Bluetooth 기술/시장 동향 LG이노텍 MCM사업팀 장기철 책임 18 Jul 2008
1. Market Trend 1. Value Chain Open, Global Market Over 6,000 Company Participate in Bluetooth Business ALPS Murata Kyocera Taiyo Yuden SEMCO LGIT Nitch Market? Silicon Vendor Module Vendor Set Maker Modile Phone PC Maker Consumer etc... CSR Broadcom TI Infineon IVT ESI (Chipset Mfg) S/W Vendor Bluetooth S/W Stack Ver 1.0 Bluetooth Qualification Cetecom 7Layer TUV HYPER 1 / 24
1. Market Trend 2. Bluetooth Applications Phone NotePC Tablet Access Point Data PDA NotePC Phone Camera MP3/iPod Music HID MP3/iPod Consumer Presenter Keyboard/Mouse Network Usage Model Car Phone Phone Car Print Voice NotePC NotePC The Bluetooth word mark and logos are owned by the Bluetooth SIG, Inc. (C) Bluetooth SIG, Inc. 2003-2006. 2 / 24
1. Market Trend 3. Application Trend Major Product Trend HID Game Console & Controller Mouse Digital Pen ü Note PC 기본 탑재 증가에 따른 Mouse + Presenter 기능으로 확대 ü Mobile Phone의 Input Device로 확대 Data NotePC PDA & Smart Phone Watch Blood Pressure Monitor ü Mobile 기기 탑재가 보편화 ü ULP (Ultra Low Power) 보급시 다양한 Sensor Application 제품 등장 Music Stereo Headset Boombox Car Stereo TV & STB ü 향후 비약적인 확대 ü 특히 Car Audio 탑재가 급격히 증대 ü Digital TV 수요 확대에 따른 채택 증대 Voice Mono Headset Car Handsfree ü Mono Headset은 저가격, 디자인, 음질에 대한 경쟁이 심화 ü 전용 Handsfree는 Car Audio 및 PND 등으 로 시장이 전환 Print Digital Camera Printer ü Digital Camera는 전송 속도의 한계로 WiFi 또는 UWB 를 채택할 가능성 높음. ü Printer는 USB Adaptor등의 Option 선택 ü Phone to TV/NotePC 사진 전송 응용 확대 3 / 24
1. Market Trend 4. Product Trend Mobile Phone's Bluetooth market be 66% over Bluetooth total market glow >15% annually from CY08 단위 : 백만개 1,800.0 1,600.0 1,400.0 1,200.0 1,000.0 800.0 600.0 400.0 Others Game Controller Game Console Car Audio Car Navi PMP HID NotePC Headset Mobile Phone ü 08년 이후의 CAGR은 15% 수준 ü Mobile Phone 및 Headset의 80% 이상의 Chipset 시장을 주도 ü NotePC, PMP, Car Audio 시장이 성장세를 보임. ü Game기 및 주변기기 적용이 이 뤄지고 있으나, 관련 업체는 극히 제한적인 상태임. 200.0 0.0 2006 2007 2008 2009 2010 2011 2012 *출처 : 자체 분석 4 / 24
1. Market Trend 4. Product Trend FCC approved product are increased very rapidly 1,600 1,400 1,200 1,000 800 600 400 200 0 306 FCC Approved Product 471 816 1,143 1,378 2003 2004 2005 2006 2007 Source : FCC Equipment Authorization Search ü FCC 승인은 2005년 이후 급격한 증가세를 나타냄. ü Set 대신 Module이 승인을 받는 Modular Approval 비중은 약 5% 정도로 실제 Set는 많을 것으로 추정 ü 승인 업체수 : 464개 (2007년) Major Company Company Product Major Product 삼성전자 157 Mobile Phone/Headset Nokia 65 Mobile Phone/Headset LG전자 55 Mobile Phone/Headset Motorola 43 Mobile Phone/Headset Sony Ericsson 42 Mobile Phone Panasonic 21 CE, PC, Automotive Sony 21 Game, PC High Tech Computer 15 PDA, Mobile Phone GN Netcom 13 Headset Micro Star International 12 PC Unitech 12 PC ASUSTeK Computer 11 PC KYE Systems 10 Audio Equipment, ODM * 2007년 FCC 승인 Product수 10개 이상 업체 5 / 24
1. Market Trend 5. Future Market Growth Bluetooth integrated Mobile handset will be saturated to 60% by 2010 2006년 약 5억개의 Chipset 판매 예상 2011년까지 년간 40%의 성장 2009년 총 10억개의 Bluetooth 제품이 판매 - ABI Research - Over 10M units shipping per week - IMS Research - Over 300M devices in 2005 Over 600M devices expected in 2006 Mobile phone penetration in 2005 was around 22% and expected to be close to 40% in 2006 - Bluetooth SIG - *출처 : KETI 현황분석보고서 (2005) 6 / 24
1. Market Trend 6. Chipset Market Share CSR & Broadcom share almost Bluetooth mobile phone market 3.2% 12.8% 3.2% 7.0% 0.1% 0.3% 4.9% 46.7% 21.7% 4.8% 0.1% 6.6% 5.9% 1.1% 1.2% 8.6% Broadcom 26.2% CSR Infineon Nokia Philips Qualcomm RFMD ST 45.5% TI CY2005 CY2006 * Source : TSR 2006 Mobile Phone 시장은 CSR, Broadcom, Qualcomm 이 경합 저전력/복합화/다기능화에 Focus Headset 시장은 CSR 주도 7 / 24
1. Wireless Technology Landscape 8 / 24
2. WPAN Standard IEEE LABEL WPAN 802.15 TASK GROUP WORKING NAME BASIC RF Low Speed 15.1 Bluetooth(1.1) 2.4GHz ISM, FM, Hopping - 15.2 Co-existence na High Speed 15.3 2.4GHz OFDM, DQPSK, AQM Trellis Coding - 15.3a WiMedia-MBOA UWB, MBOA : 3~8GHz, SB : 3~5GHz - 15.3c TG3c 57~64GHz, mmwave Low Speed/Power 15.4 Zigbee 868,900MHz, 2.4GHz ISM, BPSK, O-QP나 Location/Ranging 15.4a TG4a UWB Impulse Radio or Chirp Spread Spectrum (2.4GHz) Low Speed/Power 15.4b TG4b 15.4 Enhancement, New Freq. Allocation Mesh Network 15.5 TG5 Determine PHY/MAC for Mesh Networking WLAN 802.11 Medium High Speed 11a,b,g,h Wi-Fi 2.4GHz, 5.6GHz DSSS or OFDM, BPSK thru 64QAM Half Rate 11a TBD DSRC 5.9GHz Higher Speed 11n HTSG 2.4GHz, 5.6GHz Use of MIMO possible WMAN 802.16 High Speed P2P 16 MMDS, LMDS 10~66GHz High Speed, Various MAC options including Mesh 16a WiMax 2~11GHz Licensed. 5~6GHz unlicensed. Single Carrier. BPSK through to 56QAM. 200 carrier OFDM The most popular 9 / 24
3. Wireless Network IP Network 무선 접속 기기간의 Cable Replacement Wi-Fi Wi-Bro IP Network Bluetooth Zigbee UWB CDMA/EVDO WLAN WPAN ~10m WWAN ~200 m 이동통신망을 이용한 Data 접속 WMODEM WiMAX ~10km WCDMA/HSDPA * WPAN : Wireless Personal Area Network * WLAN : Wireless Local Area Network * WWAN : Wireless Wide Area Network 10 / 24
4. Bluetooth SIG Vision Quick evolution in storage capacity and functionality in mobile phones and other electronic devices Choice between developing our own radio or building on another industry standard Synergies in co-operation as outlined in our umbrella vision 1+1 is morethan2 Wireless creates new opportunities more than 3,000 Bluetooth products on the market 11 / 24
4. Bluetooth SIG Vision Source CSR, 2006 12 / 24
5. Emerging Tech - NFC 13 / 24
5. Emerging Tech - NFC Bluetooth Simple Pairing Integrate connectivity bundle (NFC, BT, Wi-Fi, GPS, FM Radio) and drive functionality (e.g. headsets, data sharing) Challenge-NFC Secure Element Bluetooth v2.1+edr support NFC based simple pairing mode Bluetooth SIG Interest Up Bluetooth handset penetration surpasses 70% by 2010 Share 30+ use case experience with NFC Forum groups to guarantee interoperability NFC enhances BT relevance NFC Bluetooth-Enabled Phones by Phone Type, World Market, Moderate Forecast, 2006-2011 (Source: ABI Research) 14 / 24
6. Emerging Tech - UWB IEEE 802.15.3a UWB 2003년 1월 2003년 5월 2005년 초 현재 고속 WPAN을 위한 Alternative PHY의 표준을 목적으 로 TG 3a 발족 총 23개 제안서 접수 (Freescale의 DS-UWB, Intel 등의 MBOA) 투표 실시 à 양측 모두 75% 의 지지 확보 실패, 현재까지 도 경합중 현재로선 IEEE 가 사실상 이중 표준을 인정 MBOA (Multband-OFDM) DS-UWB 주파수운용 14개 (대역폭: 528MHz) 3.1~4.9GHz, 5.825~106GHz 변조방식 OFDM (128 FFT)/QPSK CDMA(M-BOK)/BP나 코딩방식 Convolutional Code Convolutional Code 전송률 55 ~ 480 Mbps 28.5 Mbps ~ 1.2 GHz 다중접속방식 Time/Frequency Hopping 4 CDMA code set 회로 복잡도 FFT/IFFT 구조 Rake Receiver 구조 15 / 24
6. Emerging Tech - UWB Bluetooth SIG device to co-operate with WiMedia Alliance. 16 / 24
7. Emerging Tech WiBree (ULP) Wibree is the first wireless technology to solve the following needs in a single solution. - Ultra low peak, average & idle mode power consumption - Ultra low cost & small size for accessories & human interface devices (HID) - Minimal cost & size addition to mobile phones & PCs - Global, intuitive & secure multi-vendor interoperability Wibree device architecture Wibree specification has been created by having two equally important implementation alternatives in mind, namely dualmode and stand-alone. In the dual mode implementation the Wibree functionality is an add-on feature inside Bluetooth circuitry sharing a great deal of existing functionality resulting in a minimal cost increase compared to existing products. The dual modes are targeted at mobile phones, multimedia computers and PCs. The stand alone implementations are power and cost optimized designs targeted at, for example, sport, wellness, and human HID product categories. Wibree radio specification Wibree radio specification enables dual-mode implementations to reuse Bluetooth RF part but also to guarantee ultra low power consumption for devices with embedded stand-alone implementation of the Wibree specification. Wibree operates in 2.4 GHz ISM band with physical layer bit rate of 1 Mbps and provides link distance of 5-10 meters. Wibree link layer specification Wibree link layer provides ultra low power idle mode operation, simple device discovery and reliable point-to-multipoint data transfer with advanced power-save and encryption functionalities. The link layer provides means to schedule Wibree traffic in between Bluetooth transmissions. Wibree host & profile specifications In the first phase Wibree provides sensor, HID and watch user interface profiles. 17 / 24
7. Emerging Tech WiBree (ULP) WiBree is a new standard for ultra low power application like as watch and sensor. Bluetooth Stack DuMo Stack WiBree Stack BT Profiles BT Profiles WiBree Profiles WiBree Profile L2CAP L2CAP PAL PAL HCI Admission Control HCI Extension HIF Link Manager (LMP) Link Controller (LC) LMP LC DuMo manager LL Link layer (LL) RF RF WiBree Technology Physical Layer (PHY) WiBree protocol stack with the Bluetooth protocol Stack 18 / 24
8. Bluetooth Specification Roadmap Lisbon Bluetooth 2.1 features 26-Jul-2007 Released üextended Inquiry Response provides more information during the inquiry procedure to allow better filtering of devices before connection. This information includes the name of the device, and a list of services, with other information. üsniff Subrate Reducing the power consumption when devices are in the sniff low power mode, especially on links with asymmetric data flows. Human interface devices (HID) are expected to benefit the most with mice and keyboards increasing the battery life from 3 to 10 times those currently used. üquality of Service these will enable audio and video data to be transmitted at a higher quality, especially when best effort traffic is being transmitted in the same piconet. üsimple Pairing this improvement will radically improve the pairing experience for Bluetooth devices, while at the same time increasing the use and strength of security. It is expected that this feature will significantly increase the use of Bluetooth. Seattle Bluetooth 3.0 features Q2/2008 üsupport for UWB high speed Channel üsupport Broadcast & Multicast Channel 19 / 24
9. Profiles Bluetooth Protocol Stack Bluetooth Profiles 20 / 24
10. Bluetooth Module Crystal TCXO Clock IN/ Request Out Clock WLAN Coexistence Coexistence LPO LPO IN LPO Voice Interface PCM EEPROM Or Flash Class1 - Power : Max 20 dbm - Application Access Point Mobile(One-phone) USB Dongle Wireless SPK RF In/Out Antenna BPF SW LNA PA Memory Memory BALUN BALUN 2.4GHz Radio RAM DSP MCU ROM I/O Host Interface UART/USB/SDIO Wake up control BT wake/host wake Reset RESET Debug or F/W Download SPI/JTAG Class2 - Power : -6~4 dbm - Application Mobile phone PDA MP3 RF+BB Single Chip Class1.5 - Power : 10 dbm Power/GND Power/GND 21 / 24
10. Bluetooth Module 부품 구성에 따른 장/단점 구 분 장 점 단 점 Substrate LTCC 기판내에 Filter등의 Passive 부품 내장 가능. 소형화에 유리 Internal Component with X-Tal 용도별 Module 구성 with E 2 PROM 안정적 성능 Set 에서의 Clock Source 를 공유하기 어려운 경우 적합 RF 성능 관련 Matching 값 저장으로 고성능 유지 및 Set에서의 별도 Calibration 공정이 불필요 Size가 클 경우 Cost 증가 내장 Passive 부품 용량의 한계 Cost & Size 증가 Phone의 경우 내부 TCXO 공유 가능으로 불필요 Cost & Size 증가 Set 공정 전문화 시 내재화 가능 Low Cost Mid Cost High End Stand Alone 구성 HOST HCI GUI Profile BT HCI HOST Multimedia Module GUI Profile Stack HOST All-In-One Module GUI Profile DSP/Stack BT Chipset Profile DSP/Stack 적용분야 Mobile Phone NotePC/PDA/PMP Car Stereo Host Resource High-End Car Stereo 부가 기능 내장 (DSP) Headset Mouse/Keyboard 등 22 / 24
10. Bluetooth Module LTCC substrate is used mostly at mobile Bluetooth module. <RF Module> <HCI Module> Description LBRQ-2B43 is a Class 2 (4dBm) Bluetooth RF module for mobile phone with any of the Bluetooth enabled QUALCOMM MSM chipset. LTCC : Low Temperature Co-fired Ceramic Features - Dimension : 4.5x3.2x1.2mm - Temperature Range : -30 ~ +75 - Supply Voltage : VDD_BAT 1.9V to 3.6V VDD_MSM 1.62 to 2.92V - Output Power : +1dBm (Typical) Class 2 - Sensitivity : -87dBm (Typical) - Interface : BlueQ - Bluetooth Specification Ver1.1, 1.2 Compliant 23 / 24
11. Chipset Roadmap Main trend of Bluetooth chipset is a convergence networking 2006 2007 2008 Standard BT2.0+EDR BT2.1+EDR BT3.0 Silicon 130nm 65nm Chipset BT+ FM Rx BT+ FM Rx/Tx BT+ UWB PHY BT+ NFC/RFID BT+ GPS BT+ FM+WiFi BT+ DVB-H Source : CSR, Broadcom, TI 24 / 24
Q & A 감사합니다! LG이노텍 장기철 책임연구원 kcchang@lginnotek.com