MV3358 CPU Module Data Sheet 2017. 4. 19 (1 / 16) page
MV3358 CPU Module Data Sheet Revision History Version: 1.0 Date: 2017. 4. 19 Description: MV3358 CPU Module Data Sheet 마이크로비젼서울시구로구구로3동 235번지한신IT타워 1003호, 1004호 E-Mail: sale@microvision.co.kr Phone: 02-3283-0101 Fax: 02-3283-0160 Homepage: www.microvision.co.kr (2 / 16) page
Contents 1. MV3358 CPU 모듈소개 2. MV3358 CPU 모듈 Connector Pins 스펙 3. AM3358 AP(CPU) Features (3 / 16) page
1. MV3358 CPU 모듈소개 본 MV3358 CPU 모듈은양산성을고려하여제작된되었다. CPU가가지고있는가능한모든핀 ( 기능 ) 을확장핀으로제공하고있어다양한프로그램테스트및하드웨어테스트를할수있다. 개발자는사용자가필요한사용부분만 Base Board ( 새로운타겟보드 ) 구성및제작하고, 메인 CPU 모듈부분은그대로장착하여다양한제품군을단시간에테스트및양산가능하다. 이런경우전체작업시간이 1/2 로줄어들기때문에개발기간및제품양산기간을단축할수있다. 저희 CPU 모듈은양산을고려하여단가및사이즈를최소화하였으며, 산업체에서는저희 CPU 모듈을이용하여다양한제품에바로적용할수있다. AM3358 Cortex-A8 emmc 4GB PMIC DDR3L 512MB [ 그림 1] MV3358 CPU 모듈전면 5.0cm 3.3cm Connector [ 그림 2] MV3358 CPU 모듈후면 (4 / 16) page
개발환경PC OS ( 개발환경 ) Ubuntu 14.04 x86_64 MV3358 BOOT ( 부트로더 ) U-boot (2015.01-rc4) MV3358 OS ( 커널 ) Kernel 4.9.37 MV3358 ROOTFS ( 파일시스템 ) Debian 8.7 (LXQt) [ 표1] MV3358 소프트웨어사양 ITEM Specification Description ARM Cortex-A8 Quad Core (Cortex-A8 1GHz Quad Core) 32KB of L1 Instruction 32KB of Data Cache CPU AM3358 32Bit Core 256KB of L2 Cache With Error Correcting 176KB of On-Chip Boot ROM 64KB of Dedicated RAM 1GHz Operation Frequency 324-Pin S-PBGA-N324 Package ZCZ Suffix, 0.80-mm Ball Pitch RAM DDR3L DDR3L 512Mbyte (400MHz) ROM emmc emmc 4GB ( 용량확장가능 ) Step down buck Converter DC DC 1,2,3 PMIC Power Management Power Management IC (PMIC) w/ 3 DC/DCs, 4 LDOs, Linear Battery Charger & White LED Driver Size: 6.00 mm x 6.00 mm Connector A AXK860145WG x 4 240 Pin (0.5mm Pitch 60 Pin x 4) Dimension (L x W x T) 50mm x 33mm x 1.2mm ( 결합시 : B to B, 높이 : 1.5mm) PCB 사양 PCB 8 Layer, FR-4 [ 표 2] MV3358 CPU 모듈하드웨어사양 (5 / 16) page
[ 그림 3] MV3358 CPU 모듈 Block Diagram 및높이치수 (6 / 16) page
USB USB UART UART OTS 2.0 OTS 2.0 Micro SD Audio HDMI Power 12V USB HOST 2.0 USB HOST 2.0 WIFI, Bluetooth Ethernet 1000Mb Ethernet 1000Mb Ethernet 100Mbp [ 그림 4] MV3358-LCD 개발보드 (7 / 16) page
ITEM SPEC&PART DESCRIPTION CPU AM3358 Coretex-A8 Core 1Ghz RAM DDR3L 512Mbyte NAND Flash EMMC 4GByte Audio Codec I2S Stereo 400mW 출력스피커, MIC IN, Headset USB 2.0 USB 2.0 Host 2EA / USB 2.0 OTG 2EA LCD LVDS 7" WSVGA LCD 1024x600 Touch Screen Capacitive Multi Touch 5 Point Multi Touch Screen Panel 적용 Ethernet LAN 10/100/1000MBsp 지원, Link/ACT LED 3Port SD Slot 1Port microsd Slot 1Port WI-FI/BT SDIO Type USB Type WI-FI 802.11b/g/n UART 4Ports USB to Serial 1Port, Extension Connector 3Ports HDMI HDMI Option 기타 Ports CAN, SPI, I2C, KEY, LED, RS485, RS232, 전원 Power 12V DC [ 표 3] MV3358-LCD 보드상세사양 (8 / 16) page
2. MV3358 CPU 모듈 Connector Pins 스펙 [ 그림 5] MV3358 CPU 모듈 CN1 핀내용 [ 그림 6] MV3358 CPU 모듈 CN2 핀내용 (9 / 16) page
[ 그림 7] MV3358 CPU 모듈 CN3 핀내용 [ 그림 8] MV3358 CPU 모듈 CN4 핀내용 (10 / 16) page
3. AM3358 AP(CPU) Features Up to 800-MHz Sitara ARM Cortex -A8 32-Bit RISC Processor NEON SIMD Coprocessor 32KB of L1 Instruction and 32KB of Data Cache With Single-Error Detection (Parity) 256KB of L2 Cache With Error Correcting Code (ECC) 176KB of On-Chip Boot ROM 64KB of Dedicated RAM Emulation and Debug - JTAG Interrupt Controller (up to 128 Interrupt Requests) On-Chip Memory (Shared L3 RAM) 64KB of General-Purpose On-Chip Memory Controller (OCMC) RAM Accessible to All Masters Supports Retention for Fast Wakeup External Memory Interfaces (EMIF) mddr(lpddr), DDR2, DDR3, DDR3L Controller: mddr: 200-MHz Clock (400-MHz Data Rate) DDR2: 266-MHz Clock (532-MHz Data Rate) DDR3: 400-MHz Clock (800-MHz Data Rate) DDR3L: 400-MHz Clock (800-MHz Data Rate) 16-Bit Data Bus 1GB of Total Addressable Space Supports One x16 or Two x8 Memory Device Configurations General-Purpose Memory Controller (GPMC) Flexible 8-Bit and 16-Bit Asynchronous Memory Interface With up to Seven Chip Selects (NAND, NOR, Muxed-NOR, SRAM) Uses BCH Code to Support 4-, 8-, or 16-Bit ECC Uses Hamming Code to Support 1-Bit ECC Error Locator Module (ELM) Used in Conjunction With the GPMC to Locate Addresses of Data Errors from Syndrome Polynomials Generated Using a BCH Algorithm Supports 4-, 8-, and 16-Bit per 512-Byte Block Error Location Based on BCH Algorithms Programmable Real-Time Unit Subsystem and Industrial Communication Subsystem (PRU-ICSS) Supports Protocols such as PROFIBUS, PROFINET, EtherNet/IP, and More Two Programmable Real-Time Units (PRUs) (11 / 16) page
32-Bit Load/Store RISC Processor Capable of Running at 200 MHz 8KB of Instruction RAM With Single-Error Detection (Parity) 8KB of Data RAM With Single-Error Detection (Parity) Single-Cycle 32-Bit Multiplier With 64-Bit Accumulator Enhanced GPIO Module Provides Shift-In/Out Support and Parallel Latch on External Signal 12KB of Shared RAM With Single-Error Detection (Parity) Three 120-Byte Register Banks Accessible by Each PRU Interrupt Controller Module (INTC) for Handling System Input Events Local Interconnect Bus for Connecting Internal and External Masters to the Resources Inside the PRU-ICSS Peripherals Inside the PRU-ICSS: One UART Port With Flow Control Pins, Supports up to 12 Mbps One Enhanced Capture (ecap) Module Two MII Ethernet Ports that Support Industrial Ethernet One MDIO Port Power, Reset, and Clock Management (PRCM) Module Controls the Entry and Exit of Stand-By and Deep-Sleep Modes Responsible for Sleep Sequencing, Power Domain Switch-Off Sequencing, Wake-Up Sequencing, and Power Domain Switch-On Sequencing Clocks Integrated 15- to 35-MHz High-Frequency Oscillator Used to Generate a Reference Clock for Various System and Peripheral Clocks Supports Individual Clock Enable and Disable Control for Subsystems and Peripherals to Facilitate Reduced Power Consumption Five ADPLLs to Generate System Clocks (MPU Subsystem, DDR Interface, USB and Peripherals [MMC and SD, UART, SPI, I2C], L3, L4, Ethernet, GFX [SGX530], LCD Pixel Clock) Power Two Nonswitchable Power Domains (Real-Time Clock [RTC], Wake-Up Logic [WAKEUP]) Three Switchable Power Domains (MPU Subsystem [MPU], SGX530 [GFX], Peripherals and Infrastructure [PER]) Implements SmartReflex Class 2B for Core Voltage Scaling Based On Die Temperature, Process Variation, and Performance (Adaptive Voltage Scaling [AVS]) Dynamic Voltage Frequency Scaling (DVFS) Real-Time Clock (RTC) Real-Time Date (Day-Month-Year-Day of Week) and Time (Hours-Minutes-Seconds) (12 / 16) page
Information Internal 32.768-kHz Oscillator, RTC Logic and 1.1-V Internal LDO Independent Power-on-Reset (RTC_PWRONRSTn) Input Dedicated Input Pin (EXT_WAKEUP) for External Wake Events Programmable Alarm Can be Used to Generate Internal Interrupts to the PRCM (for Wakeup) or Cortex-A8 (for Event Notification) Programmable Alarm Can be Used With External Output (PMIC_POWER_EN) to Enable the Power Management IC to Restore Non-RTC Power Domains Peripherals Up to Two USB 2.0 High-Speed OTG Ports With Integrated PHY Up to Two Industrial Gigabit Ethernet MACs (10, 100, 1000 Mbps) Integrated Switch Each MAC Supports MII, RMII, RGMII, and MDIO Interfaces Ethernet MACs and Switch Can Operate Independent of Other Functions IEEE 1588v2 Precision Time Protocol (PTP) Up to Two Controller-Area Network (CAN) Ports Supports CAN Version 2 Parts A and B Up to Two Multichannel Audio Serial Ports (McASPs) Transmit and Receive Clocks up to 50 MHz Up to Four Serial Data Pins per McASP Port With Independent TX and RX Clocks Supports Time Division Multiplexing (TDM), Inter-IC Sound (I2S), and Similar Formats Supports Digital Audio Interface Transmission (SPDIF, IEC60958-1, and AES-3 Formats) FIFO Buffers for Transmit and Receive (256 Bytes) Up to Six UARTs All UARTs Support IrDA and CIR Modes All UARTs Support RTS and CTS Flow Control UART1 Supports Full Modem Control Up to Two Master and Slave McSPI Serial Interfaces Up to Two Chip Selects Up to 48 MHz Up to Three MMC, SD, SDIO Ports 1-, 4- and 8-Bit MMC, SD, SDIO Modes MMCSD0 has Dedicated Power Rail for 1.8-V or 3.3-V Operation Up to 48-MHz Data Transfer Rate Supports Card Detect and Write Protect Complies With MMC4.3, SD, SDIO 2.0 Specifications (13 / 16) page
Up to Three I 2 C Master and Slave Interfaces Standard Mode (up to 100 khz) Fast Mode (up to 400 khz) Up to Four Banks of General-Purpose I/O (GPIO) Pins 32 GPIO Pins per Bank (Multiplexed With Other Functional Pins) GPIO Pins Can be Used as Interrupt Inputs (up to Two Interrupt Inputs per Bank) Up to Three External DMA Event Inputs that can Also be Used as Interrupt Inputs Eight 32-Bit General-Purpose Timers DMTIMER1 is a 1-ms Timer Used for Operating System (OS) Ticks DMTIMER4 DMTIMER7 are Pinned Out One Watchdog Timer SGX530 3D Graphics Engine Tile-Based Architecture Delivering up to 20 Million Polygons per Second Universal Scalable Shader Engine (USSE) is a Multithreaded Engine Incorporating Pixel and Vertex Shader Functionality Advanced Shader Feature Set in Excess of Microsoft VS3.0, PS3.0, and OGL2.0 Industry Standard API Support of Direct3D Mobile, OGL-ES 1.1 and 2.0, OpenVG 1.0, and OpenMax Fine-Grained Task Switching, Load Balancing, and Power Management Advanced Geometry DMA-Driven Operation for Minimum CPU Interaction Programmable High-Quality Image Anti-Aliasing Fully Virtualized Memory Addressing for OS Operation in a Unified Memory Architecture LCD Controller Up to 24-Bit Data Output; 8 Bits per Pixel (RGB) Resolution up to 2048 2048 (With Maximum 126-MHz Pixel Clock) Integrated LCD Interface Display Driver (LIDD) Controller Integrated Raster Controller Integrated DMA Engine to Pull Data from the External Frame Buffer Without Burdening the Processor via Interrupts or a Firmware Timer 512-Word Deep Internal FIFO Supported Display Types: Character Displays - Uses LIDD Controller to Program these Displays Passive Matrix LCD Displays - Uses LCD Raster Display Controller to Provide Timing and Data for Constant Graphics Refresh to a Passive Display Active Matrix LCD Displays - Uses External Frame Buffer Space and the Internal DMA Engine to Drive Streaming Data to the Panel 12-Bit Successive Approximation Register (SAR) ADC (14 / 16) page
200K Samples per Second Input can be Selected from any of the Eight Analog Inputs Multiplexed Through an 8:1 Analog Switch Can be Configured to Operate as a 4-Wire, 5-Wire, or 8-Wire Resistive Touch Screen Controller (TSC) Interface Up to Three 32-Bit ecap Modules Configurable as Three Capture Inputs or Three Auxiliary PWM Outputs Up to Three Enhanced High-Resolution PWM Modules (ehrpwms) Dedicated 16-Bit Time-Base Counter With Time and Frequency Controls Configurable as Six Single-Ended, Six Dual-Edge Symmetric, or Three Dual-Edge Asymmetric Outputs Up to Three 32-Bit Enhanced Quadrature Encoder Pulse (eqep) Modules Device Identification Contains Electrical Fuse Farm (FuseFarm) of Which Some Bits are Factory Programmable Production ID Device Part Number (Unique JTAG ID) Device Revision (Readable by Host ARM) Debug Interface Support JTAG and cjtag for ARM (Cortex-A8 and PRCM), PRU-ICSS Debug Supports Device Boundary Scan Supports IEEE 1500 DMA On-Chip Enhanced DMA Controller (EDMA) has Three Third-Party Transfer Controllers (TPTCs) and One Third-Party Channel Controller (TPCC), Which Supports up to 64 Programmable Logical Channels and Eight QDMA Channels. EDMA is Used for: Transfers to and from On-Chip Memories Transfers to and from External Storage (EMIF, GPMC, Slave Peripherals) Inter-Processor Communication (IPC) Integrates Hardware-Based Mailbox for IPC and Spinlock for Process Synchronization Between Cortex-A8, PRCM, and PRU-ICSS Mailbox Registers that Generate Interrupts Initiators (Cortex-A8, PRCM) Spinlock has 128 Software-Assigned Lock Registers Security Crypto Hardware Accelerators (AES, SHA, PKA, RNG) Boot Modes Boot Mode is Selected via Boot Configuration Pins Latched on the Rising Edge of the (15 / 16) page
PWRONRSTn Reset Input Pin Package: 324-Pin S-PBGA-N324 Package(GCZ Suffix), 0.80-mm Ball Pitch Applications Supports Defense, Aerospace, and Medical Applications: Controlled Baseline One Assembly and Test Site One Fabrication Site Available in 40 C to 105 C Temperature Range Extended Product Life Cycle Extended Product Change Notification Product Traceability [ 그림 9] AM3358 AP(CPU) Block Diagram (16 / 16) page