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ISSUE NO : Rev: 002 Product Family Data Sheet LM231B - 2323 Middle Power LED Introduction Features Package : Silicone Reflector LED Package Beam Angle : 120 Precondition : JEDEC Level 2a Dimension :

1 ISSUE NO : Rev: 002 Product Family Data Sheet LM231B Middle Power LED Introduction Features Package : Silicone Reflector LED Package Beam Angle : 120 Precondition : JEDEC Level 2a Dimension : 2.3 x 2.3 x 0.7 mm ESD withstand Voltage : up to ± 5KV [HBM] Reliability Test : LM-80 qualified Applications INDOOR LIGHTING : Ambient Light, LED tube, Down light, LED bulb and Ceiling Light SAMSUNG ELECTRONICS 95, Samsung2-Ro, Giheung-Gu, Yongin-City, Gyeonggi-Do , KOREA 1 / 49

2 Contents 1. Product Code Information Luminous Flux Characteristics Characteristics Typical Characteristics Graph Outline Drawing & Dimension Reliability Test Items & Conditions Solder Conditions Tape & Reel Label Structure Packing Structure Precaution For Use Hazard Substance Analysis Report / 49

3 1. Product Code Information 1) Luminous Flux Bins (T s = 25 ) Nominal CCT Product Code Flux Rank Sorting Condition Intensity Range (cd) Flux Bin Flux Range (Φ v, lm) SY 6.24 ~ ~ K SPMWHT223MD5WAW0S0 S0 SZ 7.06 ~ ~ S ~ ~ SY 6.40 ~ ~ K SPMWHT223MD5WAV0S0 S0 SZ 7.22 ~ ~ S ~ ~ SY 6.56 ~ ~ K SPMWHT223MD5WAU0S0 S0 SZ 7.38 ~ ~ S ~ ~ SY 6.89 ~ ~ K SPMWHT223MD5WAT0S0 S0 SZ S ~ ~ ~ ~ Notes: SAMSUNG ELECTRONICS maintains a tolerance of ±5% on Luminous Flux measurements 3 / 49

4 1) Luminous Flux Bins (Continued) Nominal CCT Product Code Flux Rank Sorting Condition Intensity Range (cd) Flux Bin Flux Range (Φ v, lm) SY 7.22 ~ ~ K SPMWHT223MD5WAR0S0 S0 SZ 8.04 ~ ~ S ~ ~ SY 7.06 ~ ~ K SPMWHT223MD5WAQ0S0 S0 SZ 7.88 ~ ~ S ~ ~ SY 6.89 ~ ~ K SPMWHT223MD5WAP0S0 S0 SZ 7.71 ~ ~ S ~ ~ Notes: SAMSUNG ELECTRONICS maintains a tolerance of ±5% on Luminous Flux measurements 4 / 49

5 2) Color Bins (T s = 25 ) 1) Color Binning Nominal CCT Product Code Color Rank Chromaticity Bins 2700K 3000K 3500K 4000K SPMWHT223MD5WAW0S0 W0(Whole bin) SPMWHT223MD5WAV0S0 V0(Whole bin) SPMWHT223MD5WAU0S0 U0(Whole bin) SPMWHT223MD5WAT0S0 T0(Whole bin) W1, W2, W3, W4, W5, W6, W7, W8, W9, WA, WB, WC, WD, WE, WF, WG V1, V2, V3, V4, V5, V6, V7, V8, V9, VA, VB, VC, VD, VE, VF, VG U1, U2, U3, U4, U5, U6, U7, U8, U9, UA, UB, UC, UD, UE, UF, UG T1, T2, T3, T4, T5, T6, T7, T8, T9, TA, TB, TC, TD, TE, TF, TG 5000K SPMWHT223MD5WAR0S0 R0(Whole bin) R1, R2, R3, R4, R5, R6, R7, R8 5700K SPMWHT223MD5WAQ0S0 Q0(Whole bin) Q1, Q2, Q3, Q4, Q5, Q6, Q7, Q8 6500K SPMWHT223MD5WAP0S0 P0(Whole bin) P1, P2, P3, P4, P5, P6, P7, P8 5 / 49

6 2) Chromaticity Region & Coordinates 6 / 49

7 2) Chromaticity Region & Coordinates (Continued) Region CIE X CIE Y Region CIE X CIE Y W rank (2700K) W1 W2 W3 W4 W5 W6 W7 W W WA WB WC WD WE WF WG Region CIE X CIE Y Region CIE X CIE Y V rank (3000K) V1 V2 V3 V4 V5 V6 V7 V V VA VB VC VD VE VF VG / 49

8 2) Chromaticity Region & Coordinates (Continued) Region CIE X CIE Y Region CIE X CIE Y U rank (3500K) U1 U2 U3 U4 U5 U6 U7 U U UA UB UC UD UE UF UG Region CIE X CIE Y Region CIE X CIE Y T rank (4000K) T1 T2 T3 T4 T5 T6 T7 T T TA TB TC TD TE TF TG / 49

9 2) Chromaticity Region & Coordinates (Continued) Region CIE X CIE Y Region CIE X CIE Y R rank (5000K) R1 R2 R3 R4 Q1 Q2 Q3 Q R R R R Q rank (5700K) Q Q Q Q Region CIE X CIE Y Region CIE X CIE Y P rank (6500K) P1 P2 P3 P P P P P Notes: SAMSUNG ELECTRONICS maintains ±0.01 tolerance of CCx, CCy 9 / 49

10 2. Luminous Flux Characteristics (T s = 25 ) Nominal Minimum CCT CRI 2700K K K K 80 If(mA) Vf(V) Power(W) Flux(lm) lm/w Notes: Luminous Flux(Φ v, lm) values are for representative reference only 10 / 49

11 2. Luminous Flux Characteristics (T s = 25 ) Nominal Minimum CCT CRI 5000K K K 80 If(mA) Vf(V) Power(W) Flux(lm) lm/w Notes: Luminous Flux(Φ v, lm) values are for representative reference only 11 / 49

12 3. Characteristics 1) Absolute Maximum Rating Item Symbol Rating Condition Operating temperature range Top -40 ~ Storage temperature range Tstg -40 ~ LED junction temperature T J Forward Current I F 150 ma - Peak Pulsed Forward Current IFP 300 ma Duty 1/10 pulse width 10ms Thermal resistance Rth, j-s 20 /W Junction to solder point Assembly Process Temperature - 260, < 10sec - ESD - 5kV HBM 2) Electro-optical Characteristics Item Forward Voltage 1) (V F) (@65 ma, Ts = 25 ) Luminous Flux 2) (Φ v) (@65 ma, Ts = 25 ) Unit Nominal CCT Product Code V - - WA lm 2700K (W0) 3000K (V0) 3500K (U0) 4000K (T0) 5000K (R0) 5700K (Q0) 6500K (P0) Rank Min Typ Max AZ A A A A *WAW0SY SY *WAW0SZ SZ *WAW0S1 S *WAV0SY SY *WAV0SZ SZ *WAV0S1 S *WAU0SY SY *WAU0SZ SZ *WAU0S1 S *WAT0SY SY *WAT0SZ SZ *WAT0S1 S *WAR0SY SY *WAR0SZ SZ *WAR0S1 S *WAQ0SY SY *WAQ0SZ SZ *WAQ0S1 S *WAP0SY SY *WAP0SZ SZ *WAP0S1 S Reverse Voltage V (@5 ma, Ts = 25 ) Color Rendering Index 3) (R a) Special CRI 4) (R9) Notes: 1)~4) SAMSUNG ELECTRONICS maintains a tolerance of V F:±0.1 V, Φ v:±5 %, R a :±3.0, R9 :±6.5 on measurements 5) " * " is Product Code of "SPMWHT223MD5" 12 / 49

13 4. Typical Characteristics Graph T s = 25 ) 1) Spectrum Distribution [CCT : 2700K & 3000K] [CCT : 3500K & 4000K] 13 / 49

14 [CCT : 5000K] [CCT : 5700K~6500K] 14 / 49

15 2) Forward Current Characteristics (T s = 25 ) [Relative Luminous Flux vs. Forward Current] [Forward Current vs. Forward Voltage] 15 / 49

16 3) Temperature Characteristics [Relative Luminous Flux vs. Ts] [Forward Voltage vs. Ts] 16 / 49

17 [Color x, y vs. Ts] 4) Color shift Characteristics (T s = 25 ) [Forward Current vs. Color x, y] 17 / 49

18 5) Derating Curve 6) Beam Angle Characteristics T s = 25 ) 18 / 49

19 5. Outline Drawing & Dimension a b Cathode Anode Recommended Land Pattern 1. Tolerance is ±0.1 mm 2. The maximum compressing force is 15N on the silicone a 3. Do not place pressure on the encapsulation resin b Notes: 1) This LED has built-in ESD protection device(s) connected in parallel to LED Chip(s). 2) Ts point & measurement method 1 Measure the nearest point to the thermal pad. If necessary, remove PSR of PCB to reach Ts point. 2 Thermal pad must be soldered to the PCB to dissipate heat properly. Otherwise, LED can be damaged. 3) Precautions 1 The pressure on the LEDs will influence to the reliability of the LEDs. Precautions should be taken to avoid the strong pressure on the LEDs. Do not put stress on the LEDs during heating. 2 Re-soldering should not be done after the LEDs have been soldered. If re-soldering is unavoidable, LED`s characteristics should be carefully checked before and after such repair. 3 Do not stack assembled PCBs together. Since materials of LEDs is soft, abrasion between two PCB assembled with LED might cause catastrophic failure of the LEDs / 49

20 6. Reliability Test Items & Conditions 1) Test Items and Results Test Item MSL Test Room Temperature Life Test High Temperature Life Test High Temperature Humidity Life Test Low Temperature Life Test Powered Temperature Cycle Test Thermal Shock High Temperature Storage Low Temperature Storage ESD(HBM) ESD(MM) Test Conditions 125, 24hrs 60, 60%RH, 120hrs Peak 260±5, 220 over time 60sec, 3 cycles Test Hours/Cycles Sample No 1 cycle ±3, DC 150mA 1,000 hrs ±3, DC 150mA 1,000 hrs ±3, 85%±2%RH, DC 150mA 1,000 hrs ±3, DC 150mA 1,000 hrs /20min 85 /20min, Sweep 100min cycle on/off: each 5min, DC 150mA -45 /15min 125 /15min, Hot plate cycles cycles 100 Ta=120 ±3 1,000 hrs 11 Ta=-40 ±3 1,000 hrs 11 R1 : 10MΩ, R2 : 1.5KΩ, C : 100pF, V = ±5kV R1 : 10MΩ, R2 : 0, C : 200pF, V = ±0.5kV 5 times 5 5 times 5 Vibration Test Mechanical Shock Test 20~2000~20 Hz 200 m/s 2, Sweep 4 min X, Y, Z 3 direction, each 1 cycle 1500G, 0.5ms, 3 shocks each X-Y-Z axis 4 cycles 11 5 cycles 11 2) Criteria for Judging the Damage Item Symbol Test Condition Min Limit Max Forward Voltage V F I F = 65 ma Init. Value*0.9 Init. Value*1.1 Luminous Flux Φ v I F = 65 ma Init. Value*0.7 Init. Value* / 49

21 7. Solder Conditions 1) Reflow Conditions ( Pb Free ) Reflow Frequency : 2 times max. 2) For Manual Soldering Not more than 5 300, under soldering iron / 49

22 8. Tape & Reel End Start More than 40 mm Mounted with More than (100~200) mm Leading part more than Unloaded tape Flash LED Unloaded tape (200~400) mm (1) Quantity : The quantity/reel to be 4,000 pcs. (2) Cumulative Tolerance : Cumulative tolerance/10 pitches to be ±0.2 mm (3) Adhesion Strength of Cover Tape : Adhesion strength to be N when the cover tape is turned off from the carrier tape at 10 angle to be the carrier tape. (4) Packaging : P/N, Manufacturing data code no. and quantity to be indicated on a damp proof package / 49

23 9. Label Structure 1) Label Structure abcdef A1 1S1 SPMWHT223MD5WA 0S0 A1 1S1 01 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII GLAV94001 / 1001 / 4,000pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII Rank Code N.B) Denoted rank is the only example. ' ' means All kind of Chromaticity Coordinate Rank. Rank Code ab : Forward Voltage(V F ) Rank (refer to page. 12) cd : Chromaticity Coordinate Rank (refer to page. 7~9) ef : Luminous Intensity(cd) Rank (refer to page. 3 and 4) 2) LOT Number The Lot number is composed of the following characters A1 1S1 SPMWHT223MD5WA 0S0 A1 1S1 01 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII GLAV94001 / 1001 / 4,000pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII / 1abc / 4,000 PCS : Production Site (S:SAMSUNG ELECTRONICS, G:GOSIN CHINA) : L (LED) : Product State (A:Normality, B:Bulk, C:First Production, R:Reproduction, S:Sample) : Year (V:2011, W:2012, X: ) 5 : Month (1 ~ 9, A, B) 6 : Day (1 ~ 9, A, B ~ V) 789 : SAMSUNG ELECTRONICS LED Product number (1 ~ 999) abc : Reel Number (1 ~ 999) 23 / 49

24 10. Packing Structure 1) Packing Process Reel A1 1S1 SPMWHT223MD5WA 0S0 A1 1S1 01 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII GLAV94001 / 1001 / 4,000pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII LEVEL 2a Aluminum Vinyl Bag A1 1S1 SPMWHT223MD5WA 0S0 A1 1S1 01 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII GLAV94001 / 1001 / 4,000pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII Material : Paper(SW3B(B)) TYPE SIZE(mm) L W H 7inch SIDE A1 1S1 SPMWHT223MD5WA 0S0 A1 1S1 01 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII GLAV94001 / 1001 / 40,000pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII [Box Label] H CHIP LED L W / 49

25 2) Aluminum Packing Bag A1 1S1 SPMWHT223MD5WA 0S0 A1 1S1 01 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII GLAV94001 / 1001 / 4,000pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII Silica gel & Humidity Indicator Card in Aluminum Vinyl Bag 25 / 49

26 11. Precaution for use 1) For over-current-proof function, customers are recommended to apply resistors to prevent sudden change of the current caused by slight shift of the voltage. 과전류방지를위해전압의미세한이동에의해야기되는전류의순간변화를방지하기위해저항등의설치를권장함. 2) This device should not be used in any type of fluid such as water, oil, organic solvent, etc. When washing is required, IPA is recommended to use. 제품은물, 오일, 유기물과같은액체타입에서의사용은제한되며, 세정이필요할시에는 IPA 사용을권장함. 3) When the LEDs illuminate, operating current should be decided after considering the ambient maximum temperature. LED의발광시, 동작전류는주변최고온도를고려하여결정되어야함. 4) LEDs must be stored in a clean environment. If the LEDs are to be stored for 3 months or more after being shipped from Samsung Electronics, they should be packed by a sealed container with nitrogen gas injected.(shelf life of sealed bags: 12 months, temp. ~40, ~90%RH) LED의보관은청정한환경에서보존되어져야하며, 만약삼성전자로부터공급받는후 3개월또는그이상보관이필요하다면질소가스를동봉한보존용기에보관되어야함. ( 보존 bag의수명 : 12 개월, 보존온도 ~40, 습도 ~90%RH) 5) After storage bag is open, device subjected to soldering, solder reflow, or other high temperature processes must be: 보존 Bag이개봉된후에, 납땜이나 reflow등의높은온도에노출되는제품은다음의사항에부합되어야함. a. Mounted within 672 hours(28 days) at an assembly line with a condition of no more than 30 /60%RH, a. 제품은 30 /60%RH보다같거나낮은조립조건에서 672시간 (28일) 이내에조립해야함. b. Stored at <10%RH. b. 10% 이하의상대습도에서보관되어야함. 6) Repack unused Products with anti-moisture packing, fold to close any opening and then store in a dry place. 사용하지않은제품은방습팩에넣어개봉부위를닫아서다시포장한후, 건조한장소에서보관할것을권장함 / 49

27 7) Devices require baking before mounting, if humidity card reading is >60% at 23±5. 만약습도표시카드의수치가 23±5 에서 60% 이상이라면, 제품실장전 baking해야함. 8) Devices must be baked for 1 hour at 65±5, if baking is required. 만약 baking이필요하다면, 제품은 65±5 에서 1시간정도 baking 되어야함. 9) The LEDs are sensitive to the static electricity and surge. It is recommended to use a wrist band or anti-electrostatic glove when handling the LEDs. LED는정전기및서지에민감한제품이므로, LED 제품을다룰시에는정전기방지장갑이나손목밴드를사용하기를권장함. If voltage exceeding the absolute maximum rating is applied to LEDs, it may cause damage or even destruction to LED devices. 만약절대허용치를초과하는전압이 LED에가해지면, LED 소자는파괴되거나손상될수있음. Damaged LEDs may show some unusual characteristics such as increase in leak current, lowered turn-on voltage, or abnormal lighting of LEDs at low current. 손상된제품은누설전류의증가, Turn on 전압의저하, 저전류에서의점등불량등의이상거동을보일수있음. 10) VOCs (volatile organic compounds) can be generated from adhesives, flux, hardener or organic additives used in luminaires (fixtures). Transparent LED silicone encapsulant is permeable to those chemicals and they may lead a discoloration of encapsulant when they expose to heat or light. VOCs( 휘발성유기화합물 ) 는등기구에사용되는접착제, Flux, 경화제, 유기물첨가제에서발생하여 LED 실리콘봉지제를투과하고, 빛또는열에노출되었을때변색이발생할수있음. This phenomenon can cause a significant loss of light emitted(output) from the luminaires(fixtures). 이러한현상은등기구로부터나오는빛의중대한손실을줄수있음. In order to prevent these problems, we recommend you to know the physical properties of materials used in luminaires, They must be selected carefully. 이러한문제발생방지를위해서, 등기구에사용되는자재에대한물성을알고주의하여선택되어야함 / 49

28 11) Risk of Sulfurization (or Tarnishing) The LED from Samsung Electronics uses a silver-plated lead frame and its surface color may change to black(or dark colored) when it is exposed to sulfur (S), chlorine (Cl) or other halogen compound 삼성전자의 LED는 Ag( 은 ) 을도금한리드프레임을사용함. 이리드프레임의표면이황 (S), 염소 (Cl), 또는다른할로겐화합물들에노출시 Ag( 은 ) 은검정 ( 또는어두운색 ) 으로바뀔수있음. Sulfurization of the lead frame may cause intensity degradation, change of chromaticity coordinates and, in extreme cases. open circuit. It requires caution. 리드프레임의황화 (Sulfurization) 는광량저하, 색좌표변화및심한경우회로내의 LED 무등 (Open) 불량을일으킬수도있으니주의가필요함. Due to possible sulfurization of lead frame, LED should not be used and stored together with oxidizing substances made of materials in a following list, : Rubber, Plain paper, lead solder cream and so on. 리드프레임황화 (Sulfurization) 의근원이될수있으니 LED는아래의목록으로만들어진산화성물질들과함께저장, 사용이불가함 : 고무, 일반종이, 납땜크림등 28 / 49

29 12. Hazard Substance Analysis - SGS 29 / 49

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35 12. Hazard Substance Analysis - SVHC(REACH) 35 / 49

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49 Revision History Date N0 Revision History Writer Drawn Approved New version T.J KIM Y.T KIM K, 5700K, 5000K CIE 8 분할적용 T.J KIM Y.T KIM 49 / 49

Contents 1. Product Code Information Characteristics Typical Characteristics Graph

Contents 1. Product Code Information Characteristics Typical Characteristics Graph Rev: 001 Product Family Data Sheet LM561B - 5630 Middle Power LED Introduction Features Beam Angle: 120 Precondition : JEDEC Level 2a Dimension : 5.6 x 3.0 x 0.8 mm ESD withstand Voltage : up to ± 5KV