Contents 1. Product Code Information Characteristics Typical Characteristics Graph
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1 Rev: 004 Product Family Data Sheet LM561B Middle Power LED Introduction Features Beam Angle: 120 Precondition : JEDEC Level 2a Dimension : 5.6 x 3.0 x 0.8 mm ESD withstand Voltage : up to ± 5KV [HBM] Applications INDOOR LIGHTING : Ambient Light, LED tube, Down light, LED bulb and Ceiling Light SAMSUNG ELECTRONICS 95, Samsung2-Ro, Giheung-Gu, Yongin-City, Gyeonggi-Do , KOREA 1 / 49
2 Contents 1. Product Code Information Characteristics Typical Characteristics Graph Outline Drawing & Dimension Reliability Test Items & Conditions Solder Conditions Tape & Reel Label Structure Packing Structure Precaution For Use Hazard Substance Analysis Report Revision History / 49
3 1. Product Code Information 1) Luminous Flux Bins (T s = 25 ) Nominal CCT Product Code Flux Rank Sorting Condition Flux Range (Φ v, lm) SPMWH 541MD5WAW S1 S ~ K SPMWH 541MD5WAW S2 S ~ 28.0 SPMWH 541MD5WAW S3 S ~ 30.0 SPMWH 541MD5WAV S1 S ~ K SPMWH 541MD5WAV S2 S ~ 28.5 SPMWH 541MD5WAV S3 S ~ 30.5 SPMWH 541MD5WAU S1 S ~ K SPMWH 541MD5WAU S2 S ~ 29.0 SPMWH 541MD5WAU S3 S ~ 31.0 SPMWH 541MD5WAT S1 S ~ K SPMWH 541MD5WAT S2 S ~ 30.0 SPMWH 541MD5WAT S3 S ~ 32.0 SPMWH 541MD5WAR S1 S ~ K SPMWH 541MD5WAR S2 S ~ 31.0 SPMWH 541MD5WAR S3 S ~ 33.0 SPMWH 541MD5WAQ S1 S ~ K SPMWH 541MD5WAQ S2 S ~ 30.5 SPMWH 541MD5WAQ S3 S ~ 32.5 SPMWH 541MD5WAP S1 S ~ K SPMWH 541MD5WAP S2 S ~ 30.0 SPMWH 541MD5WAP S3 S ~ 32.0 Notes: 1) SAMSUNG ELECTRONICS maintains a tolerance of ±5% on Luminous Flux measurements. 2) " " (the quantity of PKG on the Reel) can be "T"(2,500pcs) or "1"(10,000pcs). 3) Warm white : " " can be "0"(Whole Bin), "H"(Half Bin) or "M"(Quarter Bin) of the color binning. Cool white : " " can be "0"(Whole Bin) or "M"(Quarter Bin) of the color binning. 3 / 49
4 2) Color Bins (T s = 25 ) 1) Color Binning Nominal CCT Product Code Color Rank Chromaticity Bins 2700K 3000K 3500K 4000K SPMWH 541MD5WAW0S1 SPMWH 541MD5WAW0S2 SPMWH 541MD5WAW0S3 SPMWH 541MD5WAWHS1 SPMWH 541MD5WAWHS2 SPMWH 541MD5WAWHS3 SPMWH 541MD5WAWMS1 SPMWH 541MD5WAWMS2 SPMWH 541MD5WAWMS3 SPMWH 541MD5WAV0S1 SPMWH 541MD5WAV0S2 SPMWH 541MD5WAV0S3 SPMWH 541MD5WAVHS1 SPMWH 541MD5WAVHS2 SPMWH 541MD5WAVHS3 SPMWH 541MD5WAVMS1 SPMWH 541MD5WAVMS2 SPMWH 541MD5WAVMS3 SPMWH 541MD5WAU0S1 SPMWH 541MD5WAU0S2 SPMWH 541MD5WAU0S3 SPMWH 541MD5WAUHS1 SPMWH 541MD5WAUHS2 SPMWH 541MD5WAUHS3 SPMWH 541MD5WAUMS1 SPMWH 541MD5WAUMS2 SPMWH 541MD5WAUMS3 SPMWH 541MD5WAT0S1 SPMWH 541MD5WAT0S2 SPMWH 541MD5WAT0S3 SPMWH 541MD5WATHS1 SPMWH 541MD5WATHS2 SPMWH 541MD5WATHS3 SPMWH 541MD5WATMS1 SPMWH 541MD5WATMS2 SPMWH 541MD5WATMS3 W1, W2, W3, W4, W5, W6, W7, W8, W0(Whole bin) W9, WA, WB, WC, WD, WE, WF, WG WH(Half bin) W5, W6, W7, W8, W9, WA, WB, WC WM(Quarter bin) W6, W7, WA, WB V0(Whole bin) V1, V2, V3, V4, V5, V6, V7, V8, V9, VA, VB, VC, VD, VE, VF, VG VH(Half bin) V5, V6, V7, V8, V9, VA, VB, VC VM(Quarter bin) V6, V7, VA, VB U0(Whole bin) U1, U2, U3, U4, U5, U6, U7, U8, U9, UA, UB, UC, UD, UE, UF, UG UH(Half bin) U5, U6, U7, U8, U9, UA, UB, UC UM(Quarter bin) U6, U7, UA, UB T0(Whole bin) T1, T2, T3, T4, T5, T6, T7, T8, T9, TA, TB, TC, TD, TE, TF, TG TH(Half bin) T5, T6, T7, T8, T9, TA, TB, TC TM(Quarter bin) T6, T7, TA, TB 4 / 49
5 1) Color Binning (Continued) Nominal CCT Product Code Color Rank Chromaticity Bins 5000K SPMWH 541MD5WAR0S1 SPMWH 541MD5WAR0S2 SPMWH 541MD5WAR0S3 SPMWH 541MD5WARMS1 SPMWH 541MD5WARMS2 SPMWH 541MD5WARMS3 R0(Whole bin) RM(Quarter bin) R1, R2, R3, R4, R5 R6, R7, R8, R9,RA R1, R2, R3, R4, R5, R6 5700K SPMWH 541MD5WAQ0S1 SPMWH 541MD5WAQ0S2 SPMWH 541MD5WAQ0S3 SPMWH 541MD5WAQMS1 SPMWH 541MD5WAQMS2 SPMWH 541MD5WAQMS3 Q0(Whole bin) QM(Quarter bin) Q1, Q2, Q3, Q4, Q5 Q6, Q7, Q8, Q9, QA Q1, Q2, Q3, Q4, Q5, Q6 6500K SPMWH 541MD5WAP0S1 SPMWH 541MD5WAP0S2 SPMWH 541MD5WAP0S3 SPMWH 541MD5WAPMS1 SPMWH 541MD5WAPMS2 SPMWH 541MD5WAPMS3 P0(Whole bin) PM(Quarter bin) P1, P2, P3, P4, P5 P6, P7, P8, P9, PA P1, P2, P3, P4, P5, P6 5 / 49
6 2) Chromaticity Region & Coordinates 6 / 49
7 2) Chromaticity Region & Coordinates (Continued) Region CIE X CIE Y Region CIE X CIE Y W rank (2700K) W1 W2 W3 W4 W5 W6 W7 W W WA WB WC WD WE WF WG Region CIE X CIE Y Region CIE X CIE Y V rank (3000K) V1 V2 V3 V4 V5 V6 V7 V V VA VB VC VD VE VF VG / 49
8 2) Chromaticity Region & Coordinates (Continued) Region CIE X CIE Y Region CIE X CIE Y U rank (3500K) U1 U2 U3 U4 U5 U6 U7 U U UA UB UC UD UE UF UG Region CIE X CIE Y Region CIE X CIE Y T rank (4000K) T1 T2 T3 T4 T5 T6 T7 T T TA TB TC TD TE TF TG / 49
9 2) Chromaticity Region & Coordinates (Continued) Region CIE X CIE Y Region CIE X CIE Y R rank (5000K) R1 R2 R3 R4 R5 Q1 Q2 Q3 Q4 Q R R R R RA Q rank (5700K) Q Q Q Q QA Region CIE X CIE Y Region CIE X CIE Y P rank (6500K) P1 P2 P3 P4 P P P P P PA Notes: SAMSUNG ELECTRONICS maintains ±0.005 tolerance of Cx, Cy 9 / 49
10 2. Characteristics 1) Absolute Maximum Rating Item Symbol Rating Condition Operating temperature range Top -40 ~ Storage temperature range Tstg -40 ~ LED junction temperature T J Forward Current I F 150 ma - Peak Pulsed Forward Current IFP 300 ma Duty 1/10 pulse width 10ms Thermal resistance Rth, j-s 16 /W Junction to solder point Assembly Process Temperature - 260, < 10sec - ESD - 5kV HBM 2) Electro-optical Characteristics Item Forward Voltage 1) (V F) (@65 ma, Ts = 25 ) Luminous Flux 2) (Φ v) (@65 ma, Ts = 25 ) Unit Nominal CCT Product Code V - - WA lm 2700K (W ) 3000K (V ) 3500K (U ) 4000K (T ) 5000K (R ) 5700K (Q ) 6500K (P ) Rank Min Typ Max AZ A A A A *WAW S1 S *WAW S2 S *WAW S3 S *WAV S1 S *WAV S2 S *WAV S3 S *WAU S1 S *WAU S2 S *WAU S3 S *WAT S1 S *WAT S2 S *WAT S3 S *WAR S1 S *WAR S2 S *WAR S3 S *WAQ S1 S *WAQ S2 S *WAQ S3 S *WAP S1 S *WAP S2 S *WAP S3 S Reverse Voltage V (@5 ma, Ts = 25 ) Color Rendering Index 3) (R a) Special CRI 4) (R9) Notes: 1)~4) SAMSUNG ELECTRONICS maintains a tolerance of V F:±0.1 V, Φ v:±5 %, R a :±3.0, R9 :±6.5 on measurements 5) " * " is Product Code of "SPMWH 541MD5" 10 / 49
11 3. Typical Characteristics Graph (T s = 25 ) 1) Spectrum Distribution [CCT : 2700K & 3000K] [CCT : 3500K & 4000K] 11 / 49
12 [CCT : 5000K & 5700K] [CCT : 6500K] 12 / 49
13 2) Forward Current Characteristics [Relative Luminous Flux vs. Forward Current] (T s = 25 ) [Forward Current vs. Forward Voltage] (T s = 25 ) 13 / 49
14 3) Temperature Characteristics [Relative Luminous Flux vs. Ts] (I F = 65mA) [Forward Voltage vs. Ts] (I F = 65mA) 14 / 49
15 4) Color shift Characteristics [Color Δx, Δy vs. Forward Current] (T s = 25 ) [Color x, y vs. Ts] (I F = 65mA) 15 / 49
16 5) Derating Curve 6) Beam Angle Characteristics 16 / 49
17 4. Outline Drawing & Dimension 1. Tolerance is ±0.10 mm 2. The maximum compressing force is 15N on the body a 3. Do not place pressure on the encapsulation resin b Left Side View Top View Bottom View Anode Mark a b Cathode Anode Front View Recommended Land Pattern Notes: 1) This LED has built-in ESD protection device(s) connected in parallel to LED Chip(s). 2) Ts point & measurement method 1 Measure the nearest point to the thermal pad. If necessary, remove PSR of PCB to reach Ts point. 2 Thermal pad must be soldered to the PCB to dissipate heat properly. Otherwise, LED can be damaged. 3) Precautions 1 The pressure on the LEDs will influence to the reliability of the LEDs. Precautions should be taken to avoid the strong pressure on the LEDs. Do not put stress on the LEDs during heating. 2 Re-soldering should not be done after the LEDs have been soldered. If re-soldering is unavoidable, LED`s characteristics should be carefully checked before and after such repair. 3 Do not stack assembled PCBs together. Since materials of LEDs is soft, abrasion between two PCB assembled with LED might cause catastrophic failure of the LEDs / 49
18 5. Reliability Test Items and Conditions 1) Test Items Test Item MSL Test Room Temperature life test High Temperature life test High Temperature humidity life test Low Temperature life test Powered Temperature Cycle test Thermal Shock High Temperature Storage Low Temperature Storage ESD(HBM) Test Conditions hrs drying 60, 60%RH 120hrs sec 3 cycles Test Hours/Cycles Sample No 1 cycle ±3, DC150 ma 1,000hrs ±3, DC150 ma 1,000hrs ±3, 85%±2%RH, DC150 ma 1,000hrs ±3, DC150 ma 1,000hrs /20 min 85 /20 min, Sweep 100min cycle on/off: each 5 min, DC 150mA -45 /15 min 125 /15 min Hot plate cycle cycle 100 Ta=120 ± hrs 11 Ta=-40 ± hrs 11 R1:10 MΩ, R2:1.5 kω, C:100 pf, V = ±5 kv 5times 5 ESD(MM) Vibration Test R1:10 MΩ, R2: 0, C:200 pf, V = ±0.5 kv 20~2000~20 Hz 200 m/s 2, Sweep 4 min X, Y, Z 3 direction, each 1 cycle 5times 5 4 cycles 11 Mechanical Shock Test 1500G, 0.5 ms, 3 shocks each X-Y-Z axis 5 cycles 11 2) Criteria for Judging the Damage Item Symbol Test Condition Min Limit Max Forward Voltage V F I F = 65 ma Init. Value*0.9 Init. Value*1.1 Luminous Flux Φ v I F = 65 ma Init. Value*0.7 Init. Value* / 49
19 6. Solder Conditions 1) Reflow Conditions ( Pb Free ) Reflow Frequency : 2 times max. 2) For Manual Soldering Not more than 5 300, under soldering iron / 49
20 7. Tape & Reel 1) Taping Dimension (unit : mm) Anode Mark (Cutting side) Tapping Diretion End Start More than 500 mm Mounted with More than 100~200 mm Leading part more than Unloaded tape LED package Unloaded tape 500 mm 20 / 49
21 2-1) Reel Dimension (max 2,500 pcs) 2-2) Reel Dimension (max 10,000 pcs) Symbol A B C W1 W2 Spec(mm) Ø330±1 80±1 13±0.5 13± ±1 (1) Quantity : The quantity/reel to be 2,500 pcs or 10,000 pcs,. (2) Cumulative Tolerance : Cumulative tolerance/10 pitches to be ±0.2mm (3) Adhesion Strength of Cover Tape : Adhesion strength to be N when the cover tape is turned off from the carrier tape at 10 angle to be the carrier tape. (4) Packaging : P/N, Manufacturing data code no. and quantity to be indicated on a damp proof Package / 49
22 8. Label Structure 1) Label Structure abcdef AZ 1S1 SPMWHT541MD5WA 0S1 AZ 1S1 01 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII GLAW94001 / 1001 / 2,500 pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII Rank Code N.B) Denoted rank is the only example. ' ' means All kind of Chromaticity Coordinate Rank. Rank Code ab : Forward Voltage(V F ) Rank (refer to page. 10) cd : Chromaticity Coordinate Rank (refer to page. 4~9) ef : Luminous Flux(Φ v, lm) Rank (refer to page. 3) 2) LOT Number The Lot number is composed of the following characters AZ 1S1 SPMWHT541MD5WA 0S1 AZ 1S1 01 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII GLAW94001 / 1001 / 2,500 pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII / 1abc / 2,500 or 10,000 PCS : Production Site (S:SAMSUNG ELECTRONICS, G:TIAJIN CHINA) : L (LED) : Product State (A:Normality, B:Bulk, C:First Production, R:Reproduction, S:Sample) : Year (V:2011, W:2012, X: ) 5 : Month (1 ~ 9, A, B) 6 : Day (1 ~ 9, A, B ~ V) 789 : SAMSUNG ELECTRONICS LED Product number (1 ~ 999) abc : Reel Number (1 ~ 999) 22 / 49
23 9. Packing Structure 1-1) Packing Process (The quantity of PKG on the Reel to be Max 2,500 pcs) Reel AZ 1S1 SPMWHT541MD5WA 0S1 AZ 1S1 01 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII GLAW94001 / 1001 / 2,500 pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII LEVEL 2a Aluminum Vinyl Bag AZ 1S1 SPMWHT541MD5WA 0S1 AZ 1S1 01 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII GLAW94001 / 1001 / 2,500 pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII Material : Paper(SW3B(B)) TYPE SIZE(mm) L W H 7inch 245±5 220±5 182±5 1 SIDE AZ 1S1 SPMWHT541MD5WA 0S1 AZ 1S1 01 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII GLAW94001 / 1001 / 25,000pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII H CHIP LED L W / 49
24 1-2) Packing Process (The quantity of PKG on the Reel to be Max 10,000 pcs) Reel AZ 1S1 SPMWH1541MD5WA 0S1 AZ 1S1 01 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII GLAV94001 / 1001 / 10,000pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII LEVEL 2a Aluminum Vinyl Bag AZ 1S1 SPMWH1541MD5WA 0S1 AZ 1S1 01 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII GLAV94001 / 1001 / 10,000pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII AZ 1S1 SPMWH1541MD5WA 0S1 AZ 1S1 01 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII GLAV94001 / 1001 / 150,000pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII [Box Label] SIZE(mm) Box L W H Inner 340±5 370±5 400±5 Outer 345±5 378±5 405± / 49
25 2) Aluminum Packing Bag AZ 1S1 SPMWHT541MD5WA 0S1 AZ 1S1 01 IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII GLAW94001 / 1001 / 2,500 pcs IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII Silica gel & Humidity Indicator Card in Aluminum Vinyl Bag 25 / 49
26 10. Precaution for use 1) For over-current-proof function, customers are recommended to apply resistors to prevent sudden change of the current caused by slight shift of the voltage. 과전류방지를위해전압의미세한이동에의해야기되는전류의순간변화를방지하기위해저항등의설치를권장함. 2) This device should not be used in any type of fluid such as water, oil, organic solvent, etc. When washing is required, IPA is recommended to use. 제품은물, 오일, 유기물과같은액체타입에서의사용은제한되며, 세정이필요할시에는 IPA 사용을권장함. 3) When the LEDs illuminate, operating current should be decided after considering the ambient maximum temperature. LED의발광시, 동작전류는주변최고온도를고려하여결정되어야함. 4) LEDs must be stored in a clean environment. If the LEDs are to be stored for 3 months or more after being shipped from Samsung Electronics, they should be packed by a sealed container with nitrogen gas injected.(shelf life of sealed bags: 12 months, temp. ~40, ~90%RH) LED의보관은청정한환경에서보존되어져야하며, 만약삼성전자로부터공급받는후 3개월또는그이상보관이필요하다면질소가스를동봉한보존용기에보관되어야함. ( 보존 bag의수명 : 12 개월, 보존온도 ~40, 습도 ~90%RH) 5) After storage bag is open, device subjected to soldering, solder reflow, or other high temperature processes must be: 보존 Bag이개봉된후에, 납땜이나 reflow등의높은온도에노출되는제품은다음의사항에부합되어야함. a. Mounted within 672 hours(28 days) at an assembly line with a condition of no more than 30 /60%RH, a. 제품은 30 /60%RH보다같거나낮은조립조건에서 672시간 (28일) 이내에조립해야함. b. Stored at <10%RH. b. 10% 이하의상대습도에서보관되어야함. 6) Repack unused Products with anti-moisture packing, fold to close any opening and then store in a dry place. 사용하지않은제품은방습팩에넣어개봉부위를닫아서다시포장한후, 건조한장소에서보관할것을권장함 / 49
27 7) Devices require baking before mounting, if humidity card reading is >60% at 23±5. 만약습도표시카드의수치가 23±5 에서 60% 이상이라면, 제품실장전 baking해야함. 8) Devices must be baked for 1 hour at 65±5, if baking is required. 만약 baking이필요하다면, 제품은 65±5 에서 1시간정도 baking 되어야함. 9) The LEDs are sensitive to the static electricity and surge. It is recommended to use a wrist band or anti-electrostatic glove when handling the LEDs. LED는정전기및서지에민감한제품이므로, LED 제품을다룰시에는정전기방지장갑이나손목밴드를사용하기를권장함. If voltage exceeding the absolute maximum rating is applied to LEDs, it may cause damage or even destruction to LED devices. 만약절대허용치를초과하는전압이 LED에가해지면, LED 소자는파괴되거나손상될수있음. Damaged LEDs may show some unusual characteristics such as increase in leak current, lowered turn-on voltage, or abnormal lighting of LEDs at low current. 손상된제품은누설전류의증가, Turn on 전압의저하, 저전류에서의점등불량등의이상거동을보일수있음. 10) VOCs (volatile organic compounds) can be generated from adhesives, flux, hardener or organic additives used in luminaires (fixtures). Transparent LED silicone encapsulant is permeable to those chemicals and they may lead a discoloration of encapsualnt when they expose to heat or light. VOCs( 휘발성유기화합물 ) 는등기구에사용되는접착제, Flux, 경화제, 유기물첨가제에서발생하여 LED 실리콘봉지제를투과하고, 빛또는열에노출되었을때변색이발생할수있음. This phenomenon can cause a significant loss of light emitted(output) from the luminaires(fixtures). 이러한현상은등기구로부터나오는빛의중대한손실을줄수있음. In order to prevent these problems, we recommend you to know the physical properties of the materials used in luminaires, They must be selected carefully. 이러한문제발생방지를위해서, 등기구에사용되는자재에대한물성을알고주의하여선택되어야함 / 49
28 11) Risk of Sulfurization (or Tarnishing) The LED from Samsung Electronics uses a silver-plated lead frame and its surface color may change to black(or dark colored) when it is exposed to sulfur(s), chlorine (Cl) or other halogen compound. 삼성전자의 LED는 Ag( 은 ) 을도금한리드프레임을사용함. 이리드프레임의표면이황 (S), 염소 (Cl), 또는다른할로겐화합물들에노출시 Ag( 은 ) 은검정 ( 또는어두운색 ) 으로바뀔수있음. Sulfurization of lead frame may cause intensity degradation, change of chromaticity coordinates and, in extreme cases, open circuit. It requires caution. 리드프레임의황화 (Sulfurization) 는광량저하, 색좌표변화및심한경우 LED 무등 (Open) 불량을일으킬수도있으니주의가필요함. Due to possible sulfurization of lead frame, LED should not be used and stored together with oxidizing substances made of materials in a following list, : Rubber, plain paper, lead solder cream and so on. 리드프레임황화 (Sulfurization) 의근원이될수있으니 LED 는아래의목록으로 만들어진산화성물질들과함께저장, 사용이불가함 : 고무, 일반종이, 납땜크림등 28 / 49
29 11. Hazard Substance Analysis - SGS 29 / 49
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35 11. Hazard Substance Analysis - SVHC(REACH) 35 / 49
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49 Revision History Date No. Revision History Drawn Writer Approved New version W.H Jung Y.T KIM Add up Quarter and half of color binning Change of tapping Q'ty from 2,000pcs to 2,500pcs 1) Change of CIE tolerance x,y:± ) Add up a mark of UL certification W.H Jung Y.T KIM C.H. KWON Y.T KIM W.H Jung Y.T KIM 49 / 49
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