(Chip Resistor)
HISTORY - - Fixed Thick Film Resistor - System
,,. ( ) RuO2 Supptering NiCr Carbon,,,,TCR HIGH POWER, TCR, Volumn chip
- (ohm's law) - - 1 R = 1 1 = 1 + R1 R2 R = R1 + R2 = 2 + 3 = 5 I = V R = 10/5 = 2 A V1 = 2A X 2= 4V V2 = 2A X 3= 6V - R(resistor), L(inductor), C(capacitor).. -.. -. ( test < 200MHz) L, C. R. Block.. R1 = 10/2 = 5A - JUMPER 0ohmJUMPER. JUMP.
PROCESS Al 2O 3 substrate For high insulation [ Conductor printing & firing ] Top & bottom conductor For high conductivity [ 2nd Glass/MK printing & firing ] To protect trimmed resistor, and to certify resistance value [ Termination printing & firing ] [ Resistor printing & firing ] Resistor blending, controll thickness [ Glass printing & firing ] To connect top and bottom conductor [ Plating (1st Ni, 2nd Sn or Sn-pb) ] To prevent worse solderability caused by oxidaton To protect resistor against trimming laser [ Taping ] [ Laser trimming ] Trimming the resistor for accurate resistance value For SMD (Surface Mounting Devices)
Chip Resistor () RESISTOR FOR General purpose Precision Low ohms Trimmable chip Array Array-precision Packaging Standard Resistance Value INTRODUCTION Thick Film Chip Resistor is general passive component which is useful for derating voltage, current controlling in circuit. Surface Mounting is available. Production is increasing with demand for small size & light weight of Set product. We provide Ultra-small, High-Reliability, High-stability Resistors. APPLICATION Operating notes Example of land pattern design Recommended soldering About production process TECHNOLOGY TREND Pb-free GENERAL FEATURES - Very small, thin, and light weight. - Suitable size and packaging for surface mount assembly. - Both flow and reflow soldering are applicable. APPLICATIONS - Home Appliances (DVD, Digital TV, CAMCODER, VTR, Digital Camera, Audio,Tunner) - Computers & Cummunications (PC, Memory Module, Mobile, Network Equiment, TCXO, etc) SPECIFICATION
RN / RP RN type (Through-hole) RP type (Dipping). T. T W 1 2 3 W Dimension L L W T L L W T 104P 2.0 1.0 0.40 104P 2.0 1.0 0.35 164P 3.2 1.6 0.60 164P 3.2 1.5 0.60-2 /.. - 2 850 - - 2dipping.. - 2 600. / -. - (850)2 dipping type. -. - Soldering.
Array / Network Array Network - ICBoard, / / -, 1-1 Mounting - - (ex) 1608 X 4164P X 1 -
(Nominal Resistance Value). (Critical Resistance Value) (Working Temperature) 1608, 2012, 3216 : -55 ~ 155 : -55 ~ 125 (Rated Ambient Temperature).( 70),. (Maximum Working Voltage) ( ).,. (Maximum Overload Voltage) ( ). 2. (Dielectric Withstanding Voltage) body1.( ) (T.C.R. - Temperature Coefficient of Resistance), 1. () (Rated Power or Power Rating). W1/16, 1/10, 1/8, 1/4, 1/2, 1. (Rated Voltage) ( ).. = (W) ( Ω) (Power Derating Curve)..
MARKING Chip-R Marking - KS / JIS / IEC (,) - Marking: 3, 4 marking, code marking Marking Flow Marking system ( IEC, JIS, KS ) - / E, E3, E6, E12, E24, E48, E96, E192. n/24 ) E24 : 10 n = 1~24 E24, E96 series. Code Marking - 2 : E24 ( -, -10) ) C2 = C(1.2) X 10 2 = 120-3 : E96 ( -, -10) ) 51B = 332 X 10 1 = 3320 = 3.32 Marking - 3 marking : 103 = 10 X 10 3 = 10000 = 10 R22 = 0.22-4 marking : 5621 = 562 X 10 1 = 5620 = 5.62 3R48 = 3.48 Marking 0603 1005 1608 2012~6432, array 3 X X O O 4 X X X O
IEC code system 1) 1 10. 2). 3)?. E-24, E-96 series 1) E-24 series 10.45 10.50 2) E-96 series E-24 series Table R 0 1 2 3 4 5 6 10 1R0 100 101 102 103 104 105 106 11 1R1 110 111 112 113 114 115 12 1R2 120 121 122 123 124 125 13 1R3 130 131 132 133 134 135 15 1R5 150 151 152 153 154 155 16 1R6 160 161 162 163 164 165 18 1R8 180 181 182 183 184 185 20 2R0 200 201 202 203 204 205 22 2R2 220 221 222 223 224 225 24 2R4 240 241 242 243 244 245 27 2R7 270 271 272 273 274 275 30 3R0 300 301 302 303 304 305 33 3R3 330 331 332 333 334 335 36 3R6 360 361 362 363 364 365 39 3R9 390 391 392 393 394 395 43 4R3 430 431 432 433 434 435 47 4R7 470 471 472 473 474 475 51 5R1 510 511 512 513 514 515 56 5R6 560 561 562 563 564 565 62 6R2 620 621 622 623 624 625 68 6R8 680 681 682 683 684 685 75 7R5 750 751 752 753 754 755 82 8R2 820 821 822 823 824 825 91 9R1 910 911 912 913 914 915 102 105 107
Standard Resistance Value Tolerance code table Tolerance code D F G J K M IEC-code system E-192 E-96 E-48 E-24 E-12 E-6 Digit number 4 digit 3 digit Specification ±0.5% ±1% ±2% ±5% ±10% ±20% Significant figure of resistance value E-192 E-96 E-48 E-24 E-192 E-96 E-48 E-24 E-192 E-96 E-48 E24 E-192 E-96 E-48 E24 100 100 100 10 178 178 178 316 316 316 562 562 562 56 101 180 18 320 569 102 102 182 182 324 324 576 576 104 184 328 583 105 105 105 187 187 187 332 332 332 33 590 590 590 106 189 336 597 107 107 191 191 340 340 604 604 109 193 344 612 110 110 110 11 196 196 196 348 348 348 619 619 619 111 198 352 626 62 113 113 200 200 20 357 357 634 634 114 203 361 36 642 115 115 115 205 205 205 365 365 365 649 649 649 117 208 370 657 118 118 210 210 374 374 665 665 120 12 213 379 673 121 121 121 215 215 215 383 383 383 681 681 681 68 123 218 388 690 124 124 221 221 22 392 392 39 698 698 126 223 397 706 127 127 127 226 226 226 402 402 402 715 715 715 129 229 407 523 130 130 13 232 232 412 412 532 532 132 234 417 541 133 133 133 237 237 237 422 422 422 750 750 750 75 135 240 24 427 759 137 137 243 243 432 432 43 768 768 138 246 437 777 140 140 140 249 249 249 442 442 442 787 787 787 142 252 448 796 143 143 255 255 453 453 806 806 145 258 459 816 147 147 147 261 261 261 464 464 464 825 825 825 82 149 264 470 47 835 150 150 15 267 267 475 475 845 845 152 271 27 481 856 154 154 154 274 274 274 487 487 487 866 866 866 156 277 493 876 158 158 280 280 499 499 887 887 160 16 284 505 898 162 162 162 287 287 287 511 511 511 51 909 909 909 164 291 517 920 91 165 165 294 294 523 523 931 931 167 298 530 942 169 169 169 301 301 301 30 536 536 536 953 953 953 172 305 542 965 174 174 309 309 549 549 976 976 176 312 556 988 Example
Reel dimensions Packaging table
Technical trends SET 1. SET (SMD CHIP ) 2. ( CHIP, CHIP ) 3. (CHIP, CHIP ) ex) "F" "J" CHIP 1. SET, USER 2. (Pb ) LEAD FREE, (POLYMER) GLASS (1 ), (2 ), R PASTE (3 ) 3. SMT (CHIP ) Pattern, GLASS PASTE, Carrier tape 4. CHIP () (,, GAS, NOISE )
Technical trends υ υ υ 0603 (0201in) 1005 (0402in) 1608 (0603in) υ υ υ Sn/Pb Plating υ υ Sn 100% Plating υ υ
Technical trends
ROAD MAP ITEM ~2001 2002 2003 2004 Miniaturization 0402 (RC1005) 0201 (RC0603) Ultra high ohms 10M ohm 1G ohm Multiple & Complex 0402X4pcs R array 0402X4pcs 5% 0402X4pcs 1% 0201 X 4pcs Parallel Network Low Noise RC series All type Pb-Free All type Done
World wide logistics Full process Taping process & Warehouse HUNGARY 1005 : 430 1608 : 1,000 2012 : 800 3216 : 150 : 0 N/W : 0 Total : 2,380 World Wide CAPA (Mpcs/month) Chip Resistor Taping Capa Bulk Capa Korea 100 - TIAN JIN THAI KOREA PHILIPPINE MEXICO Philippine 3,200 3,600 Tian jin (China) 2,000 2,400 Mexico 200-1005 : 570 1608 : 2,100 2012 : 700 3216 : 90 : 30 N/W : 130 Total : 3,620 Thai 300 - Hungary 200 - Total 6,000 6,000
Pb-free Pb-free - (Pb) Marketing ( : 2001 Recycle) - Pb-free solder (Sn/Pb Sn ) Pb-free (Sn/Pb) Pb-free(Sn) Solder Soldering ( reflow ) 185 (Sn63/Pb37) 220 (Sn/Ag/Cu ) Soldering (230) (240) peak 5 peak 30 Pb-free 1. Pb-free T/F: '01. 01. 2. Pb-free : '01. 09. 3. SONY (CR, MLCC) : '01. 10. 4. Pb-free line Setup (SEMPHIL) : '01. 11. ( ) 5. Pb-free (4/, CR ) : '01. 12. Pb-free 1. / - Delphi : - Motorola : 2001 - Ericsson : 200180% - Siemens : 2001 - Philips : 1998 2. - NEC : 200212 - Sanyo : 20043 - Sharp : 2001 - Hitachi : 20023 - Fujitsu : 2002 - Mastushita : 20033 - Mitsubishi : 20023Pb-free solder [ soldering] [Pb-free soldering]
Reliability Test NO TEST ITEM TEST CONDITON CYCLE (months) 1 Vibration 2 Bending Strength 3 4 5 6 7 Termination Strength Resistance To Soldering Heat High Temperature Storage Low Temperature Storage Temperature Cycle 8 Load Life 9 Humidity Load 10 11 Short-time Over Load Intermittent Over Load 12 T. C. R 13 Solderability 14 V. C. R 15 Withstanding Voltage 16 NOISE 17 Insulation Resistance 18 Body Strength 19 Leaching Frequency : 10 ~ 55 ~ 10Hz Amplitude : 1.5 Frequency : 1oct/min Time : 2hr each of 3axis Bending force : 3 Time : 10sec Force: 2012,3216,3225 = more then 0.5 1005,1608,RC164P= more then 0.3 Temp.: 2605 Time : 101sec. solder: H63A(JIS Z 3282) / S63A(KSD 6704) Flux: rosin 25% + methanol 75% Temp.: 1252 Time : 1000Hr Temp.: -552 Time : 1000Hr Temp.: -55(30min)20(15min) 125(30min)20(15min) Cycle: 5 Temp.: 703 Load : Rate voltage (on for 90min and off for 30mim) Time : 1000Hr Temp.: 403 Humi.: 90~95%RH Load : Rate voltage (ON for 90min and OFF for 30mim) Time : 1000Hr Load : 2.5 times of the rate voltage Time : 5sec. Load : 2.5 times of the rate voltage Time : ON for 1sec and OFF for 25sec Cycle: 10,000 cycle Temp.: 20-552012520 Time : 30min Computation : TCR( PPM /) = R - Ro 1 X X10 6 Ro T To Hear,R =resistance value for -55or 125 Ro=resistance value for 20 T =-55or 125 To= 20 Temp.: 2355 Time : 20.5sec solder: H63A(JIS Z 3282) / S63A(KSD 6704) Flux: rosin 25% + methanol 75% Apply Voltage: 1/10times of Rate voltage(v2) Rate voltage(v1) Computation : R1 R 2 1 Vc( PPM / V ) = X X 10 6 R 2 V 1 V 2 Hear, R1=resistance value for V1() R2=resistance value for V2() Apply Voltage : - AC 500V for more then 2012 size - AC 100V for low then 1608 size Time : 1min Apply Voltage : - AC 500V for more then 2012 size - AC 100V for low then 1608 size Time : 1min Measurement pressure : 1.00.2N Compress speed: 100mm/min Temp.: 2605 Time : 301sec. solder: H63A(JIS Z 3282) / S63A(KSD 6704) Flux: rosin 25% + methanol 75% SPL Q'TY (pcs) REFERENCE 6 6 JIS C 5202 6.3 6 6 JIS C 5202 6.1.4(3) 6 6 JIS C 5202 6.1.2(1) 3 6 JIS C 5202 6.10 6 6 JIS C 5202 7.2 6 6 JIS C 5202 7.1 6 18 JIS C 5202 7.4 3 18 JIS C 5202 7.10 3 18 JIS C 5202 7.9 3 6 JIS C 5202 5.5 3 6 JIS C 5202 5.8 6 6 JIS C 5202 5.2 6 6 JIS C 5202 6.5 EVT MVT EVT MVT EVT MVT EVT MVT EVT MVT EVT MVT 6 SEMCO 50-S-SCR001 JIS C 5202 6.5 6 SEMCO 50-S-SCR001 JIS C 5202 5.7 6 SEMCO 50-S-SCR001 JIS C 5202 5.9 6 SEMCO 50-S-SCR001 JIS C 5202 5.6 6 SEMCO 50-S-SCR001 JIS C 5202 6 SEMCO 50-S-SCR001