회사소개서 Company Introduction 써트론아이엔씨경기도안산시단원구목내동 (031) We will fabricate PCB for your company

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1 회사소개서 Company Introduction 써트론아이엔씨경기도안산시단원구목내동 (031)

2 1. 회사현황 2. 영업현황 3. 생산로드맵 회사개요회사소개연혁 영업현황 영업전략 품질경영시스템푼질방침및목표 생산현황공정 Process 제품현황 조직도 품질전략 생산능력 인증현황 기술로드맵

3 1. 회사현황 회사명설립일대표이사소재지품질인증홈페이지 써트론아이엔씨 <Cirtron INC> 2006년 4월김정식경기도안산시단원구목내동 반월공단 15BL 15-1LOT ISO9001, ISO 대표전화 031) 팩스 031) 대표메일 생산품목 PCB (Printed Circuit Board).Rigid-PCB(Hard PCB), Flexible-PCB.Build up PCB, 다층 PCB (Multi Layer PCB - 4L~36L).Rigid Flexible PCB, Metal PCB.ETC

1. 회사현황 치열한경쟁의시대라는 21세기에퇴보하지않고꾸준한성장을거듭할수있었던것은고객님들의많은관심과성원에힘입어더욱열심히노력한결과라생각됩니다. 그에부응하고자저희써트론임직원일동은고객을최우선으로 " 고객성공 " 이라는경영방침을목표로세우고고객의곁으로한발더나아가겠습니다.

4 1. 회사현황 치열한경쟁의시대라는 21세기에퇴보하지않고꾸준한성장을거듭할수있었던것은고객님들의많은관심과성원에힘입어더욱열심히노력한결과라생각됩니다. 그에부응하고자저희써트론임직원일동은고객을최우선으로 " 고객성공 " 이라는경영방침을목표로세우고고객의곁으로한발더나아가겠습니다. 최근전자산업의급속한변화로인해통신기기, 컴퓨터, 방송기기등등이루말할수없을정도로많은전자기기들이새로이개발되고또퇴보되고반복의길을걷고있습니다. 그러기에이러한전자기기들의기본부품이되고있는인쇄회로기판에대한관심도및연구가활발히진행되고있어앞으로무한한발전과가능성이있는산업으로주목받고있습니다. 이러한현실에앞서나가기위해서고객님들의믿음과성원을바탕으로새로운 PCB 개발에최선을다할것입니다. 저희써트론은 [ 기술 / 납기 / 품질경영 ] 을목표로삼고최고의 PCB 업체로서도약할것이며, 여러분이맡겨 주신크고작은일에대해책임과성실로써전임직원이혼연일체가되어혼신의힘을기울일것을약속드립니다

5 1. 회사현황 월써트론설립 월 60Layer 개발 10월 Flexible PCB 생산 월 Metal PCB 생산 (2L) 9월 써트론아이엔씨법인전환 12월방열 FPCB생산 (LED 후레쉬모듈 ) 월 CERAMICS PCB 생산 11월방열 FPCB 제조방법특허출원 12 월신사옥확장이전 ( 현사옥 ) 2010 ~ 월 UL인증 3월 METAL UL 인증 4월특허획득 ( 특허제 ) 6월 ISO 9001 / ISO 인증획득 9월벤처기업확인서획득 월방열경성PCB 제조방법특허획득 ( 특허제 ) 10월엠엔피설비매입 / 인원충원 10월아이에스인수 / 설비및기술, 생산 CAPA 확장운영

6 1. 회사현황 재무회계 경영기획부 인사총무 구매기획 경영 / 기술고문 영업부 영업팀 영업관리 대표이사 부사장 공정관리 품질경영부 품질관리 품질보증 생산관리부 기술연구소 외주관리생산팀사양관리샘플팀 인원현황 구분 관리직 품질 기술연구소 생산 합계 인원 기준

7 1. 회사현황

8 1. 회사현황 특허증 ( 방열경성 PCB) ISO 9001 UL 인증서 특허증 ( 방열 F-PCB) ISO UL 인증서

9 2. 영업현황

2. 영업현황 Normal Type Delivery Sample Mass 2L 2.5 1.

5 wks 6~8L 5 2.0 wks 사양관리 CAM PCB 제작 10~14L 8 2.0 wks 16~18L 10 2.

10 2. 영업현황 Normal Type Delivery Sample Mass 2L wks 전문샘플팀구성생기 1, 품질 1, 생산 1 CIRTRON Process Sample Team 4L wks 6~8L wks 사양관리 CAM PCB 제작 10~14L wks 16~18L wks 20L wks 일반사양을제외한모델에대해서는별도협의요망 별도의 Sample Team 운영으로고객납기에대응 Sample Team 개별품질관리 고객의납기, 품질 100% 충족

11 3. 생산혁신로드맵 엄격한품질관리 - 경영진이품질시스템, 시정예방조치, 공정개선활동 -4Step 품질전략수립, 실천 - 품질및사후관리극대화지향 전사적자원관리 - 정보기술 (IT) 을활용하여비즈니스프로세스확립 - 경영관리및생산설비 IT 화로기업경쟁력제고 기업경쟁력강화 - 기술, 품질과서비스의차별화 - 변화하는시장의능동적대처 - 효율적자원관리로고객의욕구충족 미래지향 R&D - 새로운기술혁신과지속적연구개발 - 교육으로인한인력양성의효율성극대화 철저한생산관리 - 최고수준의인적자원으로효율적재원관리 - 원가절감과생산성극대화로고객의비용절감

12 3. 생산혁신로드맵 써트론은전사적인품질경영활동과지속적인개선을통해최고의품질을유지하고최상의서비스를제공하여 다양한고객의요구를충족시켜고객감동실현을위해품질방침을정하고적극실천한다. 방침 품질제일주의구현 납기의차별화 지속적인고객감동실현 목표 ISO 품질시스템정착으로품질경쟁력확보 제품신뢰성확보로 ZERO Defect 실현 지속적인품질개선으로 Loss 절감

13 3. 생산혁신로드맵 Q.A. (Sample) 수입검사 품질검사 신뢰성검사 출하검사 4 Step 고객품질보증 Q.C. (Sample) 품질목표종합평가 적층드릴도금 D/F PSR Spec Hole spec Etch 현상 품질목표종합평가 3 Step 공정품질관리 제조 ( 전수 ) 내층검사 외층검사 특성검사 최종검사 2 Step 공정품질평가 공정 (Sample) 공정자주검사 1 Step 공정품질유지

3. 생산혁신로드맵 Materials Drill to Copper BGA pitch Plugging Immersion Gold Layer count Panel size Aspect Ratio Item Impedance Tol Pattern Smallest Drilled Hole 1 년후 2 년후 1st half 2nd half 1st half 2nd

14 3. 생산혁신로드맵 Materials Drill to Copper BGA pitch Plugging Immersion Gold Layer count Panel size Aspect Ratio Item Impedance Tol Pattern Smallest Drilled Hole 1 년후 2 년후 1st half 2nd half 1st half 2nd half Polyimide, PPE Polyimide, PPE Polyimide, PPE Polyimide, PPE Polyimide, PPE Polyimide, PPE Polyimide, PPE FR-4 FR-4 FR-4, BT-Resin FR-4, BT-Resin, Iso410 FR-4, BT-Resin, Iso410 FR-4, BT-Resin,Iso410 FR-4, BT-Resin, Iso410 10% 8% 8% 8% 5% 5% 5% Inner Layer 0.004"(0.10mm) 0.003"(0.08mm) "(0.06mm) "(0.06mm) "(0.06mm) 0.002"(0.05mm) 0.002"(0.05mm) Outer Layer 0.005"(0.13mm) 0.004"(0.10mm) "(0.09mm) "(0.09mm) "(0.09mm) 0.003"(0.07mm) 0.003"(0.07mm) 13.4" x16" "(0.14mm) "(0.114mm) 0.004"(0.10mm) "(0.089mm) 0.003"(0.076mm) 0.003"(0.076mm) 0.003"(0.076mm) 16"x20" 0.006"(0.152mm) 0.005"(0.127mm) "(0.114mm) 0.004"(0.10mm) "(0.089mm) 0.003"(0.076mm) 0.003"(0.076mm) 20"x24" "(0.165mm) "(0.14mm) 0.005"(0.127mm) "(0.114mm) 0.004"(0.10mm) "(0.089mm) 0.003"(0.076mm) 13.4"x26" "(0.165mm) "(0.14mm) 0.005"(0.127mm) "(0.114mm) 0.004"(0.10mm) "(0.089mm) 0.003"(0.076mm) 26"x27.5" 0.010"(0.254mm) 0.008"(0.203mm) 0.008"(0.203mm) 0.007"(0.178mm) 0.007"(0.178mm) 0.006"(0.152mm) 0.006"(0.152mm) 0.062" 0.125" 0.150" 현재 0.8mm pitch 0.5mm pitch 0.5mm pitch 0.5mm pitch 0.4mm pitch 0.4mm pitch 0.35mm pitch No Yes Yes Yes Yes Yes Yes 0.002u"(0.05um) 0.027u"(0.07um) 0.003u"(0.08um) 0.003u"(0.08um) over 0.040u"(1.0um) over 0.040u"(1.0um) over 0.04u"(1.0um) " 0.008" 0.008" 0.006" 0.006" 0.006" 0.006" 13.38"x25.98" 13.38"x25.98" 13.38"x25.98" 13.38"x25.98" 13.38"x25.98" 13.38"x25.98" 13.38"x25.98" 3 년후 12 : 1 14 : 1 14 : 1 16 : 1 16 : 1 18 : 1 18 : 1 4 년후

15 ROUTER V-CUT 초음파수세 DRILL BBT ETCHING

16 라미네이터노광 1 호기노광 2 호기 현상 1 호기현상 2 호기정면기

17 PRINTING 장비 (PSR 인쇄 ) PRINTING 장비 (SILK 인쇄 ) PRINTING 장비 (PSR, SILK) BOX OVEN 제판노광기 BELT SAND 기기

18 제판자동세척기제판건조기포장기 현미경 (X200) 확대경 (X5) 휨교정기

19 구분자체공정외주공정비고 1 적층 2 DRILL 3 동도금 4 노광, 부식 D/F 5 인쇄 PSR 6 외형가공 ROUTER V-CUT 7 B. B. T. 8 표면처리 HASL, OSP, GOLD, ETC 9 최종 / 출하검사

20 Multi Layer PCB CAM / FILM Double Side PCB CAM / FILM Silk 원판재단 원판재단 표면처리 내층회로형성 Drill 외형가공 A.O.I 동도금 B.B.T Oxide D/F 최종검사 Lay-Up 중간검사 출하검사 Hot Press Etching 납품 X-Ray P.S.R

21 원자재 C/L 후가공 CCL 재단 C/L 재단 표면처리 CNC Drill C/L 가공 1 차타발 동도금 B.B.T D/F 밀착 접착제부착 노광 보강판부착 현상 2 차타발 부식 / 박리 최종검사 C/L 가접 출하검사 적층 포장

22 Flex Layers 회로형성 Baking C/L 가접 Registration Hole Punching Rigid Layers 회로형성 Router & V -Cutting Registration Hole Punching Oxide FR-4 0.4T 이상 V-CUT 적용가능 Apply only for 6L above 1 st Lay-up Eye-Let 2 nd Lay-up Cushion Sheet(PE) 합지적층 CNC Drilling Plasma Etch Punching

23 10% 10% telecom (18%) Mobile (12%) Settop Box (7%) 제품군별매출 1% 31% Digital TV (5%) CCTV, DVR (3%) ETC (8%) 15% 23% - Broadcast, Military, DOUBLE SIDED ( 15% ) MLB 4L ( 14% ) 15% 15% 생산현황 MLB 6L ( 18% ) Over MLB 8L (20% ) 18% 14% HDI ( 18% ) FPC & Rigid-Flex ( 15% ) 20% 18%

24 Specialty Boards Probe Cards/Boards Burn-in Boards Ultra Thin Boards High Technology Raw PCBs High Density Boards Back Plane Boards Build-Up Boards

Probe Cards/Boards (Controlled Impedance Boards) Applications: - Semiconductor wafer probing & IC testing - High-speed signal processing units - High frequency communication equipment Typical CIRTRON

25 Probe Cards/Boards (Controlled Impedance Boards) Applications: - Semiconductor wafer probing & IC testing - High-speed signal processing units - High frequency communication equipment Typical CIRTRON Controlled Impedance Boards Specification Number of Layers Base material Thickness Conductor width Conductor space Hole diameter Surface treatment (Electroless gold plating) (Units : mm) FR-4, PPE 4.8~ ø µm (Units : inch) FR-4, PPE 0.190~ ø µ

26 Burn-In Boards Applications: - Semiconductor IC burn-in testing Typical CIRTRON Burn-In Boards Specification Number of Layers Base material Thickness Conductor width Conductor space Hole diameter Surface treatment (Gold Fingers & HASL) (Units : mm) 4-22 FR-4,polyimide, FR-5, BT-Resin 0.8~ ø & 13µm (Units : inch) 4-22 FR-4, polyimide, FR-5, BT-Resin 0.031~ ø µ & 0.5µ

Ultra Thin Boards Applications: - High-End Consumer Electronics (Camcorders & Cellular Phones) - Flash Memory Cards - LCD Monitor Drivers - Camera Module Typical CIRTRON Ultra Thin Boards

27 Ultra Thin Boards Applications: - High-End Consumer Electronics (Camcorders & Cellular Phones) - Flash Memory Cards - LCD Monitor Drivers - Camera Module Typical CIRTRON Ultra Thin Boards Specification Number of Layers Base material Thickness Conductor width Conductor space Hole diameter Surface treatment (Soft Gold & HASL) (Units : mm) 2-12 FR-4 0.1~ ø µm (Units : inch) 2-12 FR ~ ø µ

28 High Density Boards Applications: - Notebook PCs - Workstations - Communications Boards Typical CIRTRON High Density Boards Specification Number of Layers Base material Thickness Conductor width Conductor space Hole diameter Surface treatment (Gold Fingers & HASL) (Units : mm) 4-12(50) FR-4 1.0~ ø & 13µm (Units : inch) 4-12(50) FR ~ ø µ & 0.5µ

29 Back Plane Boards Applications: - High-End Computers - Communications Transformer (TRS) Typical CIRTRON Back Plane Boards Specification Number of Layers Base material Thickness Conductor width Conductor space Hole diameter Surface treatment (Electroless gold plating) (Units : mm) 4-60 FR-4, BT-Resin 3.2 ~ ø µm (Units : inch) 4-60 FR-4, BT-Resin 0.126~ ø µ

30 Build Up Boards Applications: - Cellular Phones - High End Electronic Appliances Typical CIRTRON Build Up Boards Specification Number of Layers Base material Thickness Conductor width Conductor space Hole diameter Surface treatment (Electroless gold plating) (Units : mm) 4-16 FR-4, RCC ø µm (Units : inch) 4-16 FR-4, RCC ø µ

31 Flexible PCBs Multi FPCB Rigid FPCB Build-Up FPCB Power LED 용 Fpcb METAL PCB

32 Multi FPCB Applications: - Cellular Phones - Printer - Hard Disk Driver Typical CIRTRON Multi FPCB Specification Number of Layers Base material Thickness (Film) Conductor width Conductor space Hole diameter Surface treatment (Gold plating, SN plating) (Units : mm) 4 Polyimide Film Min. 12.5µm ø µm (Units : inch) 4 Polyimide Film Min. 0.49µ ø µ

33 Rigid FPCB Applications: - Mobile Phone Keypad - Camera Module - CDRW Pick up - MP3 Player Typical CIRTRON Rigid FPCB Specification Number of Layers Base material Thickness Conductor width Conductor space Hole diameter Surface treatment (Gold plating, SN plating) (Units : mm) FR-4, PI 350µm ø µm (Units : inch) FR-4, PI 13.78µ ø µ

Build-Up FPCB Applications: - Cellular Phones - Digital Camera - LCD Module - Camera Module Typical CIRTRON Build-Up FPCB Specification Number of Layers Base material Thickness Conductor width

34 Build-Up FPCB Applications: - Cellular Phones - Digital Camera - LCD Module - Camera Module Typical CIRTRON Build-Up FPCB Specification Number of Layers Base material Thickness Conductor width Conductor space Hole diameter Surface treatment (Gold plating, SN plating) (Units : mm) FR-4, PI 350µm ø µm (Units : inch) FR-4, PI 13.78µ ø µ

Power LED 용 FPCB Applications: - Cellular Phones - Digital Camera - LED Module - Camera Flash Module Description: LED Mounting Fpcb from, complement the heat problem is a mineral coating Because a

35 Power LED 용 FPCB Applications: - Cellular Phones - Digital Camera - LED Module - Camera Flash Module Description: LED Mounting Fpcb from, complement the heat problem is a mineral coating Because a lot of heat emission is very High temperature. Typical CIRTRON Power LED 용 FPCB Specification Number of Layers Base material Thickness Conductor width Conductor space Hole diameter Surface treatment (Gold plating, SN plating) (Units : mm) 2-4 Polyimide Film 0.4~3.2t ø µm (Units : inch) 2-4 Polyimide Film 15.75µ µ

Typical CIRTRON METAL PCB Specification Number of Layers Base material Thickness Conductor width Conductor

36 Metal PCB Applications: - LED TV - LED 조명 - LED 형광등 - LED 모니터 Description: Recent lighting, communications and other electronic device are actively using the display. Typical CIRTRON METAL PCB Specification Number of Layers Base material Thickness Conductor width Conductor space Hole diameter Surface treatment (Gold plating, SN plating) (Units : mm) 1-2 AL. 0.6~3.2t ø µm (Units : inch) 1-2 AL µ µ

37 양면생산능력 (PCB & FPCB) Double side : 15,000 m2 / Month Sample Read Time : 3~5 Days Multi-Layer 생산능력 (PCB & FPCB) Multi layer: 10,000 m2 / Month Sample Read Time : 7~10 Days R-FPCB 생산능력 R-FPCB: 8,000 m2 / Month Sample Read Time : 7~12 Days 빌드 - 업생산능력 (PCB & FPCB) Build-up: 6,000 m2 / Month Sample Read Time : 9~14 Days

Shop Tolerance : Standard Advanced Remark Minimum Outer Line Width.006.003 Minimum Inner Line Width.006.003 Minimum Outer Space, Trace/Trace.006.003 Minimum Inner Space, Trace/Trace.005.

38 Shop Tolerance : Standard Advanced Remark Minimum Outer Line Width Minimum Inner Line Width Minimum Outer Space, Trace/Trace Minimum Inner Space, Trace/Trace Minimum Space, PCB Edge to Conductor Layer-to-Layer Registration ±.005 ±.004 Maximum Finished PCB Thickness Minimum Board Thickness Tolerance ±10% ±7% Dimensions-Hole Location(<12" Finished Board) ±.003 ±.0025 (>12" Finished Board) ±.004 ±.003 Dimensions-Fab O.D Fabrication Radius ±5 deg. ±5 deg. Warp age (inch per inch) (flatness of finished board) Minimum Component Pitch Minimum Dielectric Thickness Maximum Number of Layers 14 50

Pad to hole size : Standard Advanced Remark Tolerance-Plated Hole Size ±.003 ±.002 Nominal Finished Hole Size.012.004 Plane Relief Diameter over drilled hole.010.

39 Pad to hole size : Standard Advanced Remark Tolerance-Plated Hole Size ±.003 ±.002 Nominal Finished Hole Size Plane Relief Diameter over drilled hole Minimum Outer Non-Plated Hole to Trace Spacing Minimum Inner Non-Plated Drilling : Standard Advanced Remark Minimum Drill Size Maximum Drill Size (Above.200 is routed) Maximum Aspect Ratio 10:1 14:1 Solder mask criteria : Standard Advanced Remark Solder mask clearances (no mask pads/complete line coverage).003 /side.002 /side SMT Minimum Pad Spacing Minimum Solder mask Dam

40 Surface finished available : Standard Advanced Remark HASL Minimum Thickness Immersion Silver 8~15u in 8~15u in Organic Solder ability Preservative (OSP) Co- Planarity To Cu plate Immersion Ni/Au Minimum Thickness* 3 u in 5 u in Immersion White Tin* 15~30u in 15~30u in * Currently outside (Future in house capability) Testing capability: Standard Advanced Remark Minimum component Pitch Test Parameters 100 Volt 250 Volt 10Ω resist 50Ω resist 50MΩ 2GΩ

41 Etch factor : These are presented as a function of the copper weight applying to all 3 category: copper Etch allowance Remark 2 Oz.002 Inner layer 1 Oz.001 Per side ½ Oz Oz.0025 Outer layer 1 Oz.0015 Per side ½ Oz.001 ⅓ Oz.0005

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