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1 Journal of the Korean Ceramic Society Vol. 46, No. 5, pp.g 456~461, DOI: /KCERS Erosion Behavior of YAG Ceramics under Fluorine Plasma and their XPS Analysis Kyeong-Beom Kim, Daemin Kim, Jungki Lee*, Yoon-Suk Oh, Hyung-Tae Kim, Hyungsun Kim*, and Sung-Min Lee Korea Institute of Ceramic Engineering and Technology(Icheon), Gyeonggi-Do , Korea *School of Materials Engineering, Inha University, Incheon , Korea (Received July 14, 2009; Revised August 7, 2009; Accepted August 9, 2009) v YAG ƒ XPS ½ Á½ Á»*Á Á½xkÁ½x *Á w» l * w w œw ( ; ; ) ABSTRACT Chemical composition and status of chemical bonding of the YAG(Y O 12 ) ceramics after the exposure to fluorine plasma have been investigated using X-ray photoelectron spectroscopy, with the analysis on its erosion behavior. On the surface, F showed the maximum content, decreasing with depth, meanwhile the cation composition remained almost constant, irrespective of the position. The peaks due to Y in the reaction layer consisted of two kinds, showing the Y-O and Y-F bonds. These surface modifications under fluorine plasma seem to promote the erosion of the YAG ceramics. Excess addition of Al 2 or Y 2 into stoichiometric YAG produced 2nd phases of Al 2 and YAl, respectively, resulting in the slight difference in the local erosion rates. But, the overall average erosion rate was not sensitive to such excess additions of Al 2 or Y 2. Key words : YAG(Y O 12 ), Plasma resistance, Erosion, X-ray photoelectron spectroscopy 1. œ syƒ w v œ w w w ƒ š. 1) v œ yw y e w yw k v w w t w jš ƒ w. w v ƒ œ 2) w» w v w û, üv w k Ÿ w š. t üv Al 2 üv w Y 2 ƒ k š. -10) Y 2 ƒ w üv wù šƒ Y 2 Al 2 t yw Y O 12 w ƒ Corresponding author : Sung-Min Lee smlee@kicet.re.kr Tel : Fax : w š. Y O 12 garnet ƒ š YAG(yttrium aluminum garnet). k Y 2, Al 2 yww wš x œ w ù v w gq t š. ù YAG w š Y 2, Al 2 1~2% sww YAG yw Y O 12 ù. w yƒ 11) YAG ƒ v y üv e w. wr YAG ƒ v ƒ» w yw. ƒ Si e y t w SiF x yw x wš yw { mw ƒ. 2) ù ò 90 C û o SiF x YAG yw AlF, YF 1291 o C, 187 C o š2,12) Al Y w y ƒ Si w ùkú 456

2 457 ½ Á½ Á»*Á Á½xkÁ½x Á ƒ. YAG v k z ƒ rl w XPS w t l ¾ y yw k w. mw v YAG ƒ ƒ w. w yw YAG Al 2 Y 2 ƒ ƒƒ ƒ YAG ƒ w y wš v üv p r š w. 2. x v z XPS t w YAG (99.999%, (100), MTI Corp., USA) w. w üv sƒw» w YAG xr w» w š ù (AES-11, Sumitomo Chemical Co., Japan) š p (C-grade, H. C. Starck, Germany) w. yw YAG yw Al 2, Y 2 ƒ 6wt% ƒ ƒ ƒ w. (Darvan-C, R. T. Banderbilt Co., USA) 0.2 wt% ƒw, Al 2 w 24 w. yw w v p w z 80 o C 12 ƒ wš w w ƒ w w. 10 mm jš 1 xw z þ x»(cold Isostatic Press) w 200 MPa Ì 2mm x. x x r»»w 10 o C/min 1700 o C¾ w z 2 wš þw w. óù xr 1µm r p w w t m w. w xr w xr (0001) q (Ÿw, q lj, w ) w. w xr t s 0. mm fm l v w kw. ü v sƒw ƒ e ICP (Inductively Coupled Plasma)x ƒ e(nie150, ( )NTM, w ) w. ƒƒ CF 4 O 2 w š v k 60 w ƒ Table 1 ùkü. v w YAG t l ¾ yw yw w k w» w XPS (K-Alpha, Thermo Scientific, UK) w. X ev ƒ Al Kα Table 1. Plasma Etching Conditions Parameter Condition RF power, W 600 RF power (bias), W 200 CF 4, SCCM 0 O 2, SCCM 5 Ar, SCCM 10 Pressure, mtorr 10 w, Ar w 87 t rl w XPS w. w r YAG w» w š X- z»(d/max-2500, Rigaku, Japan) w 15 kv, 0 ma 10 o /min xr ew z ql. v t y w» w xr gqw z FE-SEM (JSM-6701F, Jeol, Japan) w w. w xr ƒ¾ y surface profiler (surfcorder ET000, Kosaka Lab., Japan) w d w.. m Fig. 1 rl ƒ y š. rl ³ w w, F O w ¾ j ywš. ƒ t F Oƒ 1:1 w ƒ ¾ w w wš ƒw. v k w ƒ k,,»q w ƒw ( ) bias w xr t w. w ƒ d w. F, O yƒ j ù w Y, Al yƒ j yw j ù» ƒw. t d y yw k y j w (Fig. 2). t ƒ¾ Y Al» w Ÿ ƒ ƒw. XPS» ƒ w ú. 1) Fig. 1 t d» ƒ F w ew x. Y, Al F w û ƒ w wz

3 v YAG ƒ XPS 458 Fig. 1. Variation of chemical compositions with the sputtering time of the YAG surface after the exposure to fluorine plasma : (a) cation and (b) anion. y w» w vjƒ w ùkù Y Ÿ rp w. d ùkù Y» w rp d 5/2 d /2» w vj, vj j» :2 w š, 2 ev ƒ š š š š. 14) w k Y vj rp w Y» w vj ƒ Y vjƒ ƒ û Y vj 60% j» ùkû (Fig. ). Y-F w w Y Y-O w w Y 60% w w Fig. 1 50% w ùkû. t F/O ƒ 1 ƒ¾ ù, F ƒƒ (-1) (-2) O Y-F Fig. 2. Photoelectron spectrums for (a) Al and (b) Y atoms with the sputtering time of the YAG surface after the exposure to fluorine plasma. w w Y Y-O w w Y w». v w ƒ v w e w yw w ƒ w ù. 1,2,12) Y O 12 v w ƒ y ƒ w. x t d y 50%, y Al, Y y k Al, Y ƒ w ú. Y yw YF y yw Y 2 ƒƒ 187 o C, 2690 C y o Y yw rl». v w ƒ t yƒ 46«5y(2009)

4 김경범 김대민 이정기* 오윤석 김형태 김형순 이성민 459 Fig.. Peak separation of photoelectron spectrum for Y atom on the surface after 6 sec sputtering of the YAG surface after the exposure to fluorine plasma.. X-ray diffraction patterns for the stoichiometric, Al2Orich and Y2O-rich YAG ceramics sintered at 1700oC for 2 h. Fig. 4 진행되고 불소화된 표면이 물리적 식각으로 제거되는 것 으로 추정할 수 있다. 따라서 YAG 세라믹스의 식각율은 주어진 플라즈마 조건에서 표면층의 불소화가 어느 정도 일어나는지, 그리고 생성된 표면층이 얼마나 빨리 스퍼터 링되는 지에 따라 변화할 수 있다. Fig. 4는 화학양론적 Y Al O 와 여기에 Al O 와 Y O 가 각각 과량으로 추가된 조성의 X선 회절 결과를 보여 주고 있다. 화학양론적 Y Al O 에는 YAG 상만이 관찰 되는데 비하여 Al O -rich 조성에서는 Al O 상이 추가로 관찰되었고, Y O -rich 조성에서는 YAlO 조성의 YAP (Yttrium Alumina Perovskite)상이 관찰되었다. 이는 Al O Y O 의 상태도에서 일부 예측되는 것으로 소결 후 급속 한 로냉에 따라 고온에서 안정한 YAlO 가 상온에서도 존 한국세라믹학회지 Fig. 5. Microstructures before fluorine plasma exposure for the (a) stoichiometric, (b) Al2O-rich and (c) Y2O-rich YAG ceramics sintered at 1700oC for 2 h. 재하는 것을 알 수 있다. 제조된 YAG, Al-rich YAG, Y-rich YAG의 플라즈마 식 각 전후의 미세구조를 Figs. 5, 6에 나타내었다. 반사전사 현미경에서 관찰하였을 때 Y의 함량이 높을수록 밝게 나 타나는데 EDX 성분분석결과에서도 X선 회절분석에서 나 타난 결정상 생성 결과를 확인할 수 있었다. Al-rich YAG 에서 검게 나타나는 부분은 Al O 만으로 이루어져 있는 것이 확인되었고, Y-rich YAG에서 밝은 부분이 Y을 더욱 많이 포함하고 있는 것이 확인되었다. 이들 시험편을 불 소계 플라즈마로 식각하는 경우 결정상에 따라 식각율의 2

5 불소계 플라즈마에 노출된 YAG 세라믹스의 식각거동 및 XPS 분석 Fig Average erosion depths after fluorine plasma exposure for 1 h. 깊이에는 큰 영향을 주지 않기 때문으로 판단된다. 즉 식 각율의 관점에서 내플라즈마성을 평가한다면 화학양론적 YAG 조성에서 일정부분 조성이 벗어난다고 하더라도 내 플라즈마성이 크게 달라지지 않는다고 할 수 있다. 4. 결 론 불소계 플라즈마에 노출된 YAG 단결정 표면에서 깊이 에 따른 조성과 화학적 상태의 변화를 XPS를 사용하여 관찰하였다. 노출된 표면에서 F의 농도가 가장 높아 O의 농도와 유사하였으나 깊이에 따라 점차적으로 F의 농도 가 감소하였다. 그러나 깊이에 따른 Y, Al의 농도차이는 관찰되지 않았다. 표면층의 Y 분석에서 서로 다른 두 가 지의 바인딩 에너지를 가지는 XPS 피크가 동시에 관찰 되었는데, 이는 Y과 전기음성도가 높은 F의 결합이 표면 반응층에서 추가적으로 존재하기 때문으로 추정되었다. 화학양론적인 YAG 조성에서 Al O, Y O 가 각각 과량으 로 포함된 YAG 를 제조한 결과 이차 상으로 Al O 와 YAlO 상을 관찰할 수 있었다. 이들 시험편을 불소계 플 라즈마에 노출하였을 때 미세구조상에서 결정상에 따라 식각깊이의 미세한 차이를 발견할 수 있었으나 평균 식 각깊이에는 큰 영향을 끼치지 않는 것으로 관찰되었다. 2 Fig. 6. Microstructures for the (a) stoichiometric, (b) Al2Orich and (c) Y2O-rich YAG ceramics sintered at 1700oC for 2 h after fluorine plasma exposure for 1 h. 차이가 미세하게 차이가 나는 것을 볼 수 있었다. Al O 의 식각율이 YAG상보다 높으며, YAG상의 식각율이 YAP 상보다 조금 더 높은 것으로 관찰되었다. Fig. 7은 불소계 플라즈마에 1시간 노출되었을 때 평균 적인 식각깊이를 측정한 결과를 보여주고 있다. YAG 계 세라믹스의 식각깊이가 표준물질인 사파이어와 비교하여 15%에 불과한 것으로 나타났고, 과량의 Al O 와 Y O 의 첨가에 따른 식각깊이의 차이는 크지 않는 것으로 나타 났다. 이러한 결과는 식각율이 높은 Al O 가 일부 존재한 다고 하더라도 고립 상으로 존재하기 때문에 평균 식각 Acknowledgment 본 연구는 지식경제부 소재원천기술개발사업의 연구비 지원으로 수행되었습니다. REFERENCES 1. G. S. May and C. J. Spanos, Fundamentals of Semicon- 제 46 권 제 5호(2009)

6 461 ½ Á½ Á»*Á Á½xkÁ½x Á ductor Manufacturing and Process Control, pp , John Wiley & Sons, Inc., New Jersey, A. J. V. Roosmalen, J. A. G. Baggerman, and S. J. H. Brader, Dry Etching for VLSI, pp. 9-69, Plenum Press, New York and London, D-M. Kim, S-Y. Yoon, K-B. Kim, H-S. Kim, Y-S. Oh, and S-M. Lee, Plasma Resistance of Yttria Deposited by EB- PVD Method(in Korean), J. Kor. Ceram. Soc., 45 [11] (2008). 4. D-M. Kim, S-M. Lee, S-W. Kim, H-T. Kim, and Y-S. Oh, Microstructural Changes of the Al 2 Ceramics during the Exposure to Fluorine Plasma(in Korean), J. Kor. Ceram. Soc., 45 [7] (2008). 5. D-M. Kim, K-B. Kim, S-Y. Yoon, Y-S. Oh, H-T. Kim, and S-M. Lee, Effects of Artificial Pores and Purity on the Erosion Behaviors of Polycrystalline Al 2 Ceramics under Fluorine Plasma, J. Ceram. Soc. Jpn., 117 [8] 86-7G(2009). 6. K. Morita, H. Ueno, and H. Murayama, Plasma Resistant Articles and Production Method Thereof, US patent (2005). 7. A. Miyazaki, K. Morita, S. Nagasaka, and S. Moriya, Plasma Resistant Member and Plasma Treatment Apparatus Using the Same, US patent (2004). 8. R. J. O Donnell, J. E. Daugherty, and C. C. Chang, Boron Nitride/Yttria Composite Components of Semiconductor Processing Equipment and Method of Manufacturing Thereof, US patent (2004). 9. Y. Kobayashi, M. Ichishima, and Y. Yokoyama, Plasma Resistant Member, US patent (2006). 10. J. Iwasawa, R. Nishimizu, M. Tokita, M. Kiyohara, and K. Uematsu, Plasma Resistant Dense Yttrium Oxide Film Prepared by Aerosol Deposition Process, J. Am. Ceram. Soc., 90 [8] 227-2G (2007). 11. J. S, Reed, Principles of Ceramics Processing, pp , John Wiley & Sons, Inc., New York, G. Y. Yeom, Plasma Etching Technology(in Korean), pp , Miraecom, Seoul, S. Kohn, W. Hoffbauer, M. Jansen, R. Franke, and S. Bender, Evidence for the formation of SiON glasses, J. Non-Crys. Solids, G (1998). 14. J. F. Moulder, W. F. Stickle, P. E. Sobol, and K. D. Bomben, Handbook of X-ray Photoelectron Spectroscopy, pp , Physical Electronics, Inc., Minnesota, w wz

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