폐사제품에관한주의사항 세라믹커패시터및인덕터이외당사제품용 폐사제품을사용하시기전에반드시읽어주십시오. 주의 본카탈로그의기재내용은 2018년 10월기준입니다. 기재내용은업데이트등으로인해예고없이변경되는경우가있습니다. 따라서, 사용시에는반드시최신정보를확인한후사용하시기바랍니다. 만일본카탈로그기재내용또는납입사양서의범위외에서폐사제품을사용하여그사용기기에손해, 하자등이발생하더라도폐사는일체의책임을지지않으므로양해해주시기바랍니다. 상세한사양에관해서는납입사양서가준비되어있으므로폐사에문의해주시기바랍니다. 폐사제품사용시에는사용할기기에실제로장착된상태및실제사용환경에서의평가및확인을반드시해주시기바랍니다. 본카탈로그에기재된제품은일반적인전자기기 AV기기, OA기기, 가전제품, 사무기기, 정보 통신기기 ( 휴대전화, PC 등 ) 에사용하기위한목적으로만들어졌습니다. 따라서, 생명또는신체에직접위해를가할가능성이있는기기 수송용기기 ( 자동차구동제어장치, 열차제어장치, 선박제어장치등 ), 교통용신호기기, 방재기기, 의료기기 ( 등급분류 1등급, 2등급, 3등급 ), 공공성이높은정보통신기기 ( 전화교환기, 전화 무선 방송등의기지국 ) 등으로의사용을검토하시는경우에는반드시사전에폐사에문의해주시기바랍니다 또한, 고도의안전성이나신뢰성이요구되는기기 우주용기기, 항공용기기, 의료기기 ( 등급분류 4 등급 ), 원자력용제어기기, 해저 용기기, 군사용기기등 에대해서는폐사제품을사용하지않도록부탁드립니다. 한편, 일반적인전자기기에있어서도안전성이나신뢰성의요구가높은기기, 회로등에폐사제품을사용하시는경우에는충분한 안전성평가를실시하시고, 필요에따라설계시에보호회로등을추가하실것을권장합니다. 폐사의서면에의한사전승낙을얻지않고앞서기술한폐사로의문의가필요한기기또는폐사가사용을금지하는기기에본카 탈로그에기재된제품을사용함으로써고객또는제 3 자에게발생한손해에관하여폐사는일체의책임을지지않으므로양해해 주시기바랍니다. 본카탈로그에기재된정보는제품의대표적동작 응용을설명하는것으로서, 그러한사용시에폐사및제 3 자의지식재산권그 외의권리에대한보증또는실시권을허락하는것은아닙니다. 폐사제품의보증범위는납입된폐사제품단일체의보증에한정되고, 폐사제품의고장이나하자로부터유발되는손해에관해서 폐사는일체의책임을지지않으므로양해해주시기바랍니다. 단, 기본거래계약서, 품질보증협정서등별도의서면계약이체결 되어있는경우에는그내용에따라보증합니다. 본카탈로그의기재내용은폐사의영업소 판매자회사 판매대리점 ( 소위 정규판매채널 ) 으로부터구입하신폐사제품에대해 적용됩니다. 상기이외로부터구입하신폐사제품에관해서는적용이제외되므로양해해주시기바랍니다. 수출주의사항 본카탈로그에기재된제품의일부에는수출시일본의 외국환및외국무역법 및미국의수출관리관련법규등의규제를확인하 신후필요한절차를취하실필요가있는제품이있습니다. 불명확한경우에는폐사에문의해주시기바랍니다.
고주파제UB & imax(3.5ghz) AH 086M555003 8.0 6.0 1.0 5550 칩안테나 리플로우 PARS 아이템표기법 NUMBER A F 2 1 6 M 2 4 5 0 0 1 - =Blnk 스페이스spce 1 2 3 4 5 6 7 1Series 1형식 nme Series 형식nme 4Specil 종별코드code Specil 종별코드 code AH Multilyer 적층안테나 ntenn F Inverted 역F F AF Helicl안테나 ntenn M Mono 모노폴pole N 모노폴 Mono ( pole(dul) 듀얼밴드 ) 2Electrode 2전극사양 code Electrode 전극사양code 5Frequency 주파수 ith 도금품 plting Code 기호 ( 예 ) (exmple) Frequency[MHz] 주파수 3Dimensions(cse 3외형크기 size) 1575 1574.397~1576.443 Dimensions(cse 외형크기 [mm] size)[mm] 2450 2400~2500 212 2.0 1.25 5550 3100~8000 216 2.5 1.6 1.Descrie 중심주파수를 Center 기재 Frequency. 316 3.2 1.6 2.ower 듀얼밴드는 Frequency 아래의주파수 for Dul. nd 083 8.0 3.0 104 10.0 4.0 6Spec 개별사양 code 086 8.0 6.0 Spec 개별사양 code 01~ S1~ Applicle AH 104F to 에 AH 적용104F 7Pckging 포장 Pckging 포장 - ping 테이핑 EXERNA 외형크기 / 표준수량 DIMENSIONS / SANDARD QUANIY AH 212M type, AF 216M type AH 316M type AH 083F type Direction mrk Feed mrk Direction mrk E E c c AH 104F type AH 104N type AH 086M type Direction mrk Feed mrk Feed mrk Direction mrk Direction mrk Feed mrk c c c c ype E c Stndrd 표준수량 quntity[pcs] [pcs] Emossed 엠보스테이프 tpe AF 216M 2.5±0.2 1.6±0.2 1.6±0.2 0.5± - - - 2000 AH 212M 2+/-0.1 1.25±0.2 0.85±0.2 0.5± - - - 4000 AH 316M 3.2±0.15 1.6±0.15 0.5±0.1 0.5±0.2-1.0min. - 3000 AH 083F 8± 3± 1± - 3.1± 1± 1.15± 1000 AH 104F 10± 4± 1± - 2.5± 1± 1± 2000 AH 104N 10± 4± 1± - 3± 0.8± 1.5± 2000 AH 086M 8± 6± 1± - 1.8±0.2 1± - 1000 단위 Unit:mm PARS 아이템일람 NUMBER Applictions 용도 Prt 형명 numer Externl 외형크기 dimensions( )[mm] (mm) Center 중심주파수 frequency[mhz] (MHz) GPS AH 316M157501 3.2 1.6 0.5 1575 AF 216M245001 2.5 1.6 1.6 2450 -AN(2.4GHz) AH 212M245001 2.0 1.25 0.85 2450 Bluetooth AH 316M245001 3.2 1.6 0.5 2450 imax(2.5ghz) AH 083F245001 8.0 3.0 1.0 2450 ZigBee AH 104F2450S1 10.0 4.0 1.0 2450 AH 104F2650S1 10.0 4.0 1.0 2650 -AN(2.4GHz/5GHz) AH 104N2450D1 10.0 4.0 1.0 2450/5400 본카탈로그에는지면사정상대표적인사양밖에기재하고있지않으므로, 폐사제품을검토하실때에는납입사양서에서상세한사양을확인하여주시기바랍니다. chipntenn_e-e05r01 또한, 각제품의상세정보 ( 특성그래프, 신뢰성정보, 사용상의주의사항등 ) 에대해서는폐사웹사이트 (http://www.ty-top.com/) 에게재하고있습니다. 162
EECRICA 전기적특성 대표특성 CHARACERISICS / YPICA CHARACERISICS 당사 ypicl 표준기판상에서의 chrcteristics on 대표적인 AIYO YUDEN 특성예 evlution ord AH 316M157501 ZX 면 XY 면 ypicl VSR chrcteristics 특성의대표예 of VSR ypicl chrcteristics 지향성의대표예 of rdition (@1.575GHz) pttern (@1.575GHz) AF 216M245001 ZX 면 XY 면 고품 ypicl VSR chrcteristics 특성의대표예 of VSR ypicl chrcteristics 지향성의대표예 of rdition (@2.45GHz) pttern (@2.45GHz) ypicl VSR chrcteristics 특성의대표예 of VSR ypicl chrcteristics 지향성의대표예 of rdition (@2.45GHz) pttern (@2.45GHz) AH 212M245001 ypicl VSR chrcteristics 특성의대표예 of VSR ypicl chrcteristics 지향성의대표예 of rdition (@2.45GHz) pttern (@2.45GHz) AH 316M245001 ypicl VSR chrcteristics 특성의대표예 of VSR ypicl chrcteristics 지향성의대표예 of rdition (@2.45GHz) pttern (@2.45GHz) AH 083F245001 본카탈로그에는지면사정상대표적인사양밖에기재하고있지않으므로, 폐사제품을검토하실때에는납입사양서에서상세한사양을확인하여주시기바랍니다. 주파제또한, 각제품의상세정보 ( 특성그래프, 신뢰성정보, 사용상의주의사항등 ) 에대해서는폐사웹사이트 (http://www.ty-top.com/) 에게재하고있습니다. 163
EECRICA 전기적특성 대표특성 CHARACERISICS / YPICA CHARACERISICS 당사 ypicl 표준기판상에서의 chrcteristics on 대표적인 AIYO 특성 YUDEN 예 evlution ord AH 104F2450S1 ZX 면 XY 면 ypicl VSR chrcteristics 특성의대표예of VSR ypicl chrcteristics 지향성의대표예 of rdition (@2.45GHz) pttern (@2.45GHz) AH 104N2450D1 ZX 면 XY 면 고주파제ypicl chrcteristics of VSR ypicl chrcteristics of rdition pttern (@3.96GHz) 품 ypicl VSR chrcteristics 특성의대표예 of VSR(2GHz 대 ) nd) ypicl chrcteristics 지향성의대표예 of rdition (@2.45GHz) pttern (@2.45GHz) ypicl VSR chrcteristics 특성의대표예 of VSR(5GHz 대 ) nd) ypicl chrcteristics 지향성의대표예 of rdition (@5.25GHz) pttern (@5.25GHz) AH 086M555003 VSR특성의대표예 지향성의대표예 (@3.96GHz) 본카탈로그에는지면사정상대표적인사양밖에기재하고있지않으므로, 폐사제품을검토하실때에는납입사양서에서상세한사양을확인하여주시기바랍니다. 또한, 각제품의상세정보 ( 특성그래프, 신뢰성정보, 사용상의주의사항등 ) 에대해서는폐사웹사이트 (http://www.ty-top.com/) 에게재하고있습니다. 164
CHIP ANENNAS PACKAGING 1Minimum Quntity ype Stndrd Quntity (pcs) Emossed pe AF216M, AH104F, AH104N 2000 AH316M 3000 AH083F, AH086M 1000 AH212M 4000 2pe Mteril Emossed pe op tpe Sprocket hole Chip Filled Bse tpe Chip cvity Chip 3ping Dimensions Emossed pe Sprocket hole φ1.5+0.1/-0 (φ0.059+0.004/-0) 1.75±0.1 (0.069±0.004) A B D C F 4.0±0.1 (0.157±0.004) 2.0±0.1 (0.079±0.004) ype AF216M AH316M AH083F AH104F, AH104N AH086M AH212M Chip Cvity pe idthness Insertion Pitch pe hickness mx. A B C D F K 1.85±0.2 2.75±0.2 8±0.2 3.5±0.1 4±0.1 1.95 (0.073±0.008) (0.108±0.008) (15±0.008) (0.138±0.004) (0.157±0.004) (0.077) (0.012) 1.9±0.2 3.5±0.2 8±0.2 3.5±0.1 4±0.1 0.85 (0.075±0.008) (0.138±0.008) (15±0.008) (0.138±0.004) (0.157±0.004) (0.033) (0.012) 3.35±0.2 8.35±0.2 16± 7.5±0.1 8±0.1 1.55 (0.132±0.008) (29±0.008) (0.630±0.012) (0.295±0.004) (15±0.004) (0.061) (0.012) 4.35±0.2 15±0.2 24± 11.5±0.1 8±0.1 1.55 (0.171±0.008) (0.407±0.008) (0.945±0.012) (0.435±0.004) (15±0.004) (0.061) (0.012) 6.25±0.2 8.26±0.2 16± 7.5±0.1 12±0.1 1.3 (0.246±0.008) (25±0.008) (0.630±0.012) (0.296±0.004) (0.473±0.004) (0.051) (0.012) 1.5±0.2 2.3±0.2 8± 3.5±0.1 4±0.1 1.5 (0.059±0.008) (0.091±0.008) (15±0.012) (0.138±0.004) (0.157±0.004) (0.059) (0.012) Unit:mm (inch) his ctlog contins the typicl specifiction only due to the limittion of spce. hen you consider the purchse of our products, plese check our specifiction. For detils of ech product (chrcteristics grph, reliility informtion, precutions for use, nd so on), see our e site (http://www.ty-top.com/). chipntenn_pck_e-e05r01
4eder nd Blnk Portion 5Reel size ype A B AF216M, AH212M AH316M 178±2.0 (7.0±0.08) 50 min. (2.0 min.) 10.0±1.5 (94±0.06) 3.0 mx. (0.12 mx.) AH083F 178±2.0 50 min. 17.0±1.0 2.5 mx. (7.0±0.08) (2.0 min.) (0.67±0.04) (0.1 mx.) AH104F AH104N 330±2.0 (13.0±0.08) 100±1.0 (3.94±0.04) 25.5±1.0 (1.0±0.04) 3.0 mx. (0.12 mx.) AH086M 330±2.0 100±1.0 17.0±1.0 2.5 mx. (13.0±0.08) (3.94±0.04) (0.67±0.04) (0.1 mx.) Unit:mm(inch) 6op pe Strength he top tpe requires peel-off force of 0.1~0.7N in the direction of the rrow s illustrted elow. his ctlog contins the typicl specifiction only due to the limittion of spce. hen you consider the purchse of our products, plese check our specifiction. For detils of ech product (chrcteristics grph, reliility informtion, precutions for use, nd so on), see our e site (http://www.ty-top.com/). chipntenn_pck_e-e05r01
CHIP ANENNAS REIABIIY DAA 1. Operting emperture Rnge Specified Vlue -40~+85 2. Storge emperture Rnge Specified Vlue -40~+85 with eing tped, -20~+40 3. Solderility Specified Vlue At lest 90% of immersed terminl surfce is covered y new solder. Solder temperture : 230±5 Durtion : 3±1 sec. Preconditioning : Preheting t 150 fter immersion into flux. 4. herml Shock Specified Vlue Shll stisfy required VSR vlue of individul specifictions for ech item. 1 hour of recovery fter 10 times of 30min.immersion lterntely t -40 nd 85 of temperture, followed y evluting electricl chrcteristics. 5. High emperture Storge est Specified Vlue Shll stisfy required VSR vlue of individul specifictions for ech item. 1 hour of recovery under stndrd condition fter 96 hours recovery with 85 of temperture, followed y evluting electricl chrcteristics. 6. ow emperture Storge est Specified Vlue Shll stisfy required VSR vlue of individul specifictions for ech item. 1 hour of recovery under stndrd condition fter 96 hours recovery with -40 of temperture, followed y evluting electricl chrcteristics. 7. Humidity Storge est Specified Vlue Shll stisfy required VSR vlue of individul specifictions for ech item. 1 hour of recovery under stndrd condition fter 96 hours recovery with 60 of temperture, 90~95% reltive humidity followed y evluting electricl chrcteristics. 8. Resistnce to Reflow Specified Vlue Shll stisfy required VSR vlue of individul specifictions for ech item. wo times of reflow soldering y recommended profile ttched, followed y evluting electricl chrcteristics. his ctlog contins the typicl specifiction only due to the limittion of spce. hen you consider the purchse of our products, plese check our specifiction. For detils of ech product (chrcteristics grph, reliility informtion, precutions for use, nd so on), see our e site (http://www.ty-top.com/). chipntenn_reli_e-e04r01
CHIP ANENNAS PRECAUIONS 1. PCB Design Precutions nd pttern design Plese do not rrnge the surfce nd inside lyer pttern ner the ntenn mounting re. nd pttern design nd pttern dimension exmples nd recommended ntenn lnd pttern AF216M AH316M ype Dimensions P A AF216M 2.5 1.5 3 AH212M 2 1 3 Unit:mm AH083F AH104F echnicl Considertions AH104N AH086M 2. Soldering echnicl Considertions Conditions of Reflow soldering (for reference) P Free Reflow Profile Reflow profile 300 Pek 260 Mx. ithin 10sec. emperture( ) 200 100 0 Preheting150 60sec. Min. Heting ove 230 40sec. Mx. Slow cooling Components should e preheted to within 100 to 130 from soldering temperture. Assured to e reflow soldering for 2 times. Note : he ove profiles re the mximum llowle soldering condition, therefore these profiles re not lwys recommended. his ctlog contins the typicl specifiction only due to the limittion of spce. hen you consider the purchse of our products, plese check our specifiction. For detils of ech product (chrcteristics grph, reliility informtion, precutions for use, nd so on), see our e site (http://www.ty-top.com/). chipntenn_prec_e-e05r01
3. Storge Conditions Storge conditions 1. he Products should not e used in the following environments : exposure to specil gses such s (C12, NH3, SOx, NOx) exposure to voltile gs or inflmmle gs exposure to lot of dust exposure to wter or condenstion Precutions exposure to direct sunlight or freezing 2. he Products should e kept in the following conditions : emperture : -10~+40 Humidity : 70%RH mx. 3. he products should e used within 6 months fter delivery. In cse of storge over 6 months, solderility shll e checked efore ctul usge. Plese contct our offices for further detils of specifictions. All of the stndrd vlues listed here re suject to chnge without notice due to technicl improvements. herefore, plese check the specifictions crefully efore use. his ctlog contins the typicl specifiction only due to the limittion of spce. hen you consider the purchse of our products, plese check our specifiction. For detils of ech product (chrcteristics grph, reliility informtion, precutions for use, nd so on), see our e site (http://www.ty-top.com/). chipntenn_prec_e-e05r01