Introduction Part Number : SPHWHTL3D3A2F6H0G4 Interior automotive lighting, Torch lighting etc. Features Package : Ceramic Substrate LED Package View

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1 Data Sheet Part Number : SPHWHTL3D3A2F6H0G4-1 -

2 Introduction Part Number : SPHWHTL3D3A2F6H0G4 Interior automotive lighting, Torch lighting etc. Features Package : Ceramic Substrate LED Package View Angle : 135 Optical Efficiency : 110 lm/w at 350 ma Precondition : JEDEC Level 2a Dimension : 3.5 x 3.5 mm Luminous Flux : Typ. 120 lm at 350 ma ESD withstand Voltage : up to ±8KV [HBM] Applications Traffic lights Backlighting ( LCD, switches, keys, displays, illuminated advertising ) Interior automotive lighting Substitution of micro incandescent lamps Marker lights ( e.g. steps, exit ways, etc. ) Signal and symbol luminaire Environmental Compliance Samsung ELECTRONICS is compliant to the restrictions of hazardous substances in electronic equipment, namely, the RoHS, ELV, ISO14001 and REACH directives. Samsung ELECTRONICS will not intentionally supplement the restricted materials to the LED product : Cd,Pb,Hg,PBBs,PBDEs and Cr

3 Table of Contents Part Number Description Characteristic Typical Characteristic Luminous Flux Bin Forward Voltage Bin Color Bin Definition Absolute Maximum Rating Typical Characteristic Graph Mechanical Dimension Soldering Condition Packing Information Product Labeling Information Reliability Test Condition Precaution for Use Hazardous Substance Analysis Revision History Company Information

4 Part Number Description The Part number designation is explained as follows : SP H WH T L3 D 3 A 2 AB C DE F GH I J K L Where: AB - designates company name and Samsung LED PKG (SP for Samsung LED PKG) C - designates power variant (H for automotive High Power) DE - designates color variant (WH for automotive White color) F - designates LED PKG version (T for initial version) GH - designates product configuration and type (L3 for 3535 Ceramic type) I - designates lens configuration (D for lens) J - designates Max.power (3 for W) K - designates specific property (A for Revision symbol) L - designates CRI variant (2 for CRI Max.70) - 4 -

5 Characteristics Typical Characteristics [T s =25 ] [1] Parameter Symbol Value Unit Luminous Flux (I F = 350 ma) Φ V Typ. 120 lm Forward Voltage (I F = 350 ma) V f Typ. 3.1 V Reverse Voltage(I R = 5 ma) V R Typ. 0.9 V Viewing Angle φ Typ. 135 Deg. Thermal Resistance (Junction to Solder Point) R th _ J-S Typ. 7 K/W Luminous Flux Bin [2] [T s =25 ] [1] Symbol Condition Bin Code Min. Typ Max. Unit G Φ V I F = 350 ma G4 lm J Forward Voltage Bin [2] [T s =25 ] [1] Symbol Condition Bin Code Min. Typ. Max. Unit F V f I F = 350 ma F6 V J

6 Color Bin Definition [3] [T s =25 ] [1] Symbol Condition Bin Code Cx Cy Cx,Cy I F=350 ma H0 H H *Notes [1] The measurement condition means that temperature dependence is excluded by applying pulse current for under 25 ms. [2] Luminous flux measuring equipment : CAS140CT Tolerance : V F : ±0.1V, Φ V :±7% [3] Chromaticity coordinates : Cx,CyaccordingtoCIE1931. Cx and Cy tolerances are ±0.01, respectively

7 Absolute Maximum Ratings Parameter Symbol Value Unit Operating temperature range T op -45 ~ +125 Storage temperature range T stg -45 ~ +125 Junction temperature T jmax +150 Maximum Forward current [4] (T s : 25 ) [5] I F 1000 ma Minimum Forward current [4] (T s : 25 ) [5] I F 100 ma Maximum Reverse current Do not apply for reverse current Maximum Transient Peaked current [6] (T s : 25 ) [5] ma 1000 ma for 10 ms ma ESD Sensitivity [7] - ± 8.0 KV HBM *Note [4] Unpredictable performance may be resulted by driving the product at below Min. I F or above Max. I F. But there will be no damage to the product. [5] The measurement condition means that temperature dependence is excluded by applying pulse current for under 25 ms. [6] Duty 1/10 pulse with 10 ms. [7] It is included the device to protect the product from ESD

8 Typical Characteristics Graph Typical Spectrum [ I F = 350 ma, T s =25 C] [8] Typical Chromaticity Coordinate Shift vs Forward Current [ I F = 350 ma, T s =25 C] [8] *Notes [8] The measurement condition means that temperature dependence is excluded by applying pulse current for under 25 ms

9 Typical Relative Luminous Flux & Forward Voltage vs Forward Current [ I F = 350 ma, T s =25 C] [9] - 9 -

10 Typical Relative Luminous Flux & Forward Voltage vs Temperature [9] Solder Pad Temperature ( ) Solder Pad Temperature ( ) Typical Chromaticity Coordinate Shift vs Temperature [ I F = 350 ma, T s =25 C] [9] Solder Pad Temperature ( ) * Notes [9] The measurement condition means that temperature dependence is excluded by applying pulse current for under 25 ms

11 Typical Radiant Pattern X Max. Permissible Forward Current [10] * Notes [10] The measurement condition means that temperature dependence is excluded by applying pulse current for under 25 ms

12 Mechanical Dimension Tolerance :±0.1mm [Top View] [Side View] [Bottom View] Thermal Pad [Front View] * Note : The thermal pad is electrically isolated from the anode and cathode contact pads. Pick and Place Do not place pressure on the resin lens ("A") It is recommended to use a pick&place nozzle with inside diameter at 3.1 mm Electric Schematic Diagram Cathode ESD Protection Diode [ Circuit ] Material Information LED Package = Silicon resin covered White GaN LED on Ceramic Sub. Electrode PAD = Au Plated PAD This LED has built-in ESD protection device(s) connected in parallel to LED Chip(s)

(Pb Free) Reflow Frequency : 2 times max.

13 Soldering Conditions Pad Configuration & Solder Pad Layout Tolerance : ±0.1mm Bare copper pattern Recommended Solder Pad Reflow Soldering Condition (Pb Free) Reflow Frequency : 2 times max. Manual Soldering Condition Not more than 5 under soldering iron.(one time only)

14 Packing Information Taping [8] User feed direction Cathode * Note [8] Unit : mm, LED taping quantity : 800EA / Reel. Reel [Unit : mm] A B C W1 W ± ± ±

15 Packing Process Dimension of Transportation Box in mm Width Length Height Remark inch

16 Product Labeling Information ABCDEF F3H1G2 SPHWHTL3D3A2F6H0G4 F3H1G2 01 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII SLAT94001 / 1001 / 800 pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII Bin code Lot Number N.B) Denoted rank is the only example. Bin Code Structure AB : Forward Voltage(V F ) Bin (refer to page. 4) CD : Color bin (Cx,Cy) (refer to page. 5) EF : Luminous Intensity(I V ) Bin (refer to page. 4) Lot Number Structure The Lot number is composed of the following characters / 1abc / 800 PCS No. Information 1 Production Site : S:SAMSUNG LED, G:GOSIN CHINA 2 LED Product State 3 A:Normality, B :Bulk, C:First Production, R:Reproduction, S :Sample 4 Year : W:2012, X:2013, Y: Month : 1 ~ 9, A, B 6 Day : 1 ~ 9, A, B ~ V 789 Product number : 1 ~ 999 abc Reel Number : 1 ~

17 Reliability Test Conditions For detailed information please contact your SAMSUNG sales partner

18 Precaution for Use 1) For over-current-proof function, customers are recommended to apply resistors to prevent sudden change of the current caused by slight shift of the voltage. 과전류방지를위해전압의미세한이동에의해야기되는전류의순간변화를방지하기위해저항등의설치를권장함. 2) This device should not be used in any type of fluid such as water, oil, organic solvent, etc. When washing is required, IPA is recommended to use. 제품은물, 오일, 유기물과같은액체타입에서의사용은제한되며, 세정이필요할시에는 IPA 사용을권장함. 3) When the LEDs illuminate, operating current should be decided after considering the ambient maximum temperature. LED 의발광시, 동작전류는주변최고온도를고려하여결정되어야함. 4) LEDs must be stored in a clean environment. If the LEDs are to be stored for 3 months or more after being shipped from Samsung Electronics, they should be packed by a sealed container with nitrogen gas injected.(shelf life of sealed bags: 12 months, temp. ~40, ~90%RH) LED의보관은청정한환경에서보존되어져야하며, 만약삼성전자로부터공급받는후 3개월또는그이상보관이필요하다면질소가스를동봉한보존용기에보관되어야함. ( 보존 bag의수명 : 12 개월, 보존온도 ~40, 습도 ~90 %RH) 5) After storage bag is open, device subjected to soldering, solder reflow, or other high temperature processes must be: 보존 Bag이개봉된후에, 납땜이나 reflow등의높은온도에노출되는제품은다음의사항에부합되어야함. a. Mounted within 672 hours (28 days) at an assembly line with a condition of no more than 30 /60 %RH, a. 제품은 30 /60 %RH보다같거나낮은조립조건에서 672시간 (28일) 이내에조립해야함. b. Stored at <10 %RH. b. 10 % 이하의상대습도에서보관되어야함. 6) Repack unused Products with anti-moisture packing, fold to close any opening and then store in a dry place. 사용하지않은제품은방습팩에넣어개봉부위를닫아서다시포장한후, 건조한장소에서보관할것을권장함

19 7) Devices require baking before mounting, if humidity card reading is >60 % at 23±5. 만약습도표시카드의수치가 23±5 에서 60 % 이상이라면, 제품실장전에 baking하여야함. 8) Devices must be baked for 1 hour at 65±5, ifbaking is required. 만약 baking이필요하다면, 제품은 65±5 에서 1시간정도 baking 되어야함. 9) The LEDs are sensitive to the static electricity and surge. It is recommended to use a wrist band or anti-electrostatic glove when handling the LEDs. LED는정전기및서지에민감한제품이므로, LED 제품을다룰시에는정전기방지장갑이나손목밴드를사용하기를권장함. If voltage exceeding the absolute maximum rating is applied to LEDs, it may cause damage or even destruction to LED devices. 만약절대허용치를초과하는전압이 LED에가해지면, LED 소자는파괴되거나손상될수있음. Damaged LEDs may show some unusual characteristics such as increase in leak current, lowered turn-on voltage, or abnormal lighting of LEDs at low current. 손상된제품은누설전류의증가, Turn on 전압의저하, 저전류에서의점등불량등의이상거동을보일수있음. 10) VOCs (volatile organic compounds) may be occurred by adhesives, flux, hardener or organic additives which is used in luminaires (fixture) and LED silicone bags are permeable to it. It may lead a discoloration when LED expose to heat or light. VOCs ( 휘발성유기화합물 ) 는등기구에사용되는접착제, Flux, 경화제, 유기물첨가제에서발생하여 LED 실리콘봉지제를투과하고, 빛또는열에노출되었을때변색이발생할수있음. This phenomenon can give a significant loss of light emitted (output) from the luminaires (fixtures). 이러한현상은등기구로부터나오는빛의중대한손실을줄수있음. In order to prevent these problems, we recommend you to know the physical properties for the materials used in luminaires, It requires to select carefully. 이러한문제발생방지를위해서, 등기구에사용되는자재에대한물성을알고주의하여선택되어야함

20 Hazardous Substance Analysis Report SPHWHTL3D3A2F6H0G4-20 -

21 Revision History SPHWHTL3D3A2F6H0G4 Author Date Revision History Drawn Approved Initial Edition H.J Park Y.T Kim Company Information US Samsung Semiconductor Inc., 3655 N. First Street, San Jose CA 95134, USA TEL Europe Samsung Electronics Germany GmbH, Samsung House, Am Kronberger Hang 6, Schwalbach/Ts,Germany TEL All rights reserved Samsung Electronics LED BUSINESS San #24, Nongseo-Dong, Giheung-Gu, Yongin-City, Gyeongii-Do Korea Sales Contact : em.yeon@samsung.com Japan Samsung Japan Corporation SLED Team 10F, Shinagawa Grand Central Tower , Kounan, Minato-ku, Tokyo , Japan TEL China (Tianjin Office in China) Tianjin Samsung LED Co., LTD. Weisi (6th) Rd., Micro-Electronics Industrial Park, Xiqing District, Tianjin , China TEL

Microsoft Word - AH351B_W_SPHWHTL3D3A2_Rev00.docx

Microsoft Word - AH351B_W_SPHWHTL3D3A2_Rev00.docx Dataa Sheet AH351B_W Partt Number : SPHWHTL3D3A2 Introduction Part Number : SPHW WHTL3D3A2 Exterior automotive lighting, Traffic lighting etc. Features Package : Ceramic Substrate LED Package View Angle