 U9, UA, UB, UC SPMWHT541MD7WAVMS0 UM(Quarter bin) U6, U7, UA, UB SPMWHT541MD7WAT0S0 T0(Whole bin) T1, T2, T3, T4, T5, T6, T7, T8, T9, TA, TB, TC, TD, TE, TF, TG 4000K SPMWHT541MD7WATHS0 TH(Half bin) T5, T6, T7, T8, T9, TA, TB, TC SPMWHT541MD7WATMS0 TM(Quarter bin) T6, T7, TA, TB 4 / 47

VD, VE, VF, VG 3000K SPMWHT541MD7WAVHS0 VH(Half bin) V5, V6, V7, V8 V9, VA, VB, VC SPMWHT541MD7WAVMS0 VM(Quarter bin) V6, V7, VA, VB SPMWHT541MD7WAV0S0 U0(Whole bin) U1, U2, U3, U4, U5, U6, U7, U8,

5 2-2) Chromaticity Region & Coordinates 5 / 47

6 2-3) Chromaticity Region & Coordinates Region CIE X CIE Y Region CIE X CIE Y W rank (2700K) W1 W2 W3 W4 W5 W6 W7 W W WA WB WC WD WE WF WG Region CIE X CIE Y Region CIE X CIE Y V rank (3000K) V1 V2 V3 V4 V5 V6 V7 V V VA VB VC VD VE VF VG / 47

4589 0.4021 0.4695 0.4207 0.4538 0.3931 0.4641 0.4112 0.4538 0.3931 0.4641 0.4112 0.4589 0.4021 0.4695 0.4207 WC 0.4646 0.4034 0.4756 0.4221 0.4593 0.3944 0.4700 0.4126 0.4418 0.3981 0.4513 0.4164 0.

7 2) Chromaticity Region & Coordinates (Continued) Region CIE X CIE Y Region CIE X CIE Y U rank (3500K) U1 U2 U3 U4 U5 U6 U7 U U UA UB UC UD UE UF UG Region CIE X CIE Y Region CIE X CIE Y T rank (4000K) T1 T2 T3 T4 T5 T6 T7 T T TA TB TC TD TE TF TG Notes: SAMSUNG ELECTRONICS maintains ±0.005 tolerance of Cx, Cy 7 / 47

4116 0.3865 0.4186 0.4037 0.4082 0.3782 0.4150 0.3950 0.4082 0.3782 0.4150 0.3950 0.4116 0.3865 0.4186 0.4037 UC 0.4183 0.3898 0.4259 0.4073 0.4147 0.3814 0.4221 0.3984 0.3915 0.3768 0.3968 0.3930 0.

8 2. Characteristics 1) Absolute Maximum Rating Item Symbol Rating Condition Operating temperature range Top -40 ~ Storage temperature range Tstg -40 ~ LED junction temperature TJ Forward Current IF 150 ma - Peak Pulsed Forward Current IFP 300 ma Duty 1/10 pulse width 10ms Thermal resistance Rth, j-s 16 /W Junction to solder point Assembly Process Temperature - 260, < 10sec - ESD - 5kV HBM 2) Electro-optical Characteristics Item Unit Nominal CCT Product Code Rank Min Typ Max Forward Voltage (V F) (@65 ma, Ts = 25 ) Luminous Flux (Φv) (@65 ma, Ts = 25 ) Reverse Voltage (@5 ma, Ts = 25 ) AZ A V - - WA A A A K (W ) 3000K (V ) lm 3500K (U ) 4000K (T ) SY *WAW S0 SZ S SY *WAV S0 SZ S SY *WAU S0 SZ S SY *WAT S0 SZ S V Color Rendering Index(Ra) Special CRI (R9) Notes: 1) SAMSUNG ELECTRONICS maintains a tolerance of V F:±0.1 V, Φ v :±5 %, R a :±3.0, R9 :±6.5 on measurements 2) " * " is Product Code of "SPMWH 541MD7". 8 / 47

ESD - 5kV HBM 2) Electro-optical Characteristics Item Unit Nominal CCT Product Code Rank Min Typ Max Forward Voltage (V F) (@65 ma, Ts = 25 ) Luminous Flux (Φv) (@65 ma, Ts = 25 ) Reverse Voltage (@5

9 3. Typical Characteristics Graph (T s = 25 ) 1) Spectrum Distribution [CCT : 2700K & 3000K] [CCT : 3500K & 4000K] 9 / 47

10 2) Forward Current Characteristics [Relative Luminous Flux vs. Forward Current] (T s = 25 ) [Forward Current vs. Forward Voltage] (T s = 25 ) 10 / 47

11 3) Temperature Characteristics [Relative Luminous Flux vs. Ts] (I F = 65mA) [Forward Voltage vs. Ts] (I F = 65mA) 11 / 47

12 4) Color shift Characteristics [Color Δx, Δy vs. Forward Current] (T s = 25 ) [Color Δx, Δy vs. Ts] (I F = 65mA) 12 / 47

13 5) Derating Curve 6) Beam Angle Characteristics 13 / 47

14 4. Outline Drawing & Dimension 1. Tolerance is ±0.10 mm 2. The maximum compressing force is 15N on the body a 3. Do not place pressure on the encapsulation resin b Left Side View Top View Bottom View Anode Mark a b Cathode Anode Front View Recommended Land Pattern Notes: 1) This LED has built-in ESD protection device(s) connected in parallel to LED Chip(s). 2) Ts point & measurement method 1 Measure the nearest point to the thermal pad. If necessary, remove PSR of PCB to reach Ts point. 2 Thermal pad must be soldered to the PCB to dissipate heat properly. Otherwise, LED can be damaged. 3) Precautions 1 The pressure on the LEDs will influence to the reliability of the LEDs. Precautions should be taken to avoid the strong pressure on the LEDs. Do not put stress on the LEDs during heating. 2 Re-soldering should not be done after the LEDs have been soldered. If re-soldering is unavoidable, LED`s characteristics should be carefully checked before and after such repair. 3 Do not stack assembled PCBs together. Since materials of LEDs is soft, abrasion between two PCB assembled with LED might cause catastrophic failure of the LEDs / 47

device(s) connected in parallel to LED Chip(s). 2) Ts point & measurement method 1 Measure the nearest point to the thermal pad. If necessary, remove PSR of PCB to reach Ts point.

15 5. Reliability Test Items and Conditions 1) Test Items Test Item MSL Test Room Temperature life test High Temperature life test High Temperature humidity life test Low Temperature life test Powered Temperature Cycle test Thermal Shock High Temperature Storage Low Temperature Storage ESD(HBM) Test Conditions hrs drying 60, 60 %RH 120hrs sec 3 cycles Test Hours/Cycles Sample No 1 cycle ±3, DC150 ma 1,000 hrs ±3, DC150 ma 1,000 hrs ±3, 85 %±2 %RH, DC150 ma 1,000 hrs ±3, DC150 ma 1,000 hrs /20 min 85 /20 min, Sweep 100min cycle on/off: each 5 min, DC 150mA -45 /15 min 125 /15 min Hot plate cycle cycle 100 Ta=120 ± hrs 11 Ta=-40 ± hrs 11 R1:10 MΩ, R2:1.5 kω, C:100 pf, V = ±5 kv 5 times 5 ESD(MM) Vibration Test R1:10 MΩ, R2: 0, C:200 pf, V = ±0.5 kv 20~2000~20 Hz 200 m/sz, Sweep 4 min X, Y, Z 3 direction, each 1 cycle 5 times 5 4 cycles 11 Mechanical Shock Test 1500G, 0.5 ms, 3 shocks each X-Y-Z axis 5 cycles 11 2) Criteria for Judging the Damage Item Symbol Test Condition Min Limit Max Forward Voltage VF IF = 65 ma Init. Value*0.9 Init. Value*1.1 Luminous Flux Φ v IF = 65 ma Init. Value*0.7 Init. Value* / 47

cycle 11 25 ±3, DC150 ma 1,000 hrs 22 85 ±3, DC150 ma 1,000 hrs 22 85 ±3, 85 %±2 %RH, DC150 ma 1,000 hrs 22-40 ±3, DC150 ma 1,000 hrs 22-45 /20 min 85 /20 min, Sweep 100min cycle on/off: each 5 min,

16 6. Solder Conditions 1) Reflow Conditions ( Pb Free ) Reflow Frequency : 2 times max. 2) For Manual Soldering Not more than 5 300, under soldering iron / 47

2) For Manual Soldering Not more than 5 seconds

17 7. Tape & Reel 1) Taping Dimension (unit : mm) Anode Mark (Cutting side) Tapping Diretion End Start More than 500mm Unloaded tape Mounted with LED package More than 100~200mm Unloaded tape Leading part more than 500mm 17 / 47

Unloaded tape Mounted with LED package More than 100~200mm

18 2) Reel 1) Reel Dimension (max 2,500 pcs) (1) Quantity : The quantity/reel to be 2,500 pcs. (2) Cumulative Tolerance : Cumulative tolerance/10 pitches to be ±0.2mm (3) Adhesion Strength of Cover Tape : Adhesion strength to be N when the cover tape is turned off from the carrier tape at 10 angle to be the carrier tape. (4) Packaging : P/N, Manufacturing data code no. and quantity to be indicated on a damp proof Package / 47

2mm (3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.

19 8. Label Structure 1) Label Structure abcdef A1 1SY SPMWHT541MD7WA 0S0 A1 1SY 01 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII GLAW94001 / 1001 / 2,500 pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII Rank Code N.B) Denoted rank is the only example. ' ' means All kind of Chromaticity Coordinate Rank. Rank Code ab : Forward Voltage(V F) Rank (refer to page. 7) cd : Chromaticity Coordinate Rank (refer to page. 5~6) ef : Luminous Flux(Φ v, lm) Rank (refer to page. 3) 2) LOT Number The Lot number is composed of the following characters A1 1SY SPMWHT541MD7WA 0S0 A1 1SY 01 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII GLAW94001 / 1001 / 2,500 pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII / 1abc / 2,500 PCS : Production Site (S:SAMSUNG ELECTRONICS, G:TIAJIN CHINA) : L (LED) : Product State (A:Normality, B:Bulk, C:First Production, R:Reproduction, S:Sample) : Year (V:2011, W:2012, X: ) 5 : Month (1 ~ 9, A, B) 6 : Day (1 ~ 9, A, B ~ V) 789 : SAMSUNG ELECTRONICS LED Product number (1 ~ 999) abc : Reel Number (1 ~ 999) 19 / 47

7) cd : Chromaticity Coordinate Rank (refer to page. 5~6) ef : Luminous Flux(Φ v, lm) Rank (refer to page.

20 9. Packing Structure 1) Packing Process (The quantity of PKG on the Reel to be Max 2,500 pcs) Reel A1 1SY SPMWHT541MD7WA 0S0 A1 1SY 01 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII GLAW94001 / 1001 / 2,500 pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII LEVEL 2a Aluminum Vinyl Bag A1 1SY SPMWHT541MD7WA 0S0 A1 1SY 01 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII GLAW94001 / 1001 / 2,500 pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII Material : Paper(SW3B(B)) TYPE SIZE(mm) L W H 7inch 245±5 220±5 182±5 1 SIDE A1 1SY SPMWHT541MD7WA 0S0 A1 1SY 01 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII GLAW94001 / 1001 / 25,000 pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII H CHIP LED L W / 47

01 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII GLAW94001 / 1001 / 2,500 pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII Material : Paper(SW3B(B)) TYPE SIZE(mm) L W H 7inch 245±5

21 2) Aluminum Packing Bag A1 1SY SPMWHT541MD7WA 0S0 A1 1SY 01 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII GLAW94001 / 1001 / 2,500 pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII Silica gel & Humidity Indicator Card in Aluminum Vinyl Bag 21 / 47

22 10. Precaution for use 1) For over-current-proof function, customers are recommended to apply resistors to prevent sudden change of the current caused by slight shift of the voltage. 과전류 방지를 위해 전압의 미세한 이동에 의해 야기되는 전류의 순간 변화를 방지하기 위해 저항 등의 설치를 권장함. 2) This device should not be used in any type of fluid such as water, oil, organic solvent, etc. When washing is required, IPA is recommended to use. 제품은 물, 오일, 유기물과 같은 액체 타입에서의 사용은 제한되며, 세정이 필요할 시에는 IPA 사용을 권장함. 3) When the LEDs illuminate, operating current should be decided after considering the ambient maximum temperature. LED의 발광 시, 동작 전류는 주변 최고온도를 고려하여 결정되어야 함. 4) LEDs must be stored in a clean environment. If the LEDs are to be stored for 3 months or more after being shipped from Samsung Electronics, they should be packed by a sealed container with nitrogen gas injected.(shelf life of sealed bags: 12 months, temp. ~40, ~90%RH) LED의 보관은 청정한 환경에서 보존되어져야 하며, 만약 삼성전자로부터 공급받는 후 3개월 또는 그 이상 보관이 필요하다면 질소 가스를 동봉한 보존용기에 보관되어야 함. (보존 bag의 수명 : 12 개월, 보존 온도 ~40, 습도 ~90%RH) 5) After storage bag is open, device subjected to soldering, solder reflow, or other high temperature processes must be: 보존 Bag이 개봉된 후에, 납땜이나 reflow등의 높은 온도에 노출되는 제품은 다음의 사항에 부합되어야 함. a. Mounted within 672 hours(28 days) at an assembly line with a condition of no more than 30 /60%RH, a. 제품은 30 /60%RH보다 같거나 낮은 조립조건에서 672시간(28일)이내에 조립해야 함. b. Stored at <10%RH. b. 10% 이하의 상대습도에서 보관되어야 함. 6) Repack unused Products with anti-moisture packing, fold to close any opening and then store in a dry place. 사용하지 않은 제품은 방습팩에 넣어 개봉 부위를 닫아서 다시 포장한 후, 건조한 장소에서 보관할 것을 권장함 / 47

23 7) Devices require baking before mounting, if humidity card reading is >60% at 23±5. 만약 습도표시카드의 수치가 23±5 에서 60% 이상이라면, 제품 실장 전 baking해야 함. 8) Devices must be baked for 1 hour at 60±5, if baking is required. 만약 baking이 필요하다면, 제품은 60±5 에서 1시간 정도 baking 되어야 함. 9) The LEDs are sensitive to the static electricity and surge. It is recommended to use a wrist band or anti-electrostatic glove when handling the LEDs. LED는 정전기 및 서지에 민감한 제품이므로, LED 제품을 다룰 시에는 정전기 방지장갑이나 손목밴드를 사용하기를 권장함. If voltage exceeding the absolute maximum rating is applied to LEDs, it may cause damage or even destruction to LED devices. 만약 절대 허용치를 초과하는 전압이 LED에 가해지면, LED 소자는 파괴되거나 손상될 수 있음. Damaged LEDs may show some unusual characteristics such as increase in leak current, lowered turn-on voltage, or abnormal lighting of LEDs at low current. 손상된 제품은 누설전류의 증가, Turn on 전압의 저하, 저 전류에서의 점등불량 등의 이상 거동을 보일 수 있음. 10) VOCs (volatile organic compounds) can be generated from adhesives, flux, hardener or organic additives used in luminaires (fixtures). Transparent LED silicone encapsulant is permeable to those chemicals and they may lead a discoloration of encapsualnt when they expose to heat or light. VOCs(휘발성 유기 화합물)는 등기구에 사용되는 접착제, Flux, 경화제, 유기물 첨가제에서 발생하여 LED 실리콘 봉지제를 투과하고, 빛 또는 열에 노출되었을 때 변색이 발생 할 수 있음. This phenomenon can cause a significant loss of light emitted(output) from the luminaires(fixtures). 이러한 현상은 등기구로부터 나오는 빛의 중대한 손실을 줄 수 있음. In order to prevent these problems, we recommend you to know the physical properties of the materials used in luminaires, They must be selected carefully. 이러한 문제 발생 방지를 위해서, 등기구에 사용되는 자재에 대한 물성을 알고 주의하여 선택 되어야함 / 47

24 11) Risk of Sulfurization (or Tarnishing) The LED from Samsung Electronics uses a silver-plated lead frame and its surface color may change to black(or dark colored) when it is exposed to sulfur(s), chlorine (Cl) or other halogen compound. 삼성전자의 LED는 Ag(은)을 도금한 리드프레임을 사용함. 이 리드프레임의 표면이 황(S), 염소(Cl), 또는 다른 할로겐 화합물들에 노출시 Ag(은)은 검정(또는 어두운색)으로 바뀔 수 있음. Sulfurization of lead frame may cause intensity degradation, change of chromaticity coordinates and, in extreme cases, open circuit. It requires caution. 리드 프레임의 황화(Sulfurization)는 광량 저하, 색좌표 변화 및 심한 경우 LED 무등(Open) 불량을 일으킬 수도 있으니 주의가 필요함. Due to possible sulfurization of lead frame, LED should not be used and stored together with oxidizing substances made of materials in a following list, : Rubber, plain paper, lead solder cream and so on. 리드 프레임 황화(Sulfurization)의 근원이 될 수 있으니 LED는 아래의 목록으로 만들어진 산화성 물질들과 함께 저장, 사용이 불가함 : 고무, 일반 종이, 납땜 크림 등 24 / 47

25 11. Hazard Substance Analysis 1) RoHS 25 / 47

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32 2) REACH (SVHC) 32 / 47

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47 Revision History Date No. Revision History Drawn Writer Approved New Version W.H Jung S.B Yun 47 / 47

Contents 1. Product Code Information Characteristics Typical Characteristics Graph

Contents 1. Product Code Information Characteristics Typical Characteristics Graph Rev: 001 Product Family Data Sheet LM561B - 5630 Middle Power LED for ErP Introduction Features Beam Angle: 120 Precondition : JEDEC Level 2a Dimension : 5.6 x 3.0 x 0.8 mm ESD withstand Voltage : up to