Contents 1. Product Code Information Luminous Flux Characteristics Characteristics

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ISSUE NO : Rev: 002 Product Family Data Sheet LM362A - CRI 90 Introduction Features Beam

6 mm ESD withstand Voltage : up to ±5KV [HBM] Reliability Test : Refer to page 25 SAMSUNG

2009-2011 SAMSUNG ELECTRONICS Co.,Ltd. All rights reserved.

1 ISSUE NO : Rev: 002 Product Family Data Sheet LM362A - CRI 90 Introduction Features Beam Angle: 120 Precondition : JEDEC Level 2a Dimension : 3.6 x 2.3 x 0.6 mm ESD withstand Voltage : up to ±5KV [HBM] Reliability Test : Refer to page 25 SAMSUNG ELECTRONICS 95, Samsung2-Ro, Giheung-Gu, Yongin-City, Gyeonggi-Do , KOREA Copyright SAMSUNG ELECTRONICS Co.,Ltd. All rights reserved. The information in this document is subject to change without notice. SAMSUNG, is a registered trademark of SAMSUNG ELECTRONICS. 1 / 47

2 Contents 1. Product Code Information Luminous Flux Characteristics Characteristics Typical Characteristics Graph Outline Drawing & Dimension Reliability Test Items & Conditions Solder Conditions Tape & Reel Label Structure Packing Structure Precaution For Use Hazard Substance Analysis Report Revision History / 47

3 1. Product Code Information 1) Luminous Flux Bins (T s = 25 ) Nominal CCT Product Code Flux Rank Sorting Condition Intensity Range (cd) Flux Bin Flux Range (Φv, lm) S ~ K SPMWHT325AD7YBW0S0 S0 S ~ S ~ S ~ K SPMWHT325AD7YBV0S0 S0 S ~ S ~ S ~ K SPMWHT325AD7YBU0S0 S0 S ~ S ~ S ~ K SPMWHT325AD7YBT0S0 S0 S ~ S ~ Notes: 1) Luminous Intensity(I v, cd) values are for representative reference only 2) SAMSUNG ELECTRONICS maintains a tolerance of ±5% on Luminous Flux measurement 2) Color Bins (Ts = 25 ) 1) Color Binning Nominal CCT Product Code Color Rank Chromaticity Bins 2700K SPMWHT325AD7YBW0S0 W0 (Whole Bin) 3000K SPMWHT325AD7YBV0S0 V0 (Whole Bin) 3500K SPMWHT325AD7YBU0S0 U0 (Whole Bin) 4000K SPMWHT325AD7YBT0S0 T0 (Whole Bin) W1,W2,W3,W4,W5,W6,W7,W8, W9,WA,WB,WC,WD,WE,WF,WG V1,V2,V3,V4,V5,V6,V7,V8, V9,VA,VB,VC,VD,VE,VF,VG U1,U2,U3,U4,U5,U6,U7,U8, U9,UA,UB,UC,UD,UE,UF,UG T1,T2,T3,T4,T5,T6,T7,T8, T9,TA,TB,TC,TD,TE,TF,TG 3 / 47

4 2) Chromaticity Region & Coordinates 4 / 47

5 2) Chromaticity Region & Coordinates (Continued) Region CIE X CIE Y Region CIE X CIE Y W rank (2700K) W1 W2 W3 W4 W5 W6 W7 W W WA WB WC WD WE WF WG Region CIE X CIE Y Region CIE X CIE Y V rank (3000K) V1 V2 V3 V4 V5 V6 V7 V V VA VB VC VD VE VF VG / 47

6 2) Chromaticity Region & Coordinates (Continued) Region CIE X CIE Y Region CIE X CIE Y U rank (3500K) U1 U2 U3 U4 U5 U6 U7 U U UA UB UC UD UE UF UG Region CIE X CIE Y Region CIE X CIE Y T rank (4000K) T1 T2 T3 T4 T5 T6 T7 T T TA TB TC TD TE TF TG / 47

7 2. Luminous Flux Characteristics (Ts = 25 ) Nominal CCT Minimum CRI 1) If(mA) Vf(V) Power(W) Flux(lm) lm/w K K / 47

8 2. Luminous Flux Characteristics (Ts = 25 ) Nominal CCT Minimum CRI 1) If(mA) Vf(V) Power(W) Flux(lm) lm/w K K / 47

9 3. Characteristics 1) Absolute Maximum Rating Item Symbol Rating Condition Operating temperature range Top -40 ~ Storage temperature range Tstg -40 ~ LED junction temperature TJ Forward Current IF 200 ma - Peak Pulsed Forward Current IFP 400 ma Duty 1/10 pulse width 10ms Thermal resistance Rth, j-s 15 /W Junction to solder point Assembly Process Temperature - 260, < 10sec - ESD - 5kV HBM 2) Electro-optical Characteristics - Voltage and CRI Item Unit Rank Min Typ Max A A Forward Voltage (@100 ma, Tj = 25 ) V YB A A A Reverse Voltage (@5 ma, Tj = 25 ) V Color Rendering Index Ra Special CRI 4) (R9) Notes: 1)~2) SAMSUNG ELECTRONICS maintains a tolerance of V F:±0.1 V, R a :±3.0 on measurements 3) Electro-optical Characteristics - Luminous Intensity and Flux Item Unit CCT Rank Min Typ Max S K S0 S S Luminous Flux (@100 ma, Ts = 25 ) lm 3000K S0 S S S S K S0 S S K S0 S S S Notes: Luminous Intensity(I v, cd) values are for representative reference only 9 / 47

10 4. Typical Characteristics Graph 1) Spectrum Distribution (Ts = 25 ) 2700K & 3000K 3500K & 4000K 10 / 47

11 2) Forward Current Characteristics (Ts = 25 ) Relative Flux vs. Forward Current Forward Current vs. Forward Voltage 11 / 47

12 3) Temperature Characteristics Relative Flux vs. Ts(solder 100mA Forward Voltage vs. Ts(solder 100mA 12 / 47

13 4) Color shift Characteristics Color x,y vs. Forward Current 13 / 47

14 5) Derating Curve (T a = 25 ) Rj-a = 30 /W Rj-a = 21 /W Rj-a = 12 /W 6) Viewing Angle Characteristics Viewing Angle 14 / 47

5. Outline Drawing and Dimension Recommended Land Pattern 1. Tolerance is ±0.1 mm 2. The maximum compressing force is 15N on the silicone a 3.

2) Ts point & measurement method 1 Measure the nearest point to the thermal pad as shown above. If necessary, remove PSR of PCB to reach Ts point.

3) Precautions 1 The pressure on the LEDs will influence to the reliability of the LEDs. Precautions should be taken to avoid the strong pressure on the LEDs.

15 5. Outline Drawing and Dimension Recommended Land Pattern 1. Tolerance is ±0.1 mm 2. The maximum compressing force is 15N on the silicone a 3. Do not place pressure on the encapsulation resin b Notes: 1) This LED has built-in ESD protection device(s) connected in parallel to LED Chip(s). 2) Ts point & measurement method 1 Measure the nearest point to the thermal pad as shown above. If necessary, remove PSR of PCB to reach Ts point. 2 Thermal pad must be soldered to the PCB to dissipate heat properly. Otherwise, LED can be damaged. 3) Precautions 1 The pressure on the LEDs will influence to the reliability of the LEDs. Precautions should be taken to avoid the strong pressure on the LEDs. Do not put stress on the LEDs during heating. 2 Re-soldering should not be done after the LEDs have been soldered. If re-soldering is unavoidable, LED`s characteristics should be carefully checked before and after such repair. 3 Do not stack assembled PCBs together. Since materials of LEDs is soft, abrasion between two PCB assembled with LED might cause catastrophic failure of the LEDs / 47

16 6. Reliability Test Items and Conditions 1) Test Items and Results Test Item Test Conditions Test Hours/Cycles Sample No MSL Test hrs drying 60, 60 %RH 120hrs sec 3 cycles 1 cycle 11 Room Temperature life test High Temperature life test High Temperature humidity life test Low Temperature life test Power Temperature Cycle Thermal Shock High Temperature Storage Low Temperature Storage 25 ±3, DC200 ma 1,000 hrs ±3, DC200 ma 1,000 hrs ±3, 85 %±2 %RH, DC200 ma 1,000 hrs ±3, DC200 ma 1,000 hrs /20 min 85 /20 min, Temp. change within 100min, on/off 5 min -45 /15 min 125 /15 min, Temp. change within 5min Hot plate cycles cycles 100 Ta=120 ± hrs 11 Ta=-40 ± hrs 11 ESD(HBM) R1:10 MΩ, R2:1.5 kω, C:100 pf, V = ±5 kv 5 times 10 ESD(MM) R1:10 MΩ, R2:0, C:200 pf, V = ±0.5 kv 5 times 10 Vibration Test 100~2000~100 Hz, 200 m/s2, Sweep 4 min, X, Y, Z 3 direction, each 1 cycle 4 cycles 11 Mechanical Shock Test 1500G, 0.5 ms, 5 cycles 11 2) Criteria for Judging the Damage Item Symbol Test Condition Limit Min Max Forward Voltage VF IF = 100 ma Init. Value*0.9 Init. Value*1.1 Luminous Flux Im IF = 100 ma Init. Value*0.8 Init. Value* / 47

17 7. Solder Conditions 1) Reflow Conditions ( Pb Free ) Reflow Frequency : 2 times max. 2) For Manual Soldering Not more than 5 300, under soldering iron / 47

18 8. Tape And Reel End Start More than 40 mm Mounted with More than (100~200) mm Leading part more than Unloaded tape Flash LED Unloaded tape (200~400) mm (1) Quantity : The quantity/reel to be 4,000 pcs. (2) Cumulative Tolerance : Cumulative tolerance/10 pitches to be ±0.2 mm (3) Adhesion Strength of Cover Tape : Adhesion strength to be N when the cover tape is turned off from the carrier tape at 10 angle to be the carrier tape. (4) Packaging : P/N, Manufacturing data code no. and quantity to be indicated on a damp proof package / 47

19 9. Label Structure 1) Label Structure abcdef A1W1S1 SPMWHT325AD7YBW0S0 A1W1S1 01 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII GLAW94001 / I001 / 4,000 pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII Rank Code Rank Code ab : Forward Voltage Rank cd : Chromaticity Coordinate Rank ef : Luminous Intensity Rank 2) LOT Number The Lot number is composed of the following characters A1W1S1 SPMWHT325AD7YBW0S0 A1W1S1 01 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII / Iabc / 4,000 pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII / Iabc / 4,000 PCS 1 : Production Site (S:SAMSUNG LED, G:GOSIN CHINA) 2 : L (LED) 3 : Product State (A:Normality, B:Bulk, C:First Production, R:Reproduction, S:Sample) 4 : Year (V:2011, W:2012, X: ) 5 : Month (1 ~ 9, A, B) 6 : Day (1 ~ 9, A, B ~ V) 789 : SAMSUNG Electronics LED Product number (1 ~ 999) abc : Reel Number (1 ~ 999) 19 / 47

10. Packing Structure 1) Packing Process Reel A1W1S1 SPMWHT325AD7YBW0S0 A1W1S1 01 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII GLAV94001 / 1001 / 4,000 pcs

20 10. Packing Structure 1) Packing Process Reel A1W1S1 SPMWHT325AD7YBW0S0 A1W1S1 01 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII GLAV94001 / 1001 / 4,000 pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII LEVEL 2a Aluminum Vinyl Bag A1W1S1 SPMWHT325AD7YBW0S0 A1W1S1 01 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII GLAV94001 / 1001 / 4,000 pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII Material : Paper(SW3B(B)) TYPE 7inch SIZE(mm) Reels/ box a b c Up to 10 Reels Up to 5 Reels 1 SIDE A1W1S1 SPMWHT325AD7YBW0S0 A1W1S1 01 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII GLAV94001 / 1001 / 40,000 pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII [Box Label] H CHIP LED W 1 L 20 / 47

21 2) Aluminum Packing Bag A1W1S1 SPMWHT325AD7YBW0S0 A1W1S1 01 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII GLAW94001 / I001 / 4,000 pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII Silica gel & Humidity Indicator Card in Aluminum Vinyl Bag 21 / 47

22 11. Precaution for use 1) For over-current-proof function, customers are recommended to apply resistors to prevent sudden change of the current caused by slight shift of the voltage. 과전류방지를위해전압의미세한이동에의해야기되는전류의순간변화를방지하기위해저항등의설치를권장함. 2) This device should not be used in any type of fluid such as water, oil, organic solvent, etc. When washing is required, IPA is recommended to use. 제품은물, 오일, 유기물과같은액체타입에서의사용은제한되며, 세정이필요할시에는 IPA 사용을권장함. 3) When the LEDs illuminate, operating current should be decided after considering the ambient maximum temperature. LED의발광시, 동작전류는주변최고온도를고려하여결정되어야함. 4) LEDs must be stored in a clean environment. If the LEDs are to be stored for 3 months or more after being shipped from Samsung Electronics, they should be packed by a sealed container with nitrogen gas injected.(shelf life of sealed bags: 12 months, temp. ~40, ~90%RH) LED의보관은청정한환경에서보존되어져야하며, 만약삼성전자로부터공급받는후 3개월또는그이상보관이필요하다면질소가스를동봉한보존용기에보관되어야함. ( 보존 bag의수명 : 12 개월, 보존온도 ~40, 습도 ~90%RH) 5) After storage bag is open, device subjected to soldering, solder reflow, or other high temperature processes must be: 보존 Bag이개봉된후에, 납땜이나 reflow등의높은온도에노출되는제품은다음의사항에부합되어야함. a. Mounted within 672 hours(28 days) at an assembly line with a condition of no more than 30 /60%RH, a. 제품은 30 /60%RH보다같거나낮은조립조건에서 672시간 (28일) 이내에조립해야함. b. Stored at <10%RH. b. 10% 이하의상대습도에서보관되어야함. 6) Repack unused Products with anti-moisture packing, fold to close any opening and then store in a dry place. 사용하지않은제품은방습팩에넣어개봉부위를닫아서다시포장한후, 건조한장소에서보관할것을권장함 / 47

23 7) Devices require baking before mounting, if humidity card reading is >60% at 23±5. 만약습도표시카드의수치가 23±5 에서 60% 이상이라면, 제품실장전 baking해야함. 8) Devices must be baked for 1 hour at 60±5, if baking is required. 만약 baking이필요하다면, 제품은 60±5 에서 1시간정도 baking 되어야함. 9) The LEDs are sensitive to the static electricity and surge. It is recommended to use a wrist band or anti-electrostatic glove when handling the LEDs. LED는정전기및서지에민감한제품이므로, LED 제품을다룰시에는정전기방지장갑이나손목밴드를사용하기를권장함. If voltage exceeding the absolute maximum rating is applied to LEDs, it may cause damage or even destruction to LED devices. 만약절대허용치를초과하는전압이 LED에가해지면, LED 소자는파괴되거나손상될수있음. Damaged LEDs may show some unusual characteristics such as increase in leak current, lowered turn-on voltage, or abnormal lighting of LEDs at low current. 손상된제품은누설전류의증가, Turn on 전압의저하, 저전류에서의점등불량등의이상거동을보일수있음. 10) VOCs (volatile organic compounds) can be generated from adhesives, flux, hardener or organic additives used in luminaires (fixtures). Transparent LED silicone encapsulant is permeable to those chemicals and they may lead a discoloration of encapsualnt when they expose to heat or light. VOCs( 휘발성유기화합물 ) 는등기구에사용되는접착제, Flux, 경화제, 유기물첨가제에서발생하여 LED 실리콘봉지제를투과하고, 빛또는열에노출되었을때변색이발생할수있음. This phenomenon can cause a significant loss of light emitted(output) from the luminaires(fixtures). 이러한현상은등기구로부터나오는빛의중대한손실을줄수있음. In order to prevent these problems, we recommend you to know the physical properties of the materials used in luminaires, They must be selected carefully. 이러한문제발생방지를위해서, 등기구에사용되는자재에대한물성을알고주의하여선택되어야함 / 47

24 11) Risk of Sulfurization (or Tarnishing) The LED from Samsung Electronics uses a silver-plated lead frame and its surface color may change to black(or dark colored) when it is exposed to sulfur(s), chlorine (Cl) or other halogen compound. 삼성전자의 LED는 Ag( 은 ) 을도금한리드프레임을사용함. 이리드프레임의표면이황 (S), 염소 (Cl), 또는다른할로겐화합물들에노출시 Ag( 은 ) 은검정 ( 또는어두운색 ) 으로바뀔수있음. Sulfurization of lead frame may cause intensity degradation, change of chromaticity coordinates and, in extreme cases, open circuit. It requires caution. 리드프레임의황화 (Sulfurization) 는광량저하, 색좌표변화및심한경우 LED 무등 (Open) 불량을일으킬수도있으니주의가필요함. Due to possible sulfurization of lead frame, LED should not be used and stored together with oxidizing substances made of materials in a following list, : Rubber, plain paper, lead solder cream and so on. 리드프레임황화 (Sulfurization) 의근원이될수있으니 LED 는아래의목록으로 만들어진산화성물질들과함께저장, 사용이불가함 : 고무, 일반종이, 납땜크림등 24 / 47

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47 Revision History Date No. Revision History Drawn Writer Approved New version N.R.KIM S.B.YUN Out box 추가 N.R.KIM S.B.YUN 47 / 47

Contents 1. Product Code Information Luminous Flux Characteristics Characteristics

Contents 1. Product Code Information Luminous Flux Characteristics Characteristics ISSUE NO : Rev: 001 Product Family Data Sheet LM362A - CRI 90 Introduction Features Beam Angle: 120 Precondition : JEDEC Level 2a Dimension : 3.6 x 2.3 x 0.6 mm ESD withstand Voltage : up to ±5KV [HBM]