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1 ,. T OYOT A CRC 1, AMCOL INT ERNAT IONAL, UBE, MIT SUBISHI CHEM. ASAHI KASEI 5 68%

2 , 90,

3 5-3. Clay.., AMCOL

4 3-38. Amcol, Allied signal Inc, Michig an State University, Claytec, Inc., Cornell Research F oundation, Inc., T oyot a Chuo Kenkyusho, Show a Denko K.K., Southern Clay Products, Amcol 1 2 Nano Composite Clay Amcol. Amcol T oyota License Clay Modification. Cornell Research, Michigan Epoxy - Clay System Polymer - Clay.

5 3-3. Modified Silicate US P olym er US Allied signal in c. 1) h et eroarom atic cation 2) ring Gen eral + Electric heteroat om company Lay ered m in eral Alkyl am m onium salt US Lay ered silicat e epoxy 4 A mm onium slat PP G, DEG, Clay Corn ell Research F n dation, inc. US h exylen e Gly col Rh eox, Inc. US Lay ered m in erals and com position s com prisin g the sam e US Org anoclay com position so US Silan e- m odified clay 15% v olatile m att er, porosity 0.3m l/ g caly silane Gen eral Electric S outhern Clay Produ ct s, In c. Loy ola Univ er sity of Chicago Clay, Clay Amcol.

6 3-4. Amcol Clay Modification Inte rc a la te s a nd exfo lia te s fo rm : o ligo m e r p o lym e r o lig o m e rs p o lym e r 2 ~ 15 %, la ye r 10 exfo lia te d laye re d m a te ria l 0.0 5% ~ 4 0 % c o m p o s ite Inte rc a la te s : s o lve nt(10 ~ 99.5 %) s o lve nt Po lym e r (a ro m a tic ring, c a rb o nyl, hyd roxyl, a m ine, a m id e ) s o lve nt o lig o m e rs p o lym e rs (p o lym e r 16 % ~ 100 %) Inte rc a la te s a nd exfo lia te s fo rm : 10 Inte rc a la te s exfo lia te s fo rm : c a rb o nyl- functio na l (c a rb oxylic a nd p o lyc a rb oxylic a c id s ; a ld e hyd e s ; keto ne s ) s p a c ing 5 o lig o m e rs p o lym e r Inte rc a la te s a nd exfo lia te s fo rm ; 80 % 5 la ye r US US US US US US Inte rc a la te s a nd exfo lia te s fo rm m o no m e rs, o lig o m e rs, p o lym e rs (no n- EVOH) Inte rc a la te s a nd exfo lia te s fo rm US ( 5 ) EVOH (0.0 5 wt% ~ 60 Wt%) N- a lke nyl a m id e, Allylic m o no m e r o lig o m e rs c o p o lym e rs 2 % 10 US Inte rc a la te s a nd exfo lia te s fo rm, c o m p o s ite m a te ria ls a m ine s, a m id e s Inte rc a la te fo rm US % p o lym e r- g ra d e c lay : US Cla y Clay Intercalate Exfoliate Intercalate Amcol Coupling Agent.

7 ,,,. grade Melt Process 1990, , US ( , ). Layer Layer 1975 Bayer

8 Fine Powder Grace. US Modified Silica. US US , US Polyamide.

9 3-5. Polyamide JP UBE, T oy ot a P oly am ide + lay ered silicat e M otor, as impact im prov er T oy ota CRL JP UBE, T oy ot a M otor, T oy ota CRL P oly am ide P oly am ide M on om er sw elling lay ered silicate JP UBE, T oy ot a M otor, T oy ota CRL P oly am ide + lay ered silicat e JP UBE, T oy ot a M otor, P oly am ide + lay ered silicat e T oy ota CRL JP UBE, T oy ot a M otor, P oly am ide P oly am ide M on om er T oy ota CRL sw elling lay ered silicate JP T oray Lay ered silicate poly am ide fiber JP SH OW A DENKO " " JP JP JP JP UNIT IKA A sahi Ch em A sahi Ch em A sahi Ch em Lay ered silicat e P oly am ide Resin Lay ered silicate P oly am ide Resin Lay ered silicate P oly am ide Resin Lay ered silicate m elt - mix in g JP A sahi Ch em P oly am ide Resin Lay ered silicate JP UNIT IKA P oly am ide Resin Lay ered silicate 1988 (Kabushiki Kaisha T oyota Chou Kenkyusho),, UBE Polyamide- Clay Polyamide Clay 1995 (Kabushiki Kaisha T oyota Chou Kenkyusho) Polyamide

10 . Unitika, T oray, Asahi, Kanegafuchi, Mistubishi Polyamide Polayamide Polyester Modifictaion Clay..

11 3-6. P OLY M E R P oly carbon at e JP , JP (Mistubishi Chem ) P oly olefine P OLYE ST ER JP (T oy ota CRL ) JP (Show a Denko ) US (1997 : E stm an Kodak ) JP (Mistubishi Ch em ) JP (UNIT IKA ) JP (T oy obo) US ( 1998 :Eastm an Ch em ) US ( 1995 : GEneral Electric) P oly acet al JP (P OLYPLA ST IC) P oly arly en e Sulfide JP (T osho Corp ) PMMA JP (T oy ota CRL ) F lu oro P olym er US (1997: Xerox ) T herm osetting resin JP (T oy ota CRL ) EP OXY US ( 1997: Michigan Stat e Univ ersity ) US ( Cornell Research F oundation In c ) T PE US ( Ex x on :) * : ( ) Polyester. Epoxy.

12 3-7. Polyamide Nanocomposite JP Kan eg afu chi Chem JP Kunim e Kogy o kk JP Mit subishi Chem P oly carbon at e PET + lay ered silicate Resin S w ellable lay ered silicat e PP PET + lay ered silicate JP Mit subishi Chem PP E lay ered silicat e JP Mit subishi Chem P oly carbon at e CO_OP Chem lay ered silicate JP Mit subishi Chem P oly est er CO_OP Chem lay ered silicate JP T osh o Corp P oly arly en e Sulfide PMMA JP T oy ota CRL lay ered silicate + M onom er JP T oy ota CRL T herm osetting resin lay ered silicate JP Kan eg afu chi T herm oplastic resin lay ered silicate Compoundin g JP T oy ota CRL poly olefin clay m elt kn eadin g Kaneg afu chi, Kunim e Kogyo, Mit subishi Chem, CO_OP Chem T oyot a CRL Nanocomposite, Modified Silica 1993 ( ) T osho CO_OP Chemical, Sow a Denko 1999, Composite. Composite System Show a Denko, Kanegafuchi Clay Modification, Mistubishi Chemical Filler Co- Op Chemical, T oyota

13 , ( ) (,, ) / ( ).

14 / /

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1. ํ™”์„ฌ์‚ฐ์—…์˜ ๊ฐœ์š” 1.1 ํ™”์„ฌ์‚ฐ์—…์˜ ๋ฅต์„ฑ ํ™” ์„ฌ์‚ฐ ์—… ์˜ ์‚ฐ ์—… ์  ํŠน ์„ฑ ํ™”์„ฌ์‚ฐ์—…์€ ์›์‚ฌ,์›๋ฉด ๋‘ฅ ๊ธฐ์ดˆ์†Œ์žฌ๋ฅผ ์ƒ์‚ฐํ•˜๋Š” ์„ฌ์œ ์‚ฐ ์—…์˜ ํ•ต์‹ฌ์‚ฐ์—…์œผ๋กœ ๊ณ ์šฉ์ฐฝ์ถœํšจ๊ณผ์™€ ๊ณ ๋ถ€๊ฐ€๊ฐ€์น˜๋ฅผ ์‹คํ˜„ํ•  ์ˆ˜ ์žˆ์Œ O ์„ธ๊ณ„์ ์œผ๋กœ ๋…์ผ,์ดํƒœ๋ฆฌ,์ผ๋ณธ ๋“ฑ ์„ ์ง„๊ตญ์„ ์ค‘์‹ฌ์œผ๋กœ M E(๋งˆ์ดํฌ๋กœ ์ผ๋ ‰ํŠธ

1. ํ™”์„ฌ์‚ฐ์—…์˜ ๊ฐœ์š” 1.1 ํ™”์„ฌ์‚ฐ์—…์˜ ๋ฅต์„ฑ ํ™” ์„ฌ์‚ฐ ์—… ์˜ ์‚ฐ ์—… ์  ํŠน ์„ฑ ํ™”์„ฌ์‚ฐ์—…์€ ์›์‚ฌ,์›๋ฉด ๋‘ฅ ๊ธฐ์ดˆ์†Œ์žฌ๋ฅผ ์ƒ์‚ฐํ•˜๋Š” ์„ฌ์œ ์‚ฐ ์—…์˜ ํ•ต์‹ฌ์‚ฐ์—…์œผ๋กœ ๊ณ ์šฉ์ฐฝ์ถœํšจ๊ณผ์™€ ๊ณ ๋ถ€๊ฐ€๊ฐ€์น˜๋ฅผ ์‹คํ˜„ํ•  ์ˆ˜ ์žˆ์Œ O ์„ธ๊ณ„์ ์œผ๋กœ ๋…์ผ,์ดํƒœ๋ฆฌ,์ผ๋ณธ ๋“ฑ ์„ ์ง„๊ตญ์„ ์ค‘์‹ฌ์œผ๋กœ M E(๋งˆ์ดํฌ๋กœ ์ผ๋ ‰ํŠธ ํ™”์„ฌ์‚ฐ์—…์˜ ๊ฒฝ์Ÿ๋ ฅ ๋ถ„์„ ๋‚€r ไธ‰, ์ƒŒ. 1. ํ™”์„ฌ์‚ฐ์—…์˜ ๊ฐœ์š” 1.1 ํ™”์„ฌ์‚ฐ์—…์˜ ๋ฅต์„ฑ ํ™” ์„ฌ์‚ฐ ์—… ์˜ ์‚ฐ ์—… ์  ํŠน ์„ฑ ํ™”์„ฌ์‚ฐ์—…์€ ์›์‚ฌ,์›๋ฉด ๋‘ฅ ๊ธฐ์ดˆ์†Œ์žฌ๋ฅผ ์ƒ์‚ฐํ•˜๋Š” ์„ฌ์œ ์‚ฐ ์—…์˜ ํ•ต์‹ฌ์‚ฐ์—…์œผ๋กœ ๊ณ ์šฉ์ฐฝ์ถœํšจ๊ณผ์™€ ๊ณ ๋ถ€๊ฐ€๊ฐ€์น˜๋ฅผ ์‹คํ˜„ํ•  ์ˆ˜ ์žˆ์Œ O ์„ธ๊ณ„์ ์œผ๋กœ ๋…์ผ,์ดํƒœ๋ฆฌ,์ผ๋ณธ ๋“ฑ ์„ ์ง„๊ตญ์„ ์ค‘์‹ฌ์œผ๋กœ M E(๋งˆ์ดํฌ๋กœ ์ผ๋ ‰ํŠธ ๋กœ๋‹‰์Šค)๋“ฑ ์ฒจ๋‹จ๊ธฐ์ˆ ์˜ ์ ‘๋ชฉ์œผ๋กœ ์ข…๋ž˜ ๋…ธ๋™ ์ค‘์‹ฌ์—์„œ ๊ธฐ์ˆ 

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