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1 Journal of the Korean Ceramic Society Vol. 46, No. 5, pp.g 456~461, DOI: /KCERS Erosion Behavior of YAG Ceramics under Fluorine Plasma and their XPS Analysis Kyeong-Beom Kim, Daemin Kim, Jungki Lee*, Yoon-Suk Oh, Hyung-Tae Kim, Hyungsun Kim*, and Sung-Min Lee Korea Institute of Ceramic Engineering and Technology(Icheon), Gyeonggi-Do , Korea *School of Materials Engineering, Inha University, Incheon , Korea (Received July 14, 2009; Revised August 7, 2009; Accepted August 9, 2009) v YAG ƒ XPS ½ Á½ Á»*Á Á½xkÁ½x *Á w» l * w w œw ( ; ; ) ABSTRACT Chemical composition and status of chemical bonding of the YAG(Y O 12 ) ceramics after the exposure to fluorine plasma have been investigated using X-ray photoelectron spectroscopy, with the analysis on its erosion behavior. On the surface, F showed the maximum content, decreasing with depth, meanwhile the cation composition remained almost constant, irrespective of the position. The peaks due to Y in the reaction layer consisted of two kinds, showing the Y-O and Y-F bonds. These surface modifications under fluorine plasma seem to promote the erosion of the YAG ceramics. Excess addition of Al 2 or Y 2 into stoichiometric YAG produced 2nd phases of Al 2 and YAl, respectively, resulting in the slight difference in the local erosion rates. But, the overall average erosion rate was not sensitive to such excess additions of Al 2 or Y 2. Key words : YAG(Y O 12 ), Plasma resistance, Erosion, X-ray photoelectron spectroscopy 1. œ syƒ w v œ w w w ƒ š. 1) v œ yw y e w yw k v w w t w jš ƒ w. w v ƒ œ 2) w» w v w û, üv w k Ÿ w š. t üv Al 2 üv w Y 2 ƒ k š. -10) Y 2 ƒ w üv wù šƒ Y 2 Al 2 t yw Y O 12 w ƒ Corresponding author : Sung-Min Lee smlee@kicet.re.kr Tel : Fax : w š. Y O 12 garnet ƒ š YAG(yttrium aluminum garnet). k Y 2, Al 2 yww wš x œ w ù v w gq t š. ù YAG w š Y 2, Al 2 1~2% sww YAG yw Y O 12 ù. w yƒ 11) YAG ƒ v y üv e w. wr YAG ƒ v ƒ» w yw. ƒ Si e y t w SiF x yw x wš yw { mw ƒ. 2) ù ò 90 C û o SiF x YAG yw AlF, YF 1291 o C, 187 C o š2,12) Al Y w y ƒ Si w ùkú 456
2 457 ½ Á½ Á»*Á Á½xkÁ½x Á ƒ. YAG v k z ƒ rl w XPS w t l ¾ y yw k w. mw v YAG ƒ ƒ w. w yw YAG Al 2 Y 2 ƒ ƒƒ ƒ YAG ƒ w y wš v üv p r š w. 2. x v z XPS t w YAG (99.999%, (100), MTI Corp., USA) w. w üv sƒw» w YAG xr w» w š ù (AES-11, Sumitomo Chemical Co., Japan) š p (C-grade, H. C. Starck, Germany) w. yw YAG yw Al 2, Y 2 ƒ 6wt% ƒ ƒ ƒ w. (Darvan-C, R. T. Banderbilt Co., USA) 0.2 wt% ƒw, Al 2 w 24 w. yw w v p w z 80 o C 12 ƒ wš w w ƒ w w. 10 mm jš 1 xw z þ x»(cold Isostatic Press) w 200 MPa Ì 2mm x. x x r»»w 10 o C/min 1700 o C¾ w z 2 wš þw w. óù xr 1µm r p w w t m w. w xr w xr (0001) q (Ÿw, q lj, w ) w. w xr t s 0. mm fm l v w kw. ü v sƒw ƒ e ICP (Inductively Coupled Plasma)x ƒ e(nie150, ( )NTM, w ) w. ƒƒ CF 4 O 2 w š v k 60 w ƒ Table 1 ùkü. v w YAG t l ¾ yw yw w k w» w XPS (K-Alpha, Thermo Scientific, UK) w. X ev ƒ Al Kα Table 1. Plasma Etching Conditions Parameter Condition RF power, W 600 RF power (bias), W 200 CF 4, SCCM 0 O 2, SCCM 5 Ar, SCCM 10 Pressure, mtorr 10 w, Ar w 87 t rl w XPS w. w r YAG w» w š X- z»(d/max-2500, Rigaku, Japan) w 15 kv, 0 ma 10 o /min xr ew z ql. v t y w» w xr gqw z FE-SEM (JSM-6701F, Jeol, Japan) w w. w xr ƒ¾ y surface profiler (surfcorder ET000, Kosaka Lab., Japan) w d w.. m Fig. 1 rl ƒ y š. rl ³ w w, F O w ¾ j ywš. ƒ t F Oƒ 1:1 w ƒ ¾ w w wš ƒw. v k w ƒ k,,»q w ƒw ( ) bias w xr t w. w ƒ d w. F, O yƒ j ù w Y, Al yƒ j yw j ù» ƒw. t d y yw k y j w (Fig. 2). t ƒ¾ Y Al» w Ÿ ƒ ƒw. XPS» ƒ w ú. 1) Fig. 1 t d» ƒ F w ew x. Y, Al F w û ƒ w wz
3 v YAG ƒ XPS 458 Fig. 1. Variation of chemical compositions with the sputtering time of the YAG surface after the exposure to fluorine plasma : (a) cation and (b) anion. y w» w vjƒ w ùkù Y Ÿ rp w. d ùkù Y» w rp d 5/2 d /2» w vj, vj j» :2 w š, 2 ev ƒ š š š š. 14) w k Y vj rp w Y» w vj ƒ Y vjƒ ƒ û Y vj 60% j» ùkû (Fig. ). Y-F w w Y Y-O w w Y 60% w w Fig. 1 50% w ùkû. t F/O ƒ 1 ƒ¾ ù, F ƒƒ (-1) (-2) O Y-F Fig. 2. Photoelectron spectrums for (a) Al and (b) Y atoms with the sputtering time of the YAG surface after the exposure to fluorine plasma. w w Y Y-O w w Y w». v w ƒ v w e w yw w ƒ w ù. 1,2,12) Y O 12 v w ƒ y ƒ w. x t d y 50%, y Al, Y y k Al, Y ƒ w ú. Y yw YF y yw Y 2 ƒƒ 187 o C, 2690 C y o Y yw rl». v w ƒ t yƒ 46«5y(2009)
4 김경범 김대민 이정기* 오윤석 김형태 김형순 이성민 459 Fig.. Peak separation of photoelectron spectrum for Y atom on the surface after 6 sec sputtering of the YAG surface after the exposure to fluorine plasma.. X-ray diffraction patterns for the stoichiometric, Al2Orich and Y2O-rich YAG ceramics sintered at 1700oC for 2 h. Fig. 4 진행되고 불소화된 표면이 물리적 식각으로 제거되는 것 으로 추정할 수 있다. 따라서 YAG 세라믹스의 식각율은 주어진 플라즈마 조건에서 표면층의 불소화가 어느 정도 일어나는지, 그리고 생성된 표면층이 얼마나 빨리 스퍼터 링되는 지에 따라 변화할 수 있다. Fig. 4는 화학양론적 Y Al O 와 여기에 Al O 와 Y O 가 각각 과량으로 추가된 조성의 X선 회절 결과를 보여 주고 있다. 화학양론적 Y Al O 에는 YAG 상만이 관찰 되는데 비하여 Al O -rich 조성에서는 Al O 상이 추가로 관찰되었고, Y O -rich 조성에서는 YAlO 조성의 YAP (Yttrium Alumina Perovskite)상이 관찰되었다. 이는 Al O Y O 의 상태도에서 일부 예측되는 것으로 소결 후 급속 한 로냉에 따라 고온에서 안정한 YAlO 가 상온에서도 존 한국세라믹학회지 Fig. 5. Microstructures before fluorine plasma exposure for the (a) stoichiometric, (b) Al2O-rich and (c) Y2O-rich YAG ceramics sintered at 1700oC for 2 h. 재하는 것을 알 수 있다. 제조된 YAG, Al-rich YAG, Y-rich YAG의 플라즈마 식 각 전후의 미세구조를 Figs. 5, 6에 나타내었다. 반사전사 현미경에서 관찰하였을 때 Y의 함량이 높을수록 밝게 나 타나는데 EDX 성분분석결과에서도 X선 회절분석에서 나 타난 결정상 생성 결과를 확인할 수 있었다. Al-rich YAG 에서 검게 나타나는 부분은 Al O 만으로 이루어져 있는 것이 확인되었고, Y-rich YAG에서 밝은 부분이 Y을 더욱 많이 포함하고 있는 것이 확인되었다. 이들 시험편을 불 소계 플라즈마로 식각하는 경우 결정상에 따라 식각율의 2
5 불소계 플라즈마에 노출된 YAG 세라믹스의 식각거동 및 XPS 분석 Fig Average erosion depths after fluorine plasma exposure for 1 h. 깊이에는 큰 영향을 주지 않기 때문으로 판단된다. 즉 식 각율의 관점에서 내플라즈마성을 평가한다면 화학양론적 YAG 조성에서 일정부분 조성이 벗어난다고 하더라도 내 플라즈마성이 크게 달라지지 않는다고 할 수 있다. 4. 결 론 불소계 플라즈마에 노출된 YAG 단결정 표면에서 깊이 에 따른 조성과 화학적 상태의 변화를 XPS를 사용하여 관찰하였다. 노출된 표면에서 F의 농도가 가장 높아 O의 농도와 유사하였으나 깊이에 따라 점차적으로 F의 농도 가 감소하였다. 그러나 깊이에 따른 Y, Al의 농도차이는 관찰되지 않았다. 표면층의 Y 분석에서 서로 다른 두 가 지의 바인딩 에너지를 가지는 XPS 피크가 동시에 관찰 되었는데, 이는 Y과 전기음성도가 높은 F의 결합이 표면 반응층에서 추가적으로 존재하기 때문으로 추정되었다. 화학양론적인 YAG 조성에서 Al O, Y O 가 각각 과량으 로 포함된 YAG 를 제조한 결과 이차 상으로 Al O 와 YAlO 상을 관찰할 수 있었다. 이들 시험편을 불소계 플 라즈마에 노출하였을 때 미세구조상에서 결정상에 따라 식각깊이의 미세한 차이를 발견할 수 있었으나 평균 식 각깊이에는 큰 영향을 끼치지 않는 것으로 관찰되었다. 2 Fig. 6. Microstructures for the (a) stoichiometric, (b) Al2Orich and (c) Y2O-rich YAG ceramics sintered at 1700oC for 2 h after fluorine plasma exposure for 1 h. 차이가 미세하게 차이가 나는 것을 볼 수 있었다. Al O 의 식각율이 YAG상보다 높으며, YAG상의 식각율이 YAP 상보다 조금 더 높은 것으로 관찰되었다. Fig. 7은 불소계 플라즈마에 1시간 노출되었을 때 평균 적인 식각깊이를 측정한 결과를 보여주고 있다. YAG 계 세라믹스의 식각깊이가 표준물질인 사파이어와 비교하여 15%에 불과한 것으로 나타났고, 과량의 Al O 와 Y O 의 첨가에 따른 식각깊이의 차이는 크지 않는 것으로 나타 났다. 이러한 결과는 식각율이 높은 Al O 가 일부 존재한 다고 하더라도 고립 상으로 존재하기 때문에 평균 식각 Acknowledgment 본 연구는 지식경제부 소재원천기술개발사업의 연구비 지원으로 수행되었습니다. REFERENCES 1. G. S. May and C. J. Spanos, Fundamentals of Semicon- 제 46 권 제 5호(2009)
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