歯자료db통합0928

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1 1 Memory PKG DIP * DUAL IN-LINE PACKAGE PIN PKG LEAD LEAD PITCH 100 MIL (254mm), PKG WIDTH 300/400/600 MIL (PIN HOLE WIDTH ), PIN 6-64 P-DIP C-DIP SDIP SK-DIP SIP * PLASTIC DIP MOLD ( ) PLASTIC( EPOXY COMPOUND) DIP * CERAMIC DIP CERAMIC DIP LEAD, BODY, CAP, GLASS (SEALING) 8-42 PIN * SHRINK DIP P-DIP LEAD PITCH 70 MIL (1778 mm) * SKINNY DIP P-DIP PKG WIDTH 600MIL PKG 300MIL * SINGLE IN-LINE PACKAGE LEAD PKG PCB PKG LEAD PITCH 100 MIL 2-23 PIN

CERAMIC DIP CERAMIC DIP LEAD, BODY, CAP, GLASS (SEALING) 8-42 PIN * SHRINK DIP P-DIP LEAD PITCH 70 MIL (1778

2 1 Memory SSIP ZIP (VDIP) * SHRINK SIP LEAD PITCH 70 MIL SIP * ZIG-ZAG IN-LINE PACKAGE (VETICAL DIP) SIP PKG LEAD, ZIG-ZAG FORMING LEAD PITCH 100 MIL SOP * SMALL OUTLINE PACKAGE PKG GULL-FORM LEAD PKG LEAD PITCH 50 MIL(127 mm) 8-44 PIN SSOP * SHRINK SOP LEAD PITCH 10/08/065/05 mm SOP 8-80 PIN

100 MIL SOP * SMALL OUTLINE PACKAGE PKG GULL-FORM LEAD PKG LEAD PITCH 50

3 1 Memory SOJ * SMALL OUTLINE J-LEADED PACKAGE SOP LEAD J FORMING PKG LEAD PITCH 50 MIL PIN SOI SVP (VPAK) * SMALL OUTLINE I-LEADED PACKAGE SOP/SOJ, LEAD I FORMING * SURFACE VERTICAL PACKAGE SIP LEAD PKG, FORMING SOJ 1/7, ZIP 1/3 LEAD PITCH 05/065 mm PIN TI VPAK, FIJITSU SVP SHP TI VPAK FUJITSU SVP * SURFACE HORIZONTAL PACKAGE SOP LEAD PIN, PCB PKG

SURFACE VERTICAL PACKAGE SIP LEAD PKG, FORMING SOJ 1/7, ZIP 1/3 LEAD PITCH 05/065 mm 24-32

4 1 Memory TSOP * THIN SOP 50 MIL, LEAD PITCH 50 MIL SOP EIAJ PKG LEAD TSOP I, TSOP II TYPE I 06/055/05 mm PITCH, SOLDER TYPE II PITCH 127 mm TSOP II TSSOP * THIN SHRINK SOP PKG BODY 10 mm, PITCH 065/05 mm TSOP 8-32 PIN TI JAPAN UTSOP VSOP USO SON * ULTRA THIN SOP PKG BODY 065 mm TSOP FUJITSU * VERY SOP SONY, FUJITSU, MITSUBISHI SSOP * ULTRA SMALL OUTLINE PACKAGE * SMALL OUTLINE NON-LEADED PKG FUJITSU CSP LEAD PKG ( QFN)

8-32 PIN TI JAPAN UTSOP VSOP USO SON * ULTRA THIN SOP PKG BODY 065 mm TSOP FUJITSU * VERY SOP SONY,

5 1 Memory FP PFP QFP * FLAT PACKAGE QFP SOP PKG * PLASTIC FLAT PACKAGE * QUAD FLAT PACKAGE PKG 4 GULL-WING LEAD PIN PKG PLASTIC, CERAMIC, METAL PLASTIC LEAD PITCH 10/08/065/05/04/03 mm, 065 mm 232 PIN, 05 mm 304 PIN EIAJ 065 mm QFP, 05 mm FINE PITCH QFP PKG BODY 20-36mm QFP, 140mm LQFP 10 mm TQFP PQFP CQFP TQFP MQFP * PLASTIC QFP * CERAMIC QFP * THIN QFP PCB 127 mm (50MIL), BODY 10mm QFP LEAD PITCH 08/065/06/05 mm, PIN * METRIC QFP JEDEC QFP LEAD PITCH mm, BODY QFP

FINE PITCH QFP PKG BODY 20-36mm QFP, 140mm LQFP 10 mm TQFP PQFP CQFP TQFP MQFP * PLASTIC QFP * CERAMIC QFP * THIN QFP PCB

6 1 Memory LQFP QFI QFN * LOW PROFILE QFP BODY 14 mm QFP * QUAD FLAT I-LEADED PACKAGE LEAD QFP (BUTT LEAD) MSP (MINI SQUARE PKG) QFP, LEAD PITCH 127 mm, PIN * QUAD FLAT NON-LEADED PACKAGE LCC, QFN EIAJ PKG PAD LEAD QFP, CERAMIC PLASTIC, LCC CERAMIC PLASTIC QFN GLASS EPOXY PCB LOW COST PITCH 127/065/05mm QTP (QTCP) MQUAD * QUAD TAPE CARRIER PACKAGE TAB TCP 4 LEAD QTP EIAJ * METAL QUAD Al BASE CAP GLASS SEALING QFP W OLIN

LEAD QFP, CERAMIC PLASTIC, LCC CERAMIC PLASTIC QFN GLASS EPOXY PCB LOW COST PITCH 127/065/05mm QTP (QTCP)

7 1 Memory BQFP * QFP WITH BUMPER QFP 4 BUMPER LEAD BENT PITCH 25 MIL (0635 mm) PIN FQFP GQFP HQFP PQ QFJ * FINE PITCH QFP PITCH 05 mm QFP * QFP WITH GUARD RING LEAD PIN RING LEAD BENT QFP RING LEAD GULL-FORM PCB MOTOROLA PITCH 05 mm, PIN 256/208 * QFP WITH HEAT SINK QFP HEAT SINK * POWER QUAD QFP BODY HEAT SINK PKG * QUAD FLAT J-LEADED EIAJ PLCC

RING LEAD BENT QFP RING LEAD GULL-FORM PCB MOTOROLA PITCH 05 mm, PIN 256/208 * QFP WITH

8 1 Memory LCC * LEADELESS CHIP CARRIER CERAMIC SUBSTRATE PAD LEAD PKG CERAMIC QFN QFN-C PLCC * PLASTIC LEADED CHIP CARRIER PLASTIC QFJ PLASTIC LCC PITCH 127 mm, PIN 84 PIN CLCC * CERAMIC LEADLED CHIP CARRIER CERAMIC QFJ QFJ-G PKG J-FORM LEAD PITCH 127 mm J-LCC PCLP * J-LEADED CHIP CARRIER BULL-EYES-CAP CERAMIC QFJ * PRINTED CIRCUIT BOARD LEADLESS PACKAGE, FUJITSU PLASTIC QFN PITCH 05/04 mm

LEADLED CHIP CARRIER CERAMIC QFJ QFJ-G PKG J-FORM LEAD PITCH 127 mm J-LCC PCLP * J-LEADED CHIP

9 1 Memory PGA * PIN GRID ARRAY PKG LEAD PIN PIN PKG PPGA CPGA LGA SUBSTRATE MULTI-LAYER CERAMIC PITCH 254/127 mm, PIN * PAD GRID ARRAY PGA PIN PAD PKG * PLASTIC PGA SUBSTRATE PCB, EPOXY CHIP SEALING LOW COST PGA * CERAMIC PGA * LAND GRID ARRAY (PAD GRID ARRAY) PIGGY BACK * SOCKET CERAMIC PLASTIC PKG DIP, QFP, QFN

PKG * PLASTIC PGA SUBSTRATE PCB, EPOXY CHIP SEALING LOW COST PGA * CERAMIC PGA

10 1 Memory BGA SBGA PBGA CBGA * BALL GRID ARRAY PCB SOLDER BALL ARRAY PKG CHIP, MOLD SEALING 200 PIN PKG, QFP LEAD 200 PIN QFP 500 PIN HI-PIN PKG * PAD ARRAY CARRIER (PAC) * GLOBE TOP PAC (GPAC) * OVER MOLDED PAD ARRAY CARRIER (OMPAC) * SUPER BGA ANAM HI-SPEED, HI-POWER PERFO-RMANCE COPPER HEATSINK CHIP BGA * PLASTIC BGA LOW COST SUBSTRATE EPOXY * CERAMIC BGA MBGA * METAL BGA OLIN BGA, ANODIZED ALUMINIUM SUBSTRATE THIN FILM CIRCUIT BGA

CARRIER (OMPAC) * SUPER BGA ANAM HI-SPEED, HI-POWER PERFO-RMANCE COPPER HEATSINK CHIP BGA * PLASTIC BGA LOW

11 1 Memory u-bga TBGA mbga C2 BGA LBGA * MICRO BGA TESERA CHIP-SIZED PKG, HI I/O, BGA * TAPE BGA TAB BGA PKG * MINI BGA FLIP CHIP SOLDER BALL DIAMETER 10 MIL, PITCH 20 MIL SANDIA NATIONAL LABORATORIES BGA MCM * CONDUCTION COOLED BGA SGS THOMSON,, PKG COPPER HEAT SLUG 5 WATT, SYSTEM BOARD COPPER PLANE * LEADFRAME BGA HITACHI,L/F SUBSTRATE LOW COST PKG

SANDIA NATIONAL LABORATORIES BGA MCM * CONDUCTION COOLED BGA SGS THOMSON,, PKG COPPER

12 1 Memory MCM * MULTI CHIP MODULE CHIP 1 PKG SUBSTRATE MCM-L (EPOXY ),MCM-C ( GLASS CERAMIC), MCM-D ( ALUMINIUM) MCM-L LOW COST, MCM-C HIC, MCM-D COST TAB TCP * TAPE AUTOMATED BONDING BARE CHIP, FILM LEAD CHIP * TAPE CARRIER PACKAGE TAB CHIP TAPE PKG TAB QFP FINE PITCH, COB PKG, LCD CHIP PITCH 025 mm, 500 PIN LEAD 2 DTCP, 4 QTCP PCB LEAD CUT FORM

AUTOMATED BONDING BARE CHIP, FILM LEAD CHIP * TAPE CARRIER PACKAGE TAB CHIP TAPE PKG

13 1 Memory CSP FC COB COG KGD * CHIP SCALE PACKAGE CHIP 120% PKG COG, BLP, u-spring * FLIP CHIP BARE CHIP BOND PAD BUMP, PCB PKG * CHIP ON BOARD BARE CHIP, PCB CHIP WIRE BOND PACKAGING * CHIP ON GLASS FLIP CHIP, SUBSTRATE GLASS LCD * KNOWN GOOD DIE WAFER LEVEL BURN, FUNCTIONAL TEST CHIP CHIP DIE LOC * LEAD ON CHIP CHIP L/F INNER LEAD PKG, COL PKG ACCESS TIME PKG

PACKAGING * CHIP ON GLASS FLIP CHIP, SUBSTRATE GLASS LCD * KNOWN GOOD DIE WAFER LEVEL

14 1 Memory COL BLP * CHIP ON LEAD LOC L/F CHIP PKG * BOTTOM LEADED PACKAGE, CSP, )LG JEDEC PKG PKG PAD LEAD, SOJ 2 CHIP BOND PAD C-BLP (CENTER),S-BLP(SIDE), 3-D BLP(STACKED) TYPE APPLICATION FUJITSU SON PKG, HI-PIN, PCB PKG

15 1 Memory u-spring * MICRO SPRING FORMFACTOR LG CSP WF LEVEL GOOD DIE GOLD WIRE BONDING SPRING Au/Ni PLATING, PKG, PCB SOLDER FLIP CHIP, REPAIR, PCB PAD PCB FLEXIBILITY Au Au Ni Au TiW I/O PKG Technology Trend High-end FlipPAC TM Tape BGA Mid range FlipPAC TM M 2 BGA TM PBGA M 2 CSP TM QFP iquad Family FBGA RamPAC TM EconoCSP TM LQFP TQFP ubga FlashPAC TM SOP, SSOP, TSOP, TSSOP Surface Mount Fine Pitch / Thin Modules/System

Technology Trend High-end FlipPAC TM Tape BGA Mid range FlipPAC TM M 2 BGA TM PBGA M 2 CSP TM QFP iquad Family

슬라이드 제목 없음

슬라이드 제목 없음 Package Process및 Package유형 과정개요 및 소개 1. Package 개요 2. Package Process flow chart 3. Package 주요공정 설명 3.1 Saw 3.2 Die Bond 3.3 Wire Bond 3.4 Mold 3.5 Solder plating 3.6 Trim and Form 4. Package Trend 5.

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歯자료db통합0928