슬라이드 1
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1 반도체부품에대한 Mechanical Test AEC-Q Series Document Solder Joint Reliability Test for Handheld product Other reliability Test for Automotive 큐알티반도체이현배선임연구원 Reliability Engineering 1 Team 1 / 33
2 목차 1. AEC 란, 2. SJR 평가시험 -Drop / Bending / TC 3. HALT 4. 기타물리시험 5. 맺음말. Reliability Engineering 1 Team 2 / 33
3 AEC-Q200 인증이요? Reliability Engineering 1 Team 3 / 33
4 Section 1 반도체규격 - 국제협회기준 - 의도하는 사용홖경 에따라분류 반도체불량메커니즘규명 설계외적인불량요소완벽차단 Failure 군용 소비자용 자동차용 Mil-STD JEDEC AEC Reliability Engineering 1 Team 4 / 33
5 Section 1 반도체규격 - 국제협회기준 - Document 구성 Automotive Electronics Council Component Technical Committee MIL-STD883 TEST METHOD STANDARD MICROCIRCUITS MIL-STD810 ENVIRONMENTAL ENGINEERING CONSIDERATIONS AND LABORATORY TESTS MIL-PRF19500 SEMICONDUCTOR DEVICES, GENERAL SPECIFICATION FOR MIL-STD202 TEST METHOD STANDARD ELECTRONIC AND ELECTRICAL COMPONENT PARTS MIL-STD750 TEST METHOD STANDARD SEMICONDUCTOR DEVICES JESD22-A108 Temperature, Bias, and Operating Life JESD22-A101 Steady State Temperature Humidity Bias Life Test JESD22-A102 Accelerated Moisture Resistance - Unbiased Autoclave JESD22-B103 Vibration, Variable Frequency JESD47 Stress-Test-Driven Qualification of Integrated Circuits AEC-Q100 FAILURE MECHANISM BASED STRESS TEST QUALIFICATION FOR INTEGRATED CIRCUITS AEC-Q101 STRESS TEST QUALIFICATION FOR AUTOMOTIVE GRADE DISCRETE SEMICONDUCTORS AEC-Q200 STRESS TEST QUALIFICATION FOR PASSIVE COMPONENTS AEC-Q001 GUIDELINES FOR PART AVERAGE TESTING Reliability Engineering 1 Team 5 / 33
6 Section 1 반도체규격 - 국제협회기준 - Qualification Plan Automotive Electronics Council Component Technical Committee AEC-Q100 AEC-Q200 Reliability Engineering 1 Team 6 / 33
7 Section 1 반도체규격 - 국제협회기준 - AEC Q 규격을따를때 AEC 협회에서제공하는공식인증서 Official Certificate 는없음. A, B 사가 AEC Q 규격을자사규격을활용할때, 자체인증규격이됨. AEC-Q series 에서규정하는 test plan 을따를것인지참고할것인지결정. Reliability Engineering 1 Team 7 / 33
8 Solder Joint Reliability 어떻게평가하나요? Reliability Engineering 1 Team 8 / 33
9 -Background-! 솔더조인트신뢰성이중요해진이유 1 joint 수증가, Fine pitch SMD 제품사용. 2 친환경요구 에따른세계적 흐름. 3 휴대용전자 제품의사용증 가. 4 자동차용전 자제품증가. Reliability Engineering 1 Team 9 / 33
10 평균수명 핚국싞뢰성학회 - Pb based 솔더와 Pb free 솔더 - 비교시험결과 시험에사용된보드와시료위치 JEDEC 표준보드를사용하여낙하시험을통핚평균수명을비교핚결과솔더성분에따른특성이 2~3 배차이를보임 Pb-free /OSP Pb-free /ENIG Pb-free /ImSn Pb-based /OSP Pb-based /ENIG 시료구성 Reliability Engineering 1 Team 10 / 33
11 - Test Schematics- 결과 Feed back 개선제품비교시험. 1 Step 2 Step 3 step Mission complete Project 구성 Daisy-chain 구성 보드사양 시료준비 시험항목결정 진동 낙하충격온도사이클 구부림 결과분석 통계적분석불량분석 Reliability Engineering 1 Team 11 / 33
12 - Daisy Chain - Package PKG side PCB side Joint 구조에 Crack 발생하면젂체 Net 의저항값이변핚다. Layer 1 Layer 2 Layer 3 Reliability Engineering 1 Team 12 / 33
13 - Board Level Drop Test - 홖경 시험 Standoff PCB Assembly Base Plate Accelerometer Drop Table Strike Surface 놓치기쉬운휴대용제품은낙하시, 케이스손상뿐아니라내부 PCB가휘어지면서각부품갂의 Crack을유발핚다. - JEDEC22-B111 Board Level Drop Test Method of Components for Handheld Electronic Products - Reliability Engineering 1 Team 13 / 33
14 - Board Level Drop Test - * 단위 : mm JEDEC & SAMSUNG Sample Size: 120 ea NVIP, VIP 타입사용 Trace 두께 (75um, 100 um) Sample Size: 55 ea NVIP, 타입사용 내부 Pattern 사용 Trace 두께 (100 um) Reliability Engineering 1 Team 14 / 33
15 - Board Level Drop Test - Service Condition Equivalent drop height (inches/cm) Velocity Change (in/s, cm/s) Acceleration Peak (G) Pulse duration (ms) H 59 / / G 51 / / B 44 / / F 30 / / A 20 / / E 13 / / D 7 / / C 3 / / JESD22-B104 Mechanical Shock 에서시험조건을제공하고있다. 조건은속도, 최대 가속도, 펄스구갂으로정의. G 가속도계로 In Put 싞호젂달 Peak Acceleration (G) Velocity Change (in/sec) Pulse Duration (ms) 측정된파형과조건비교 t Reliability Engineering 1 Team 15 / 33
16 - Board Level Drop Test - Service Condition Equivalent drop height (inches/cm) Velocity Change (in/s, cm/s) Acceleration Peak (G) Pulse duration (ms) H 59 / / G 51 / / B 44 / / F 30 / / A 20 / / E 13 / / D 7 / / C 3 / / JESD22-B104 Mechanical Shock 에서시험조건을제공하고있다. 조건은속도, 최대 가속도, 펄스구갂으로정의. G 가속도계로 In Put 싞호젂달 Peak Acceleration (G) Velocity Change (in/sec) Pulse Duration (ms) 측정된파형과조건비교 t Reliability Engineering 1 Team 16 / 33
17 - Joint 불량유형 - IMC crack 솔더성분과패드코팅재의성분에따라 IMC 특성도달라진다. 솔더에작용하는 Strain 은 IMC 부위에집중되고 Crack 이발생, 전파된다 Trace crack 전기적신호를전달하기위한 Trace 전달현상도자주등장하는유형이다. Trace 의방향을변경하거나 Via 를사용하여 crack 가능성을낮출수있다. Resin crack PCB 방향으로전파되는 Crack 은솔더구조보다 PCB 가약할수있는 Halogen-Free 제품에서이슈가되고있다. Reliability Engineering 1 Team 17 / 33
18 - Reporting - 불량에대핚 Weibull 분석으로비교시험이가능하며, Dye & Pry / X-section 을통해불량부위확인및개선정보로홗용핛수있다. Reliability Engineering 1 Team 18 / 33
19 - Cyclic Bend Test- 홖경 시험 Load Span Moveable anvil Fixed anvil IC Package Support Span 제조공정에서횟수는작지만크게휘거나, 사용자홖경에서는강도는약하지만횟수는수만번씩휘어지게된다. - JEDEC22-B113 Board Level Cyclic Bend Test Method for Interconnect Reliability Characterization of Components for Handheld Electronic Products - Reliability Engineering 1 Team 19 / 33
20 - Cyclic Bend Test- Bottom View Span of Load Anvil 75mm Span for support Anvil 110mm Test Conditions Load Anvil 이동거리 : 2 mm 구부림속도 : 1Hz 시험기갂 : 60% 또는 200 K cycles Reliability Engineering 1 Team 20 / 33
21 - Cyclic Bend Test- 이벤트 (EVENT) : Daisy Chain 의저항이규정된범위를벖어나는현상 불량 (FAILURE) : 발생핚이벤트가특정조건을만족하는현상 Drop: The first event of intermittent discontinuity as defined above followed by 3 additional such events during 5 subsequent drops. Bending : The first event of intermittent discontinuity with resistance peak greater than the threshold value followed by at least 9 additional confirmation events within 10% of the cycles to first event. Reliability Engineering 1 Team 21 / 33
22 - Temperature Cycling - 홖경 시험 온도사이클시험을통해서고온과저온에서의영향, 급격핚온도변화 의영향그리고피로 stress 에대핚내성을평가핚다. - JEDEC22-A104 Temperature Cycling- Reliability Engineering 1 Team 22 / 33
23 - TC 와 TS- MiL-STD-883 MiL-STD-202 Thermal Shock 항목에시험장비를 Air type과 Liquid type으로나누어표기함. Air type : 온도사이클시험 Liquid type: 열충격시험 Transfer Time - TC: 1 min / TS: 10 Dwell Time - TC: 10 min / TS: 2 min Specified Temp reached in - TC: 15 min / TS: 5 min JESD22-A104 Air type : 온도사이클시험 Liquid type: 열충격시험 Transfer Time - TC: 1 min (dual chamber) / TS: 10 s SJR 시험용 ramp rate 조항. IPC-SM-785 온도사이클시험 -Slower temperature change insufficient to produce thermal shock in the specimen. The ramp rate used is less than 20 /min. 열충격시험 -Abrupt temperature change causing sudden temperature gradient and stress on the specimen. As a rule, the ramp rate exceeds 30 /min. Reliability Engineering 1 Team 23 / 33
24 - Dwell (Soak) Time 기준 - 온도사이클시험조건은, 온도범위 ΔT, 시료가온도조건에노출되는 Dwell Time, 온도변화속도를뜻하는 Ramp rate, 총사이클로구성. Military Standard JEDEC Reliability Engineering 1 Team 24 / 33
25 - Solder Joint TC Component ramp rate Ramp rate is not critical for most component testing with the exception of interconnects, see Interconnect ramp rate Typical ramp rate for this situation is 15 C/minute or less for any portion of the cycle, with a preferred rate of 10 C to 14 C/minute. Reliability Engineering 1 Team 25 / 33
26 - 온도프로파일 - Table 1: Temperature cycling test conditions Table 4: Soak mode conditions 125 C if selecting 14 C/munute, 165 C C 14 C 11.8 Cycle Time = H/L soak time + ramp time = (10 *2)+(12 *2)= 44minutes -40 C approximatel y 12minutes Reliability Engineering 1 Team 26 / 33
27 - 챔버및결과분석 - Temp. Range : -40 ~125 Ramp Rate: 14 /min Dwell Time : 10 min Test Duration : 3000 cycles Weibull Analysis Dye & Pry X-Section Reliability Engineering 1 Team 27 / 33
28 Section 3 초가속수명시험 (HALT) - 기본개념 - HALT 란무엇인가? HALT Qual Issue Not a Pass - Fail test Stress product well outside operating Spec. stimulate failure vs. Simulate environment RCA/Engineering Judgement Operation Issue Product Fully Functional (Continually monitored) Find failure - Fix On the Fly Method Issue Incremental / Controlled / Documented Quickly exposes Latent Design & Process Flaws Design Tool Process Issue ideally used in design verification Torture Test Temperature & Vibration Reliability Engineering 1 Team 28 / 33
29 Section 3 초가속수명시험 (HALT) - 동작 / 파괴핚계 ( 마진 ) - HALT 는불량요소를자극 (stimulation) 하고, 발생핚현상을어떤식으로개선핛지를연구하는시험이다. 제품의동작 ( 또는파괴 ) 핚계를찾고동작마진의확보 / 연장을시갂 / 비용과함께고려하여품질의개선을도모핛수있다. Tem UDL p. UOL OL DL Vibratio n Grms LOL LDL Product Environmental Operating Specification HALT Operating Limits HALT Destruct Limits Reliability Engineering 1 Team 29 / 33
30 Section 3 초가속수명시험 (HALT) - 시험방법 - Basic 5 Sequences of HALT 1) Thermal Step Stress Test - cold 2) Thermal Step Stress Test - Hot 3) Rapid Thermal Transient Stress Test 4) Vibration Step Stress Test 5) Combined Environment Stress Test Set point ( ) Temp Stabilization 10 min 30 min 50 min t1 t 3 t 2 Test Temp. UDL Failure Sample Temp. 80 UOL Failure t 1 : Dwell period t 2 : Functional Test t 3 : Dwell time Recover Failure 10 min 30 min 50 min 70 min Reliability Engineering 1 Team 30 / 33
31 Section 3 초가속수명시험 (HALT) - 결과분석 & feedback - Feed Back 제품개선후 Post-HAST 또는공정용 Profile 을만들어 HASS 적용. Reliability Engineering 1 Team 31 / 33
32 Section 4 기타물리시험 - 휴대용품 & 자동차용시험고려사항 - 외부패키징물질평가내부칩물리적손상 Joint 단품평가및 Board Level Solder Joint Reliability 평가내부요소및본딩불량 Tensile 및 Shear 최대값측정 Reliability Engineering 1 Team 32 / 33
33 - 맺음말 - 어떻게 무엇을 물리적성질을유지하는가? 전기적성질을유지하는가? 주요스트레스요소선정. 사용자환경모사 왜 구성요소의취약점개선비교시험수명예측 Reliability Engineering 1 Team 33 / 33
34 For more Information 이현배선임연구원 / 신뢰성기술 1 팀 Tel) ) hyunbae.lee@qrtkr.com 감사합니다.
슬라이드 1
큐알티반도체안도석수석연구원 연락처 : 010-2982-9094 E-mail : doseok.ahn@qrtkr,com 1 신뢰성시험의역사 1920~1940 년대 1940~1950 년대 1950~1960 년대 1960s 년 ~ 1876 년벨, 전화기발명 제 2 차세계대전발발 한국전쟁 (6.25 전쟁 ) 발발 NASA 유인우주프로그램활동 1920 년전자진공관수요증가
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