앰코는고객의기대를뛰어넘는고객의기대를넘어서는무결점서비스 앰코만의품질마인드로최고의제품과서비스를고객에게제공하여비즈니스경쟁력을증대시킵니다. QualityFIRST 비전 성공적인디자인, 제품개발과인증을추구한다. 무결점의제품과서비스를제공한다. 모든조직은완벽한무결점을실행한다. Qu

Transcription

1 PRODUCT Line Card Enabling the Future 반도체 패키징, 설계, 조립 및 테스트 서비스 분야의 세계 최대 공급업체 중 하나인 앰코는 차세대 제품을 현실로 만들어 줍니다. 어셈블리 설계 테스트 본 문서의 모든 콘텐츠는 저작권법에 따라 무단복제 및 배포를 금지하며, 제공된 정보의 정확성을 보장하지는 않습니다. 앰코는 본 문서의 정보사용에 따른 특허나 라이선스 등과 관련된 어떠한 형태의 피해에 대해서도 책임을 지지 않습니다. 본 문서는 앰코의 제품보증과 관련하여 표준판매약관에 명시된 것 이상으로 확대하거나 변경하지 않습니다. 앰코는 사전고지 없이 수시로 제품 및 제품정보를 변경할 수 있습니다. 앰코의 이름 및 로고는 Amkor Technology, Inc.의 등록상표입니다. 그 외 언급된 모든 상표는 각 해당 회사의 자산입니다. 2018, Amkor Technology Incorporated. All Rights Reserved. DS820C 5/ 년 6월 연락처 : ATKQnA@amkor.co.kr 제품정보 :

2 앰코는고객의기대를뛰어넘는고객의기대를넘어서는무결점서비스 앰코만의품질마인드로최고의제품과서비스를고객에게제공하여비즈니스경쟁력을증대시킵니다. QualityFIRST 비전 성공적인디자인, 제품개발과인증을추구한다. 무결점의제품과서비스를제공한다. 모든조직은완벽한무결점을실행한다. QualityFIRST 문화

3 목차 위치 Laminate 05...PBGA 05...CABGA 07...FCBGA frame 14...PDIP 14...PowerSOP SOT-23/TSOT 15...SSOP/QSOP 16...TSOP 16...TSSOP/MSOP Power 25...PSMC 25...SOD123-FL 25...SOD128-FL 25...TO TO-220F 25...TO-220FP 25...TO-220SMD 08...Stacked CSP 09...fcTMV 09...fpfcMEP 17...SOIC 17...ExposedPad TSSOP/ MSOP/SOIC/SSOP 18...LQFP 19...TQFP 20...ExposedPad LQFP 25...TO DPAK 25...TO-252JEITA 25...TO TO-263 (7-pin) 25...HSON Mini-HVSON (8-pin) 10...fcCSP 13...fcSCSP 20...ExposedPad TQFP 21...MQFP 22...PLCC 22...FusionQuad 23...MLF 25...HVSON (8-pin) 25...SO8-FL 25...TSON8-FL 25...TOLL 25...LFPAK Wafer Bump, Wafer Level Processing & Die Services 26...WLCSP Die Processing 26...Wafer Bump (8 & 12 ) 27...Turnkey Process Flow MEMS & Sensors 28...Cavity MEMS 28...Molded Cavity 28...Cavity LF Test 29...Major IC Testers 29...Wafer Prober 30...Package Test Handler 30...Strip Test/Film Frame Handler 30...Discrete/Power Test 31...Wafer Probe Roadmap 31...Package Test Roadmap PnP 32...Package Test Roadmap Film Frame 32...Package Test Roadmap Strip 33...Package Test Roadmap Gravity 33...Package Test Roadmap Turret 33...Burn In Oven 33...End Of Line (EOL) Services 34...Amkor by the Numbers 35...Worldwide Sales Offices

4 글로벌 앰코 전략적으로 위치한 생산기지 및 고객지원센터 영업사무소 및 고객지원센터 본사 어셈블리 및 테스트 시설 영업사무소, 고객지원센터, 어셈블리 및 테스트 시설 대한민국 인천 독일 뮌헨 대한민국 서울 프랑스 아르샹 일본 후쿠이, 후쿠오카, 하코다테, 키츠키, 쿠마모토, 우즈키 중국 베이징 포르투갈 포르토 일본 도쿄 중국 상하이 중국 선전 대한민국 광주 보스턴 산호세 템피 어바인 샌디에이고 대만 주베이 댈러스 오스틴 대만 룽탄 대만 신주 필리핀 문틴루파 필리핀 비난 라구나 말레이시아 쿠알라룸푸르 싱가포르 공장 코드 범례 앰코는 전 세계적으로 22개의 어셈블리 및 테스트 제조시설을 보유하고 있습니다. 다음의 제품 도표는 서로 다른 패키지가 어느 시설에서 제조되는지를 나타냅니다. 중화권 C3...Shanghai T1, T6...Taoyuan City T3, T5...Hsinchu 일본 JFI...Fukui (JG) JFO...Fukuoka (JH) JHD...Hakodate (JB) JKM...Kumamoto (JL) JKT...Kitsuki (JI) JUK...Usuki (JJ) 대한민국 K4...Gwangju K3, K5...Incheon 필리핀 P1...Muntinlupa City P3, P4...Binan Laguna 말레이시아 M1...Kuala Lumpur 포르투갈 ATEP...Porto Automotive capability에서 대부분 사용할 수 있는 패키지입니다. 패키지는 실제 크기로 표시되지 않고 사용 가능한 패키지를 나타냅니다. 문의 : 앰코 영업팀(asales@amkor.co.kr) Amkor Product Line Card 2018년 6월 4

5 Laminate 패키지 앰코가가진 laminate 패키지기술의뛰어난기능은, 향상된전기적및열성능이요구되는고전력및고속 IC에이점을제공합니다. Laminate 패키지는 leadframe 기판위에플라스틱또는테이프 laminate 기판을사용하는 BGA 설계를사용하고, 주변부가아닌패키지바닥에전기연결부를배치합니다. 기판의바닥면에고르게분포된범프가시스템보드에전기연결을제공합니다. 이 BGA 형식은 leadframe 패키지보다낮은열저항, 낮은인덕턴스및많은상호연결을 제공합니다. 향상된전기적, 열적성능을요구하는고전력및고속 IC가앰코 laminate 패키지기술의고기능성으로부터도움을받습니다. Laminate 패키지는 microprocessors/controllers, gate arrays, memory, chipsets, analog, Flash, SRAM, DRAM, ASIC, DSP, RF 디바이스및 PLD와같은고성능어플리케이션에이상적인솔루션입니다. PBGA Packages Package Dimensions PBGA Legend: Max full array ball count shown contact Amkor for custom BGA pattern availability. and Pitch Package Outline Size 0.8 mm 1.0 mm 1.27 mm 19 x K4, P3 DS x K4, P3 DS x K4, P3 DS x K4, P3 DS x K4, P3 DS x K4, P3 DS x K4, P3 DS x K4, P3 DS x K4, P3 DS x K4, P3 DS520 PBGA CABGA Packages Package Dimensions CABGA Size and Pitch 0.4 mm 0.5 mm 0.65 mm 0.8 mm 1 mm 1.27 mm 2.5 x P3 DS550 3 x K4, P3 DS x , C3, K4, P3, JKT DS550, DSJD405 4 x 4 49, 64 40, 41, 48,49 24 C3, K4, P3 DS x , 81 JKT DSJD405 5 x 5 97, , 48, 56, 57, 62, 64, 65, 68, 72, 76, 80, C3, K4, P3, JKT DS550, DSJD x , 99 JKT DSJD405 6 x , 56, 64, 80, 84, 86, 88, 92 49, C3, K4, P3, JKT DS550, DSJD405 6 x 6 96, 140, , 97, 100, 101, 105, 111, 112, 113, 120, C3, K4, P3, JHD, JKT DS550, DSJD405 7 x 7 187, , 86, 100, 104, 107, , 80 48, 49, 64 C3, K4, P3, JKT DS550, DSJD405 7 x 7 209, 211, , 128, 132, 137, 142, 143, 144, 154, , 84, 137 C3, K4, P3, JKT DS550, DSJD405 8 x 8 121, , 80, 100, 108, 112, 113, , 64, 80, 81 C3, K4, P3 DS550 8 x , 128, 132, 133, 144, 160, 161, 164, 176, , 140 C3, K4, P3, JHD, JKT DS550, DSJD405 8 x 8 195, 196, 208, 219, 225 C3, K4, P3 DS550 CABGA Amkor Product Line Card 2018 년 6 월 5

6 CABGA Packages (Cont.) Package Dimensions CABGA and Pitch Size 0.4 mm 0.5 mm 0.65 mm 0.8 mm 1 mm 1.27 mm 9 x 9 296, , 156, 188, 201, 220, 225, , 121, 141, , 100 C3, K4, P3, JKT, JHD DS550, DSJD x , 360, , 179, , , 100, 104, 120, 121, 128, C3, K4, P3, JKT DS550, DSJD x , 396, , 192, 200, 216, 221, 224, 225, 233, 235, C3, K4, P3, JKT, JHD DS550, DSJD x , , 257, 267, 268, 273, 277, 284, 285, 289, 292, 296, 297, C3, K4, P3 DS550, DSJD x , 345, 346 C3, K4, P3 DS x , 440, , , 177, 192, , 132, 144, C3, K4, P3, JHD, JKT DS550, DSJD x , , 280, 289, 305, 321, 324, 337, 361, , 208, 225, 241 C3, K4, P3, JKT DS550, DSJD x , 487, , 244, 260, 272, 291, 308, 337, , 160, 168, C3, K4, P3, JHD DS550, DSJD x , 569, , 388, , , 192, 196 C3, K4, P3, JHD, JKT DS550, DSJD x , 714, , 241 C3, K4, P3, JKT DS550, DSJD x , 248, 273 C3, K4, P3 DS x , 286, 289, 325, 280, 281, 282, 289, 337, 341, C3, K4, P3, JHD, JKT DS550, DSJD x , 368, 385, 400, 401, 420, , 336, , 193, 201, 224, C3, K4, P3, JHD, JKT DS550, DSJD x C3, K4, P3, JHD DS550, DSJD x , , 332, , , 169 C3, K4, P3 DS x , 456, 480, 516, 521, 538, 562, , 387, 400 C3, K4, P3, JHD DS550, DSJD x , 464, 543, 586, , 349, , 209, 217, 220, 228, 233, 240, 255, 260, 261, 265, 280, 288, 289 C3, K4, P3, JHD, JKT DS550, DSJD x , , , 176, 196 C3, K4, P3, JHD DS550, DSJD x , 609, , 324, 360, 423, 426, 445, , , 225 C3, K4, P3, JHD DS550, DSJD x , , 268, 272, 292, , 208, 224, 228, 252, , 164 C3, K4, P3, JKT DS550, DSJD x , 604, , 521, 532, , 316, 318, 320, 324, 326, 358, 364, 399, C3, K4, P3, JHD, JKT DS550, DSJD x , 906 JHD DSJD x JHD DSJD x , 490, 537 JHD DSJD x , 352, 484 JKT DSJD401, DSJD x , 456, 484, JKT DSJD x , 613, 620, 640, 641, JKT DSJD x , 868, JKT DSJD401 CABGA Amkor Product Line Card 2018 년 6 월 6

7 FCBGA Packages Package Dimensions FCBGA Size and Pitch 0.4 mm 0.5 mm 0.65 mm 0.8 mm 1 mm 1.27 mm 12 x K4, T3 DS x K4, T3 DS x K4, T3 DS x K4, T3 DS x K4, T3 DS x K4, T3 DS x K4, T3 DS x K4, T3 DS x , K4, T3, JHD DS831, DSJD x K4, T3 DS x , 1024, , K4, T3, JHD, JKM DS831, DSJD x , 784 K4, T3, JHD, JKM DS831, DSJD x K4, T3, JHD, JKM DS831, DSJD x , 1020, 1024 K4, T3, JHD, JKM DS831, DSJD x , 1089, 1152, 1156 K4, T3, JHD, JKM DS831, DSJD x , 1296, K4, T3, JHD, JKM DS550, DSJD x , K4, T3, JHD DS550, DSJD x K4, T3, JHD DS550, DSJD x K4, T3 DS x K4, T3, JHD DS550, DSJD x K4, T3 DS x K4 DS x K4 DS x K4 DS x K4 DS x K4 DS x K4 DS831 Full Array Ball s (ball count shown indicates maximum package size produced to date) FCBGA Amkor Product Line Card 2018 년 6 월 7

8 Stacked CSP (SCSP) Packages Package Dimensions Stacked CSP (S-CSP) Size and Pitch 0.4 mm 0.5 mm 0.6 mm 0.65 mm 0.75 mm 0.8 mm 1 mm 1.27 mm 2 mm Package Outline 3 x 3 25 K4 DS x , 49 K4 DS573 4 x , 48 K4 DS x , 60 K4 DS573 5 x , 64, 65, 72, 76, 77, K4 DS573 6 x , 76, 84, 96, 97, 100, , 64 K4 DS573 6 x K4 DS x K4 DS x K4 DS573 7 x 7 209, , 117, 121, 143, 144, 160, , 81, C3, K4 DS573 7 x 10 52, C3, JKT DS x K4 DS573 8 x , 120, 128, 160, 161, 176, 196, 208, , , C3, K4 DS573 8 x K4 DS573 8 x K4 DS573 8 x JKT 8 x 11 56, 88 C3, K4 DS573 8 x K4 DS573 8 x 12 66,67,74 44 K4 DS573 9 x 7 56 K4 DS573 9 x , 204, 216, 225, , 144, , 100 K4 DS573 9 x , 103, 105 C3, K4 DS573 9 x , , 130 JKT 10 x , , 180, 216, 259, 268, 328, , 121, 128, C3, K4 DS x JKT 10 x 12 79, 88 K4 DS x C3 DS x JKT 10 x K4 DS x K4 DS x , 137 C3, K4, JKT DS x , 88, 107, 133 K4 DS x , , K4 DS x K4 DS x , 135 C3, K4 DS x K4 DS x JKT 11.5 x K4 DS x , 162, K4, JKT DS573 Stacked CSP (S-CSP) Amkor Product Line Card 2018 년 6 월 8

9 Stacked CSP (SCSP) Packages (Cont.) Package Dimensions Size and Pitch 0.4 mm 0.5 mm 0.6 mm 0.65 mm 0.75 mm 0.8 mm 1 mm 1.27 mm 2 mm Package Outline 12 x , 228, 260, 272, 277, 289, 318, , 128, 144, 160, 161, 168, 179, 196 C3, K4 DS573 Stacked CSP (S-CSP) 12 x , K4, JKT DS x K4 DS x , K4, JKT DS x , 325, 341, 401, K4 DS x , 240, 348, 409, , 152, C3, K4 DS x , 53, , K4, JKT DS x K4 DS x , , 255, K4 DS x , K4 DS x , , 324 K4 DS573 Stacked CSP (S-CSP) fctmv Packages Nominal Package Dimensions fctmv *Simulated 100 MHz Size BGA Size Ball Package Height Ball Pitch Tray Matrix Units Per Tray Package Outline 9.9 x x K PO 12 x x K PO 12 x / / x K PO 14 x / / x K PO x N/A x K PO fctmv fpfcmep Packages Nominal Package Dimensions fpfcmep N/A *Simulated 100 MHz Size BGA Size Ball Package Height Ball Pitch Tray Matrix Units Per Tray Package Outline 12.4 x mm mm max 0.35 (0.27) 8 x K x mm mm max 0.35 (0.27) 8 x K x mm mm max 0.35 (0.27) 8 x K x mm mm max 0.40 (0.27) 7 x K x mm mm max 0.40 (0.27) 7 x K x mm mm max 0.40 (0.27) 7 x K4 fpfcmep Amkor Product Line Card 2018 년 6 월 9

10 fccsp Packages Nominal Package Dimensions fccsp 17 *Simulated 100 MHz Size BGA Size Ball Package Height Ball Pitch Tray Matrix Units Per Tray Package Outline 2 x x C3, K PO0C DS577 2 x x C3, K PO0B DS x N/A 17 N/A x C3, K4 No POD DS577 3 x max x C3, K PO DS577 3 x x C3, K PO0A DS577 3 x x C3, K PO DS x LGA x C3, K PO DS577 4 x 4 21 LGA x C3, K PO DS x x C3, K4 N DS577 5 x 5 32 LGA 32 LGA x P PO DS577 5 x 5 33 LGA x C3, K PO0A DS577 5 x 5 36 LGA 36 LGA x P PO DS577 5 x 5 39 LGA x C3, K PO DS577 5 x N/A N/A C3, K PO0B DS577 5 x 5 44 LGA x P PO DS577 5 x 6 53 LGA x C3, K PO DS577 5 x N/A N/A C3, K PO0A DS577 5 x min. 13 x C3, K PO DS577 5 x max x C3, K PO DS577 5 x x C3, K4 VN041-1 DS x LGA N/A N/A C3, K PO0A DS x x C3, K PO DS x 6.51 NA x C3 NT90-PB420-1 DS577 6 x x C3, K PO DS577 6 x max. 0.46/ x C3, K PO DS577 6 x x C3, K4 VN346-1 DS577 6 x x C3, K PO DS577 6 x NA NA 1 NA 14 x C3, K4 N DS x 6.43 NA x K4 NT90-PB315-1 DS x max x C3, K PO DS x x C3, K PO DS x N/A N/A C3, K PO0A DS x x C3, K PO DS x N/A N/A C3, K PO0A DS x x C3, K PO DS x x C3, K PO0A DS x max x C3, K PO DS577 7 x 7 40 LGA x P PO DS577 7 x N/A N/A C3, K PO DS577 7 x N/A N/A C3, K PO DS577 7 x N/A N/A C3, K PO DS577 7 x x C3, K4 VK575-1 DS577 7 x x C3, K PO DS577 7 x N/A N/A C3, K PO0A DS577 fccsp Amkor Product Line Card 2018 년 6 월 10

11 fccsp Packages (Cont.) Nominal Package Dimensions fccsp *Simulated 100 MHz Size BGA Size Ball Package Height Ball Pitch Tray Matrix Units Per Tray Package Outline 7 x x C3, K PO DS577 7 x N/A N/A C3, K PO0A DS577 7 x x C3, K PO DS x x C3, K PO DS x x C3, K PO DS x x C3, K PO DS x x C3, K4 N DS577 8 x LGA x C3, K PO DS577 8 x x C3, K PO DS577 8 x x C3, K PO DS577 8 x N/A N/A C3, K PO DS577 8 x N/A N/A C3, K PO DS577 8 x / x C3, K PO DS x x C3, K PO DS x 9.2 NA x K PO DS x x C3, K PO DS x x C3, K PO DS x x C3, K PO DS x x C3, K4 NT90-Y DS577 9 x mm x P PO DS x ± x C3, K PO0D DS x x C3, K PO DS x x C3, K PO DS x N/A N/A C3, K PD0A DS x x C3, K PO DS x x C3, K PO DS x ± x C3, K PO0A DS x x C3, K PO DS x x C3, K4 N DS x x C3, K PO DS x max x C3, K PO DS x N/A 454 N/A x C3, K4 No POD DS x ± x C3, K PO0B DS x ± x C3, K PO0A DS x x C3, K PO DS x max. 0.46/ x C3, K PO DS x x C3, K PO DS x x C3, K PO DS x N/A N/A C3, K PO0A DS x x C3, K PO DS x x C3, K PO DS x x C3, K PO DS x x C3, K4 N DS577 fccsp Amkor Product Line Card 2018 년 6 월 11

12 fccsp Packages (Cont.) Nominal Package Dimensions fccsp *Simulated 100 MHz Size BGA Size Ball Package Height Ball Pitch Tray Matrix Units Per Tray Package Outline 11 x max x K PO DS x max x K PO DS x x C3, K PO DS x x C3, K PO DS x x C3, K PO DS x max x K PO DS x max x K PO0A DS x x C3, K PO DS x x C3, K PO DS x max. 1 9 x C3, K PO DS x x C3, K PO DS x max x C3, K PO DS x x C3, K4 VB699-2 DS x x C3, K4 VB699-5 DS x N/A N/A C3, K PO DS x x C3, K PO DS x x C3, K PO DS x x C3, K PO DS x max x C3, K PO DS x max x C3, K PO DS x x C3, K PO DS x x C3, K PO DS x max x C3, K PO DS x x C3, K PO0C DS x max x K PO0B DS x max x C3, K PO DS x x C3, K PO DS x x C3, K PO DS x x C3, K PO DS x x C3, K4 NT90-NH568-1 DS x max x C3, K PO DS x x C3, K PO0A DS x x C3, K4 NT90-P rev-a DS x x C3, K PO DS x x C3, K PO DS x x C3, K PO DS x x C3, K PO DS x x C3, K PO DS x max x C3, K PO DS x N/A 990 N/A 0.40(0.50) 7 x C3, K4 No POD DS x N/A 992 N/A x C3, K4 No POD DS x x C3, K PO DS x max. 0.8 N/A N/A C3, K PO DS577 fccsp Amkor Product Line Card 2018 년 6 월 12

13 fcscsp Packages Nominal Package Dimensions fcscsp *Simulated 100 MHz Size BGA Size Ball Package Height Ball Pitch Tray Matrix Units Per Tray Package Outline 6.7 x x C3, K PO DS x x K4 NT90-PC105-1 DS x x K4 NT90-P DS x x K4 NT90-P DS x max x C3, K PO DS577 9 x max x C3, K PO DS577 9 x N/A 441 N/A x C3, K4 No POD DS x max x C3, K PO DS x max x C3, K PO DS x x K PO DS x x C3, K PO DS x N/A 775 N/A 0.35(0.65) 8 x C3, K4 No POD DS577 fcscsp Amkor Product Line Card 2018 년 6 월 13

14 frame 패키지 frame 패키지는오랫동안산업표준이었습니다. 앰코의가장인기있는전통적인 leadframe 패키지유형중하나는 SOIC (Small Outline Integrated Circuit) 와 QFP (Quad Flat Pack) 이며, 일반적으로 Dual 및 Quad 제품으로알려져있습니다. frame 패키지는 wirebond 또는 flip chip 기술을사용하여 die 를 leadframe 패키지 carrier에연결합니다. 많은생산량을가진이패키지는, 크기와무게를줄이면서최적의성능을요구하는휴대용오디오, 비디오및통신장치와같은최종제품에이상적입니다. Dual 패키지는소비자제품및자동차제품에사용되는 memory, analog IC, microcontrollers에서일반적으로사용됩니다. 이패키지는특히낮은핀수의디바이스에서경쟁력있는제조비용으로다양한 packaging 기능을제공합니다. Quad 패키지는 ASIC, DSP, microcontroller 및 memory IC에서광범위하게사용되며, 중간및낮은핀수 IC를위한저렴한비용의신뢰성있는솔루션을제공하는광범위한개방형및폐쇄형 tools를포함합니다. MicroFrame QFN 패키지는 copper leadframe 기판이있는 CSP (Chip Scale Package) 근처에캡슐화된플라스틱입니다. 이패키지는패키지바닥주변 lead를사용하여 PWB에전기적으로연결하며, ExposedPad 기술을열향상시켜제공합니다. 뛰어난열적, 전기적성능외에도 MLF 패키지는크기, 무게및성능이중요한모든적용에이상적인선택입니다. PDIP Packages Nominal Package Dimensions (mils) PDIP Shoulder Width Width Length Thickness Standoff Pitch JEDEC Pad Size Electrical Performance Bulk Capacitance (pf) Resistance (mω) Package Outline MS-001 P DS MS-001 P DS MS-001 P DS397 PDIP PowerSOP 3 (PSOP3) Packages Nominal Package Dimensions PSOP3 *Simulated 100 MHz Width Length Thickness Standoff Overall Height Pitch Tip-to-Tip JEDEC Pad Size MO x 7.9 Electrical Performance* Bulk Capacitance (pf) Resistance (mω) Package Outline P DS MO-166 P DS MO-166 P DS MO-166 P DS MO-166 P DS320 PSOP3 Amkor Product Line Card 2018 년 6 월 14

15 SOT-23/TSOT Packages Nominal Package Dimensions Width Length Thickness Overall Height Pitch Tip-to-Tip JEDEC/EIAJ Package Outline / SOT346/TO-236/SC-59 P DS581 SOT SOT143/TO-253 P DS / MO-178 P DS MO-178 P DS581 SOT MO-178 P DS581 TSOT (TSOP) / N/A P /41211 DS MO-193 P /41211 DS MO-193 P /41211 DS MO-193 P /41211 DS581 TSOT (TSOP) SSOP/QSOP Packages Nominal Package Dimensions (inches unless otherwise specified) SSOP 14/ Width 5.3 mm (209 mil) 5.3 mm (209 mil) 5.3 mm (209 mil) 5.3 mm (209 mil) Length Thickness Standoff Overall Height Pitch Tip-to-Tip JEDEC Pad Size Electrical Performance* Bulk Capacitance (pf) Resistance (mω) Package Outline 6.2 mm 1.73 mm 0.13 mm 1.86 mm 0.65 mm 7.80 mm MO-150 P DS mm 1.73 mm 0.13 mm 1.86 mm 0.65 mm 7.80 mm MO x P DS mm 1.73 mm 0.13 mm 1.86 mm 0.65 mm 7.80 mm MO-150 P DS mm 1.73 mm 0.13 mm 1.86 mm 0.65 mm 7.80 mm MO x P DS360 SSOP QSOP MO-137 P DS360 QSOP *Simulated 100 MHz Amkor Product Line Card 2018 년 6 월 15

16 TSOP Package Nominal Package Dimensions TSOP I *C3 factory production targeted for stacked memory die. Width Length Thickness Standoff Overall Height Pitch Tip-to-Tip JEDEC/ JEITA Pad Size Electrical Performance Bulk Capacitance (pf) Resistance (mω) Package Outline ~ max ATM DS ~ max 0.4~ ATM DS ~ max ATM DS ~ max MS-142/ EIAJ ED C3, ATM DS330 TSOP I TSSOP/MSOP Packages Nominal Package Dimensions TSSOP MSOP *Simulated 100 MHz Width Length Thickness Standoff Overall Height Pitch Tip-to-Tip JEDEC Pad Size Electrical Performance* Bulk Capacitance (pf) Resistance (mω) Package Outline MO P DS MO-153 P DS MO-153 P DS MO-153 P DS MO-153 P DS MO P DS MO-153 P DS MO-187 P DS MO-187 P DS350 TSSOP MSOP Amkor Product Line Card 2018 년 6 월 16

17 SOIC Packages Nominal Package Dimensions (inches) SOIC Narrow SOIC Wide *Simulated 100 MHz Width Length Thickness Standoff Overall Height Pitch Tip-to-Tip JEDEC Pad Size Electrical Performance* Bulk Capacitance (pf) Resistance (mω) Package Outline MS-012 P DS MS-012 P DS MS-012 P DS N/A 3.6 x P DS MS-013 P DS MS-013 P DS MS-013 P DS370 SOIC Narrow SOIC Wide ExposedPad TSSOP/MSOP/SOIC/SSOP Packages Nominal Package Dimensions epad TSSOP epad MSOP N/A Width Length Thickness Standoff Overall Height Pitch Tip-to-Tip JEDEC Pad Size Electrical Performance* Center Corner Package Outline MO-153 P DS MO-153 P DS MO x P DS MO x P DS MO-153 P DS MO x P DS MO-153 P DS MO x P DS MO-187 P DS571 epad TSSOP epad MSOP epad SOIC MS-012 P DS MS-012 P DS571 epad SOIC epad SSOP MO-271 P DS571 epad SSOP *Simulated 100 MHz Amkor Product Line Card 2018 년 6 월 17

18 LQFP Packages Nominal Package Dimensions LQFP *Simulated 100 MHz Size Thickness Pitch Form Standoff Foot Length Tip-to-Tip JEDEC Tray Matrix Units Per Tray Pad Size Electrical Performance* Bulk Capacitance (pf) Resistance (mω) Package Outline 7 x MS x x P1, JKM, JUK, 34604/ DS232, JFO JMD3S DSJD408 7 x MS x x P1, JKM, JUK, 34604/ JFO JMD4S DS232, DSJD408 7 x MS x P1, JUK, JFO 34604/ JMD3S DS232, DSJD x MS x P1, JUK, JFO 34607/ JMD3S DS232, DSJD x MS x P1, JUK, JFO 34607/ JMD3S DS232, DSJD x MS x P1, JKM, JUK, 34607/ JFO JMD4S DS232, DSJD x MS x JUK 34607/ JMD3S DS232, DSJD x x JUK JMD3S DSJD x MS x P1, JKM, JUK 51023/ JMD3S x MS x P1 DS232 DS232, DSJD x MS x P DS x MS x P1, JUK / JMD3S DS232, DSJD x MS x x P1, JKM, JUK / JMD4S DS232, DSJD x / / MS x / P1, JKM, JUK JMD3S072293/ DS232, JMD3S DSJD x X JUK JMD3S DSJD x X JUK JMD3S DSJD x x 22.0 MS x P DS232, DSJD x x 22.0 MS x P1, JKM 45373/ JMD3S DS232, DSJD x MS x P DS x MS x x P1, JKM, JUK, / JFO JMD3S DS232, DSJD x MS x P1, JKM, JUK / JMD3S DS232, DSJD x MS x P DS x MS x x P1, JKM, JUK, 32780/ JFO JMD3S DS232, DSJD x MS x P1, JKM, JFO 32780/ JMD3S DS232, DSJD x MS x x P1, JFO 34514/ JMD3S DS230, DS x MS x 9 36 P1, JFO 34514/ JMD3S DS230, DS232 LQFP Amkor Product Line Card 2018 년 6 월 18

19 TQFP Packages Nominal Package Dimensions TQFP *Simulated 100 MHz Size Thickness Pitch Form Standoff Foot Length Tip-to-Tip JEDEC Tray Matrix Units Per Tray Pad Size Electrical Performance* Bulk Capacitance (pf) Resistance (mω) Package Outline 5 x MS x P DS230 7 x MS x x P1, JFO DS230 7 x MS x x P1, JFO DS230 7 x MS x P1, JFO DS x MS x P1, JFO DS x MS x P1, JFO DS x MS x P1, JFO DS x MS x P DS x MS x P DS x x JKM JMD3S DSJD x MS x P1 DS x MS x P DS x MS x P DS x MS x x 8 14 x / / MS x P1, JKM 16 x MS x P1, JKM 20 x MS x x P DS / JMD3S / JMD3S DS230, DSJD408 DS230, DSJD408 P DS x MS x P DS230 TQFP Amkor Product Line Card 2018 년 6 월 19

20 ExposedPad LQFP Packages Nominal Package Dimensions Exposed Pad LQFP Size Thickness *JEDEC Standard Test Boards 1W with die attach pad soldered to PCB Pitch Form Standoff Foot Length Tip-to-Tip JEDEC Tray Matrix Units Per Tray Pad Size Electrical Performance* Loop Center Loop Corner Package Outline 7 x x JUK DS x x P DS x x P DS x x x P DS x 14 52/ / x P1 DS x x P DS x x x P DS x x P DS x x x P1 DS x x x P1 DS x x P DS x x x P1, JKM, JFO /JMD3S DS x x P DS x x P DS x x x P1, JKM, JFO 32780/JMD4S DS x x P DS x x x P1, JFO 34514/JMD4S DS x x 9 36 P1, JFO 34514/JMD4S DS231 Exposed Pad LQFP ExposedPad TQFP Packages Nominal Package Dimensions Exposed Pad TQFP Size Thickness *JEDEC Standard Test Boards 1W with die attach pad soldered to PCB Pitch Form Standoff Foot Length Tip-to-Tip JEDEC Tray Matrix Units Per Tray Pad Size Electrical Performance* Loop Center Loop Corner Package Outline 5 x x P DS231 7 x x P DS231 7 x x x P1, JKM 32770/JMD3S DS231 7 x x P DS x x P DS x x P DS x x x JFO, JUK 32772/JMD3S DS x x P DS x x JFO JMD3S x 14 52/ / x P1 DS x x P DS x x x P1, JKM, JUK, JFO /JMD3S DS x x P DS x x JKM JMD3S x x P1, JKM /JMD3S DS x x P DS x x x P DS x x JKM /JMD3S DS231 Exposed Pad TQFP Amkor Product Line Card 2018 년 6 월 20

21 MQFP Packages Nominal Package Dimensions MQFP *Simulated 100 MHz Size Thickness Pitch Form Standoff Tip-to-Tip JEDEC Tray Matrix Units Per Tray Pad Size Electrical Performance* Bulk Capacitance (pf) Resistance (mω) Package Outline 10 x MS x x P1 DS x MS x P1 DS x MS x P1 DS x MS x P1 DS x MS x P1 DS x MS x P1 DS x MS x P1 DS x MS x P1 DS x MS x P1 DS x MS x P1 DS x MS x P1 DS x MS x P1 DS x MS x P1 DS x MS x P1 DS x x 23.2 MS x P1 DS x x 23.2 MS x P1 DS x x 23.2 MS x P1 DS x x 23.2 MS x x P1 DS x x 23.9 MS x P1 DS x x 23.9 MS x P1 DS x x 23.9 MS x P1 DS x x 23.9 MS x P1 DS x / / MS x 8 24 P1 DS x / / MS x 8 24 P1 DS x MS x P1 DS x MS x 8 24 P1 DS x / / MS x 8 24 P1 DS x MS x 8 24 P1 DS x MS x 8 24 P1 DS x MS x x P1 DS x MS x 8 24 P1 DS232 MQFP Amkor Product Line Card 2018 년 6 월 21

22 PLCC Packages Nominal Package Dimensions (inches unless otherwise specified) PLCC *Simulated 100 MHz Pkg Type Size Size (inches) Thickness (inches) Pitch (inches) JEDEC Qty Per Tube Pad Size Electrical Performance* Bulk Capacitance (pf) Resistance (mω) Package Outline x x MS x P DS x x MS x 6.6 P DS x x MS x Square P DS x MS P DS x MS P DS x x MS x P DS232 Rectangular x MS P DS232 PLCC FusionQuad Packages Nominal Package Dimensions FusionQuad Size Total Max IO Number Possible Dual Row Land Single Row Land Peripheral Max Die Pad Size 0.4 pitch 0.5 pitch 0.4 pitch 0.5 pitch 0.4 pitch 0.5 pitch 0.4 pitch 0.5 pitch Pkg Pad Size Electrical Performance* 10 x P1 DS x P1 DS x ld 6.5 x P1 DS x P1 DS x P1 DS x P1 DS587 *Simulated 100 MHz Note : Above are estimates only. 모든옵션에대해상세설계가아직구현되지않았습니다. Actual pin counts are pad size dependent. Bulk Capacitance (pf) Resistance (mω) Package Outline FusionQuad Amkor Product Line Card 2018 년 6 월 22

23 MicroFrame MLF /QFN/SON/DFN Packages Nominal Package Dimensions MicroFrame MLF /QFN/SON/DFN Size MLF /QFN/ SON/DFN s Pitch Dual Row Pitch Electrical Performance* Bulk Capacitance (pf) Resistance (mω) 1 x 1 4, , C3, P3 DS572 2 x 2 4, 6, 8, 10, , C3, P3 DS572 3 x 3 4, 6, 8, 10, , 0.65, 0.5, 0.4, 0.35, C3, P1, P3 DS572 3 x , 0.5, 0.4, 0.35, 0.3 C3, P1, P3 DS572 3 x 3 20, , 0.4, 0.35, 0.3 C3, P1, P3 DS572 4 x 4 8, 10, 12, , 0.8, 0.65, 0.5, 0.4, 0.35, C3, P1, P3, JFO DS572 4 x 4 16, , 0.65, 0.5, 0.4, 0.35, 0.3 C3, P1, P3, JFO DS572 4 x , 0.5, 0.4, 0.35, 0.3 C3, P1, P3, JFO DS572, DSJD409 4 x 4 24, , 0.4, 0.35, 0.3 C3, P1, P3, JFO DS572, DSJD409 4 x , 0.35, 0.3 C3, P1, P3, JFO DS572, DSJD409 4 x , 0.3 C3, P1, P3 DS572 5 x 5 8, 10, , 0.8, 0.65, 0.5, 0.4, 0.35, 0.3 C3, P1, P3, JFO DS572 5 x 5 20, , 0.65, 0.5, 0.4, 0.35, C3, P1, P3, JFO DS572 5 x , 0.5, 0.4, 0.35, 0.3 C3, P1, P3, JFO DS572 5 x 5 32, , 0.4, 0.35, 0.3 C3, P1, P3, JFO DS572, DSJD409 5 x , 0.35, 0.3 C3, P1, P3, JFO DS572, DSJD409 5 x C3, P1, P3 DS572 5 x C3, P1, P3 DS572 6 x 5 18, , 0.65, 0.5, 0.4, 0.35, 0.3 C3, P1, P3 DS572 6 x , 0.4, 0.35, 0.3 C3, P1, P3 DS572 6 x , 0.35, 0.3 C3, P1, P3 DS572 6 x 6 16, , 0.65, 0.5, 0.4, 0.35, 0.3 C3, P1, P3, JFO DS572 6 x 6 26, , 0.5, 0.4, 0.35, 0.3 C3, P1, P3 DS572 6 x 6 *Simulated 12 GHz. Values dependent on specific die and wire configurations. 30, 32, 36, 40, 44, , 0.4, 0.35, C3, P1, P3, JFO DS572 6 x , 0.35, 0.3 C3, P1, P3, JFO DS572 6 x 6 56, 60, , 0.3 C3, P1, P3 DS572 6 x 6 44, 60, C3, P1, P3 DS572 6 x P3, JHD DS572, DSJD409 7 x 7 24, , 0.65, 0.5, 0.4, 0.35, 0.3 C3, P1, P3, JFO DS572 7 x , 0.5, 0.4, 0.35, 0.3 C3, P1, P3, JFO DS572 7 x 7 44, , 0.4, 0.35, C3, P1, P3, JFO DS572 7 x , 0.35, 0.3 C3, P1, P3, JFO DS572 7 x , 0.3 C3, P1, P3 DS572 7 x C3, P1, P3 DS572 7 x C3, P1, P3 DS572 7 x C3, P1, P3 DS572 MicroFrame MLF /QFN/SON/DFN Amkor Product Line Card 2018 년 6 월 23

24 MicroFrame MLF /QFN/SON/DFN Packages (Cont.) Nominal Package Dimensions Size MLF /QFN/ SON/DFN s Pitch Dual Row Pitch Electrical Performance* Bulk Capacitance (pf) Resistance (mω) 8 x , 1.42, 0.8, 0.65, 0.5, 0.4, 0.35, 0.3 C3, P1, P3 DS572 MicroFrame MLF /QFN/SON/DFN 8 x , 0.8, 0.65, 0.5, 0.4, 0.35, 0.3 C3, P1, P3 DS572 8 x 8 32, , 0.65, 0.5, 0.4, 0.35, 0.3 C3, P1, P3 DS572 8 x , 0.5, 0.4, 0.35, 0.3 C3, P1, P3 DS572 8 x 8 52, , 0.4, 0.35, 0.3 C3, P1, P3 DS572 8 x , 0.35, 0.3 P3, JKM DS572, DSJD409 8 x 8 68, , 0.3 C3, P1, P3 DS572 8 x 8 88, C3, P1, P3 DS572 8 x 8 84, 92, C3, P1, P3 DS572 9 x , 0.65, 0.5, 0.4, 0.35, 0.3 C3, P1, P3 DS572 9 x 9 44, , 0.5, 0.4, 0.35, 0.3 C3, P1, P3 DS572 9 x 9 60, , 0.4, 0.35, 0.3 C3, P1, P3 DS572 9 x , 0.35, C3, P1, P3, JFO DS572, DSJD409 9 x , 0.3 C3, P1, P3 DS572 9 x C3, P1, P3 DS572 9 x 9 100, 108, C3, P1, P3 DS x , 0.65, 0.5, 0.4, 0.35, 0.3 C3, P1, P3 DS x 10 52, , 0.5, 0.4, 0.35, 0.3 C3, P1, P3 DS x 10 64, 68, , 0.4, 0.35, C3, P1, P3 DS x , 0.35, 0.3 C3, P1, P3 DS x , 0.3 C3, P1, P3 DS x , C3, P1, P3 DS x C3, P1, P3 DS x C3, P1 DS x C3, P1 DS x , 0.65, 0.5, 0.4, 0.35, 0.3 C3, P1 DS x , 0.5, 0.4, 0.35, 0.3 C3, P1 DS x 12 84, , 0.4, 0.35, 0.3 C3, P1 DS x , , 0.35, 0.3 C3, P1 DS x , 0.3 C3, P1 DS x C3, P1 DS x C3, P1 DS572 MicroFrame MLF /QFN/SON/DFN 12 x , C3, P1 DS x , C3 DS572 *Simulated 12 GHz. Values dependent on specific die and wire configurations. Amkor Product Line Card 2018 년 6 월 24

25 Power Packages 앰코의 Power 패키지포트폴리오는자동차, 통신및산업을포함한다양한시장과애플리케이션을제공합니다. 전력에민감한모바일애플리케이션에최적화된앰코의고성능전력장치에는패키지 carrier로서 leadframe을사용하며, 주로 wirebond 상호연결기술을사용합니다. 대부분제품은 copper clip interconnect 를사용하여전력장치에가장잘알려진전기적특성을제공합니다. 전기적, 열적개선에중점을둔기술을이용하는이패키지는, 고급전력 packaging, 고급 copper clip 연결및모듈이포함됩니다. Power Packages Nominal Package Dimensions Power Package Width Length Thickness Overall Height Pitch Tip-to-Tip JEDEC/JEITA Package Outline PSMC ATM DS616 PSMC ATM PO DS617 SOD123-FL ATM PO DS614 SOD128-FL ATM PO DS613 TO JFI JMD4S DSJD410 TO-220F JFI JMD4S DSJD411 TO-220FP ATM PO DS610 TO-220SMD JFI JMD4S DSJD412 TO JFI JMD4S DSJD413 DPAK JEDEC JFI JMD4S DSJD414 TO-252JEITA JEITA JFI JMD4S DSJD415 TO / JFI JMD4S DSJD416 TO-263 (7-pin) JFI JMD4S DSJD417 HSON x 6.0 JFI JMD4S DSJD407 Mini-HVSON (8-pin) x 3.3 JFI JMD4S DSJD403 HVSON (8-pin) x 6.0 JFI JMD4S DSJD402 SO8-FL JEDEC ATM PO DS611 SO8-FL JEITA ATM DS611 SO8-FL JEDEC ATM PO DS611 TSON8-FL JEDEC ATM PO DS612 TSON8-FL JEDEC ATM PO DS612 TOLL JEDEC ATM PO (w/kelvin pin) PO (w/o Kelvin pin) LFPAK JEDEC JFI DS619 DS618 Power Amkor Product Line Card 2018 년 6 월 25

26 Wafer Bump, Wafer Level Processing & Die Processing Services 앰코는여러전략적위치 ( 한국, 중국, 대만 ) 에서 electroplated solder, Cu pillar technologies 및 Wafer Level Chip Scale Packaging (WLCSP) 분야의첨단기술능력을제공합니다. 당사의생산기지는주요파운드리와인접해독보적으로자리잡고있기때문에고객이통합된물류센터를통해출시시간을단축할수있습니다. 다이와기판사이의전기적, 기계적연결은 flip chip 패키지구조의가장중요한요소중하나입니다. Cu pillar, lead-tin 및 leadfree solder는이러한연결 또는 bump 를형성하는데사용되며, 다이에대한우수한접착성, 최소저항및높은조립수율을나타내야합니다. Solder bump 및 Cu pillar는 thin film metal deposition, plating 또는 ball loading 기술을사용하여형성됩니다. 앰코는디바이스와최종제품의 motherboard가 solder로직접연결되는, Wafer Level Chip Scale Packaging (WLCSP) 를제공합니다. WLCSP의 full turnkey solution은 wafer bumping (with or without pad Redistribution Layer or RDL), wafer level final test, device singulation and packing in tape and reel 등을포함하고있습니다. 다이의엑티브면을보호하는 PBO나 PI 같은유전층위에형성된앰코의견고한 Under Bump Metallurgy (UBM) 은가혹한보드레벨조건에서도견딜수있도록신뢰성있는인터커넥션솔루션을제공합니다. WLCSP 패키지제품군은가장작은 form factor와 high end RF WLAN combo chips에서 FPGA, power management, Flash/EEPROM, integrated passive networks 및표준성능을활용하는동시에광범위한반도체장치유형에적용됩니다. WLCSP Die Processing Services (8 & 12 ) Product Type UBM Type Solder Composition Repassivation Ball Size Pitch/Sphere Diameter Die Thickness Bump Height RDL Trace/ Space Available Option WLCSP BoR (2 mask) CSP nl (4 mask) CSP n3 (3 mask) CSP nl BoR (Bump on Repassivation) CSP nl + RDL (Bump on Redistribution) CSP n3 + RDL (Bump on Redistribution) 8 : K4, T5, C3 12 : K4, K5, T1, C3 Ni/Au, Nickel based, Thick copper UBM Pb-free SAC alloys (Plated) Sn/Ag Pb-free Cu pillar PBO, PI, Low cure polymers 4~ ~70 mm mm/0.30 mm 0.40 mm/0.25 mm 0.30 mm/0.20 mm (0.15 mm Sphere Diameter is available) 150 μm to 450 μm 0.5 mm Pitch : 250 μm 0.4 mm Pitch : 210 μm 0.3 mm Pitch : 170 μm CSP nl : 12/12 μm CSP n3 : 15/15 μm Backside lamination (black) Carrier Tape : 7 or 13 reels WLCSP Reliability Package Level Board Level Preconditioning at Level 1 85 C/85% RH, 168 hours, 260 C peak Temp Cycle -55 C/+125 C, 1000 cycles High Temp Storage 150 C, 1000 hours Temp Cycle -40 C/+125 C, 15 min. ramp rate, 500 cycles Drop Test JEDEC condition B (1500G), 100 drops Reliability Wafer Bump (8 & 12 ) Product Type Low Alpha Repassivation Repassivation Opening Typical Production Bump Height Seed Layer Pad Pitch Lower Limit Wafer Example Wafer Bump Solder Bumping RP Cu Pillar BOP Solder Bumping BOP Cu Pillar RDL SnAg Plating Bump with or without Redistribution Cu Pillar Plating Bump with or without Redistribution 8 : K4, T5, C3 12 : K4, K5, T1, C3 8 : K4, T5, C3 12 : K4, K5, T1, C3 All available as low alpha <0.002 cts/hr/cm 2 ) PBO, PI, Low cure polymers PBO : Min. 15 μm PI : Min. 25 μm 150 μm array : 70 μm 125 μm peripheral : 75 μm Ti/Cu, TiW/Cu Solder bump : Array 150 μm pitch/75 μm UBM (min) Micro bump : Array 40 μm pitch/20 μm UBM (min) Cu pillar bump: Staggered 80 μm pitch/30 μm UBM (min) Wafer Bump Solder Bumping RDL 63Sn/37Pb Plating Bump with or without Redistribution 12 : T1 Amkor Product Line Card 2018 년 6 월 26

27 Turnkey Process Flow - CSP nl WLCSP WLP Test DPS ff ff ff ff Design services available Layout Mask tooling Wafer RDL patterning and bumping (ball sphere loaded or plated) Automated Optical Inspection (AOI) for best in class quality assurance Wafer map generation Inspect & Clean PBO or PI 1 RDL Sputter Deposition Resist Processing Cu RDL Plating Resist & Seed Metal Removal PBO or PI 2 UBM Sputter Deposition Resist Processing Cu or Ni-based UBM Resist & Seed Metal Removal Ball Place ff ff ff ff Final Probe Test software and hardware development Probe card design, service and support Test program transfer Wafer sort for RF, memory, logic and analog applications ff ff ff Backgrind Backside Lamination Laser Mark Singulation Tape & Reel AOI Strong emphasis on singulated device edge quality for all Si nodes Shipping material design and supply management Drop ship to final customer available Amkor Product Line Card 2018 년 6 월 27

28 MEMS & Sensors 앰코는마이크로전자기계시스템 (MEMS) 및마이크로광학전자기계시스템 (MOEMS) 패키징분야의최대아웃소스공급업체로, 세계시장을선도하는기업입니다. MEMS (Microelectromechanical Systems) 는우리의실생활을감지하거나조작할수있는초소형센서입니다. MEMS 는마치 integrated circuit (IC) device 의제작과유사하게 micro machining processes 를이용해 만들어집니다. 장치가비슷해보이지만, standard IC 패키지솔루션은종종호환되지않습니다. 앰코는웨이퍼레벨을포함한모든패키지플랫폼에걸쳐 cavity, non-cavity 및 hybrid 솔루션을광범위하게보유하고있습니다. 모든제품에제공되는패키지구성과재료선택은 total sensing solution 의기능및성능에중요한역할을할수있습니다. Cavity MEMS Packages Open Tool Available ( Builds) Width Length Thickness Pkg Type Lid Type Die Qty Inter-connect POD Dwg Unit Dwg Cavity LGA Metal Multi-die WB P3 TBD TBD Cavity LGA Metal Multi-die WB P PO TBD Cavity LGA Metal Multi-die WB P3 TBD TBD Cavity LGA Metal Multi-die WB P PO UD Cavity LGA L2L Multi-die WB P P UD MEMS Molded Cavity LGA Polymer Multi-die WB K PO UD MEMS Cavity LGA Polymer Multi-die WB K PO UD Cavity LF Polymer Multi-die WB P PO UD MEMS/Sensor Package Standards Package Type Overmolded Exposed Die Surface Cavity Package Molded Cavity Package frame SOIC/MLF ChipArray LGA/FPBGA Amkor Product Line Card 2018 년 6 월 28