PCB ACF 77 GHz. X,,.,. (dip brazing), (diffusion bonding), (electroforming),, [1],[2].. PCB(Printed Circuit Board), (anisotropic conductive film: ACF)

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1 THE JOURNAL OF KOREAN INSTITUTE OF ELECTROMAGNETIC ENGINEERING AND SCIENCE Oct.; 29(10), ISSN (Print) ISSN X (Online) PCB ACF 77 GHz 77-GHz Slot Array Antenna Using PCB and ACF 윤평화 권오윤 송림 김병성 Pyoung-Hwa Yoon Oh-Yun Kwon Reem Song Byung-Sung Kim 요약 77 GHz. 77 GHz,, ACF(Anisotropic Conductive Film). 1 16,., db, 77 GHz 17 dbi. Abstract This study presents the performance evaluation results of a 77-GHz waveguide slot array antenna that was fabricated by attaching a patterned printed circuit board(pcb) on a metal block. The 77-GHz waveguide was divided into a top plate and a bottom structure. The top plate was fabricated using a patterned PCB that can implement a fine slot at low cost. The top cover was then bonded to the bottom metal structure with a waveguide trough using anisotropic conductive film. For evaluating the antenna performance, a 1 16 slot array antenna was fabricated using our proposed method and the gain and pattern were measured and compared with the simulation results. Though the measurement results demonstrate a reduction in gain of around db compared to the simulation results assuming ideal bonding conditions, the pattern hardly changed and the slot antenna with a gain of approximately 17 dbi at 77 GHz can be easily manufactured at a low cost using the proposed method. Key words: Slot Array Antenna, Waveguide, ACF, 77 GHz Automotive Radar. 서론 77 GHz,.,., (No ) (No. 2017H1D8A ). (College of Information & Communication Engineering, Sungkyunkwan University) Manuscript received September 4, 2018 ; Revised October 10, 2018 ; Accepted October 19, (ID No ) Corresponding Author: Byung-Sung Kim ( 752 c Copyright The Korean Institute of Electromagnetic Engineering and Science. All Rights Reserved.

2 PCB ACF 77 GHz. X,,.,. (dip brazing), (diffusion bonding), (electroforming),, [1],[2].. PCB(Printed Circuit Board), (anisotropic conductive film: ACF) - (thermal-compression bonding). 77 GHz,.. 본론 2-1 제안한 77 GHz 슬롯배열안테나의제작및설계., PCB. PCB (dielectric) (bottom metal)..,., PCB,., ACF. ACF matrix, interconnec- 그림 GHz Fig. 1. Proposed fabrication process of a 77 GHz waveguide antenna. tion., ACF flip-chip [3] [5]. Dexerial ACF(CP801AM-35AC), ACF -.,, GHz TE 10. 2(a) PCB 16, (λ g ). (closed end) 1/4 λ g. 2(a) WR-10,. HFSS. 753

3 THE JOURNAL OF KOREAN INSTITUTE OF ELECTROMAGNETIC ENGINEERING AND SCIENCE. vol. 29, no. 10, Oct 유전층이 인 경우 (a) air (a) Dielectryc layer - air 상 하부 구조체 슬롯 배열안테나 (a) 3-D view (b) top view (a) 3-D view of the upper/lower (b) Top view of the slot array structures 도파관 슬롯 배열안테나의 구조도 유전층이 그림 2. Fig. 2. The configuration of a waveguide slot array. 인 경우 (b) RO5880 (b) Dielectric layer - RO5880 일반적인 도파관 슬롯 배열 안테나 구조와 다르게 상 판의 하부 금속층을 지지하는 유전층이 존재하기 때문에 입력 임피던스 및 안테나 방사 패턴에 영향을 미칠 것으 로 예상된다. 따라서 시뮬레이션을 통해 이러한 유전층이 배열 안테나 특성에 미치는 영향을 분석하였다. 또한 유 전층이 없는 경우(air)도 함께 시뮬레이션을 진행하여 비교 하였다. 상판 PCB는 유전율 2.2, 손실탄젠트 의 RT/ Duroid 5880(RO5880) 기판을 이용하였으며, 두께는 mm이다. ACF layer없이 상부 기판과 하부 블록이 이상적 으로 접합된 조건으로 시뮬레이션을 진행하였다. 이렇게 구한 세부 파라미터 값들과 시뮬레이션 결과를 표 1에 제 시하였다. Air에 비해 슬롯의 장축 길이(S )가 줄어들었으 며, 안테나 최대 이득(peak IEEE gain)은 약 0.3 db 감소한 것을 확인할 수 있었다. 따라서 본 연구에서 제안하는 77 GHz 슬롯 배열 안테나 구조에서 유전층이 안테나 특성에 w 에서 분포의 시뮬레이션 결과 그림 GHz E-field (yz) Fig. 3. The simulated E-field distribution at 77 GHz(yzplane). 평면 미치는 영향은 크지 않은 것을 확인할 수 있었다. 그림 3은 도파관 슬롯 배열 안테나의 E-field 분포의 시 뮬레이션 결과를 나타낸다. 유전층이 Air와 RO5880 두 경 우 모두 77 GHz에서 TE 가 정상적으로 형성된 것을 확 인할 수 있었다 슬롯 배열 안테나의 시뮬레이션 및 측정결과 그림 4는 제작된 슬롯 배열 안테나 실측 사진을 나타낸 다. 그림 4(a)는 제작된 상판 PCB를 나타내며, 하부 금속 슬롯 배열 안테나 사이즈 및 시뮬레이션 결과 표 1. Table 1. Dimension of slot array antenna and their simulation results. Dielectric Dx Dy Sn Sw Ly Air (mm) RO5880 (mm) Dielectric Simulated peak IEEE gain Simulated total efficiency Air GHz GHz RO GHz GHz (a) 상판 PCB의 제작된 안테나의 (b) bottom view top view (a) Bottom view (b) Top view of the of the PCB fabricated antenna 제작된 안테나 사진 (c) 제작된 안테나의 bottom view (c) Bottom view of the fabricated antenna 그림 4. (RO5880 PCB) Fig. 4. Photograph of the fabricated antenna.

4 PCB ACF 77 GHz (b) 4(c) ACF. 4(b) RO5800 alignment mark mm 3., (return loss) (radiation pattern). 5 S-. 10 db GHz(2.10 GHz)., GHz(2.47 GHz) GHz., 3.5 db 16.6 dbi. ACF layer (matrix),, mis-alignment, tolerance,. RO5880 FR-4. FR-4 4.4, 0.02, 0.2 mm., 7 S-. 10 db GHz(2.4 GHz). RO 5880 FR-4. (a) xz- (a) xz-plane (b) xy- (b) xy-plane 그림 6. (RO5880 PCB) Fig. 6. Gain patterns of the fabricated antenna. 그림 5. S- (RO5880 PCB) Fig. 5. The simulated and measured S-parameters. 그림 7. S- (FR-4 PCB) Fig. 7. The simulated and measured S-parameters. 755

5 THE JOURNAL OF KOREAN INSTITUTE OF ELECTROMAGNETIC ENGINEERING AND SCIENCE. vol. 29, no. 10, Oct 표 2. (FR-4 PCB) Table 2. Dimension of slot array antenna with and their measurement results. D x D y S n S w L y Dimension(mm) Dielectric Sim. Meas. Measured peak realized gain GHz GHz 77 GHz (measured peak realized gain) 2. W- positioner. 2.3 db, 77 GHz 17.1 dbi.. 결론 77 GHz. 77 GHz 1 16, PCB ACF. RO5880 FR-4 77 GHz., db, dbi.,. References [1] D. J. Kim, M. Zhang, J. Hirokawa, and M. Ando, "Design and fabrication of a dual-polarization waveguide slot array antenna with high isolation and high antenna efficiency for the 60 GHz band," IEEE Transactions on Antennas and Propagation, vol. 62, no. 6, pp , Jun [2] D. Y. Kim, Y. Lim, H. S. Yoon, and S. Nam, "Highefficiency W-band electroforming slot array antenna," IEEE Transactions on Antennas and Propagation, vol. 63, no. 4, pp , Apr [3] W. Ryu, M. J. Yim, S. Ahn, J. Lee, W. Kim, and K. W. Paik, et al., "High-frequency SPICE model of anisotropic conductive film flip-chip interconnections based on a genetic algorithm," Transactions on Components and Packaging Technologies, vol. 23, no. 3, pp , Sep [4] M. J. Kim, W. Ryu, Y. D. Jeon, J. Lee, S. Ahn, and J. Kim, et al., "Microwave model of anisotropic conductive film flip-chip interconnections for high frequency applications," IEEE Transactions on Components and Packaging Technologies, vol. 22, no. 4, pp , Dec [5] M. J. Kim, I. H. Jeong, H. K. Choi, J. S. Hwang, J. Y. Ahn, and W. Kwon, et al., "Flip-chip interconnection with anisotropic conductive adhesive for RF and highfrequency applications," IEEE Transactions on Components and Packaging Technologies, vol. 28, no. 4, pp , Dec

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