레이저미세가공서비스
Business Area 레이저미세가공서비스범위 ( 주 ) 코썸사이언스레이저미세가공서비스 10 년이상축적된독자적이고전문화된레이저응용기술을보유하고있어다양한 application 제공. 샘플의 thermal expansion 극소화로최대의가공정밀도와정확한테스트결과제공. Small volume Order Mass production Laser Micro-Machining 레이저미세가공 R&D (Out Sourcing) 다양한파장의 Laser (CO 2, Nd-YAG, Fiber) 장비를보유하고있어 polymer, thin-film, ceramic, metal, glass 등여러가지소재의가공가능. Feasibility test Customized Order Mass production 기업이나기관에서표준화된제품또는시리즈제품에필요한레이저미세가공공정을의뢰받아당사보유레이저로지속적이고장기적인가공서비스제공 R&D Test (Feasibility Test) 초미세레이저장비의도입을검토중인기업또는레이저를이용한가공공정이필요한기업이나기관의의뢰로테스트진행하여적합한 solution 제공 Customized Order 레이저를이용한가공에어려움을겪고있는고객들의다양한가공의뢰에대해당사가보유한가공기술을최적의요구조건에맞추어제공하는 1:1 맞춤형서비스 Small volume Order 레이저가공의뢰에있어소량이고단기적인샘플시범테스트을의뢰하는대학, 기업등기타연구소에대해당사의풍부하고전문화된기술을제공 Laser Processing Development - Advanced Laser Technology
Service Process 서비스진행절차 Customer 1. 가공의뢰 기술상담 2. 가공결과중간점검 3. 비용결제 연구기관 1. 견적서송부 2. 가공물 ( 샘플 ) 수령 3. 초기가공 중간보고 4. 최종가공 결과물송부 5. 비용청구 ( 주 ) 코썸사이언스 기업 Customer 대학 Sample test procedures 레이저응용기술연구소 축적된데이타 Optimized Solutions Tested Sample (Output)
Key Applications 레이저미세가공응용범위 ITO / FTO Scribing Marking & Engraving Film (Polymer 계열 ) Transparent materials such as Glass, Quartz, Sapphire, Fused Silica(CaF 2, MgF 2 ) ITO/PI, ITO/PET, ZnO/PI, ZnO/PET Materials Solar Cell Wafer Thin Film Polymer Flex Circuits Hydrogel Kapton Natural Materials Silicon Quartz Sapphire Silica Paper/Cardboard Wood Mica Glass Aerogel Fused Silica Ceramics Alumina Aluminum Nitride (ALN) Black Ceramic Ferrite Green Ceramic LTCC / HTCC Piezo Ceramic Yttria Stabilized Zirconia Thin Metals / Foils Aluminum Foil Brass Foil Copper Foil Gold Foil Molybdenum Nickel Foil Titanium Foil Metals Bronze Cobalt Cold Rolled Steel Germanium Hardened Steel Hot Rolled Steel Mild Steel Molybdenum Silver Stainless Steel Steel Tantalum Tungsten Plastics Acrylic Lexan Lucite Polycarbonate Styrene Laminates Expoxies Duroid Flex Circuits Garrolite Conductive Epoxy Epoxy Preforms Frozen Epoxy Alloys Kovar Mild Steel Molybenum Nitinol Stainless Steel Steel Superalloys Tantalum Zircaloy Adhesives - Advanced Laser Technology
Polymer 1064nm Pulse energy: Rep rate: 40kHz (on the PI film) Scribing of IMI film on Glass Film Release FTO (FTO on glass) 1060nm FTO (on the PI film) 1080nm PET Film PET Film FTO Release (FTO on glass) Polyimide Film Polyimide Film ITO Scribing (Including Ag) Thickness: 2.8mm Polaroid Film ITO Scribing (Ag Including) PET Film 10.6 μm PET Easy Cut ITO (on the PET film)
Polymer Acrylic Resin 10.6 μm Thickness: 5mm PI Film ITO 1,080nm (PICO Laser) PMMA 10.6 μm Ag Film Punching (Ag & Polymer Film) 10.6 μm PI Film FTO Scribing Polymer Deposition Thin-film ITO Scribing 1,080nm
Wafer (Ceramics) Scribing of Ceramic 1080nm Solar cell Wafer Edge isolation Wavelength : Solar Cell Wafer Doping Wafer Doping Wavelength : Ceramic Film LED CELL of Si-Wafer 1064nm Pulse energy: Rep rate: 10kHz Si Wafer Pattern Si Wafer Round Thickness: 520 μm Removal of TCO on CIGS + Mo Glass 1064nm Edge Isolation of Si Solarcell 1064nm Pulse energy: Rep rate: 500kHz Removal of CIGS on Mo+Glass 1064nm Pulse energy: Rep rate: 500kHz Silicone Sheet AIN Wafer Hole Si Wafer Pattern Si Wafer Wavelength : Si Wafer Align Key Marking Ceramic Hole 10.6 μm
Wafer (Ceramics) Patterned Si-Wafer (Membrane Pattern) Si Wafer Full ARC Ablation (Anti-Reflective Coating) LGBC Scribing (Laser Grooved Buried Contracts) Green Sheet Scribing (Unfired Ceramic Sheet) Si Wafer Ceramic (Ni Oxide + YSZ) 1064nm Ceramic (Ni Oxide + YSZ) 1064nm Si Wafer Round Si Wafer Hatching Si Wafer Full (Cross-Section) Thickness: 0.3mm Si Wafer (Membrane Pattern) Fired Ceramic Sheet (Via Hole) Si Wafer Si Wafer Scribing (Scanner Type)
Metal Via Hole Metal on PET 10.6μm SUS Thin Film Ferrite Compound (Cross-Section) Thickness: 150μm Metal Hole Cu Thin Film Tungsten-Carbide (Via Hole) Wafer Doping Wavelength : Tungsten-Carbide & Nickel Complex (Via Hole) Tantalum (Ta) Mg Surface Cu Wafer Gold Thin Film (Inner PDMA Film) Scribing of ZnO on glass Aluminium Oxide Wafer Mo Scribing (Solar Cell Thin Film) Mo (Molybdenum) Thin Film Removing of ZnO on Glass Rep rate: 30kHz
Metal SUS Scribing Invar Steel (Fe-NI) Scribing SUS420J2 Scribing Cathode/Anode Electrode (Copper & Aluminium) Thickness: 25μm Pure Mg (Magnesium) Ag Coated GdBCO on STS (Cross-Section) Au Pad Full Scribing Copper Foil Hole Back Electrode Film Ablation (ZnO on the Glass) Ag Nano Wire Thin-film Scribing 1064nm Cu Thickness: 0.1mm SUS Thickness: 0.1mm Alumina Tube 10.6μm Metal Film SUS304 Hole Aluminium Through Line Metal Oxide Film Ablation Si Wafer Metal Layer Ablation
Transparent Materials & Etc. Graphite Scribing of Glass Rep rate: 30kHz on the Aluminium Wavelength : Artificial Diamond Glass Quartz Quartz Micro-Hole (Cross-Section) Epoxy Resin 10.6μm Sapphire Micro- Hole Thickness: 420μm Superconductor GdBCO Thin Film Scribing (Cross-Section) Soda-Lime Glass Hole Scribing (Via Hole) Wavelength : Superconductor GdBCO Thin Film (Through Hole) Quartz Scribing 10.6μm Flexible Gorilla Glass Slide Glass Graphene Carbon Disk (100% Carbon) Quartz Hole (Via Hole)
Transparent Materials & Etc. Sapphire Wafer (Cross-Section) Gold/Pt/CVD Diamond Pattern Scribing (Using Edge Alignment) Glass Full Thickness: 0.5T PMN-PT (Piezoelectric Element) Glass Microwire Quartz Thin Film Sapphire Wafer Scribing Quartz Wafer 10.6μm Thickness: 500μm OLED Light Hole Thickness: 0.88mm Quartz Wafer Round 10.6μm Thickness: 680μm Glass Channel (Lab-on-a-chip) Transparent Electrode Scribing Thickness: 0.71mm Glass Full
Laser Micro-Machining System 레이저미세가공시스템 Nd-YAG (DPSS) LASER - / / 1064nm CO2 LASER - 10.6 μm / 9.35 μm / 9.4 μm FIBER LASER - 1080nm EXCIMER LASER - 193nm / 248nm
http://www.kortherm.co.kr ( 주 ) 코썸사이언스는다양한파장의레이저를보유하고있습니다. 문의주시면다양한응용분야에맞는샘플테스트를실비로이용가능합니다. We have wide range of selection for laser and we can provide the complete sample test work 레이저미세가공 corresponding 서비스 to required applications.. 주 ( 주 ) 코썸사이언스 소 : 인천광역시부평구청천동 425 우림라이온스밸리 C 동 1203B 호 phone : 032) 623-6320~4 fax : 032) 623-6325 e-mail : sales1@kortherm.co.kr 032) 623-6326~7 info2@kortherm.co.kr