PowerPoint 프레젠테이션

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1 Scanning LIB. Safety SPECIFICATION FOR APPROVAL RoHS CUSTOMER ITEM : LG Electronics inc. : Power Supply Unit. P/NO Model Name Customer Supplier LGP32F-12P EAY LGP32F-12P DATE : Revision : 1.0 Remark : MP (PCB REV 1.0) Producing District : HWASUNG,KOREA ( 한국화성 ) ( 생산지 ) QINGDAO,CHINA ( 중국청도 ) Safety Standard Parts [ 안전규격부품 List ] Power Cord, Power Plug, X/Y-Capacitor, Power Switch, Fuse, SMPS Trans, Stand-By Trans, Photo coupler, Insulation( 절연 ) Resistor, Discharge( 방전 ) Resistor, Fusing Resistor, FBT.CPT, CPT Socket, DY, D-Coil, Line Filter, PCB Material, Front / Back-cover Material Relay(1-2 차간 ), Varistor, Adapter EMC Standard Parts [ 전자규격부품 List ] Power Plug, Line Filter, X-Capacitor, Y-Capacitor, SMPS Trans, Tuner, Saw-Filter, Shield Case, Oscillator, Pattern Change Green [ 유해물질확인사항 ] This item must meet the standards of LG Electronics for six major substances as designated by RoHS for control. (Cd: 10ppm under, Pb/Hg/Cr+6/PBB/PBDE: 100 ppm under) YUYANG DNU CO., LTD 488-1, YULAM-LI, PALTAN-MYEON, HWASUNG-SI, KYONGGI-DO, KOREA Tel : , Fax :

2 Documentation For Approval Model Name Customer Supplier LGP32F-12P EAY LGP32F-12P Written Checked Approved 2 Date:

3 Contents NO. A table of contents Page 1 Documentation of Approval 1~2 2 Contents 3 3 Revision History 4 4 CTQ Management & Model Marking 5 Specification 5 1. INTRODUCTION 2. SPECIFICATION 2.1 Input Requirements 2.2 Power Output Characteristics 2.3 Environment Requirement 2.4 Dielectric Strength Voltage and Insulation Resistance 2.5 Burn-in 2.6 Interface 2.7 Product Safety 2.8 Construction 2.9 Function of protection 2.10 Sound Noise Characteristics Connector Specification 2.12 PCB Dimension Apply to Eyelet point Electrical Characteristics 2.15 Mechanical Characteristics 6~16 6 Schematic Diagram 17~18 7 Block Diagram 19~20 8 Parts List 21~25 9 Process Marking 26~27 10 PCB Layout 28~32 11 Safety Parts 33~35 12 Mechanical Drawing 36~37 13 Packing Drawing 38~44 14 Bar-code Label Drawing 45~46 15 Labeling Point 47~48 16 Workmanship Point 49~50 17 Manufacturing Process (Flow-Chart) 51~53 18 * Appendix A1. PCB Check list A2. Warranty letter 54~65 3 Date:

4 Revision History Rev No. Contents 0.1 Apply to DV (PCB REV 0.4) PCB P/No. : EAX (1.3) Date of Approval Checked J.H.SHIN Remark DV 1st Edition. 0.2 Apply to PV (PCB REV 0.5) PCB P/No. : EAX (1.4) J.H.SHIN PV 1st Edition. 1.0 Apply to MP (PCB REV 1.0) PCB P/No. : EAX (1.6) J.H.SHIN 1. Surge Solution - Add ZD104 : 15V SOD Add C108 : 100pF 50V MP Edition. 4 Date:

5 CTQ Management No. Contents Page Power Factor Power Output Characteristics Stand by Power Consumption 10 5 Date:

6 Specification 6 Date:

7 1. INTRODUCTION 1.1 Scope This approval is the description related to every electrical and structural specifications and reliability For Power Supply Unit used on 32 inch LGE LED TV. 1.2 Customers product related items Product : Power Supply Unit Part code : EAY Product name Product name : LGP32F-12P Revision code : SPECIFICATION 2.1 Input Requirements Nominal Input Voltage Input Voltage Variation Input Current Nominal Frequency Frequency Variation Range Phase Leakage Current Surge Immunity Hold-up Time Lightning Surge Inrush Current AC 100V to AC 240V AC 90V to AC 264V Under 1.6Arms. (at 100Vac & Nominal Load) Under 0.8Arms. (at 240Vac & Nominal Load) 50 / 60 Hz 47 Hz to 63 Hz Single 0.7mA_peak. (100Vac ~ 240Vac) ± 4kV / 1000ns / 0 to 360 More than 20ms at 100Vac and maximum output Set condition. 2kA Normal, Common Mode 80A zero-peak max at cold start and any specified line, load, temperature conditions Power Factor over than 0.4 at Vac & max load condition 7 Date:

8 2.2 Power Output Characteristics Output Voltage Variable range [V] Rated Current (Min, Max) [Amean] Voltage Regulation [V] Ripple Voltage [mvp_p] 3.5V (STBY) 3.325V ~ 3.675V 0.3W Under (15mA) A (0~1.2A) (ON condition) ± 5% 250 mvp_p (Set Condition) 12V 11.4V ~ 12.6V 0.5A (0.3~0.5A) ± 5% 350 mvp_p 24V 22.8V ~ 25.2V 2.4A (0.1~2.4A) ± 5% 500 mvp_p * On Condition : In a moment of Power_ON Signal activated, the current of 3.5V output should be limited within 40mA(Max) at LCD TV condition for stability. Do not turn Power_ON Signal on at the load condition of 3.5V output, more than 40mA. * Total regulation for each output circuit includes the results of input voltage variation, load variation, warm-up drift and temperature change. * The following instruments shall be used for measuring ripple noise. 1. Probe having impedance ratio of 1:1. 2. Oscilloscope having frequency characteristic of 100MHz or more. - Test Point : power output each pin Add Electrolytic Capacitor 47 μf μf Power Supply Unit Output Voltage + Load 700mm Oscilloscope Measurement point Ripple and noise are measured at the end of output cable which are added a 0.1uF ceramic capacitor and 47uF electrolytic capacitor. ( connected parallel ) * Power turn on system (Only E/Load condition) If Main Board is opened, that is electrical load condition, drive on signal must be turn on after about 1.5s behind power on signal 8 Date:

9 2.2.1 Stand By Power Consumption Output Voltage 3.5V (STBY) 12V 24V Load [A] Don t Care (Power-Off) Wattage [W] Less than 0.3W Under (230Vac / 50Hz) 2.3 Environment Requirement Operating Temperature Range -10 to 40 (60 :No Hardware Failure, TV SET Condition) Operating Humidity Range 30 to 85 % Storage Temperature Range -25 to 85 deg. Storage humidity Range 5 to 90 % MTBF (Mean Time Between Failure) Cooling Condition Shock 50,000 hour Natural Air 98 m s2 Shock test consists of pivoting the power supply, from one edge of it s bottom side, on a flat surface (such as wood having thickness of 10mm or more) and allowing the opposite edge to fall from a height of 50mm to this surface. The test is performed three times on each edge of the bottom side of the power supply 2.4 Dielectric Strength Voltage and Insulation Resistance Safety Dielectric Strength Voltage Insulation Resistance AC 3KV or DC 4240V 1 Min 10 ma (Test SPEC) AC 3.6KV 1 Sec 10 ma (PSU Mass Production) Between Primary and All Secondary Circuits. Insulation resistance shall be more than 8M ohm (at DC 500V) Between Primary Live, Neutral line and Secondary. * Above tests are performed at room temperature in non-condensing atmospheric conditions * Frame grounds are connected to secondary circuits. 2.5 Burn-in More than 2 hours at 45 (±5 ), Normal input voltage. AC on/off must be test 1 time after burn-in. 80% Load of specification. 9 Date:

10 2.6 Interface Appellation Explanation Signal Direction Action POWER ON Vcc Circuit ON/OFF Input Hi : Vcc ON Low : Vcc OFF 2.7 Product Safety Safety Safety Standards to be applied EMI/RFI Standards to be applied Design to meet the requirements as follows UL60065, UL60950, IEC60065 and Design to meet the requirements as follows FCC and EN55020, EN55013 Class B with 4dB minimum margin. 2.8 Construction Weight Unit Size Less than 600g 155(W) X 155(L) X 26.6(H) 2.9 Function of protection Protection Over Current Short Circuit Output Circuit Trip Point Min Max Notes STBY 3.5V 2.0A 5.0A Auto Re-start 12V 1.0A 10.0A Latch 24V 3.0A 5.0A Latch STBY 3.5V - Auto Re-start 12V - Latch 24V - Latch * This Power Supply has above-mentioned protections. * Short circuit protection between different output terminals is not considered. * Trip point for over voltage indicates the operating point when the output voltage slowly increases. * The conditions of Over Current measurement Multi output(3.5v,12v,24v) is nominal load state except an over current measurement. 10 Date:

11 2.10 Sound Noise Characteristics. PSU Noise Specification 22.5 db(a) / 20.u Pa 2.0E-5 Pa (1/1 octave, A-weighting, to 1khz ~ 16khz Total overall Measure Location : Anechoic Room Measure Condition : At a distance of 60cm mic Full white pattern, at AC 110V/220V The max specification (measure 3 points, at PSU center and left & right on the side) 11 Date:

12 2.11 Connector Specification Connectors Usage SK101 Type : YW396-03AV Maker : YEON-HO Pin No. Signal 1 NEUTRAL 2 LIVE P202 Type : 20022WR-14BD(H14BD2) Maker : YEON-HO Pin No. Signal 1 24V 2 24V 3 24V 4 24V 5 24V 6 GND 7 GND 8 GND 9 GND 10 GND 11 ERROR 12 INV-ON 13 A-DIM 14 P-DIM Type : SMAW200-H24S2 Maker : YEON-HO P201 Pin No. Signal Pin No. Signal 1 POWER-ON 2 24V 3 24V 4 24V 5 GND 6 GND 7 GND 8 GND 9 3.5V V V V 13 GND 14 GND 15 GND 16 N.C 17 12V 18 INV-ON 19 12V 20 A-DIM 21 12V 22 P-DIM 23 N.C 24 ERROR 12 Date:

13 2.12 PCB Dimension. 4.5mm 4.5mm 4.5mm 155mm 155mm 4.5mm 22.0mm Max PCB : 1.6mm 3mm Max 1) Power board PCB : 155mm X 155mm X 1.6(T)mm 2) Component Height : Max 22.0mm 3) Lead Cutting : Max 3mm 4) PCB Material : FR-1,KB,DS,L,CTI Date:

14 2.13 Apply to the Eyelet point. (LGP32F-12P) Apply to the Eyelet point 2.0Φ : EL1,EL2,EL17,EL18,EL19,EL20,EL21,EL22,EL24,EL25,EL26,EL27 (12EA) Apply to the small Eyelet point 1.6Φ : EL3,EL4,EL5,EL6,EL7,EL8,EL10,EL11,EL23,EL28,EL29, EL30,EL31,EL32,EL33 (15EA) 14 Date:

15 2.14 Electrical Characteristics No. Test Item Test method Intermittent Operation stability Test Low temperature operation Low temperature Storage test Leave At low temperature Heat cycle storage test The switching regulator shall ON/OFF for 20,000 time at an Interval of 10 sec at maximum load, after that electrical Characteristics shall be satisfied. The switching regulator is left at the operating guarantee Minimum temperature for 2 hours without applying electricity. After that power shall be turned on, and then the electrical Characteristics shall be satisfied. The switching regulator is left at minimum storage Temperature for 96 hours or more. Then the switching regulator is left at a room temperature and humidity for 1 hour or more, after that electrical characteristics shall be satisfied. The switching regulator is 10 consecutive temperature cycle that shown below is performed and then leave them at room temperature and humidity for 1 hour or more. After that, electrical characteristics shall be satisfied. Time 30 minutes minutes 25 -> -20 Temperature 60 minutes Minimum storage temperature (-20 ) 30 minutes -20 -> minutes minutes 25 -> minutes Maximum storage temperature (70 ) 30 minutes 70 -> 25 5 Heat shock test Heat shock test performed under following conditions without applying electricity and then leave them at room temperature and humidity for 1 hour or more. After that, electrical characteristics shall be satisfied. Condition : -45 (30minutes), 120 (30minutes), Switching time : Less than 5 minutes, 200 cycles. 15 Date:

16 2.15 Mechanical Characteristics No. Test Item Test method 1 Appearance 2 Vibration There shall be no contaminant or dirt on the switching regulator which has adverse effect on electrical characteristics. There shall be no excessive unevenness or scratches on the plated or painted surface. While applying electricity : Vibration frequency : 5 ~ 100Hz Acceleration : 4.9 m/s 2 Vibration in X,Y,Z direction for 30 minutes While applying electricity : Vibration frequency : 5 ~ 100Hz Acceleration : 14.7 m/s 2 Vibration in X,Y,Z direction for 30 minutes After that electrical characteristics shall be satisfied. There shall be no damage to appearance and construction. Shock : 98 m/s 2 3 Shock On the oak more than 10mm thickness with the flat face, raise the one side for 50mm, and it carries out each side free fail for three sides. There shall be no damage to appearance and construction. 16 Date:

17 Schematic Diagram 17 Date:

18 "RB"Type *Cap option* N.C C pF 1KV R501 62K 1W T501 EE S-LS01 or 12S-LS02 C V 82uF C V 82uF C112 N.C *Cap option* EAY C110,C111:82uF/450V C112:N.C EAY _ 500V C110,C111,C112:82uF/500V R R W 1W PRN PRN C pF 50V C pF 50V NC CS FB BA IC501 ICE3BR4765JZ C uF 50V DRAIN VCC GND C uF 50V C506 10uF 50V NXB R K C511 N.C ZD501 N.C Q502 KTN2222AS E ZD503 B 20V C R507 1K R506 75K D503 HER108G C504 47uF 50V NXB D501 HER108G R /4W RD C pF 1KV D502 HER108G R /4W RD B+ D D201 SB5100 C uF 10V NXB R /4W RD J201 LB201 N.C C202 N.C R % C203 N.C 3.5V 1.2A POWER_ON 24V P201 SMAW200-H24S V AC2 3 1 A BD101 TS4B05G 4 C 2 AC1 C pF 50V ZD504 N.C R /4W IC502 EL817MB-DT IC202 R202 1K AZ431LANTR-E1 K A R R203 10K C204 N.C C uF R K R K 1% 1% 3.5V 12V V INVERTER_ON ADIM PDIM ERROR CY pF 250V CY pF 250V VCC R510 10K Q501 KTC3551T E B C R R504 1K 1/4W IC503 EL817MB-DT R /4W R210 LF101 LLF C510 N.C ZD502 20V C505 47uF 50V NXB C Q201 KTN2222AS E B 220 1/4W R209 10K C uF 50V R POWER_ON *R102 M-Forming* S 1 CY pF 250V C pF 1KV R K 2W CX uF 275V R M 1/2W IC101 SSC1S311 D103 1N4148W R R HS1 *HEAT-SINK* Q101 G D S MDF10N65 D101 HER108G C pF 1KV T101 EER3618 D 6 5 B C pF 1KV D252 SB5100 R W C uF 25V NXB R K 2W 12V 0.5A P WR-H14BD V T3.15A H 250V F101 VA101 INR14D621K TH101 5D-15 C106 N.C R105 1K ST NC BD FB/OLP DRV OCP VCC GND C pF 50V R R /4W C103 10uF 50V NXB R112 10K VCC ZD104 15V C pF 50V R W ZD101 N.C ZD103 16V R104 15K 1 12S-LM07 11 C271 R pF 22 1KV 1W D251 MBRF20200CT *HEAT-SINK* HS2 C uF 35V NXB C uF 35V NXB R K 2W R K 2W 24V 2.4A ERROR R R K R255 30K 1% R257 30K 1% 12 INVERTER_ON LIVE 3 1 YW396-03AV SK101 NEUTRAL R111 47K C uF 50V C pF 50V ZD102 N.C 1/4W IC102 EL817MB-DT R K R261 30K C255 C uF 50V R256 1K 1% R % ADIM PDIM IC251 KA431A K A R N.C R K 1% CY110 CY111 LB210 THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. *HEAT-SINK* 35*15*20H 1500pF 250V CY112 N.C JUMPER R-TYPE LB211 N.C PCB P/N : EAX PSU P/N : EAY EAY _ 500V Circuit REV 0.6 PCB REV 1.0 LGP32F-12P STBY\MULTI 1 1

19 Block Diagram 19 Date:

20 20 Date:

21 Parts List 21 Date:

22 LGP32F-12P (EAY ) NO. L/V Q'ty UNIT LOCATION SPECIFICATION DESCRIPTION MAKER MI HS1 MULTI FET ASS'Y HEAT SINK ASS'Y 1 MI 1 EA HS1 LGP32F-12P (35*15*20) HEAT SINK 2 MI 1 EA Q101 TK7A65D TO-220FP MDF10N65B TO-220FP PFF10N65 TO-220FP 3 MI 1 EA FOR Q101 M/S S/W + Φ3.0 7L SILVER PLATE HEAD SCREW 4 MI 0.01 GR FOR Q101 HC300 C-5500 G746 YG6111 DS-323 SILICON GREASE MI HS2 MULTI DIODE ASS'Y HEAT SINK ASS'Y 5 MI 1 EA HS2 LGP32F-12P (35*15*20) HEAT SINK 6 MI 1 EA D251 MBRF20200CT, 20A, 200V TO-220FP MBRF20U200CT/CTA, 20A, 200V TO-220FP FMXA-2202S, 20A, 200V TO-220FP 7 MI 1 EA FOR D251 M/S S/W + Φ3.0 7L SILVER PLATE HEAD SCREW 8 MI 0.01 GR FOR D251 HC300 C-5500 G746 YG6111 DS-323 SILICON GREASE MI LGP32F-12P MI COMPONENTS MI ASS'Y TS4B05G V 4A 9 MI 1 EA BD101 KBJ406G 600V 4A D4SB60L 600V 4A DIODE TS4B05G 600V 4A 10 MI 2 EA C110,C111 KMF 82uF 450V M RB P7.5 Φ18X31.5 SK 82uF 450V M RB P7.5 Φ18X30 CAPACITOR, ALUMINUM NK 100pF 250V K P10,Y1 CD 100pF 250V K P10,Y1 11 MI 1 EA CY103 CT81 100pF 250V K P10,Y1 CAPACITOR, CERAMIC SD 100pF 250V K P10,Y1 DA 100pF 250V K P10,Y1 NK 470pF 250V K P10,Y1 CD 470pF 250V K P10,Y1 12 MI 2 EA CY101,CY102 CT81 470pF 250V K P10,Y1 CAPACITOR, CERAMIC SD 470pF 250V K P10,Y1 DA 470pF 250V K P10,Y1 NK 1500pF 250V M P10, Y1 CD 1500pF 250V M P10, Y1 13 MI 1 EA CY110 CT pF 250V M P10, Y1 CAPACITOR, CERAMIC SD 1500pF 250V M P10, Y1 DA 1500pF 250V M P10,Y1 14 MI 1 EA CX101 PCX uF 275V P15 MPX 0.47uF 275V P15 CAPACITOR, FILM SB V 5A P20 15 MI 2 EA D201,D252 SB V 5A P20 DIODE SR V 5A P20 T3.15A H 250V 215 VIOLET(1-LINE) 16 MI 1 EA F101 T3.15A H 250V 50CT VIOLET(1-LINE) FUSE, TIME LAG T3.15A H 250V TSC VIOLET(1-LINE) MORS 100KΩ 2W J SMALL P20 M-Forming 17 MI 1 EA R102 RSD02 100KΩ 2W J SMALL P20 M-Forming RESISTOR, METAL OXIDE FILM PR02 100KΩ 2W J SMALL P20 M-Forming JS MI 1 EA PG100 SPCC 0.4T GND REINFORCE GND PIN 19 MI 3 EA IC102,IC502,IC503 EL817MB(DT) LTV817M-BN IC FET DIODE YUWON NRT HUAGUANG INNO D&C TOSHIBA MAGNACHIP POWER DEVICE JUNGWOO SEOUL METAL ASEA BOLT TANJIN METAL CHANG AMLS ONG SHINETSU MOMENTIVE DONGYANG SILICON YUWON NRT HUAGUANG INNO D&C SENSITRON KEC SANKEN JUNGWOO SEOUL METAL ASEA BOLT TANJIN METAL CHANG AMLS ONG SHINETSU MOMENTIVE DONGYANG SILICON TSC LITEON SHINDENGEN DACHANG SAMYOUNG SUSCON APEX INTEC TDK YINANDON SAMWHA DONGIL ELEC. APEX INTEC TDK YINANDON SAMWHA DONGIL ELEC. APEX INTEC TDK YINANDON SAMWHA DONGIL ELEC. EUROPTRONIC SENSITRON LITEON TSC LITTELFUSE Dainfuse WALTER ABCO SMART SAMSUNG JS EVERLIGHT LITEON 20 MI 1 EA IC501 ICE3BR4765JZ IC INFINEON 21 MI 1 EA LF MI 1 EA TH101 CV620280SH LLF-124 LLF-124 LLF-124 DSC5D15 5Ω 6A Φ15 MF72-5D15 5Ω 6A Φ15 WTR15D5 5Ω 6A Φ15 ICL-5W 5R00MSMT LINE FILTER THERMISTOR NTC 23 MI 1 EA T101 12S-LM07(EER uH) TRANSFORMER 24 MI 1 EA T MI 1 EA VA MI 1 EA P202 12S-LS01(EE mH) 12S-LS02(EE mH) INR14D621K-CAP 620V Φ14 TUBE WMR14D621K 620V Φ14 TUBE SVC621D-14ABW7 620V Φ14 TUBE 20022WR-14BD 20022WR-H14BD2 TRANSFORMER VARISTOR 27 MI 1 EA SK101 YW396-03AV WAFER YEONHO 28 MI 1 EA P201 SMAW200-H24S2 24PIN WHITE WAFER YEONHO WAFER TNC SOOJUNG FEELUX DONG YANG TELECOM DSC NSE Xiamen Wanming SMART JIANGSU CHANNELON DONG YANG TELECOM SOOJUNG CLOVER HITECH FEELUX BUJEON JIANGSU CHANNELON FEELUX DONG YANG TELECOM SOOJUNG TDK CLOVER HITECH AMOTECH Xiamen Wanming SAMWHA YEONHO YEONHO 22 Date:

23 LGP32F-12P (EAY ) SMT LGP32F-12P SMT COMPONENTS SMT ASSEMBLY 29 SMT 1 EA C pF 50V J 1608 NPO CAPACITOR, CHIP 30 SMT 2 EA C507,C pF 50V J 1608 NPO CAPACITOR, CHIP 31 SMT 1 EA C pF 50V J 1608 NPO CAPACITOR, CHIP 32 SMT 2 EA C105,C pF 50V K 1608 X7R CAPACITOR, CHIP 33 SMT 1 EA C uF 50V K 1608 X7R CAPACITOR, CHIP 34 SMT 3 EA C206,C502,C uF 50V K 1608 X7R CAPACITOR, CHIP 35 SMT 2 EA C107,C uF 16V K 1608 X7R CAPACITOR, CHIP 36 SMT 1 EA ZD SMT 1 EA D103 BZT52C15 15V SOD-123 MMSZ5245BT1G 15V SOD-123 MMSZ5245B 15V SOD-123 SDS4148G 100V 150mA SOD-123 1N4148W 100V 150mA SOD-123 1N4148W 100V 150mA SOD-123 MMSD4148T1G 100V 200mA SOD-123 DIODE, ZENER DIODE SAMWHA YAGEO HEC SAMWHA YAGEO HEC SAMWHA YAGEO HEC SAMWHA YAGEO HEC SAMWHA YAGEO HEC SAMWHA YAGEO HEC SAMWHA YAGEO HEC DIODES ONSEMI RECTRON AUK DIODES RECTRON ONSEMI 38 SMT 1 EA IC101 SSC1S311, SO-8 IC SANKEN 39 SMT 1 EA IC202 TLV431BSN1T1G 1.24V ±0.5% SOT-23 SJ432BS 1.24V ±0.5% SOT-23 AZ431LANTR-E1 1.24V ±0.5% SOT-23 IC ONSEMI AUK BCD 40 SMT 1 EA IC251 SNF431BS 2.5V ±0.5% SOT-23 AS431ANTR-E1 2.5V ±0.5% SOT-23 KIA431BM 2.5V ±0.5% SOT SMT 1 EA R106 47Ω J 1608 RESISTOR, CHIP 42 SMT 1 EA R Ω J 1608 RESISTOR, CHIP 43 SMT 1 EA R Ω J 1608 RESISTOR, CHIP 44 SMT 3 EA R105,R202,R507 1KΩ J 1608 RESISTOR, CHIP 45 SMT 1 EA R KΩ J 1608 RESISTOR, CHIP 46 SMT 1 EA R KΩ J 1608 RESISTOR, CHIP 47 SMT 4 EA R112,R203,R209,R510 10KΩ J 1608 RESISTOR, CHIP 48 SMT 1 EA R104 15KΩ J 1608 RESISTOR, CHIP 49 SMT 1 EA R261 30KΩ J 1608 RESISTOR, CHIP 50 SMT 1 EA R111 47KΩ J 1608 RESISTOR, CHIP 51 SMT 1 EA R506 75KΩ J 1608 RESISTOR, CHIP 52 SMT 1 EA R KΩ J 1608 RESISTOR, CHIP 53 SMT 1 EA R Ω F 1608 RESISTOR, CHIP 54 SMT 1 EA R Ω F 1608 RESISTOR, CHIP 55 SMT 1 EA R256 1KΩ F 1608 RESISTOR, CHIP 56 SMT 1 EA R KΩ F 1608 RESISTOR, CHIP 57 SMT 1 EA R KΩ F 1608 RESISTOR, CHIP 58 SMT 1 EA R KΩ F 1608 RESISTOR, CHIP 59 SMT 2 EA R255,R257 30KΩ F 1608 RESISTOR, CHIP 60 SMT 1 EA R107 10Ω J 3216 RESISTOR, CHIP IC AUK BCD KEC SAMSUNG YAGEO SAMSUNG YAGEO SAMSUNG YAGEO SAMSUNG YAGEO SAMSUNG YAGEO SAMSUNG YAGEO SAMSUNG YAGEO SAMSUNG YAGEO SAMSUNG YAGEO SAMSUNG YAGEO SAMSUNG YAGEO SAMSUNG YAGEO SAMSUNG YAGEO SAMSUNG YAGEO SAMSUNG YAGEO SAMSUNG YAGEO SAMSUNG YAGEO SAMSUNG YAGEO SAMSUNG YAGEO SAMSUNG YAGEO 23 Date:

24 LGP32F-12P (EAY ) 61 SMT 1 EA R Ω J 3216 RESISTOR, CHIP 62 SMT 1 EA Q501 BCW66GLT SOT-23 NPN KTC3551T 80V 1A TSM NPN 2SC5865 SOT-23 NPN TRANSISTOR KTN2222AS 40V 600mA SOT-23 NPN 63 SMT 2 EA Q201,Q502 MMBT2222ALT 40V 600mA SOT-23 NPN PMBT2222A 40V 600mA SOT-23 NPN TRANSISTOR SBT2222A 40V 600mA SOT-23 NPN HT-130A SMT 0.05 GR HT-130D-7 BOND LOCTITE 3609 AI LGP32F-12P A/I COMPONENTS AI ASSEMBLY 65 AI 1 EA C201 NXB 1500uF 10V M P5 Φ10X20 SG 1500uF 10V M P5 Φ10X20 CAPACITOR, ALUMINUM 66 AI 2 EA C251,C252 NXB 1000uF 35V M P5 Φ12.5X20 SG 1000uF 35V M P5 Φ13X21 CAPACITOR, ALUMINUM 67 AI 1 EA C253 NXB 470uF 25V M P5 Φ10X16 SG 470uF 25V M P5 Φ10X16 CAPACITOR, ALUMINUM 68 AI 2 EA C103,C506 NXB 10uF 50V M P5 Φ5X11 SG 10uF 50V M P5 Φ5X11 CAPACITOR, ALUMINUM 69 AI 2 EA C504,C505 NXB 47uF 50V M P5 Φ6.3X11 SG 47uF 50V M P5 Φ6.3X11 CAPACITOR, ALUMINUM DG 100pF 1KV K P5 125 CK 100pF 1KV K P AI 1 EA C512 CK45 100pF 1KV K P5 125 CAPACITOR, CERAMIC EKR 100pF 1KV K P5 125 CT81 100pF 1KV K P5 125 DG 470pF 1KV K P5 125 CK 470pF 1KV K P AI 1 EA C102 CK45 470pF 1KV K P5 125 CAPACITOR, CERAMIC EKR 470pF 1KV K P5 125 CT81 470pF 1KV K P5 125 DG 1000pF 1KV K P5 125 CK 1000pF 1KV K P AI 4 EA C101,C270,C271,C501 CK pF 1KV K P5 125 CAPACITOR, CERAMIC EKR 1000pF 1KV K P5 125 CT pF 1KV K P5 125 BFS3550R2F SINGLE RADIAL 73 AI 1 EA LB210 HBR S 3550 PT SINGLE RADIAL INDUCTOR, BEAD FILTER LEAD SER BA SINGLE RADIAL EL3,EL4,EL5,EL6,EL7, 74 AI 15 EA EL8,EL10,EL11,EL23,EL28, 1.6X3.0 EYELET EL29,EL30,EL31,EL32,EL33 EL1,EL2,EL17,EL18,EL19, 75 AI 12 EA EL20,EL21,EL22,EL24,EL25, 2.0X3.0 EYELET EL26,EL27 J6,J9,J16,J18,J20, 76 AI 17 EA J23,J24,J25,J27,J28, J34,J36,J38,J39,J40, Φ0.6 JUMPER WIRE J201,CY111 UF1007 1KV 1A DO AI 4 EA D101,D501,D502,D503 UF4007 1KV 1A DO-41 HER108G 1KV 1A DO-41 DIODE UF4007 1KV 1A DO-41 1N5246B 16V DO AI 1 EA ZD103 1N5246B 16V DO-35 DIODE, ZENER MTZJ16B 16V DO-34 1N5250B 20V DO AI 2 EA ZD502,ZD503 1N5250B 20V DO-35 DIODE, ZENER MTZJ20B 20V DO AI 1 EA R101 MSR37 1.2MΩ 1/2W J SURGE RESISTOR, FIXED PRC92 1.2MΩ 1/2W J SURGE CARBON COMPOSITION CRS 1Ω 1/4W J SMALL 81 AI 1 EA R505 RDM94 1Ω 1/4W J SMALL RESISTOR, CARBON FILM SFR25 1Ω 1/4W J SMALL CRS 22Ω 1/4W J SMALL 82 AI 3 EA R109,R110,R503 RDM94 22Ω 1/4W J SMALL RESISTOR, CARBON FILM SFR25 22Ω 1/4W J SMALL CRS 100Ω 1/4W J SMALL 83 AI 1 EA R502 RDM94 100Ω 1/4W J SMALL RESISTOR, CARBON FILM SFR25 100Ω 1/4W J SMALL CRS 220Ω 1/4W J SMALL 84 AI 1 EA R210 RDM94 220Ω 1/4W J SMALL RESISTOR, CARBON FILM SFR25 220Ω 1/4W J SMALL CRS 270Ω 1/4W J SMALL 85 AI 1 EA R207 RDM94 270Ω 1/4W J SMALL RESISTOR, CARBON FILM SFR25 270Ω 1/4W J SMALL CRS 330Ω 1/4W J SMALL 86 AI 1 EA R201 RDM94 330Ω 1/4W J SMALL RESISTOR, CARBON FILM SFR25 330Ω 1/4W J SMALL CRS 1KΩ 1/4W J SMALL 87 AI 1 EA R504 RDM94 1KΩ 1/4W J SMALL RESISTOR, CARBON FILM SFR25 1KΩ 1/4W J SMALL MORS 22Ω 1W J SMALL 88 AI 2 EA R270,R271 RSD01 22Ω 1W J SMALL RESISTOR, METAL OXIDE FILM PR01 22Ω 1W J SMALL MORS 2.2KΩ 2W J SMALL 89 AI 3 EA R250,R251,R252 RSD02 2.2KΩ 2W J SMALL RESISTOR, METAL OXIDE FILM PR02 2.2KΩ 2W J SMALL MORS 62KΩ 1W J SMALL 90 AI 1 EA R501 RSD01 62KΩ 1W J SMALL RESISTOR, METAL OXIDE FILM PR01 62KΩ 1W J SMALL 91 AI 1 EA R114 WNPS 0.24Ω 2W J SMALL PRN Ω 2W J SMALL RESISTOR, WIRE WOUND 92 AI 2 EA R511,R512 WNPS 0.82Ω 1W J SMALL PRN Ω 1W J SMALL RESISTOR, WIRE WOUND 93 AI 1 EA PCB LGP32F-12P (155*155*1.6T) FR-1,KB,DS,L,CTI-600 PCB SAMSUNG YAGEO ONSEMI KEC ROHM KEC ONSEMI NXP AUK HITECH KOREA HITECH KOREA LOCTITE SAMYOUNG SUSCON SAMYOUNG SUSCON SAMYOUNG SUSCON SAMYOUNG SUSCON SAMYOUNG SUSCON APEX INTEC DONGIL ELEC TDK SAMWHA YINANDON APEX INTEC DONGIL ELEC TDK SAMWHA YINANDON APEX INTEC DONGIL ELEC TDK SAMWHA YINANDON SAMWHA HANBACK SCC SAMSUNG JS DOSUNG DAERIN SAMSUNG JS DOSUNG DAERIN DIELEC DAEALEAD TPI DIODES DACHANG RECTRON TSC RECTRON VISHAY ROHM RECTRON VISHAY ROHM SMART ABCO SMART ABCO SMART ABCO SMART ABCO SMART ABCO SMART ABCO SMART ABCO SMART ABCO SMART ABCO SMART ABCO SMART ABCO SMART ABCO SMART DUCK SUNG HT CIRCUIT(QINGDAO) DONGMYUNG CIR TIAN FENG TIS KOREA 24 Date:

25 ETC LGP32F-12P (EAY ) LGP32F-12P SUBSIDIARY MATERIALS 94 ETC EA LGP32F-12P 580*450 *173* 8T BOX CARTON 95 ETC EA LGP32F-12P 575*159*8T (Cross board A) BOX PARTITION 96 ETC EA LGP32F-12P 450*159*8T (Cross board B) BOX PARTITION 97 ETC EA LGP32F-12P 575*445*8T BOX PAD 98 ETC 1.00 EA 440 * 220 BUBBLE SHEET 99 ETC 1 EA 40 X 8 NY WHITE 93CODE 19DIGIT BAR CODE 100 ETC 30 GR EF-9301(g) ILF-714(kg) FLUX 101 ETC 0.01 Kg S-1000 K8418 DILUENT 102 ETC Kg HSE-11 B20 BAR (SN:99%,AG:0.3%,CU:0.7%) SN:99%, AG:0.3%, CU:0.7% SOLDER BAR 103 ETC Kg HSE-11 B20 WIRE (SN:99%,AG:0.3%,CU:0.7%) SN:99%, AG:0.3%, CU:0.7% SOLDER WIRE H-828W E ETC 3 GR QS9112 RTV TSE3854DS-W BOND (RTV) KE402RTV DS818 NEWEA IND DAESAN. HANYOUNG JAEIL QXBW NEWEA IND DAESAN. HANYOUNG JAEIL QXBW NEWEA IND DAESAN. HANYOUNG JAEIL QXBW NEWEA IND DAESAN. HANYOUNG JAEIL QXBW DUCKJIN S&P JAEIL QXBW SHUN JIN HANA. ALPHA ION ELEC KI DYFENCO HEESUNG METAL SEOUL ALLOYMETAL HEESUNG METAL SEOUL ALLOYMETAL ONG ONG KCC MOMENTIVE SHINETSU 동양실리콘 25 Date:

26 Process Marking 26 Date:

27 공정표시 MARK (PCB SILK) Min. 3mm D M H I F A P T S Q R RT D : 자삽 M : SMD H : 수삽최종 I : ICT F : 1 차성능 A : AGING P : HI-POT T : 최종검사 (ATE) S : SET 검사 Q : QC 검사 R : 불량수리 RT : 양산보증시험 Min. 3mm 27 Date:

28 PCB Layout 28 Date:

29 Top Silk 29 Date:

30 Bottom Silk 30 Date:

31 Bottom Pattern 31 Date:

32 Bottom Solder mask 32 Date:

33 Safety Parts 33 Date:

34 Object/part No. Manufacturer / Trademark Type / Model Value / Rating Parts Marking ( 實物 ) standard mark(s) of conformity1) AC input connector, (SK101) YEON HO YW396 Series 250V / 7.5A UL498 UL Littelfuse Inc. 215 Series LF.T3.15AH250VP IEC Fuse, (F101) WALTER FUSE TSC TSC3.15A250V(P) IEC T3.15A H / 250V BUSSMANN S505 T3.15AH250V IEC Dainfuse 50CT T3.15AH250V IEC Line Filter, (LF101) TNC CV620280SH S3 DONG YANG TELECOM CO., LTD Rated 130 FEELUX LLF-124 LLF-124 SOOJUNG IEC Test in appliance Samwha SVC621D-14 SVC Varistor, (VA101) Amotech Co., Ltd. INR 14D621 Min. 620V INR 14D621 IEC Xiamen Wanming Electronics Co.,Ltd WMR14D621K WMR 14D621K Lite-on KBJ406G KBJ406G Bridge Diode, (BD101) DACHANG TS4B05G TS4B05G GULF GSIB460 Min. 600V / Min. 4A GSIB460 TSC TS4B05G-26 TS4B05G E96005 SHINDENGEN D4SB60L D4SB60L E Test in appliance X-cap. (CX101) Thermistor. (TH101) Pilkor PCX2 337 PCX2 337 SUNGHO CMPP CMPP Okaya LE 275V (CX101= Max 0.47uF) LE EUROPTRONIC MPX MPX CHENGTUNG CTX CTX DSC DSC 5D-15 DSC 5D-15 Xiamen Wanming Electronics Co.,Ltd WTR 15D050 WTR 15D050 JIANGSU XINGSHUN ELECTRONICS CO., LTD 5D2-15 5ohm at 25 C 5D2-15 Smart ICL-5W ICL-05 5R00MSMT NANJING SHIHENG ELECTRONICS CO., LTD MF72 5D15 MF72 5D15 IEC UL1414 IEC UL1414/UL1283 IEC UL1414 E199061/ E IEC 'nd edition IEC UL1414 IEC SAMYOUNG NZE 500V/Min 82uF/105 NZE500V82uF IEC Test in appliance Elec.Cap., (C110,C111) Optinal (C112) SAMYOUNG KMF KMF450V82uF SUSCON SK 450V / Min 82uF / SK450V82uF SAMWHA WL 105 LT450V82uF IEC Test in appliance LELON RGA RGA450V82uF Flyback IC, (IC501) INFINEON ICE3BR4765JZ Min. 650 V / Min 1.67A 3BR4765JZ IEC Test in appliance TOSHIBA TK7A65D TK7A65D Switching TR, Min. 650V / MAGNACHIP MDF10N65B (Q101) Min 4.5A MDF10N65B POWER DEVICE PFF10N65 PFF10N65 ANSHAN KEI FAT Y1 / CT7 CT7 471K Kunshan Wansheng Y1 / CT7 CT7 471K Apex intec Y1 / NK NK471K Y Cap., (CY101,CY102) Y Cap., (CY103) DONG IL Y1 / DA DA471K YINANDON Y1 / CT81 Min 250V / Max 470pF CT81 471K SAMWHA Y1 / SD SD471K JYA-NAY Y1 / JN JN471K GUANGDONG SOUTH HONGMING Y1 / F F471K TDK Y1 / CD CD471K ANSHAN KEI FAT Y1 / CT7 CT7 101K Kunshan Wansheng Y1 / CT7 CT7 101K Apex intec Y1 / NK NK101K DONG IL Y1 / DA DA101K YINANDON Y1 / CT81 Min 250V / Max 100pF CT81 101K SAMWHA Y1 / SD SD101K JYA-NAY Y1 / JN JN101K GUANGDONG SOUTH HONGMING Y1 / F F101K TDK Y1 / CD CD101K IEC IEC Date:

35 ANSHAN KEI FAT Y1 / CT7 CT7 152M Kunshan Wansheng Y1 / CT7 CT7 152M Apex intec Y1 / NK NK152M Bridging Cap., (CY110) DONG IL Y1 / DA Min 250V / DA152M YINANDON Y1 / CT81 Max 1500pF CT81 152M SAMWHA Y1 / SD SD152M IEC JYA-NAY Y1 / JN JN152M GUANGDONG SOUTH HONGMING Y1 / F F152M TDK Y1 / CD CD152M Switching Transformer, (T101) Switching Transformer, (T501) SOOJUNG DONG YANG TELECOM CO., LTD JIANGSU CHANNELON ELECTRONIC GROUP FEELUX Clover hi-tech Co., Ltd. SOOJUNG BUJEON DONG YANG TELECOM CO., LTD JIANGSU CHANNELON ELECTRONIC GROUP TDK FEELUX Clover hi-tech Co., Ltd. SOOJUNG DONG YANG TELECOM CO., LTD JIANGSU CHANNELON ELECTRONIC GROUP FEELUX 12S-LM07 12S-LS01 Class B Class B 12S-LM07 12S-LS01 12S-LS02 Class B 12S-LS02 IEC IEC IEC Test in appliance Test in appliance Test in appliance Opto-coupler, (IC102,IC502,IC503) Everlight EL817 EL817 >0,4mm / Rated 6000Vac Lite-on LTV BN IEC UL 1577 Smart PRC IEC Discharge Resistor, (R101) UNIROYAL ELECTRONICS INDUSTRY CO., LTD MGR0W2J****A10 IEC /2W, 1.2Mohm, 5% Pilkor SR37,MSR37 IEC DONGMYUNG CIR. DM5-V-0 94V-0 HT CIRCUIT(QINGDAO) 1994V0 94V-0 FR-1 TIAN FENG TU-1 94V-0 Duck sung DS8-V-0 94V-0 TIS KOREA TIS-3 94V-0 1) an asterisk indicates a mark which assures the agreed level of surveillance Remarks: *) Large volume capacitors exceeding volume 1750 mm3 35 Date:

36 Mechanical Drawing 36 Date:

37 37 Date:

38 Packing Drawing 38 Date:

39 39 Date:

40 40 Date:

41 41 Date:

42 42 Date:

43 43 Date:

44 44 Date:

45 Bar-Code Label Drawing 45 Date:

46 PSU Bar Code Label Spec 2~3mm 40 mm min 34mm min 2~3mm Bar Code Size 는그림의 size 가최소 size 이며, 업체기준및 PCB 공간에따라변경할수있으나, 그림의 size 보다줄일수는없음. 일자표기방법 8 mm T9D1A (1.0) 5mm min T 9 D 1 A (1.0) Serial No. ( 10 Digit No. or 34 Digit No ) Part No of LGE (EAY ) Manufacturing Line (A, B, C.. ) Approval Revision History (Bar code should not be read during scanning work.) Manufacturing Date [1,2,3,4,5,6,7,8,9,A,B,C,D,E X] Manufacturing Month (1, 2, 3, Oct. :O, Nov. : N, Dec. : D ) Manufacturing Year(9:2009 / A :2010 / B :2011 ) Supplier Code ( L : LGIT / B : H&E / T : YY..) 46 Date:

47 Labeling Point 47 Date:

48 LABELING POINT 48 Date:

49 Workmanship Point 49 Date:

50 Silicone Bonding Point ( PCB Bottom ) 50 Date:

51 Manufacturing Process 51 Date:

52 공정번호공정흐름도중요도공정명 작업내용 4M Man( 사람 ) Machine( 장비 ) Material( 재료 ) Method( 방법 ) supplier 1 NG 수입검사 샘플수입검사진행 G D/Calipers (Mitutoyo) M/Meter (Mitutoyo) PIN Gauage (Eisen) L.C.R Meter (HP) 내압기 (Extech) 전자현미경 (ICALSCOPE) DCR Meter (GW Instek) 석정반 ( 성진이앤지 ) 수입검사기준서 2 AI 자삽 Equence Axial (Dynapert) Radial (Panasert) Eyelet ( 은성 ) Jumper 전용기 승인원대치 Axial / Radial 리드각도 : 15 ~ 25 도리드길이 : 1.5 ~ 2mm 3 SMT Chip 자삽 AIS-K411-R2SS (TSM) VIP-98 (N BTU Eng co.) 1810 (Exl Heller) HDP-2C (Panasonic) YV-64D (Yamaha) HSD-X (Yamaha) HSD-XG (Yamaha) YV-100XS (Yamaha) YV-100XS (Yamaha) YVL88II (Yamaha) YVL88XF (Yamaha) YV-100XF (Yamaha) YV-100XF (Yamaha) YV-100X (Yamaha) YV-10 승인원대치 1. 미삽, 오삽, 역삽없을것 2. Chip 틀어짐 PCB PAD 에서 1/3 이상벗어낫을경우 NG 3. 접착강도 1608 : 1kgf 이상 2012 : 1.3kgf 이상 3216 : 1.5kgf 이상 4 H/S 준비작업 H/S 준비작업승인원대치 1. 치수에맞게작업할것 5 수삽부품삽입승인원대치오삽, 미삽, 역삽, 설삽없을것 Rework 6 수삽외관검사 NG 수삽부품확인 ( 미삽 / 오삽역삽 ) G CTQ 7 Wave Soldering 납땜홍호선사원 SAF-700 ( 신명기전 ) SAS-680LTP ( 신명기전 ) SAS-680TP ( 신명기전 ) SAS-680 ( 신명기전 ) HSE-11 B20 WIRE( 희성 ) SN:99%, AG:0.3%, CU:0.7% 공정관리기준 Au : 0.2wt% 이하 Cu : 1.2wt% 이하 Zn : wt% 이하 Bi : 0.025wt% 이하 Fe : 0.02wt% 이하 Cd : N.D Pb : 0.1% 이하 over 시교체 Rework 8 중간검사 NG 수삽부품확인 ( 미삽 / 오삽역삽 ) G 9 Soldering 면납을수정 납땜상태확인수정 HSE-HGF10( 희성금속 ) Rework 10 반면검사납땜상태확인검사 NG Repair G 11 ICT ICT검사 NG G Repair 12 동작검사동작출력치확인 NG G CMS-9000 FX ( 우리회사 ) CMS-9000 FX ( 우리회사 ) CMS-9000 FV ( 우리회사 ) ATS1000(1),ATS500, ATS1000(2) ( 비오비엔터프라이즈 ) 1. 오삽, 미삽, 역삽,open,short 검출 2. PASS, FAIL 판정확인 1. TEST JIG 및 CONVEYOR 에제품장착상태확인 2. PASS, FAIL 판정확인 (FAIL 시경광등울림 ) Repair Safety 13 내압Test 내압검사 7142 (Extech) NG G CTQ 1. TEST JIG 및 CONVEYOR 에제품장착상태확인 2. PASS, FAIL 판정확인 (FAIL 시경광등울림 ) 14 실리콘도포실리콘도포 QS9112(KCC) E-410(ONG) Repair CTQ 15 Aging Aging진행 Aging System ( 아진전자 ) NG G 1. CABLE 연결상태확인 2. 출력전압확인용 LED 상태확인 3. 부품 BURNT 유 / 무확인 52 Date:

53 Repair CTQ 16 특성검사제품출력치확인 NG G 김재규대리, 이용순반장정경택대리, 문경덕사원 ATS1700(1),ATS1700(2) ATS1200,ATS1600, ATS1000(3),ATS1500 ( 비오비엔터프라이즈 ) 1. 자재의오삽, 설삽, 미삽상태확인 2. 냉납, SHORT, 납볼등 SOLDERING 상태확인 3. READ 길이확인 (MAX 2.5mm) 4. 실리콘 BONDING 상태확인 Repair 17 외관검사제품외관검사진행 NG G 18 실장 / 포장실장검사포장진행 SK SK A 골 1 종, SK SSKK DW 2 종, SK SK B 골 1 종, 수 K 수수출용 2 종 ( 제일포장산업 ) 19 출하검사 제품품질보정, 출하검사진행 ATS3000 ( 비오비엔터프라이즈 ) 출하검사기준서 53 Date:

54 # Appendix List No. Contents 1 PCB Check list 2 Warranty letter 54 Date:

55 # Appendix 1. PCB CHECK LIST 55 Date:

56 Revision History Rev DATE REMARK 1 기존 PCB Check Sheet Ver1.9 에서 신규 Power Check Sheet Ver1.0 으로개정함 Date:

57 Details Check Item RESULT REMARK 부품 LOCATION NO. NG 1 Power 1 차측회로 Location No. 가 100 번대일것 (Multi 1 차측포함 ) JUMPER 는제외됨. 2 Power 2 차측회로 Location No. 가 200 번대일것 (Stand by 2 차측,Multi 2 차포함 ) JUMPER 는제외됨. 3 Inverter 1 차측회로 Location No. 가 300 번대일것 Inverter 회로없음. 4 Inverter 2 차측회로 (F/B,OVP 회로부포함 ) Location No. 가 400 번대일것 Inverter 회로없음. 5 Stand by 1차측은 Location No. 가 500번대일것 JUMPER는제외됨. 6 PFC단은 Location No. 가 600번대일것 JUMPER는제외됨. 7 MICOM 주위는 Location No. 가 700번대일것 해당사항없음 8 LCD : LED Driver 단은 Location No. 가 800번대일것 LCD 에만적용함 9 PDP : STBY 1,2차단은 Location No. 가 300번대일것 PDP 에만적용함 10 PDP : Va 2차단은 Location No. 가 500번대일것 PDP 에만적용함 11 PDP : Vs 2차단은 Location No. 가 900번대일것 PDP 에만적용함 12 PDP : Vs,Va 1차단은 Location No. 가 800번대일것 PDP 에만적용함 13 CTV : Power Block은 Location No. 800번대일것 CTV 에만적용함 14 Resistor의회로Location No. 는 R*** 로시작할것 15 Capacitor의회로Location No. 는 C*** 로시작할것 16 Diode의회로Location No. 는 D*** 로시작할것 17 Zener Diode의회로Location No는 ZD*** 로시작할것 18 Coil 의회로 Location No. 는 L*** 로시작할것 (PFC 포함 ) 19 Transformer 의회로 Location No. 는 T*** 로시작할것 (Drive Trans 포함 ) 20 Bead 의회로 Location No. 는 LB*** 로시작할것 21 Fuse 의회로 Location No. 는 F*** 로시작할것 22 TR/FET/Thyristor 의회로 Location No. 는 Q*** 로시작할것 23 Varistor 의회로 Location No. 는 VA*** 로시작할것 24 Volume Resistor 의회로 Location No. 는 VR*** 로시작할것 해당사항없음 25 Jumper 의회로 Location No. 는 J*** 로시작할것 26 H/S 의회로 Location No. 는 HS*** 로시작할것 27 IC 의회로 Location No. 는 IC*** 로시작할것 DDC 표준 57 Date:

58 Details Check Item RESULT REMARK 부품 LOCATION NO. NG 28 Connector wafer / Ass`y (Board in type) 의회로 Location No. 는 P*** 로시작할것 29 Eyelet의회로Location No. 는 EL*** 로시작할것 30 Gripper의회로Location No. 는 G*** 로시작할것 해당사항없음 31 Holder의회로Location No. 는 HD*** 로시작할것 32 Thermistor의회로Location No는 TH*** 로시작할것 33 Metal Ground의회로Location No. 는 PG*** 로시작할것 해당사항없음 34 Line Filter의회로Location No. 는 LF*** 로시작할것 35 AC Socket(Inlet) 의회로 Location No. 는 SK*** 로시작할것 (AC 전원 Docking 용 Wafer 포함 ) DDC 표준 36 Photo Coupler의회로Location No는 IC*** 로시작할것 DDC 표준 37 Relay의회로Location No. 는 RL*** 로시작할것 해당사항없음 38 Y-Capacitor의회로Location No는 CY*** 로시작할것 39 X-Capacitor의회로Location No는 CX*** 로시작할것 40 Fuseble Resistor 의회로 Location No 는 R*** 로시작할것 해당사항없음 PCB Pattern 간격 NG 1 Primary Secondary(GND,Y-Cap,Photo Coupler) 간격이 Creepage 기준을만족할것.( 규격 Gr. 안전규격 Check List 참조.Note 0) ( 단, Working Voltage 가 350V 이상일때규격요청거리에따른다.) 첨부화일참조. (Creepage) NOTE 0 Creepage 2 Primary(L,N) Safety GND 간격이 3mm 이상일것 ( 단, 2 심일경우 6mm 이상일것 ) 3 Live Neutral 간격이 3mm 이상일것 Primary Secondary 부품간공간거리는 6mm 이상일것 (6mm 이하일경우에는 insulation sheet 추가 ) 1 차측 Main Current loop 는 Pattern 두께 3mm 이상일것 (BD 1 차평활 Cap 까지중점 Check) PFC Coil 밑으로소신호 Line 이지나가지말것. DC 는문제없음 주 GND(AC 평활 Cap. GND) 에서 IC GND 연결시 Pattern Impedance 를고려하여 pattern 을분리할것. DIP Type St-By IC 일경우고압 Pin 과근접 Pin 간의이격거리확보할것. - Drain pin 과인접된 pin 은 N.A 나공 pin 일것. 58 Date:

59 Details Check Item RESULT REMARK Component NG 1 Surge Test 시 1~2차간간격이 6.0mm 이상일것 (safety GND와 2차 GND의구별주의 ( 절연 Y-Cap사용 ) 공간확보주의, 절연Sheet) ( 주 ) 3 심 :3.0mm 이상 ( 내압 test 必 ) 2 심 :6.0mm 이상 (Y-cap 포함 ) 2 전해 Cap( 전수 ) 부품주위발열부품과 3mm 이상이격시킬것 ( 공간거리 ) 3 1 차평활전해 Cap 부품 upper 영역은 1mm 이상 Bottom 영역은 5mm 이상이격시킬것 (Vertical type Capacitor 에한함 ) (Note 1) PSU 가수직장착모델에한함. 4 1 차평활 Cap 3mm 영역내아래로 Pattern 이지나가지는않을것 ( 양면 PCB 상측 Pattern 에한함 ) 5 높이가낮은코어를사용할경우절연 tape 를사용할것 (PCB 와의이격거리확보 ) 1,2 차절연형 Trans 에한함 6 Trans 의경우 300V 기준으로 Barrier 8mm 이상사용하고있을것 (Note 0) (Barrier 를줄이기위해 Wire 에 Tube 사용가능, 규격 GR. 필확인사항 ) 첨부화일참조. (Creepage) T501 : 3 중절연 Wire 사용. T101 : Bobbin 형상으로절연거리유지됨. 7 AC Inlet 의경우 Yellow - Green wire 의 Screw 3.5Φ 이상일것. * Y/G wire 를사용하지않을경우, PCB Pattern 으로만대응시엔 200A Test 통과할것 * Safety GND 는독립적으로 GND 역할만하도록할것. UL Test 의뢰 * Pattern 대응시엔반드시규격확인을할것 8 부품에힘을가했을때 1~2 차부품간 6mm 공간거리확보할것. Core 에절대로부품이접촉되면안됨 9 Box type Capacitor 사용시 Forming type 이적용할것. RTV Bond 가되어있을것 (X-capacitor 포함.) 단, PDP Sony 모델에한함 관계없음. 10 CORE(Trans 류 All 포함 ) 주위에는 2mm 이상전부품을이격시킨다. * 유기전압 1kV (peak to peak) 이상시엔 4mm 이상 (1000:1 Probe 기준 ) 11 Inverter Trans 와 Metal Frame(shield) 과 4mm 이상이격을시킨다. ( 적용이어려울경우, 반드시 Insulation sheet 추가한다.) Inverter 회로미적용 차측출력 Wafer 는고정 PIN 추가 TYPE 적용할것 ( 단, LPB 일경우 Micom Deberging 용 Wafer 는제외 ) NOTE 0 NOTE 1 Creepage CAPACITOR 59 Date:

60 Details Check Item RESULT REMARK 필수 Marking 사항 NG 1 AC Socket, AC입력용 Wafer에 L/N표시는되어있을것. (Docking Type도 L/N 표시 (QA 요청 ), 상, 하측모두표시 ) 특히, Socket B/D-in type의경우, AC socket 자체에 L/N 표기가되어있으므로, 반드시 PCB L/N 마킹과 Fuse 는 Live 단에위치할것 동일한지확인한다. (Note 3-2) Safety GND 는 Chassis 로부터분리될때작업자가확인가능한위치일것. (Note 2) 2 심은제외함 2 * 추후, PCB 상, 하면에모두표기, 상세한내용은하단의유첨파일참조요망, 그리고, 반드시규격에최종확인받을것. Fuse rating( 전압,T, 전류,H), caution( 규격문구 ), UL Mark 는입력되어있을것 3 Ex) T5A H 250V 형식으로표시함 * caution: UL 에등록되어있는문구가그대로입력되어야함 (For ~, Replace ~ ) 4 Fuse 가보이는곳에위치할것 (Fuse Marking 도보이는곳에.) 5 High Voltage warning mark 가입력되어있을것. - Inverter 출력부 : LIPS 에한함 Inverter 출력부영역표시하고 Warning mark 추가. - Primary 측 Metal.(H/Sink), High Voltage 가 open 된곳. (Fuse) : 공통 6 입력 / 출력전압, 전류 Spec표기는되어있을것 (Note 3) 7 1차측과 2차측구분하는 Marking 표시할것. ( 상측면 / 하측면 ) 8 각부품의회로 No. 가부품에가려지지않을것 Solder pattern 에하측회로 No./ 부품형상등겹쳐지지말것 기구 Dead Space가고려되어 PCB Marking할것. PCB 고정용 Metal 영역표시할것. PCB 사양서에 CTI Spec 이있는지확인하고, PCB 에마킹되었는지확인할것. - 표기값 : 600V 이상 (CTI 600) Critical Component List 기준으로회로도에 Caution 마크넣을것 13 PCB 에 Screw 마크넣을것 NOTE 2 NOTE 3 NOTE 3-2 Safety GND 규정 Input/Output B/D-in socket 60 Date:

61 Details Check Item RESULT REMARK EMI NG Lightning Surge 가 L/N Test 시 Varistor 를 14Φ 620V 이상사용할것 Lightning Surge 가 L/G, G/N 간 : 3KV 이상시 Y-Cap. Y1 급사용할것 Lightning Surge 로인해 Fuse Dead 시만. ( 대책 : arcing 을방지,Varistor 는 Fuse 와가까운곳에위치할것 ) GND Arcing pattern Slit 은 1.2mm 일것 Arcing Pattern 양단거리는 safety 규정은최소 3.0mm 이상일것 (L/N 사이 ) Conducted Emission 측정조건 : 110Vac/220Vac & 50Hz/60Hz TV Model : GND 有 / 無, Vivid/Standard, HDMI/Antenna INVERTER (LIPS 에한함 ) NG 1 Ballaster capacitor 사용할것 2 Inverter Trans 로부터주변 4mm 이내에소신호 AC pattern 이지나갈시에는 OVP/OLP 등 Worst 상태를반드시확인하여이상이없을것 (Feed Back Line 포함 ) [ AC 입력으로부터 Inverter 에간섭되는 noise 를줄이기위해 POWER FET 의 Heat Sink 를형상변경하여 AC 입력부와 Inverter Trans 간 Shield 로사용. (CE 규제사항 ) - Design 상고려되어야함.] 해당사항없음 3 Inverter 출력부에적용한고압 Capacitor 의 Lead 는인위적힘을가하여도주변부품과 Touch 되지않도록절연거리확보 or Bodning 적용할것. ( 특히, 다른고압 Capacitor 의 body 와 touch 되지않도록할것 ) 해당사항없음 Inverter Trans Gripper 및 Eyelet 부위 Size 확인할것. 해당사항없음 4 - Pin 동박 Size : 5.5mm - Pattern Size 확대 : 6mm ( 단, 32 인치이상 LIPS 에만적용함 ) 5 고압 Inverter wafer 는수평 Type 일것. 해당사항없음 61 Date:

62 Details Check Item RESULT REMARK 기타 NG 1 Fuse 깡통 (CAN)Type 을사용하지말것. 2 Main Board/Power Board(LIPS 포함 ) 연결 Connector 의 Housing 과 Wafer 의 Maker 가일치할것. * 일치가안될경우, Spec. 확인및 QA 인증시험이요구됨.( 특히,Board in connector 는 Terminal 도확인 ) 3 Litz Wire 사용하지말것. USTC 4 PFC Bypass Diode 가적용되어있을것. (Note 4) 첨부화일참조 (Bypass) Inrush 제어용 Relay 적용모델인경우, 첨부화일참조 (Relay) 5 Fusing Resistor 적용확인할것.(Note 5) ( 단, Fusing Resister 미적용시 Relay Open Test Relay 사용안함. 확인하여, PL 조건만족할것 ) 6 1 차 Control IC 의 IC Vcc 정류 Cap. 은 High Ripple, Low Impedance Cap. 사용할것. 7 RN Type (Metal Film Type) Resistor 는 100kohm 이상사용하지말것. 08 년 6 월 26 MNT ND 분양산문제발생. ( 여러차례재발됨 ) TO-220, TO-3P type FET, Diode, IC 적용시, 08 년 3 월 LGEAZ CKD 분 PQ 8 Forming type 을적용했을때 forming 후 cutting을하기때문에길이가짧아진다. 따라서반드시 Heatsink 와 PDM 등록승인원, 부품현물을 3자확인후 lead 길이, pitch 확인할것. (LGEAZ, LGEND 관련하여사전협의필요 이전문제발생하여지급조처한이력있음. LGEND 에서는 forming type 을전수원함 ) 9 PCB 하측 lead 길이 special 관리모델의경우 ( 예를들어 2.0mm 관리품 ) H/Sink, wafer, 각종 부품도면받아서 lead 길이 check 할것 10 Critical Component List 의부품인경우실물에서형명마킹제대로되어있는지확인할것 일본향모델에사용되는방전저항은규격인증된 11 Dip Type 저항만사용할것. ( 단, 일본향모델에한함 ) NOTE 4 NOTE 5 Bypass-Diode Relay 62 Date:

63 Details Check Item RESULT REMARK Attachment NG 1 PL check List LGP32F-12P_PL Safety Check List 63 Date:

64 APPENDIX 2 WARRANTY LETTER (ROHS) 64 Date:

65 Non-use certificate Description For approval / For mass production Submitting date Cooperating suppliers Company name YUYANG DNU CO.,LTD. Approval Person in charge Head of department Contact Tel.: Name KIM SANG CEO sokim@yuyang.co.kr Signature D: TV & MFT Pb Free RoHS warranty leter_spi_ pdf LGE Part No. EAY Part production date filling the sheet in case of mass production Maker Part No. LGP32F-12P Production plant HWASUNG in KOREA QINGDAO in CHINA Part name LGP32F-12P This is to certify that materials used and contained in the products and components that we supply to your company, meet the standards of the checked items listed below. below We meet the standards of LG Electronics for six major substances (Pb, Cd, Cr 6+, Hg, PBBs, PBDEs) as designated by RoHS for control. * Records are requested if they are parts to be actually installed on the PCB (Printed Circuit Board) Soldering Type: Flow Reflow (Requirement : 250 / 10sec ) 1. Maximum heat-resisting temperature : Time within actual Peak time : 10 Pb-Free Soldering (all solder cream, Bar, Wires included) is available to apply. Note. 1. All the contents written on these documents must be created on the basis of facts, and cooperating suppliers must submit the data immediately whenever LG Electronics requests. 2. In the case that these documents are used for approval purposes, cooperating suppliers must submit the sample on the request. For the purpose of mass production, it must be submitted at the time of delivering the first product. 65 Date: