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1 韓國電磁波學會論文誌第 17 卷第 12 號 2006 年 12 月論文 소형및변형된접지면을이용한신호선복사성방사레벨의감소방법 Reduction of Radiated Emission from Signal Traces Using Modified and Small-Sized Ground Patterns 박필성 이재욱 이택경 조춘식 김재흥 * 최형도 ** Pil Sung Park Jae Wook Lee Taek Kyung Lee Choon Sik Cho Jaeheung Kim* Hyung Do Choi** 요약 본논문에서는다양한접지면과함께단일신호선로및복수신호선로로부터의복사성방사레벨과신호간커플링현상을관찰하고좁은접지면과새로운패턴을이용하여일정한주파수대역에서신호선로로부터의복사성방사레벨의감소를얻을수있음을접지면의최적화과정과함께기술하고있다. 다양한접지면과함께윗층에설치된신호선로로부터의복사메커니즘의예측및해석의정당성을각각상용소프트웨어와실험을통하여검증하였다. Abstract We analyze the radiated emission and mutual coupling problem from a single microstrip transmission line and double signal traces with various ground patterns. In this paper, it is shown that the reduction of the radiated emission from the signal traces can be accomplished by using the novel and compact patterns on the ground planes in a specific frequency band. The accuracy and validation of radiation mechanism from the transmission line on a novel ground plane are evaluated and explained by using a commercially available software and experiment, respectively. Key words : Common-mode Current, Radiated Emission, Corrugation Ⅰ. 서론전자장치 / 시스템의발전을위한시스템클럭주파수향상과소형화에의해시스템의복잡도가증가하게되었고이는다시전자파간섭 (EMI) 과전자파방사 (Electromagnetic Emission) 에대한가능성을높이게되었다. 참고문헌 [3] 에서는고주파신호 (100 MHz 이상 ) 로동작하는 PCB상에서일반적으로 EMC 레벨해석이 3가지기본적문제점에직면하고있음 을보이고있다. 특히, 두번째문제점으로지적된디지털시스템의 PCB 선로상에서잡음선전류성분에의해여기되는복사성방사성분은디지털시스템의성능에예기치못한결과를초래할수있으며또한이러한이유로 CISPR, CENELEC, 그리고 Federal Communication Commission(FCC) 에서는오래전부터특정거리에서최대방사전계측정을통하여 30 ~1,000 MHz 대역과그이상의대역에서동작하는디지털전자장비에서의방사방출에대한표준을 한국항공대학교항공전자및정보통신공학부 (School of Electronics, Telecommunication and Computer Eng., Hankuk Aviation University) * 한국정보통신대학교지능형전파센터 (Intelligent Radio Engineering Center, Information and Communications University) ** 한국전자통신연구원전자파환경연구팀 (EM Environment Research Team, Electronics and Telecommunications Research Institute) 논문번호 : 수정완료일자 : 2006 년 11 월 22 일 1189

2 韓國電磁波學會論文誌第 17 卷第 12 號 2006 年 12 月 정하였다. 접지면의구조에변화 (gap의 width와 length) 를줌에따라두개의전송선로사이간간섭현상에변화를나타낼수있음을참고문헌 [5] 에서보였으며이는복사성방사레벨의증감을간접적으로나타낸것이다. 본논문에서는디지털전자장비의전자파방사의가장큰부분으로여겨지는 PCB 선로상에서야기되는전자파복사성방사레벨에대하여논하도록하겠다. 그리고해석의편의를위해주방사원인은공통모드에기인함을가정한다. 본논문에서는측정을위해 3 m 측정법을사용하였고예측치에대한데이터는시뮬레이션을수행하였으며그결과의정확성을위해방사구조를제작하여측정하였다. 본논문을통해 PCB 선로로부터의복사메카니즘을연구, 조사하였으며복사에영향을미치는몇몇인자를찾아내었고더욱이특정대역에서복사성방사레벨을줄이는방법을접지면구조의최적화를통하여유도하였다. Ⅱ. 단일의신호선선로에서의방사성방사 (Radiation From a Single Signal Trace) FCC 규정에명시된바와같이전체방사되는전계와최대방사되는전계와의관계를규명하기위하여방사체의 Directivity D를먼저알아야한다 [1]. 본검증에서는참고문헌 [1], [4] 의간단한구조의데이터를통해마이크로스트립선로의복사성방사의방향성측정을검증하고자하며본논문의해석상의정확성을재차확인하기위하여좁은접지면이있는 PCB로부터의복사성방사에대하여도언급한다 [2]. 우선측정에이용된마이크로스트립전송선로의가장기본적인구조는그림 1과같다 [1],[4]. 참고문헌 [1] 에서방향성 (directivity) 의주파수의존정도를설명하기위해다음의변수들을이용하였다. h=1.55 mm, L=10 cm, w=4.8 mm, 그리고유전체의상대유전율은 ε sr =2.2이며이때마이크로스트립의특성임피던스는 Z 0 =50 Ω으로가정하였다. 간단한마이크로스트립구조에서의최대복사방향은 φ가 0 과 180 에서 (xz-plane) 존재하게되며 θ 각도에서는주파수가증가함에따라 90 에서 90 방향으로최대각도가옮겨감을알수있다. 그림 1(b) 는위의각변수들의값을이용하여최대방사각도를예측한결과를보여주고있으며, 이결과는참고문헌 [1] 에주어진 (a) (b) 그림 1. (a) 길이 L인마이크로스트립전송선로구조 [1],[4], (b) 주파수에따른단일마이크로스트립선로에서복사되는최대복사각도의예측치 (black-circled line), 측정치 (white-circled line) [1] Fig. 1. (a) Microstrip line structure with a longitudinal length, L [1],[4] (b) Maximum radiation angle as a function of frequency in a single microstrip line, prediction(black-circled line) and measurement(white-circled line) in [1]. 결과와일치함을보여주고있다. 위의결과들은 PCB 선로상의마이크로스트립전송선로에흐르는전류성분을수직 ( 전류원의효과고려 ) 및수평 ( 전송선로효과고려 ) 으로흐르는전류성분으로구분하여각성분에의한영향을고려한후전체전계를계산하면다음과같이표현할수있다 [1]. - 수평전류성분에의한복사전계표현식 E θh = j ωμ 0 I 0 LA L 4π E φh = j ωμ 0 I 0 LA L 4π 여기서 (R v -1) cos θ cosφ e - jkr ( R h +1) sinφ e - jkr r r 1190

3 소형및변형된접지면을이용한신호선복사성방사레벨의감소방법 A L = 1 L L/2 e - j( k e- k sin θ cos φ)x - L/2 = sin [(k e - k sin θ cos φ)l/2] [(k e - k sin θ cos φ)l/2] ' dx' R v = 1- jv ε sr cosθ 1+ jv ε sr cosθ tan (kvh) tan (kvh) R h = 1+ jv cos θ 1- jv cos θ cot (kvh) cot (kvh) (a) v = ε sr -1, R =r-x ' sinθcos φ, k =ω μ 0 ε 0, k e = k ε er, ε sr < ε er <1 - 수직전류성분에의한복사전계표현식 E θv = j ωμ 0 I 0 F I 4πε sr kv tan (kvh)(r v+1) sinθ e - jkr r 여기서 F I =2j sin [ (k e -k sin θcosφ)l/2] 두번째로그림 2(a) 의구조와같이좁은접지면에의한신호선선로로부터의방사성레벨을계산하였다. 참고문헌 [2] 에서복사성방사레벨의접지면면적에따른변화를살펴보기위하여다음의변수를사용하였다. PCB 기판의도체두께는 mm, 유전체두께는 1.53 mm로서 glass epoxy(ε r=4.7) 의유전체에상단에 signal trace(s) 와하단에 ground plane (G) 이위치하였으며접지면에폭이좁은추가적인접지면 (ground patch, P) 를부착하여차분모드 (differential-mode) 의구조체를구성하였다. 신호원으로는기본주파수가 25 MHz(transmission line의특성임피던스 = Ω), 9 V의전원을사용하는것으로하였으며, 반대편종단은 330 Ω의부하로종단하였다. 그계산결과와측정결과를그림 2(b) 와 2(c) 에도시하였다. 계산결과는상용소프트웨어를통한시뮬레이션을통하였으며측정결과는참고문헌 [2] 의결과를인용하였다. 특히, 그림 2(c) 는본논문의전반적인기술에자주인용되는복사성방사레벨의비교자료로사용하기위하여 ( 접지면구조의변화에따른복사성방사레벨의감소정도비교 ) 넓은접지면 (wide ground plane, W 2=5.5 mm) 과좁은접지면 (narrow (b) (c) 그림 2. (a) 좁은접지면으로구성된 PCB 로부터의복사성방사구조 [2], (b) 접지면선폭에따른 PCB 상의단일선로로부터복사되는방사레벨의차이, (c) 넓은접지면 (5.5 mm) 과좁은접지면 (0.5 mm) 의 PCB 상에서단일선로로부터복사되는방사레벨 Fig. 2. (a) Radiation structure from PCB with narrow ground plane [2], (b) Radiated emission level according to the change of width of ground plane, (c) Radiated emission level from single trace on PCB with wide/narrow ground planes. 1191

4 韓國電磁波學會論文誌第 17 卷第 12 號 2006 年 12 月 Ground Plane, W 2=0.5 mm) 의복사성방사레벨을나타내고있다. 그림 2(b) 에서보듯이접지면의면적이증가할수록복사성방사레벨이감소하는것을알수있으며, 이후에기술되는내용에는단일마이크로스트립선로에있어서복사성방사레벨을줄이는다양한접지면구조에대하여살펴보도록한다. 관심있는주파수대역은 50~600 MHz로서비교적저주파수대역이며복사성방사레벨을측정하는위치는신호선표면으로부터수직으로 3 m 떨어진지점 (3 m 측정법에따라서 ) 으로가정하였다. 접지면의폭은비록적어짐에도불구하고전기적으로는복사성방사레벨의크로스토크성능의변화가없도록 ( 즉, 면적에따른방사레벨을볼때방사레벨이감소하도록 ) 하는것을최종목표로하여변수변화에따른특성변화를관찰하여최적의접지면패턴을도출하였다. 기본구조와최적화구조를얻기위하여그림 3 (a)~(c) 이외에도 2열의기생패치를갖는접지면, 2 열의단절된기생패치를갖는접지면, corrugation형접지면에대해구조적인연구와각변수에따른시뮬레이션을단계적으로수행하였으며, 그림 3(a)~ (c) 는그림으로표시되지않은위 3개에비해접지면의면적이줄어듦에도복사성방출레벨을효과적으로줄이는구조였다. 최적화된구조인그림 3(c) 가기본구조인 T-type( 그림 3(a)) 과 Hybrid-π( 그림 3(b)) 의변형을통하여얻어졌다. 그림 4(a), (b) 에서는구조의단계적인변화에따른 (a) T 형기본구조 (a) T-type (a) T 형기본구조의 L 인자에따른복사성방사레벨변화 (a) T-type(radiated emission according to variable 'L') (b) Hybrid-π 형기본구조 (b) Hybrid-π type (c) 최적화구조 (c) Finally Optimized Structure 그림 3. 접지면의기본구조와최적화구조 Fig. 3. Various types of ground plane. (b) Hybrid-π 형기본구조의 rw 인자에따른복사성방사레벨변화 (b) Hybrid-π type(radiated emission according to variable 'rw') 그림 4. 복사성방사레벨 [dbuv/m] Fig. 4. The radiated emission level from two types of ground plane. 1192

5 소형및변형된접지면을이용한신호선복사성방사레벨의감소방법 변수들의시뮬레이션중복사성방사레벨에주된영향을준변수의변화에따른복사성방사레벨의정도변화를나타냈고특히, 4(b) 에서 Hybrid-π type은최적화구조이전에구조면의감소에도불구하고넓은접지면의복사성방사레벨에근접하게그크기를감소시킬수있음을보였다. 최적화과정은변수인 L h, L n, W n, N(corrugation의수 ) 을변화시키면서, 동시에다른변수들 (L 1=55 mm, L 2=200 mm, L 3=200 mm, W 1=38.5 mm, W 3=0.5 mm, W n=1 mm) 은고정시키고유지하면서특성을살펴보았다. 그림 5는접지면의모양이다른 PCB 구조를자세히나타내고있으며그림 6(a) 는세개의다른접지면패턴에따른단일신호선으로부터의복사되는방사레벨을시뮬레이션한것이며예측된결과로부터알수있듯이접지면에적절한패턴을가함으로서 (a) 최적화된접지면이있는 PCB 선로로부터방사되는방사레벨의예측치 ( Final 로표현함 ) (a) The predicted emission level from PCB signal trace with the optimized ground plane (b) 시뮬레이션한반사손실 (b) Simulated return loss (c) 측정된반사손실 (c) Measured return loss 그림 5. 단일선로상으로부터복사되는방사레벨을측정하기위해제작된실물사진 Fig. 5. The photograph of the fabricated PCB traces for measuring the radiated emission level. 그림 6. 시뮬레이션및측정결과 ( Final 로표현함 ): W 2=2.5 mm, W n=2 mm, W h=1 mm, L n=1 mm, L h=1 mm, N=19 Fig. 6. Simulated and measured data : W 2=2.5 mm, W n=2 mm, W h=1 mm, L n=1 mm, L h=1 mm, N=

6 韓國電磁波學會論文誌第 17 卷第 12 號 2006 年 12 月 복사성방사레벨이넓은접지면 ( Wide 로표시함 ) 을가지는경우로접근할수있음을알수있다. 그림 6(a) 의시뮬레이션결과의타당성을보이기위하여반사손실에대한측정치와예측치를그림 5(b) 와 5(c) 를통하여보이고있다. Ⅲ. 복수신호선선로 (Radiation From Double Signal Traces) 앞서 Ⅱ절에서논의한것과같이접지면의폭을최소로하면서일정한주파수대역에서복사성방사레벨이최소가되도록설계하는것을염두에두고, 신호선이두개인경우의복사성방출레벨및신호선상호간의커플링감소가접지면의형태에따라서어떻게얻을수있는지를살펴보고자한다. 다음의그림 6은일반적인 PCB 선로상의신호선이두개인경우의단면도를보여주는것으로서, 사용된변수들은각각 W 3 =0.5 mm, H=1.53 mm, t=0.036 mm, d=2 mm로고정하였으며변수로서 W 2 =3 mm인경우는접지면이좁은경우를대표하며 W 2 =30 mm인경우는접지면이넓은경우를대표한다. 그림 8(a) 와 (b) 는신호선이한개존재할때신호선에인가되는전압에의한복사성방사레벨, 신호선이두개있는경우에한쪽신호선에만신호가인가되는경우, 신호선이두개있는경우의두쪽신호선에동시에신호가인가되는경우에따라서복사성방사레벨의예측치를나타내고있다. 이때복사성방사레벨이가장높은 2 signal trace with 2 input 을이후의전개과정에서복사성방사레벨의기준으로가정한다. (a) 좁은접지면상에서의입력신호에따른복사성방사레벨 (a) The radiated emission level according to input signal trace with narrow ground plane (b) 넓은접지면상에서의입력신호에따른복사성방사레벨 (b) The radiated emission level according to input signal trace with wide ground plane 그림 8. 신호선두개존재할때신호원과접지면의넓이에따라복사성방사레벨의변화정도 Fig. 8. The variation of the radiated emission level according to the number of sources and the area of ground plane. 그림 7. 일반적인 PCB 선로상의신호선이두개인경우의단면도 Fig. 7. The cross section view of double signal traces with ground plane. Ⅱ절에서와마찬가지로 pattern study와 parameter study를통해최종적으로접지면패턴을구하였으며최적화된구조를찾기위하여다양한패턴들이비교되었다. 그중의일부분을나열하면다음의그림 9 와같다. Ⅱ절에서와마찬가지로최종적으로결정된 hybrid type의각변수값들을변경함으로써접지면이넓은경우의복사성방사레벨에근접하는최적화된 1194

7 소형및변형된접지면을이용한신호선복사성방사레벨의감소방법 (a) Corrugation 형기본구조 (a) Corrugation type (b) Rectangular Slot 형기본구조 (b) Rectangular slot 그림 10. 주요변수 W n 과 W 2 에따른복사성방사레벨의변화 Fig. 10. The variation of radiated emission level according to the parameters, W n and W 2. (c) 최적화구조 (Corrugation 과 Rectangular Slot 의혼합형 ) (c) Mixed Pattern(Combination of corrugation and rectangular slot) 그림 9. 복사성방사레벨을줄이기위한다양한접지면패턴 Fig. 9. The various ground patterns to minimize the radiated emission level. (a) 다양한접지면으로부터의방사레벨 (a) With various ground planes 접지면패턴을구성하도록하였다. 이때앞서 Ⅱ절에서얻은변수중에서 W h =1 mm/l h =1 mm/l n =1 mm/n=19로고정하였고 W 2 와 W n 의변화에따른복사성방사특성을관찰하였다. 그림 10은각 W 2 마다최적의 W n 값을모두비교한것이다. 위결과에서확인해보면저주파대역 (50 ~200 MHz) 에서 W 2=8 mm/w n=5 mm일때가복사성방사레벨이최소화될때의접지면패턴임을알수있으며 200~550 MHz 구간에서는패턴에도영향을받지만 W 2( 접지면의폭 ) 의영향이주된것임을확인할수있었다. 그림 11(a) 는다양한접지면을가지는 PCB 선로로부터복사되는방사레벨을나타내는것으로세개의패턴 (corrugation, rectangular slot, W 2 =6 mm인 hybrid (b) 좁은접지면에패턴이있는경우와없는경우의복사성방사레벨비교 (b) With/without a novel ground pattern on narrow ground plane 그림 11. 예상되는복사성방사레벨 Fig. 11. The predicted emission level. 1195

8 韓國電磁波學會論文誌第 17 卷第 12 號 2006 年 12 月 형태 ) 에의한방사레벨이 50~200 MHz 범위내에서는 W 2=30 mm인넓은접지면의경우와비슷하다. 또한, 복합된구조 (hybrid 형태의접지면 ) 가방사레벨의감소에가장적합하다는것을알수있다. 그림 11(b) 는 W 2=5 mm인폭을가지는접지면에패턴이있는경우와없는경우를비교한것으로특히주목할점은같은넓이 W 2=5 mm에서패턴을가하지않은경우의복사는접지면이좁은경우와동일하였으나그림 11(b) 에서확인할수있듯이최고 8 db 이상의복사성방사레벨감소효과를나타내고있다. 이는접지면에적절한패턴작업을취함으로서복사성방사레벨을낮출수있음을암시한다. 그림 12(a) 는두개의신호선을가지는 PCB double signal traces의제작된실물을나타내며, 그림 12(b) 와 (c) 는상호커플링의값을시뮬레이션과측 정치를비교해봄으로서그림 11의예측된결과의타당성을보이고자하였다. 그림의결과에서알수있듯이접지면의면적이적은경우에도적절한접지면패턴구조를적용하면일정한주파수대역에서복사성방사레벨을낮출수있음을확인할수있다. Ⅳ. 결론본논문에서는 PCB 접지면의넓이와접지면의모양에따라복사성방사레벨특성이어떻게변화하는지에관하여다루었으며, 특히, 접지면의넓이를최소화하면서접지면의최적화된패턴을적용하여단일선로및복수신호선로로부터의복사성방사레벨을낮출수있는방법에관하여연구하였다. 더욱이, 변수변화에따른특성변화를살펴봄으로서복사성방사레벨의감소를유도할수있는가장효 (a) 다양한접지면을이용한두개선로상으로부터방사를측정하기위한실제사진 (a) The photograph of double signal traces with various ground planes (b) 두신호간의예상되는상호간섭레벨 (b) The predicted mutual coupling between two signal traces (c) 측정된상호간섭레벨 (c) The measured mutual coupling between two signal traces 그림 12. 실물사진, 예측치및측정치비교 Fig. 12. The fabricated PCB traces and the comparison between the predicted and measured results. 1196

9 소형및변형된접지면을이용한신호선복사성방사레벨의감소방법 과적인구조를시뮬레이션과측정을통하여검증하였다. 참고문헌 [1] D. A. Hill, D. G. Camell, K. H. Cavcey, and G. H. Koepke, "Radiated emissions and immunity of microstrip transmission lines : theory and reverberation chamber measurements", IEEE Trans. Electromagnetic Compatibility, vol. 38, no. 2, pp , May [2] T. H. Ooi, S. Y. Tan, and H. Li, "Study of radiated emissions from PCB with narrow ground plane", IEEE International Symposium on Electromagnetic Compatibility, pp , May [3] L. B. Gavelle, P. F. Wilson, "EMI/EMC in printed circuit boards - a literature review", IEEE Trans. Electromagnetic Compatibility, vol. 34, no. 2, pp , May [4] D. L. Terrell, R. K. Keenan, Digital Design for Interference Specification, Second Edition, Newnes, [5] T. M. Zeeff., T. H. Hubing, and T. P. Van Doren, "Traces in proximity to gaps in return planes", IEEE Trans. On Electromagnetic Compatibility, vol. 47, no. 2, pp , May 박필성 2006 년 2 월 : 한국항공대학교항공전자공학과 ( 공학사 ) [ 주관심분야 ] PCB EMI/EMC 대책기술, 항공기 EMI/EMC 이재욱 1992년 2월 : 한양대학교전자공학과 ( 공학사 ) 1994년 2월 : 한국과학기술원전기및전자공학과 ( 공학석사 ) 1998년 2월 : 한국과학기술원전기및전자공학과 ( 공학박사 ) 1998년 3월~2004년 2월 : 한국전자통신연구원디지털방송연구단전파기반연구그룹 2004년 3월~현재 : 한국항공대학교항공전자및정보통신공학부, 전자및항공전자전공, 조교수 [ 주관심분야 ] 마이크로파및밀리미터파능, 수동소자해석및설계, EMI/EMC 대책기술, 고출력증폭기및고출력안테나설계 이택경 1983년 2월 : 고려대학교전자공학과 ( 공학사 ) 1985 년 2 월 : 한국과학기술원전기및전자공학과 ( 공학석사 ) 1990 년 2 월 : 한국과학기술원전기및전자공학과 ( 공학박사 ) 1990 년 3 월 ~1991 년 2 월 : 한국과학기술원전기및전자공학과연구원 1990 년 5 월 ~1991 년 4 월 : Univ. of Texas at Austin, Post Doctoral Fellow 1991 년 9 월 ~1992 년 2 월 : 한국과학기술원정보전자연구소연구원 2001 년 7 월 ~2002 년 7 월 : Univ. of Illinois, Urbana-Champaign, 방문교수 1992 년 3 월 ~ 현재 : 한국항공대학교항공전자및정보통신공학부교수 [ 주관심분야 ] 마이크로파, 안테나, 전자파해석, 레이다등 1197

10 韓國電磁波學會論文誌第 17 卷第 12 號 2006 年 12 月 조춘식 1987년 2월 : 서울대학교제어계측공학과 ( 공학사 ) 1995년 12월 : University of South Carolina, Electrical Eng. ( 공학석사 ) 1998년 12월 : University of Colorado at Boulder, Electrical Eng. ( 공학박사 ) 2004년 3월~현재 : 한국항공대학교항공전자및정보통신공학부정보통신공학전공, 전임강사 [ 주관심분야 ] RFIC/MMIC, LNA, Oscillator, Antenna, Computational Electromagnetics 등 최형도 1986 년 2 월 : 고려대학교재료공학과 ( 공학사 ) 1989 년 8 월 : 고려대학교재료공학과 ( 공학석사 ) 1996 년 8 월 : 고려대학교재료공학과 ( 공학박사 ) 2004 년 6 월 ~2005 년 12 월 : 한국전파진흥협회부설 EMC 기술지원센터장 1997 년 1 월 ~ 현재 : 한국전자통신연구원전자파환경연구팀장 [ 주관심분야 ] 전자파인체영향, EMI/EMC 소재및부품등 김재흥 1989년 2월 : 연세대학교전자공학과 ( 공학사 ) 1998년12월 : Univ. of Colorado at Boulder, Electrical Engineering ( 공학석사 ) 2002년 5월 : Univ. of Colorado at Boulder, Electrical Engineering ( 공학박사 ) 2006년 3월~현재 : 한국정보통신대학교연구교수 [ 주관심분야 ] Beamforming Lens and Array, High Efficiency Active Circuits 1198

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