5. 5-1. 90 94 95,. T OYOT A CRC 1, AMCOL INT ERNAT IONAL, UBE, MIT SUBISHI CHEM. ASAHI KASEI 5 68%. 3-34.
3-35. 5-2. 90, 90, 97. 6. 3-36.
5-3. Clay.., AMCOL. 3-37. 5-3- 1..
3-38. Amcol, Allied signal Inc, Michig an State University, Claytec, Inc., Cornell Research F oundation, Inc., T oyot a Chuo Kenkyusho, Show a Denko K.K., Southern Clay Products, Amcol 1 2 Nano Composite Clay Amcol. Amcol T oyota License Clay Modification. Cornell Research, Michigan Epoxy - Clay System Polymer - Clay.
3-3. Modified Silicate US5514734 1995-07- 10 P olym er US5530052 1995-04- 03 Allied signal in c. 1) h et eroarom atic cation 2) ring Gen eral + Electric heteroat om company Lay ered m in eral Alkyl am m onium salt US5554670 1994-09- 12 Lay ered silicat e epoxy 4 A mm onium slat PP G, DEG, Clay Corn ell Research F n dation, inc. US5634969 1995-11- 03 h exylen e Gly col Rh eox, Inc. US5707439 1995-12- 18 Lay ered m in erals and com position s com prisin g the sam e US5780376 1997-02- 20 Org anoclay com position so US5824226 1997-02- 03 Silan e- m odified clay 15% v olatile m att er, porosity 0.3m l/ g caly silane Gen eral Electric S outhern Clay Produ ct s, In c. Loy ola Univ er sity of Chicago Clay, Clay Amcol.
3-4. Amcol Clay Modification Inte rc a la te s a nd exfo lia te s fo rm : o ligo m e r p o lym e r o lig o m e rs p o lym e r 2 ~ 15 %, la ye r 10 exfo lia te d laye re d m a te ria l 0.0 5% ~ 4 0 % c o m p o s ite Inte rc a la te s : s o lve nt(10 ~ 99.5 %) s o lve nt Po lym e r (a ro m a tic ring, c a rb o nyl, hyd roxyl, a m ine, a m id e ) s o lve nt o lig o m e rs p o lym e rs (p o lym e r 16 % ~ 100 %) Inte rc a la te s a nd exfo lia te s fo rm : 10 Inte rc a la te s exfo lia te s fo rm : c a rb o nyl- functio na l (c a rb oxylic a nd p o lyc a rb oxylic a c id s ; a ld e hyd e s ; keto ne s ) s p a c ing 5 o lig o m e rs p o lym e r Inte rc a la te s a nd exfo lia te s fo rm ; 80 % 5 la ye r US 5 5524 69 1996-09- 0 3 US 5698 624 199 7-12- 16 US 5 72 1306 1998-02- 24 US 5 760 12 1 1998-06- 0 2 US 5804 6 13 1998-09- 0 8 US 583 7 763 1998-11- 1 7 Inte rc a la te s a nd exfo lia te s fo rm m o no m e rs, o lig o m e rs, p o lym e rs (no n- EVOH) Inte rc a la te s a nd exfo lia te s fo rm US 5844 032 1998-12- 0 1 ( 5 ) EVOH (0.0 5 wt% ~ 60 Wt%) N- a lke nyl a m id e, Allylic m o no m e r o lig o m e rs c o p o lym e rs 2 % 10 US 584 9 830 1998-12- 1 5 Inte rc a la te s a nd exfo lia te s fo rm, c o m p o s ite m a te ria ls a m ine s, a m id e s Inte rc a la te fo rm US 5880 19 7 1999-03- 0 9 5 5 % p o lym e r- g ra d e c lay : US6 0 50 509 2 000-04 - 18 Cla y Clay Intercalate Exfoliate Intercalate Amcol Coupling Agent.
,,,. grade Melt Process 1990, 1990. 5-3- 2.,. 3-39. 1970 1975. US 4739007( 62-74957, 1985.9.30). Layer Layer 1975 Bayer
Fine Powder Grace. US 4176090 Modified Silica. US 4810734 US 5164460, US 5206284. Polyamide.
3-5. Polyamide JP 1990-29457 UBE, T oy ot a P oly am ide + lay ered silicat e M otor, as impact im prov er T oy ota CRL JP 1990-305828 UBE, T oy ot a M otor, T oy ota CRL P oly am ide P oly am ide M on om er sw elling lay ered silicate JP 1990-208358 UBE, T oy ot a M otor, T oy ota CRL P oly am ide + lay ered silicat e JP 1990-10226 UBE, T oy ot a M otor, P oly am ide + lay ered silicat e T oy ota CRL JP 1991-081364 UBE, T oy ot a M otor, P oly am ide P oly am ide M on om er T oy ota CRL sw elling lay ered silicate JP 1992-209844 T oray Lay ered silicate poly am ide fiber JP 1995-242817 SH OW A DENKO " " JP 1996-169950 JP 1998-298426 JP 1999-217497 JP 1999-209606 UNIT IKA A sahi Ch em A sahi Ch em A sahi Ch em Lay ered silicat e P oly am ide Resin Lay ered silicate P oly am ide Resin Lay ered silicate P oly am ide Resin Lay ered silicate m elt - mix in g JP 1999-199770 A sahi Ch em P oly am ide Resin Lay ered silicate JP 1999-172100 UNIT IKA P oly am ide Resin Lay ered silicate 1988 (Kabushiki Kaisha T oyota Chou Kenkyusho),, UBE Polyamide- Clay Polyamide Clay 1995 (Kabushiki Kaisha T oyota Chou Kenkyusho) Polyamide
. Unitika, T oray, Asahi, Kanegafuchi, Mistubishi Polyamide. 1990 Polayamide Polyester Modifictaion Clay..
3-6. P OLY M E R P oly carbon at e JP 1995-228762, JP 1998-60160 (Mistubishi Chem ) P oly olefine P OLYE ST ER JP 1998-182892 (T oy ota CRL ) JP 1998-30039 (Show a Denko ) US5955190(1997 : E stm an Kodak ) JP 1995-166036 (Mistubishi Ch em ) JP 1999-130951 (UNIT IKA ) JP 1999-246748 (T oy obo) US 6034163 ( 1998 :Eastm an Ch em ) US 5773502 ( 1995 : GEneral Electric) P oly acet al JP 1999-246736 (P OLYPLA ST IC) P oly arly en e Sulfide JP 1993-194851 (T osho Corp ) PMMA JP 1999-71465 (T oy ota CRL ) F lu oro P olym er US 5840796 (1997: Xerox ) T herm osetting resin JP 1998-259016 (T oy ota CRL ) EP OXY US5801216 ( 1997: Michigan Stat e Univ ersity ) US5554670 ( Cornell Research F oundation In c ) T PE US 5652284 ( Ex x on :) * : ( ) Polyester. Epoxy.
3-7. Polyamide Nanocomposite JP 1997-143359 Kan eg afu chi Chem JP 1996-333475 Kunim e Kogy o kk JP 1996-199048 Mit subishi Chem P oly carbon at e PET + lay ered silicate Resin S w ellable lay ered silicat e PP PET + lay ered silicate JP 1995-151165 Mit subishi Chem PP E lay ered silicat e JP 1995-228762 Mit subishi Chem P oly carbon at e CO_OP Chem lay ered silicate JP 1995-166036 Mit subishi Chem P oly est er CO_OP Chem lay ered silicate JP 1993-194851 T osh o Corp P oly arly en e Sulfide PMMA JP 1999-71465 T oy ota CRL lay ered silicate + M onom er JP 1998-330535 T oy ota CRL T herm osetting resin lay ered silicate JP 1998-259016 Kan eg afu chi T herm oplastic resin lay ered silicate Compoundin g JP 1998-182892 T oy ota CRL poly olefin clay m elt kn eadin g Kaneg afu chi, Kunim e Kogyo, Mit subishi Chem, CO_OP Chem T oyot a CRL Nanocomposite, Modified Silica 1993 ( ) T osho CO_OP Chemical, Sow a Denko 1999, Composite. Composite System Show a Denko, Kanegafuchi Clay Modification, Mistubishi Chemical Filler Co- Op Chemical, T oyota
. 5-3- 3..,. 1997 ( ) (,, ). 1998. 2000 / ( 10-2000- 3711).
3-8. 10-2000- 3711 / 10-2000- 16466 / 10-2000- 18215 10-2000- 37082-10- 2000-7007572 10-2000- 7007573 10-2000- 40961-10- 2000-7008904 - 10-2000- 48493 10-2000- 52689 10-2000- 7010179 10-2000- 58276 10-2000- 7011613