목차 품질의역사...2 공장위치및제공서비스...3 테스트에대한로드맵...4 우리의역량...7 테스트비용을절감하기위한노력...8 시장별로차별화된테스트...9 그외테스트서비스및공정소개 앰코는여러시장에분포된다양한제품들의테스트가가능합니다. 1 앰코테스트서비스 amk

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1 품질지원과고객만족을위한앰코의테스트서비스 앰코테스트서비스

2 목차 품질의역사...2 공장위치및제공서비스...3 테스트에대한로드맵...4 우리의역량...7 테스트비용을절감하기위한노력...8 시장별로차별화된테스트...9 그외테스트서비스및공정소개 앰코는여러시장에분포된다양한제품들의테스트가가능합니다. 1 앰코테스트서비스 amkor.com

자동차반도체조립및테스트분야 1 위기업 앰코는반도체제품테스트에있어서광범위한테스트역량과풍부한경험을보유하고있습니다.

3 품질의역사 수십년간 Tier 1 고객들및첨단업계의선두주자들을지원해오면서축적된지식을바탕으로, 앰코의테스트솔루션은첨단기술, 품질, 성능및테스트비용등에대해서도다뤄야함을잘알고있습니다. 앰코는각고객의제품초기단계부터협업함으로써, 고객들이테스트전략을잘수립하고장비선택을현명하게결정하도록도움을주어차별화된테스트솔루션을제공합니다. WHO IS AMKOR 앰코는 Wafer level & Package Assembly 와더불어종합적인테스트서비스도제공합니다. 자동차반도체조립및테스트분야 1 위기업 앰코는반도체제품테스트에있어서광범위한테스트역량과풍부한경험을보유하고있습니다. Markets Automotive & Industrial, Communications, Networking, Computing and Consumer Applications Analog/Mixed Signal, Digital, Imaging, Memory, Power/Discrete, PMIC, RF, Sensors & Actuators and SoC(s) Advanced Packages 2.5/3D, Cavity MEMS, fine pitch Cu pillar, MCM (Multi-Chip Module), advanced SiP, SWIFT, WLCSP, WLFO 앰코테스트서비스 amkor.com 2

4 정확하고완벽한테스트서비스 Wafer probe, final test, strip test, film frame test, system level test, post-saw test, opens/shorts test, burn-in and complete end-of-line. 24/7 완전한네트워크가갖춰진테스트라인에서의작업 고객의제품수명전반에걸친광범위한테스트컨설팅, 개발및엔지니어링서비스 IN 2016 WE TESTED >7 BILLION UNITS USING >2,500 TESTERS 앰코의생산공장들은 주요 FAB 업체와고객사가까이있어 Wafer probe, Bump/WLCSP 및 Assembly 와테스트서비스를두루지원합니다. Co-location benefits include: FAST feedback STREAMLINED logistics and SHORTER cycle times 위치및서비스 중국상하이 Wafer probe/package test, Film frame test, System level test 통신, 메모리 Bumping, FC, CSP, MLF, PBGA 93K, UFLEX, FLEX, J750, Magnum, T5XXX 테스트개발 대한민국 Wafer probe/package test, Film frame test, System level test 자동차, 컨슈머, 통신 Bumping, FC, CSP, MLF, TSV, TMV, TQFP 93K, UFLEX, FLEX, J750, T55XX, T2K 테스트개발 일본 (J-DEVICES) Wafer probe/package test 자동차, 컨슈머, 메모리 FC, PBGA, QFN 93K, UFLEX, FLEX, J750, T2K, Magnum, T65XX 테스트개발 포르투갈 Wafer probe 통신, 메모리경험, RF WLFO UFLEX RF, Rack & Stack, T5XXX 테스트개발 대만 Wafer probe/package test, Film frame test 통신, 게임, PC Bumping, FC, WLCSP 93K, UFLEX, FLEX, J750, T2K, ETS, LTX, T6XXX, STS 말레이시아 Package test Power, Discrete TO-220FP, SO8-FL, TSON8-FL, SONXXX-FL TESEC, CATS, ITS, Tsuruga 필리핀 Wafer probe/package test, Film frame test, System level test, MEMS test 자동차, 컨슈머, 메모리 MLF, Leadframe, QFP, Burn-in 93K, FLEX, J750, T2K, Magnum, ETS, LTX, D10, ASLX 테스트개발 3 앰코테스트서비스 amkor.com

5 테스트로드맵 앰코는광범위한장비를보유하고있으며최신디바이스를테스트하는데필요한새로운장비에지속적으로투자합니다. 주요테스터, 프로버및핸들러는다음과같습니다. TESTERS MATURE MAINSTREAM QUALIFICATION MIXED SIGNAL PS400/800, T657X, I-FLEX, J750, Catalyst, SX-37XX PS1600, T2000, UFLEX, Diamond Chroma 3650 APPLICATION POWER ANALOG RF ETS88/364, J750, ASLX, EVA100 I-FLEX RF, Catalyst RF, PAX, NI-STS PS1600, T2000 IPS, UFLEX, J750EX/HD PS1600 (PS-RF), UFLEX, (UW-12G/24G) ETS800 PS1600 (WS-RF), PAX-II MEMORY T537X, T558X, Magnum 1, Magnum 2, Magnum 2x T5503/HS, T5832/33, T5851, Magnum V (VU) CIS IP750 T2000 ISS ETS800 앰코테스트서비스 amkor.com 4

6 TESTERS FOR NAND Advantest Tester Model Name/Spec. Teradyne Data Transfer Rate (bps) 8G 5G 4G 3G 2G 1G 800M 500M 400M 300M 200M 100M 11.6 Gbps (UFS 2.0 G4) PCIe Gen3 5.8 Gbps (UFS 2.0 G3) PCIe Gen2 2.9 Gbps (UFS) 1.6 Gbps 1.33 Gbps (Toggle 4.0) 800 Mbps (Toggle 3.0) 533 Mbps (Toggle 2.0) 400 Mbps (Toggle 2.0) 200 Mbps 133 Mbps (Toggle 1.0) T537X (286 Mbps) T5588 (800 Mbps) Magnum 2x (800 Mbps) MAGNUM VU Magnum V (1.6 Gbps) T5833 (2.4 Gbps) T5851 PROBER MATURE MAINSTREAM QUALIFICATION 300 MM WAFER PROBE >±1.5 µm *P12XL *PRECIO-XL *UF3000 *OPUS3 ±1.5 µm <±1.0 µm *UF3000EXe *PRECIO-NANO *UF3000EX *OPUS3-SP *OPUS5 APPLICATION 200 MM WAFER PROBE >±4.0 µm P8XL UF200 ±2.0 µm PRECIO-OCTO FILM FRAME PROBE >±2.0 µm <±2.0 µm FP200A **WDF12DP/+ **FP3000 FD12 *Tri-Temp option, **Tri-Temp option for FFP 5 앰코테스트서비스 amkor.com

7 HANDLERS MATURE MAINSTREAM QUALIFICATION PICK & PLACE >4 SITES <8 SITES >16 SITES <32 SITES *MT9510 *CASTLE NS70xx **NS80xx TW152 **HT9045 **HT9046 ***ECLIPSE ***M4871(GS1) TW153 HT9046LS *MATRIX *NX1032XS ***HT1028C *NX1016MT **TW153V TURRET BOWL BOWL FILM FRAME NX16/32 XD248 NY20 FT2018 NY32W PM38 GRAVITY <4 SITES >8 SITES *SO1000 *SO8000 *SO2000 *ZEUS APPLICATION MEMORY <128 SITES <256 SITES >512 SITES HT3309 M6771 M6300 TW350HT M6242 M6243 STRIP/ FILM FRAME STRIP FILM FRAME X384 SITES, STRIP FILM FRAME *InStrip HT3323A FH1200 SH5000 SH3000 SO3000 *Jaguar SLT HT3016 (x12) Chroma 3260 (x6) SENSOR/ ACTUATOR CUSTOM PM35 (x8) microphone NX32 (x8) microphone XD248 (x4) e-compass NX16 (x1) Hall sensor PM35 (x8) humidity/temp TOTAL SOLUTION InStrip Accel/Gyro OSAI (x140) Pressure *Tri-Temp, **Active Thermal Control (ATC), ***Both 앰코테스트서비스 amkor.com 6

우리의역량 웨이퍼공정, 고급범프, 웨이퍼프로브, 어셈블리, 파이널테스트, 시스템레벨테스트,

years experience spanning 4-12 (300 mm) wafers at 14 nm and

(>100A) Multiple probe card technologies: cantileve r (<1

GHz), MEMS and dual-level CoW Many topologies: Al pad, fine

x 25 µm 2 pads/bumps Prober capabilities: alignment to <±1 µm

Cantilever Cu Pillar Bump Membrane MEMS CSP nl Pogo Pin FINAL

Services Singulated up to x16/x32 parallelism Massively

MLF film frame InCarrier System Level Synchronous &

(Shikino Hightech) SoC (STK) Memory (STK, JEC, AEHR) Small

8 우리의역량 웨이퍼공정, 고급범프, 웨이퍼프로브, 어셈블리, 파이널테스트, 시스템레벨테스트, 번인및후공정서비스를포함한턴키솔루션을제공하므로앰코와파트너관계를맺게되면많은이점이있습니다 WAFER PROBE 25 years experience spanning 4-12 (300 mm) wafers at 14 nm and below Logic, Mixed Signal, Analog and RF including high power (>100A) Multiple probe card technologies: cantileve r (<1 GHz), vertical (up to 40,000 probes), pogo, membrane (>4 GHz), MEMS and dual-level CoW Many topologies: Al pad, fine pitch Cu pillar WLCSP, bump and film frame 40 µm pitch and 25 x 25 µm 2 pads/bumps Prober capabilities: alignment to <±1 µm and -55 C to +200 C temperature range PROBE TECHNOLOGY Cantilever Cu Pillar Bump Membrane MEMS CSP nl Pogo Pin FINAL TEST BURN-IN Automatic Test Equipment (ATE) Development Services Singulated up to x16/x32 parallelism Massively parallel NAND Strip, massively parallel Leadframe (x308) Saw MLF film frame InCarrier System Level Synchronous & asynchronous Automotive (MCC) Analog (Shikino Hightech) MCU (Shikino Hightech) SoC (STK) Memory (STK, JEC, AEHR) Small MLF strip (x960) NAND Specialized Solutions SiP using distributed test flows 2.5/3D in-situ 7 앰코테스트서비스 amkor.com

9 테스트비용을절감하기위한노력 테스트비용을줄이기위해앰코는다량의병렬스트립테스트와이에필요한소프트웨어및하드웨어개발서비스를제공합니다. MASSIVELY PARALLEL STRIP TEST 직렬 EEPROM, 마이크로컨트롤러, 전원관리및연산증폭기와같은, 테스트시간이길고수명주기가긴애플리케이션은스트립형식의병렬테스트가비용측면에서효율적입니다. 앰코의최고밀도리드프레임 (XDLF) 공정을활용함으로써한번의터치다운으로 300 개유닛까지높은병렬처리를달성하게됩니다. 조립형식 Std Leadframe Film Frame (FH1200) 패키지 TQFP up to 64 lead, 10 x 10 mm 2 SOIC (mil): N (150), W (300), Std (208) mil TSSOP up to 28 lead (3.0 and 4.4 mm body sizes) PDIP up to 8 lead LGA 12 x 12 mm 2 Saw MLF up to 7 x 7 mm 2 TEST DEVELOPMENT 몇몇고객들은테스트솔루션을자체적으로개발후, 생산을위해앰코로이관합니다. 앰코는고객과의공동개발혹은소프트웨어와하드웨어솔루션의전적인개발도진행할수있습니다. 이과정에서최대효과를얻고자하신다면제품설계의초기단계에서당사와협력하시는방법이가장좋지만, 제품수명주기후반부의제품이라도비용절감에효과적인장비로전환하거나더많은자재를동시에테스트하게함으로써상당한비용절감을하도록도와드립니다. 고객과협력하며앰코는다음을보장합니다. 획기적인원가절감첫수율을높일수있는앰코만의해결방안원스톱책임서비스앰코범프및어셈블리와의긴밀한관계 고객이신제품출시를원하든비용절감및생산성향상을원하든앰코는풀서비스테스트개발을제공하고기존의수많은테스터를활용합니다. 신규테스터의사용은마지막방법으로제안됩니다. InCarrier Saw MLF (including various sensors/actuators (MEMS)) 일반적인테스트개발사이클타임 Month 0 Month 1 Month 2 Month 3 Planning Proposal S.O.W. P.O. Development Socket Load Board Interface (3~4+ 주 ) PIB Probe Card (4~8+ 주 ) LEAD-TIME PER APPLICATION Logic/Mixed : 6~8주 Analog : 8~10주 RF/MEMS : 12~14 주 참고 : 개발리드타임은고객의테스트요구사항에따라달라질수있습니다. SW Development Production Definition Development Program Dev. (3~4+ 주 ) Debug (2~3+ 주 ) Corr/Qual. (1+ 주 ) Release HVM Deployment 앰코테스트서비스 amkor.com 8

10 시장별로차별화된테스트 자동차및산업 앰코는주요아시아, 미국및유럽공급망을지원하는, 자동차시장에서최고의 OSAT 입니다. 이분야의제품에는높은수준의성능이요구되는인포테인먼트와안전장치가포함됩니다. 이를위해서는훨씬더포괄적인테스트요구사항이필요합니다. 고품질, 표준을준수하는프로세스및시스템 추가검사및저온 / 상온 / 고온을지원하는멀티온도테스트기능 웨이퍼프로브 (-55 C to +200 C) 파이널테스트 (-55 C to 175 C) Burn-in 저온에서웨이퍼프로브테스트, 파이널테스트는상온및고온에서만수행 어셈블리후테스트공정으로출하하기전, 2/4 와이어켈빈연결을통해개방 / 단락테스트를시행하여파이널테스트를보완 현재솔루션 Large body SiP (Infotainment) using tri temperature System Level Test ABS & Electronic Control Unit (ECU) test (MLF, QFP) ADAS test (FCBGA) IoT (MCU, RF & sensors/actuators) Specialized test for electric vehicle components inverters, converters 개발 mmwave radar component test wafer & die-level Solutions for LIDAR AEC-Q100 grade zero compliant burn-in solutions 앰코는최고의자동차 OSAT 공급업체입니다. 9 앰코테스트서비스 amkor.com

통신 앰코의매출중 40% 이상이통신분야 ( 스마트폰, 태블릿및휴대기기 ) 에서창출됩니다. 당사의최첨단테스트솔루션은셀룰러및커넥티비티기술요구사항의급격한변화에발빠르게대응합니다. 앰코는이미 5G 무선과새로운테스트요구사항에잘대응하고있습니다. 주요고객및 ATE 공급업체와협력하여차세대 RF 테스트기능을구현할준비가되어있습니다.

11 통신 앰코의매출중 40% 이상이통신분야 ( 스마트폰, 태블릿및휴대기기 ) 에서창출됩니다. 당사의최첨단테스트솔루션은셀룰러및커넥티비티기술요구사항의급격한변화에발빠르게대응합니다. 앰코는이미 5G 무선과새로운테스트요구사항에잘대응하고있습니다. 주요고객및 ATE 공급업체와협력하여차세대 RF 테스트기능을구현할준비가되어있습니다. Leverage RF wafer probe capabilities known good die (KGD) for WLCSP and known tested die (KTD) for SiP Multi-site x8 RF test to lower cost Augment ATE coverage with SLT (protocol test) Address complex SiP with simple SLT SoC + memory PoP double side test/stack CSP memory and logic test Advanced ATE w/32 port and 6G Local RF shielding 60 dbm NI-STS for front end RF, SiP and IoT Asynchronous test for different RF connectivity standards 현재솔루션 Memory interface test through logic or modem die DRAM test at system level test and memory fuse blow through logic die Top/bottom socket with 0.3 & 0.35 mm pitch respectively LTE-A, WLAN, Bluetooth, GPS, Zigbee RF front end (Antenna, Switch, Filter, PA, LNA) Transceiver, connectivity (Bluetooth, Zigbee, WLAN), GPS RF MEMS, Passive On Glass (POG) Fine pitch TMV /MeP Mobile AP & BB PoP Mobile modem & memory stack CSP 앰코테스트서비스 amkor.com 10

12 네트워킹및컴퓨팅 앰코는 % 혹은그이상의가동시간이요구되는까다로운네트워킹및컴퓨팅시장을위한고성능테스트솔루션을제공하는선두업체입니다. 당사는 SiP, SoC 및구성부품을이시장들 ( 서버, 라우터, 스위치, PC, 랩탑및주변장치 ) 에공급하는여러고객을보유하고있습니다. 이러한시장들에는스토리지기술및하드디스크드라이브에서 SSD(Solid State Drive) 로의마이그레이션이필수적입니다. 또한, 앰코는다양한 NAND 테스트기능을갖추고있습니다 Distributed test (wafer probe, in-situ test between key assembly steps and final test (SLT and ATE) for 2.5D) Active thermal control for 300 watt products across tri-temperature in SLT and ATE test Probe solutions and wafer map management for chip on wafer (CoW) Dynamic burn-in Test during burn-in (TDBI) Film frame and strip test (x308 EEPROM) 현재솔루션 ᗮ ᗮ >2 TB bandwidth in package High performance >3 GHz DDR4 Memory interface test through logic die UFS Protocol system-level test PoP, MCP emmc (NAND + controller), MCP (SDRAM + NAND) MicroSD, SSD, UFS 메모리테스터로드맵 3200 LP /4266 T5371/2/5 Magnum 2x Magnum V T5832 Scalable Frequency (Mbps) LP /2133 SCM ~3200 Toggle 533/800/1.XG 800 emmc400/533/ 앰코테스트서비스 amkor.com

13 시장별로차별화된테스트 POWER/DISCRETES 앰코는빠른납기와비용절감을위해조립공정과밀접하게통합된테스트서비스를갖춘전력소자디바이스의세계적인선두업체입니다. 전력 / 소자제품에필요한특징은다음과같습니다. High current, high voltage Adequate thermal capacity Kelvin contact-type tests Low Rds_on 앰코의대량생산제품은다음과같습니다. Intelligent power modules Multi-voltage FETs Flip-chip MOSFETs Insulated-Gate Bipolar Transistors (IGBT) Diodes Regulators and bipolar transistors for the automotive, power transmission and industrial segments TEST EQUIPMENT OFFERINGS : COMPANY MODEL TEST ITEM Tesec 881-TT, 351-TT, 341-TT DC ERD CMS-100S8 Series Rg VS240AN, DTS-241 DC Hokuto AT-999 Series VDSX (SUS)/VCEX (SUS)/trr AM-083 trr/vsurge CATS DV-240 Series ΔVDS/ΔVBE Minekoon 615-SW Switching test (trr/i rr/t off/t on/i Latch) ITC ITC55100C UIS Shibasoku WL-22, WL-25 IC Power Tech QT-4100 Series DC QT101 Series UIS POWorld VC6700 Transient test HANDLERS Gravity Turret MANUFACTURER TESEC Ueno Seiki Sowa KES SRM 앰코테스트서비스 amkor.com 12

14 시장별로차별화된테스트 SENSORS & ACTUATORS (MEMS) 오늘날의인터넷용제품에는 MCU, RF 송신기 / 수신기, 센서및액추에이터가필요합니다. 테스트솔루션은물리적실제아날로그신호를전기데이터로변환하고제품이양호한지를판단하기위해데이터를처리해야합니다. TYPE Magnetometer Accelerometer Gyroscope Microphone Pressure Inertial Combos Optical RF Devices TEST APPLICATION 3-Axis, 0 to 10 gauss, 0.1 accuracy 3-Axis, Low-g, High-g, Strip test 3-Axis yaw rate, Gyroscope test Sound stimulus for both top-port/bottom/port 0 to 20 bar, Strip test, Bench characterization 6-10 Degrees of Freedom (DoF) Auto-focus, Microdisplay, Picoprojectors Timing devices, Switch/Varicaps, BFilters, Duplexers Emerging MEMS Energy harvesting, Microfluidics, Ultrasonic gesture recognition INERTIAL Magnetometer x4 3 Gauss, x Gauss, x256 앰코의개발및생산지속적인개발 Accelerometer x72 Up to 180 /sec, x144 Up to 90 /sec, x256 개발계획 Gyroscope x72 Accuracy <.5%, x144 <.1%, x256 6DOF, 9DOF RF Oscillator/Filter OPTIC IR/RGB/UV x72 x144 x256 x4/x8 x16 x32 Accuracy <.3%, x32 Accuracy <.1%, x64 ENVIRONMENT Microphone x8 SNR 70 db, THD 130 db, x35 SNR 73, THD 135 db. x64 Humidity/Temperature x2 Accuracy ±1 C, x144 Accuracy ±0.5 C, x256 Pressure x2 Stable time <1 sec, 20 bars, x96 <0.5 sec, 20 bars, x144 MICROFLUIDICS x2 x4/x8 4H 앰코테스트서비스 amkor.com

그외앰코테스트서비스및프로세스 FULL END-OF-LINE PROCESSING Bake Scan Pack Ship Finished good services ROBUST FACTORY AUTOMATION (CIM/CAM) 높은수준의품질및효율성 RFID 및하드웨어관리 테스트프로그램관리자동화 가동률관리 수율관리 데이터분석 리포트자동화 제조경험

15 그외앰코테스트서비스및프로세스 FULL END-OF-LINE PROCESSING Bake Scan Pack Ship Finished good services ROBUST FACTORY AUTOMATION (CIM/CAM) 높은수준의품질및효율성 RFID 및하드웨어관리 테스트프로그램관리자동화 가동률관리 수율관리 데이터분석 리포트자동화 제조경험 완전히자동화된생산환경 숙련된작업자와시스템에의한빠르고정확한운영 기술지원 고사양신제품에대한새로운솔루션 (PoP/TSV/fcCSP/FCBGA) 우수한품질의최첨단장비및신속한기술지원 보유한장비의범위 전체공정범위 : laser mark/fvi/ bake/tape & reel/dry-pack 릴팩킹및포장을위한다양한물품공급업체확보 EXTENSIVE FAILURE ANALYSIS Non-Destructive Analysis E/L Bench Test X-ray Scanning Acoustic Tomograph Destructive Analysis Decapsulation Grinder : X-section Microscope Field Emission Scanning Electron Microscope Die-Level Analysis Photo Emission and OBIRCH Thermal Emission GLOSSARY ABS : Anti-lock Braking System ADAS : Advanced Driver-Assistance Systems ATE : Automatic Test Equipment CoW : Chip on Wafer CSP : Chip Scale Packaging EEPROM : Electrically Erasable Programmable Read-Only Memory GPS : Global Positioning System LIDAR : Light Detection and Ranging LNA : Low Noise Amplifier MCP : Multi-Chip Packaging NAND : Non-volatile storage memory PMIC : Power Management Integrated Circuit SiP : System in Package SLT : System Level Test SoC : System on Chip UFS : Universal Flash Storage 앰코테스트서비스 amkor.com 14

16 앰코테크놀로지홈페이지에서당사위치와최신제품정보를볼수있습니다. 제품정보 : 문의및연락처 : ATKQnA@amkor.co.kr 본문서의모든콘텐츠는저작권법에따라무단복제및배포를금지하며, 제공된정보의정확성을보장하지는않습니다. 앰코는본문서의정보사용에따른특허나라이선스등과관련된어떠한형태의피해에대해서도책임을지지않습니다. 본문서는앰코의제품보증과관련하여표준판매약관에명시된것이상으로확대하거나변경하지않습니다. 앰코는사전고지없이수시로제품및제품정보를변경할수있습니다. 앰코의이름및로고는 Amkor Technology, Inc. 의등록상표입니다. 그외언급된모든상표는각해당회사의자산입니다 Amkor Technology, Incorporated. All Rights Reserved. BR702EKR 7/18

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