For The Pioneers Plasma System - plasma polymerization - nano application - surface treatment - semiconductor process - FPD process miniplasma - Station 세계최고의플라즈마전문기업
miniplasma - Station Plasma system for wide applications The most advanced Plasma surface treatment and modification system PLASMART는플라즈마전문가들로구성된플라즈마전문기업으로서플라즈마발생, 제어, 계측분야에서반도체양산장비에적용되는우수한성능의제품을생산하는국내유일의플라즈마전문기업입니다. MINIPLASMA series는연구개발전용플라즈마시스템으로서나노, 환경, 신소재, 바이오, 의료, 반도체및디스플레이등의첨단분야에서요구되는다양하고까다로운플라즈마환경을빠르고쉽게구현할수있도록제작되었으며연구자들의선구적인연구를효율적으로수행할것이라확신합니다. 특히 10여년이상축적된플라즈마발생및제어기술, 플라즈마진단기술등이바탕이되어설계된 MINIPLASMA series는안정적이고재현성있는실험환경을제공해드립니다. 또한반도체양산장비관련기술을바탕으로개발되어장비의안정성과편의성, 안전성등에서차별화된가치를제공합니다. Solid Liquid Gas Plasma Add energy Plasma is Positive ion External electric field Hot electron Neutral Electrons electrically activated gas [Ionization] old electron [Electron Heating] Hot electron Molecule Radicals physically & chemically activated gas [Dissociation] Plasma species
miniplasma - Station Plasma system for wide applications For the pioneers of plasma process engineering, supply of various plasma environments MINIPLASMA-station 만이제공하는다양한플라즈마기능사항 교체형플라즈마소스 (onvertible electrode) - 하나의장비로 RIE type( 식각공정용플라즈마소스 ) 과 PE type( 증착공정용플라즈마소스 ) 을동시에구현! 원거리플라즈마소스 (Remote plasma 기능 ) - Remote 플라즈마와 Direct 플라즈마의손쉬운전환! 고밀도플라즈마소스 (High density plasma source, IP) -10 12 cm -3 이상의고밀도플라즈마소스장착가능 펄스플라즈마오퍼레이션 (Pulse operation) - Pulse operation 에의한다양한신공정개발가능 플라즈마계측 (Diagnostic ) - Plasmart 사의다양한계측장비를용이하게설치운영할수있는호환성 Example of plasma process + + + + H H H H + + H H H H
다섯가지모듈을조합하여모든종류의플라즈마를구현할수있으며다양한플라즈마공정을수행할수있습니다. 상부모듈 P (capacitively coupled plasma) IP (inductively coupled plasma) Remote plasma (plasma shield) Gas shower head 각모듈의기능성을극대화하는 20 여가지의 accessory 제공 진공모듈 쳄버모듈 저진공시스템 (low vac.) 고진공시스템 (high vac.) 150mm(6 ) 원형쳄버 300mm*200mm 사각쳄버 개스 / 기화공급모듈 하부모듈 P (capacitively coupled plasma) Heating stage ( ~ 500 ) ooling stage ( ~ -20 ) Sample stage Non-toxic, toxic gas Max. 6 ch. 기화공급시스템 MINIPLASMA station 의구성모듈과선택사양 상부모듈쳄버모듈하부모듈진공모듈 개스 / 기화공급모듈 Plasma polymerization P 6 원형쳄버 Heating stage Low vac. Non-toxic 2ch Vaporizer 1ch Surface treatment P 300*200 사각쳄버 ooling stage Low vac. Non-toxic 3ch Nano particle & ALD IP etching IP pulse 6 원형쳄버 Heating stage High vac. IP 6 원형쳄버 P High vac. Pulse Toxic 1ch Non-toxic 2ch Toxic 1ch RIE etching Shower head 6 원형쳄버 P High vac. Non-toxic 2ch Toxic 1ch IP VD IP 6 원형쳄버 Heating stage High vac. Non-toxic 2ch Toxic 2ch PEVD P 6 원형쳄버 Heating stage Low vac. Non-toxic 2ch Toxic 2ch Ashing IP remote 6 원형쳄버 Heating stage Low vac. Non-toxic 2ch 플라즈마공정별 MINIPLASMA station 의권장구성예
다양한플라즈마소스의조합 (Schematic of various plasma sources) 축전결합형플라즈마소스 Grid (apacitively oupled Plasma source) 하부플라즈마소스 (P-RIE type) 상부플라즈마소스 (P-PE type) 원거리 P 소스 (P Remote plasma) 유도결합형플라즈마소스 Grid (Inductively oupled Plasma source) 고밀도 IP 소스 + 하부플라즈마소스 고밀도 IP 소스 (IP nly top source) 원거리 IP 소스 (IP Remote plasma) (IP source + P-RIE type) 플라즈마소스에따른활성종과플라즈마밀도, 이온에너지의특성 (Radical and plasma density vs ion energy with plasma sources) Radical density Power generator and matcher IP remote plasma IP (only top source) IP (addition bottom source) Grounded chamber Plasma Substrate P remote plasma P (PE type) P (RIE type) Antenna (IP) Electrode (P) Grid (for remote plasma) Ion energy
miniplasma - Station Plasma system for wide application 다양한플라즈마소스 (Various plasma sources ) (P-PE type 과 P-RIE type, remote, IP source 를쉽게전환가능 ) 플라즈마소스 Plasma sources 교체형플라즈마소스 (onvertible electrode) - 하나의장비로 RIE type 과 PE type 플라즈마를동시에구현! Electrode 가상하부에설치되어있고 RF feed 를쉽게상하전극에교체장착할수있어 PE type 과 RIE type 의플라즈마를하나의장비로구현할수있습니다. [MINIPLASMA 의플라즈마소스 ] 플라즈마밀도, 전자온도 ~ 10 10 /cm 3, 1 ~ 3 ev 이온포격효과 (Ion assist effect) Large 응용예 (Application) Reactive Ion Etching (anisotropic etching) P-RIE type 높은에너지를가진이온들이시료표면에입사하므로이온의포격효과가요구되는공정에유리한구조 ( 대표적예, RIE) ~ 10 10 /cm 3, 1 ~ 3 ev Small PEVD, Plasma etching (isotropic etching) P-PE type 시료에입사하는이온의에너지가높지않으며이온의포격효과가적게요구되는공정에적합한구조 ( 대표적예, PEVD) ~ 10 9 /cm 3, ~1 ev Small (nly radical) damage free surface treatment, ashing Remote plasma 플라즈마가발생하는영역과시료의공정이수행되는영역을구분해놓은형태로써플라즈마내에존재하는이온, 전자, 활성종 (radical) 들중활성종만이표면에입사되어표면반응에기여하게됨, 시료의표면이이온에의한열손상, 또는전하들에의한전하손상이우려되는경우주로사용함 플라즈마쉴드 (plasma shield) : 탈부착이용이한 MINIPLASMA 전용플라즈마쉴드를통하여 remote 플라즈마와 direct 플라즈마를쉽고빠르게전환할수있다. 손상이적어야하는활성종 (radical) 이주로사용되는공정에서는 remote 플라즈마를사용함 고밀도플라즈마소스 (Inductively oupled Plasma source) - 기본형인 P type 의플라즈마 source 이외에도 Plasmart 사의플라즈마 source 기술에의해구현된고밀도플라즈마발생장치인 IP source (DoSA antenna) 장착이가능하여연구개발의범위를극대화시켰습니다. 10.0 P IP Plasma density, electron temperature ~ 10 10 /cm 3, 1~ 3 ev ~ 10 12 /cm 3, 2~5 ev Ion assist effect Large Small application RIE, PEVD, Plasma etching HDP VD, etching ashing Uniformity for 200mm (%) 7.5 5.0 2.5 Uniformity vs Pressure DoSA - P200 2, 13.56 MHz Power : 500W Distance : 70 mm [DoSA TM IP source] 0.0 5 10 15 20 25 30 뛰어난플라즈마균일도와넓은공정윈도우는 DoSA TM IP 의특징으로국내외에약 30 여건의특허가출원되었으며현재다양한양산공정에사용되고있는가장진보된 IP source 입니다. Pressure (mtorr) [DoSA TM IP 의 pressure 에따른 Plasma uniformity 특성 ]
miniplasma - Station Plasma system for wide application 고급기능사항과편리한유저소프트웨어 (Elevated Hardware and onvenient Software) 추가기능사항 Additional faculty 펄스플라즈마오퍼레이션 (Pulsed power and matching operation) 플라즈마소스에인가되는 RF 전원을펄스로인가할경우다른특성을지닌플라즈마가형성됩니다. 이러한펄스동작기능은새로운공정을개발할수있도록장비의능력을한층강화시킵니다. n FF n 펄스플라즈마의경우펄스 on 시의플라즈마특성과펄스 off 시의플라즈마특성에많은차이가있는데예를들면펄스 off 일경우는전자온도와전자밀도가낮아져개스의해리특성과이온화특성에차이가발생합니다. 낮은전자온도는식각공정시선택비를높이는기능을하며플라즈마 on/off 의 duty 비를조절함으로써다양한펄스플라즈마를형성할수있습니다. MINIPLASMA 에서는펄스동작기능을수행할수있는 RF 전원과매쳐 (matcher) 를지원합니다. [Pulse operation diagram] FF N Application process PEALD (Plasma Enhanced Atomic Layer Deposition) Selective etching Nano particle generation [size controllable] [IP source 를 Pulse operation 할경우플라즈마의특성, MINIPLASMA - Station IP, SLP 2000 로측정 ] 편리하고안정적인유저소프트웨어 (Software and GUI for convenience and reliability operation) Smart RF matcher control - Advanced linearized algorithm에기반한 control 로우수한 matching performance 구현자동압력제어 -다중PID 제어를통한고성능자동압력제어와운전압력조건유지및재현실현. Auto dry-n2 vent control - 시료수납시 one touch vent operation 가능. hamber cleaning recipe control (option) - ne-touch cleaning operation 기능. 플라즈마 parameter monitoring control (option) - 플라즈마계측장비장착시 GUI 화면에플라즈마실시간 monitoring 결과표시기능. GUI 화면
다양한옵션기능 Flexible accessories 정량제어가가능한기화공급시스템 (liquid delivery system) Purge liquid inlet 1/4 VR fitting Vaporizer VAP utlet 1/4 VR fitting Liquid source inlet 1/8 VR fitting Drain 1/8 VR fitting L-MF Liquid Mass flow controller Liquid mass flow meter 를이용하여액체상태의시약을정량투입하고, 3- phase diagram 상의 gas phase 에해당하는조건을구현하여투입된시약을전량기화시키는 PLASMART 사의 liquid delivery system 은여타경쟁사제품에비해안정적인동작원리와최적화된구성을바탕으로개발되었으며저렴한비용으로액상의시약을이용하는연구에널리이용될수있습니다. 3-phase diagram 다양한플라즈마 measurement system 의적용 Model name 구분 Measurement parameters 비고 SLP2000 Single Langmuir probe Ion density, electron temperature, EEDF, plasma potential, uniformity 전문가용측정장치로써플라즈마 physics 를연구하는데최적화되었음 DLP2000 Double Langmuir Probe Ion density, electron temperature, uniformity 플라즈마 process, equipment 개발에적합, 쉽고안정적특성 [KT mark] NIEA Non-invasive ion energy analyzer Ion energy distribution 비침투식으로플라즈마 process 감시가능 [System I 2010] [Z]PS VI-monitor 플라즈마 impedance, efficiency 플라즈마발생효율, 플라즈마의전기적특성을측정 Plasma- P utoff-probe Electron density, Electron temperature Deposition process, Atmospheric plasma [world first technology]
안전하고효율적인실험환경제공 재현성및안정성 (reliability) 자동시스템채택 - Touch screen 장착으로손쉬운조작성 - 전기능 one-touch operation - 개스유량, 압력조절, RF 파워조절등의자동제어 Smart software - 직관적인 GUI - 한화면에모든기능의작동상태와조작이가능 실험의재현성확보를위해보강된 hardware / software Smart RF matching system - advanced linearized algorithm 에기반한 micro-stepping motor control - 우수한 matching performance 자동압력제어시스템 - 다중 PID 제어를통한고성능자동압력제어 - 손쉬운공정조건유지, 재현 (DG) capacitance diaphragm gauge 적용 - 공정개스, 증착등에영향을받지않음 -no-filament Auto-dry N2 vent system - 시료수납시쳄버환경유지 - one-touch vent operation Wall condition 유지를위한 liner (option) - ( 공정에큰영향을미치는 ) wall condition 을 liner 교체하여유지 - 쳄버클리닝주기를연장 hamber cleaning recipe 제공 - 손쉬운 chamber, pumping system 클리닝 플라즈마 monitoring system 장착 - 플라즈마계측장치장착가능 - 실시간박막측정장치등의설치가용이한포트구성 - Ion energy analyzer 장착가능 Interlock 기능강화 - 조작의오류로인한사고를방지하는 safety interlock algorithm 탑재 - 전원, 공압, 냉각수, purge gas 등의상태를체크하는감지센서탑재 - emergency alarm 기능 - 작동상태를명시하는 operation lamp bypass, purge line 이구성되어있는안전한개스공급시스템 - Toxic (corrosive, explosive) gas 사용시채택 -line 내의잔류 gas 를제거하기위한안전시스템 쉬운유지보수와신속하고정확한 A/S Status 지시기능탑재 - warning, error 등의상태를명시하는 fault detection 시스템 - fault 시구체사항의상태를손쉽게확인 자가유지보수가용이한 module 구성 - 손쉬운자가진단, 관리 ne stop A/S 접수 system 운영 - 즉각적인 A/S 대응시스템 A/S tracer 운영 - internet 을통한 A/S 상황확인 system
miniplasma - Station Plasma surface treatment &modification system General Dimension (mm) Weight olor Electric power 1000 (w) 700 (d) 1300 (h) 300 kg Ivory 3-phase, 208 VA (±10 %), 40 A, 50/60 Hz Plasma Source Plasma source apacitively coupled plasma Plasma density: 10 9 /cm 3 (Ar, 500 mtorr) Electron temperature: 1 3 ev utline & dimension (front view) RF generator x 2 Matching network x2 13.56 MHz, 1000 W Forced-air cooling 13.56 MHz, 1000 W Forced-air cooling hamber hamber ylinder type for 6 wafer AL6061, anodized Manual specimen loading/unloading entered gas feeding with shower head Substrate For 6 wafer, height adjustable by 50mm Forced-air cooling RF bias optional Heater optional Pumping & gas supply system Pressure control Process gauge: DG; 1 Torr (full range) Pumping gauge: ATM sensor Automatic throttle valve Pump Gas supply system TMP (optional), 340 l/s il rotary pump, 290 l/m (dry pump optional) MF controlled Up to 6 ch. (Toxic 3 ch. Non-toxic 3 ch.) utline & dimension (side view) * 세부사양서는본사영업팀으로요청하시기바랍니다.
miniplasma Series Lineup miniplasma - ube 초소형플라즈마처리장치인 MINIPLASMA-cube 는실험테이블위에쉽게설치가능하여플라즈마관련실험을보다간단하고쉽게수행할수있도록설계및제작된저가형플라즈마처리장비입니다. General Dimension (mm) Weight olor Electric power <specification> 510 (w) 340 (d) 440 (h) 40 kg Ivory 2-phase, 208 VA (±10 %), 10 A, 50/60 Hz Plasma Source Plasma source RF generator Matching network apacitively coupled plasma Plasma density: 10 9 /cm 3 (Ar, 500 mtorr) Electron temperature: 1 3 ev 13.56 MHz, 300 W Forced-air cooling 13.56 MHz, 300 W Forced-air cooling utline & dimension (front view) hamber hamber ylinder type, Φ 105 mm AL6061, anodized Manual specimen loading/unloading entered gas feeding with shower head Substrate Φ 75 mm, Height adjustable by 40mm Forced-air cooling RF bias optional Heater optional Vacuum System Pressure control Process gauge: DG; 1 Torr (full range) Pumping gauge: ATM sensor Automatic throttle valve Vacuum valve Electric angle valve(nw25) Automatic venting line Vacuum line SUS hard tube SUS flexible bellows * 세부사양서는본사영업팀으로요청하시기바랍니다. utline & dimension (side view)
For the Pioneers 대전광역시유성구용산동 543 ( 대덕테크노벨리내 ) TEL : 042) 934 2545~2547 FAX : 042) 863 2524 http://www.plasmart.com, plasmart@plasmart.com