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1 Dataa Sheet AH351B_W Partt Number : SPHWHTL3D3A2

120 lm at 350 ma ESD withstand Voltage : up to ±8KV [HBM] Reliability Test : AEC Q-101 qualified Applications Traffic lights Backlighting ( LCD, switches, keys, displays, illuminated advertising )

2 Introduction Part Number : SPHW WHTL3D3A2 Exterior automotive lighting, Traffic lighting etc. Features Package : Ceramic Substrate LED Package View Angle : 135 Optical Efficiency : 110 lm/w at 350 ma Precondition : JEDEC Level 2a Dimension : 3.5 x 3.5 mm Luminous Flux : Typ. 120 lm at 350 ma ESD withstand Voltage : up to ±8KV [HBM] Reliability Test : AEC Q-101 qualified Applications Traffic lights Backlighting ( LCD, switches, keys, displays, illuminated advertising ) Interior automotive lighting Substitution of micro incandescentt lamps Marker lights ( e.g. steps, exit ways, etc. ) Signal and symbol luminaire Environmental Compliance Samsung ELECTRONICS is compliant to the restrictions of hazardous substances in electronic equipment, namely, the RoHS, ELV, ISO14001 and REACH directives. Samsung ELECTRONICS will not intentionallyy supplement the restricted materials to the LED product : Cd,Pb,Hg,PBBs,PBDEs and Cr

3 Table of Contents Part Numberr Description Ordering informationn Characteristics Typical Characteristic Luminous Flux Bin Forward Voltage Binn Color Bin Definition Absolute Maximum Rating Typical Characteristicc Graph Mechanical Dimensio on Soldering Condition Packing Information Product Labeling Information Reliability Test Condition Precaution for Use Revision History Company Informationn

4 Part Number Description The Part number designation is explained as follows : SP H WH T L3 AB C DE F GH D 3 A 2 AB CD EF I J K L MN OP QR Where: AB - designates company name and Samsung LED PKG (SP for Samsung S LED PKG) C - designates power variant (H for f automotive High Power) DE - designates color variant (WH for automotive White color) F - designates LED PKG version (T for initial version) GH - designates product configuration and type (L3 for 3535 Ceramic type) I - designates lens configuration ( D for lens) J - designates Max power (3 for W) K - designates specificc property (A for Revision symbol) L - designates CRI variant (2 for CRI Max.70) MN - designates forward voltage property OP - designates CIE coordination property QR - designates luminous flux property - 3 -

5 Characteristics Typical Characteristicss [T s = 25 ] [1] Parameter Symbol Value Unit Luminous Flux (I F = 350 ma) Φ V Typ. 120 lm Forward Voltage (I F = 350 ma) V f Typ. 3.1 V Reverse Voltage(I R = 5 ma) ) V R Typ. 0.9 V Viewing Angle φ Typ. 135 Deg. Thermal Resistance (Junctionn to Solder Point) R th h_ J-S Typ. 7 K/W Luminous Flux Bin [2] [T s = 25 ] [1] Symbol Condition Bin Code Min. Typ Max. Unit G Φ V I F = 350 ma J2 M lm P Forward Voltage Bin [2] [T s = 25 ] [1] Symbol Condition Bin Code Min. Typ. Max. Unit V f I F = 350 ma F3 J V - 4 -

6 Color Bin Definition [3 3] Symbol Bin Code Cx [Condition : I F F=350 ma ] [Ts = 25 ] [1] H Cy Cx,Cy H H H *Notes [1] The measurement condition means that temperature dependence is excludedd by applying pulse current for under 25 ms. [2] Luminous flux measuring equipment : CAS140CT Tolerance : V F : ±0.1V, Φ V : ±7 % [3] Chromaticity coordinates : Cx, Cy according to CIE Cx and Cy tolerances are ±0.01, respectively

7 Absolute Maximum Ratings Parameter Symbol Valuee Unit Operating temperature range T op -45 ~ +125 Storage temperature range T stg -45 ~ +125 Junction temperature T jmax +150 Maximumm Forward (T s : 25 ) [5] current [4] I F 1000 ma Minimumm Forward current [4] (T s : 25 ) [5] Maximumm Reversee current I F 100 Doo not apply for reverse current ma Maximumm Transient Peaked (T s : 25 ) [5] current [6] ma 1000 ma for 10 ms ma ESD Sensitivity [7] - ± 8.0 KV HBM *Note [4] Unpredictable performance may be resulted by driving the product at below Min. I F or above Max. I F. But there will be no damage to the product. [5] The measurement condition means that temperature dependence is excludedd by applying pulse current for under 25 ms. [6] Duty 1/ 10 pulse with 10 ms. [7] It is included the device to protect the product from ESD

8 Typical Characteristics Graph Typical Spectrum [ I F = 350 ma, T s = 25 C ] [8] Typical Chromaticity Coordina ate Shift vs Forward Current [ I F = 350 ma, T s = 25 C ] [8] *Notes [8] The measurement condition means that temperature dependence current for under 25 ms. is excludedd by applying pulse - 7 -

9 Typical Relativee Luminous Fluxx & Forward Voltage vs Forward [ I F = 350 ma, T s = 25 C ] [9] Current - 8 -

10 Typical Relative Luminous Flux & Forward Voltage vs Temperature [9] Solder Pad Temperature ( ) Solder Pad Temperature ( ) Typical Chromaticity Coordinatee Shift vs Temperature [ I F = 350 ma, T s = 25 C ] [9] Solder Pad Tempera ature ( ) * Notes [9] The measurement condition means that temperature dependence current for under 25 ms. is excludedd by applying pulse - 9 -

11 Typical Radiant Pattern X Max. Permissible Forward Current [10] * Notes [10] The measurement condition means that temperature dependence is excluded by applying pulse current for under 25 ms

12 Mechanical Dimension Tolerance : ±0.1mm [Top View] [Side View] [Bottom Thermal Pad View] [Front View] * Note : The thermal pad is electrically isolated from the anode andd cathode contact pads.. Pick and Place Do not place pressure on the resin lens ("A") It is recommended to use a pick&place nozzle with inside diameter at 3.1 mm Electric Schematic Diagram Cathode ESD Protection Diodee [ Circuit ] Material Information LED Package = Silicon resin coveredd White GaN LED on Ceramic Sub. Electrodee PAD = Au Plated PAD This LED has built-in ESD protection device(s) connected in parallel too LED Chip(s)

13 Soldering Conditions Pad Configuration & Solder Pad Layout Tolerancee : ±0.1mm Baree copper pattern Recommended Solder Pad Reflow Soldering Condition ( Pb Free) Reflow Frequency : 2 times max. Manual Soldering Condition Not more than 5 under soldering iron.(one time only)

14 Packing Information Tapin ng [11] User feed direction * Note [11] Unit : mm, LED taping quantity : 800EA / Reel. Reel [Unit[ : mm] A B C W1 W ± ± ±

15 Packing Process Dimension of Transportation Box in mm Width Length Height Remark inch

16 Product Labeling Information A B C D E F F3H3J2 SPHWHTL3D3A2F6HBG4 F3H3G2 01 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII SLAT94001 / 1001 / 800 pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII Bin code Lot Number N.B) Denoted rank is the only example. Bin Code Structure AB : Forward Voltage(VF) F Bin (refer to page. 5 ) CD : Color bin (Cx,Cy) (refer to page. 6) EF : Luminous Intensity( (I V ) Bin (refer to page. 5 ) Lot Number Structure The Lot number is composed off the following characters / 1abc / 800 PCS No abc Information Production Site : S:SAMSUNG LED, G:GOSIN CHINAA LED Product State A :Normality, B :Bulk, C :First Production, R :Reproduction, S :Sample: Year : X:2013, Y:2014, Z: Month : 1 ~ 9, A, B Day : 1 ~ 9, A, B ~ V Product numberr : 1 ~ Reel Number : 1 ~

17 Reliability Test Conditions SPHWHTL3D3A2 For detailed Information please your SAMSUNG Sales partner contact

18 Precaution for Use SPHWHTL3D3A2 1) For over-current-proof function, customers are recommended to apply resistors to t prevent sudden change of the current caused by slight shift of the voltage. 과전류방지를위해전압의미세한이동에의해야기되는전류의순간간변화를방지하기위해저항등의설치를권장함. 2) This device should not be used in any type of fluid such as water, oil, organic solvent, etc. When washing is required, IPA is recommended to use. 제품은물, 오일, 유기물과같은액체타입에서의사용은제한되며, 세정이필요할시에는 IPA 사용을권장함. 3) When the LEDs illuminate, operating current should be decided afterr considering the ambient maximum temperature. LED 의발광시, 동작전류는주변최고온도를고려하여결정되어야함. 4) LEDs must be stored in a clean environment. If the LEDs are to be stored for 3 months or more after being shipped from Samsung Electronics, they should bee packed by a sealed container with nitrogen gas injected.(shelf life of sealed bags: 122 months, temp. ~40, ~90 % RH) LED 의보관은청정한환경에서보존되어져야하며, 만약삼성전자로부부터공급받는후 3개월또는그이상보관이필요하다면질소가스를동봉한보존용기에보관되어야함. ( 보존 bag의수명 : 12 개월, 보존온도 ~40, 습도 ~90 % RH) 5) After storage bag is open, device subjected to soldering, solder reflow, or other high temperaturee processess must be: : 보존 Bag이개봉된후에, 납땜이나 reflow등의높은온도에노출되는제품은다음의사항에부합되어야함. a. Mounted within 672 hours (28 days) at an assembly line with a condition of no more than 30 /60 %RH, a. 제품은 30 / 60 %RH보다같거나낮은조립조건에서 672시간 (28 일 ) 이내에조립해야함. b. Stored at <10 %RH. b. 10 % 이하의상대습도에서보관되어야함. 6) Repack unused Products with anti-moisture packing, fold to t close any opening and then store in a dry place. 사용하지않은제품은방습팩에넣어개봉부위를닫아서다시포장한한후, 건조한장소에서보관할것을권장함

19 7) Devices require baking before mounting, if humidity card reading r is >60 % at 23± ±5. 만약습도표시카드의수치가 23±5 에서 60 % 이상이라면, 제품실장장전에 baking 하여야함. SPHWHTL3D3A2 8) Devices must be baked forr 1 hour at 65±5, if baking iss required. 만약 baking이필요하다면, 제품은 65±5 에서 1시간정도 baking 되어야함. 9) The LEDs are sensitive to the static electricity and surge. It is recommended use a wrist band or anti-electrostatic glove when handlingg the LEDs. LED 는정전기및서지에민감한제품이므로, LED 제품을다룰시에는는정전기방지장갑이나손목밴드를사용하기를권장함. to If voltage exceeding the absolute maximum rating is applied to LEDs, it may cause damage or even destruction to LED devices. 만약절대허용치를초과하는전압이 LED에가해지면, LEDD 소자는파괴되거나손상될수있음. Damaged LEDs may show some unusual characteristics such s as increase in leak current, lowered turn-on voltage, or abnormal lighting of LEDs L at loww current. 손상된제품은누설전류의증가, Turn on 전압의저하, 저전류에서의의점등불량등의이상거동을보일수있음. 10) VOCs (volatile organic compounds) may be occurred by adhesives,, flux, hardener or organic additives which is used in luminaires (fixture) and LED silicone bags are permeable to it. It may lead a discoloration when LED expose e to heat or light. VOCs ( 휘발성유기화합물 ) 는등기구에사용되는접착제, Flux, 경화제, 유기물첨가제에서발생하여 LED 실리콘봉지제를투과하고, 빛또는열에노출되었을때변색이발생할수있음. This phenomenon can give a significant loss of light emitted (output) from the luminaires (fixtures). 이러한현상은등기구로부터나오는빛의중대한손실을줄수있음음. In order to prevent these problems, we recommend you to know the physical properties for the materials used in luminaires, It requires to select t carefully. 이러한문제발생방지를위해서, 등기구에사용되는자재에대한물성을알고주의하여선택되어야함

Revision History SPHWHTL3D3A2 Date 2013.02.25 2015.09.07 Revision History Initial Edition Revisee of Luminous Flux bin Author Drawn Approved H.J Park Y.T Kim S.Y Hong J.

20 Revision History SPHWHTL3D3A2 Date Revision History Initial Edition Revisee of Luminous Flux bin Author Drawn Approved H.J Park Y.T Kim S.Y Hong J..G Son Company Information US Samsung Semiconductor r Inc., 3655 N. First Street, San Jose CAA 95134, USA TEL Europe Samsung Electronicss Germany GmbH, Samsung House, Am Kronberger Hangg 6, Schwalbach/Ts,German ny TEL Samsung Electronics 5 All rights reserved 95, Samsung 2-ro, Giheung-Gu,, Yongin-City, Gyeonggi-Do # Korea Sales Contact : em.yeon@samsung.com -00 Japan Samsung Japan Corporation SLEDD Team 10F, Shinagawa Grand Central Towerr , Kounan, Minato-ku, Tokyo , Japan TEL China (Tianjin Office in China) Tianjin Samsung LEDD Co., LTD. Weisi (6th) Rd., Micro-Electronics Industrial Park, Xiqing District, Tianjin , China TEL

Introduction Part Number : SPHWHTL3D3A2F6H0G4 Interior automotive lighting, Torch lighting etc. Features Package : Ceramic Substrate LED Package View

Data Sheet Part Number : SPHWHTL3D3A2F6H0G4-1 - Introduction Part Number : SPHWHTL3D3A2F6H0G4 Interior automotive lighting, Torch lighting etc. Features Package : Ceramic Substrate LED Package View Angle