슬라이드 1

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1 기판재료와패키징 참고문헌 Kyocera 전자재료세라믹스, 반도출판

2 기판재료의요구조건 1) 절열성 2) 치밀성 3) 열팽창계수 4) 열전도도 5) 고밀도배선 6) 기판강도 7) 열충격성 8) 세라믹 / 도체접착강도 9) 도체의배선저항 10) 저유전율 11) 방사선방출 12) 기판칫수정확성 13) 저가격 14) 내식성

3 Al2O3 IC 기판 Kyocera

4 Al2O3 IC 기판의제조 제조공정 원료 Al2O3 + 소결조제 (SiO2, MgO, Al2O3...) 볼밀분쇄 혼합 ( 유기결합제, 용제 ), 닥터브레이드법 ( 후막제조공정 ) 으로 casting, green sheet 제조 절단또는구멍가공, 배선인쇄 적층 ( 가열, 가압 ) 소결

5 Al2O3 IC 기판의제조 테이프케스팅 : Thick film 제조기술, 닥터블레이드법, 슬러리제조후에블레이드로 green sheet 의두께조절. 원료 슬러리제조 케스팅 그린시트 그린시트가공 ( 절단, 구멍가공 ) 도체배선 ( 수직배선 / 도체페이스트충진, 평면배선 / 도체페스트스크린인쇄 ) 적층 ( 가열가압 ) 소결 ( 동시소성, 분위기, 바인더제거, 수축율제어 )

6 Al2O3 IC 기판의제조 green sheet 닥터브레이드법 ( 후막제조공정 ) 금속도체 paste사용 ( 점도, 칙소트로피, paste내의고형성분의입경과양, 유기바인더와용매 ) screen printing 소결 ( 분위기 ), 동시소결, 전극의선택 전극재료 Ag, Ag-Pd, Ag-Pt, Au; Cu, Ni, Al, W, Mo

8 Al2O3 IC 기판의제조 유리함유물 ; 도체페이스트에함유된유리분말로도체금속의수축과유리의젖음성향상, 전극과기판의접착성의향상 전극인쇄방법 동시소성 구성재료의수축율제어

9 Al2O3 IC 기판의제조건식후막기판 VS. 습식후막기판 건식후막기판 인쇄배선을하는기판이소결체인경우건식후막기판 도체나절연체형성시에페이스상태로인쇄후, 소성을반복 소결온도 C, 공기중, 귀금속전극사용으로 high cost, 다층화의한계. 습식후막기판 인쇄배선을하는기판이 green sheet 일경우습식후막기판 그린시트위에인쇄, 고밀도배선, 다층, 고신뢰화, 소결시의수축제어가어렵다. 1600C 의고온소결로전극선택에제한, 환원소결, 배선의미세배선및다층화가쉽다. 구멍가공의신뢰성이높다.

10 IC 기판앞으로의전개 재료특성향상 ( 강도, 유전율, 고주파특성, 열팽창계수등 ) 도체재료의선정 ( 접착강도, 전기저항, 소자접착부의신뢰성등 ) 기판칫수의고정도화 ( 외형칫수, 스루홀칫수, 휘어짐, 표면조도등 ) 저가격화 프로세스간략화 고속도화 재현성

11 저온소결세라믹스배선기판 새로운요구 1) 저온, 공기중의소결에의한저가격화 2) 배선도체의저저항, 기판유전율의저감을통한신호전파속도의고속화 3) 습식후막기판에의수동소자탑재 저융점의유리세라믹재료사용 ( 소결온도 1100 도이하 ) 전극금속 Cu(mp 1084C), Au(1063C), Ag(961C), Ag-Pd( C) 도체 paste 열팽창계수와기판강도가문제 Al2O3- 붕규산계결정화유리, 붕산주석바륨, SiO2-Al2O3-Na2O-B2O3, Al2O3- 붕규산유리

14 제조공정 LTCC 세라믹다층패키지 : 저온소성세라믹스

15 방열성복합기판 Al2O3/W 상에 Ni, Cu 의도금, DBC( 판에 Cu-O 공정액상이용으로 Cu 판접합, 1065C, N2 분위기 ) 강판위에 MgO-BaO-B2O3-SiO2 의결정화유리착막 Cu, Al, 스텐리스위에 Al2O3 용사한기판

Direct copper bonded (DCB) ceramic substrates: http://en.wikipedia.

16 Direct copper bonded (DCB) ceramic substrates: DBC is a complex material, in which two layers of copper are directly bonded onto an aluminium-oxide(al 2 O 3 ) or aluminium-nitride(aln) ceramic base. It has fine electrical insulation and thermal conductive properties, and has widely used in the power hybrids, power control circuits, power semiconductor modules, power supply modules, solid-state relays, high frequency switch mode power supplies(smps), electrical heating installations, semiconductor refrigerators, microware and military as well as aerospace technologies and other relative fields. Features of DCB ceramic substrates: 1 Fine mechanical strength, mechanically stable shape, good adhesion and corrosion resistant. 2 Excellent electrical and thermal conductive properties. 3 The number of thermal cycling reaches 50 thousands, high reliability. 4 The themal expansion coefficient is close to that of silicon, So thermal resistance is very low, At same time, the production technologies can be simplified. 5 May be structured just like printed circuit boards or IMS Substrates 6 Operating temperature:

17 세라믹패키징구조 다층기판의적층 비아홀 발생하는열의처리하는패키징기술, AlN, SiC 기판, 히트싱크부착

18 CERAMIC PACKAGING TECHNOLOGIES As with plastic packaging technologies, Japan leads the world in the production of ceramic packages. Over 80% of all ceramic packages used in noncaptive markets are supplied by three large Japanese companies: Kyocera, NTK, and Sumitomo Metals and Alloys. In addition, companies supplying their own in-house needs for ceramic packages include Shinko, Ibiden, NEC, Hitachi, Matsushita, Oki, Toshiba, and others. The primary ceramic package applications today fall into two categories: single-chip and multichip packages. Single-chip PGAs are the dominant ceramic package application, with a market estimated at $1.2 billion in 1993 and projected to grow to $2.0 billion by The highest-volume applications for PGA packages include computer and telecommunications products. The market for multichip packages was about $670 million in 1993, half the size of the PGA market. But multichip packages are expected to surpass the PGA market by 1997 with sales of over $3.0 billion. The growth in multichip packaging is driven by the increased demands of advanced personal computers, workstations, mainframes, supercomputers, and evolving HDTV applications.

19 Ceramic packaging trends (

20 Consumer ceramic substrate (

21 Low-cost ceramic co-firing process with copper (

22 Glass ceramic/copper with surface resistors (Phttp://

MULTI-CHIP POWER MODULES (MCPMs) 참고자료 http://www.

23 MULTI-CHIP POWER MODULES (MCPMs) 참고자료

24 제조공정 PGA: Pin Grid Array 패키지

25 Ceramic packages for electronics 참고자료 ceramic dual inline packages (C-DIP), ceramic small outline packages (C-SOP), ceramic pin grid array packages (C-PGA), ceramic quad flat packages (C-QFP), ceramic quad flat J-leaded packages (C-QFJ) ceramic quad flat non-leaded packages (C-QFN).

歯자료db통합0928

歯자료db통합0928 1 Memory PKG DIP * DUAL IN-LINE PACKAGE PIN PKG LEAD LEAD PITCH 100 MIL (254mm), PKG WIDTH 300/400/600 MIL (PIN HOLE WIDTH ), PIN 6-64 P-DIP C-DIP SDIP SK-DIP SIP * PLASTIC DIP MOLD ( ) PLASTIC( EPOXY