Vertical Probe Card for Wafer Test
Vertical Probe Card Technology Pin Technology 1) Probe Pin Testable Pitch:03 (Matrix) Minimum Pin Length:2.67 High Speed Test Application:Test Socket Life Time: 500000 Insulation Material: (Sumika Super S-1000) Vertical Probing 2) Tubeless Pin Testable Pitch: 100 (Matrix) Minimum Pin Length: 3.0 Application:High Density PCB(Flipchip), TAB Probe Card, TCP Test Probe Card Life Time: 1000,000 Insulation Material: (Sumika Super S-1000),, Vertical Probing 3) Micro Cube Pin Testable Pitch:25 Pin Length:Variable(Probe Card5.4 ) Pin Thickness:Variable Application:TFT LCD/Organic EL Cell Test Probe Card,Wafer Test Probe Card Life Time: 300,000 Insulation Material:, Vertical Probing
Vertical Probe Card Technology Pin Pitch for Test Technology 1) Tubeless Pin Straight:100 Matrix:100 2) Micro Cube Pin Straight:25 Zigzag: 1)12.5
Vertical Probe Card Technology Pin Edge & Available Pad Size 1) Tubeless Pin 10 ~100 Damage :Min 15 (Circle) Available Target Pad Size:Min25 1 2 3 2) Micro Cube Pin Damage :9~12 10~15 (Ellipse) Available Target Pad Size: 20 < 500 / 45 Tilt by SEM >
Vertical Probe Card Technology Micro Precision Technology 1) Micro Drilling Engineering Plastic Micro Hole Hole Diameter:Min 50 2) Micro Micro Slot Slot Width:Min 12
Vertical Probe Card Technology(Micro Cube) Concept Interface Pin Mother Board Wafer Chip PAD Micro Cube Pin Wafer Pogo Tower Mother Board PCB Pin Block Ground Plate Interface Pin Wafer Micro Cube Pin
Vertical Probe Card Technology(Micro Cube) Structure Pin Block Cover Pin Block Mother Board <Top View> Base Block <Bottom View> Board Guide Ring
Vertical Probe Card Technology(Micro Cube) Pin Block Center Block Retaining Screw Center Block Fix Block Micro Cube Pin Setting Block Ground Plate Micro Cube Pin Interface Pin Interface Pin Setting Block Base Block
Vertical Probe Card Technology(Micro Cube) Micro Cube Pin Block
Vertical Probe Card Technology(Micro Cube) Interface Pin Block
Vertical Probe Card Technology(Micro Cube) Pin Interface
Vertical Probe Card Technology(Micro Cube) Cross Section of Probe Card Center Block Retaining Screw Pin Block Cover Center Block Micro Cube Pin Fix Block Micro Cube Pin Setting Block Ground Plate Interface Pin Interface Pin Setting Block Mother Board Base Block
Vertical Probe Card Technology(Micro Cube) Features 1. Vertical Probing 2. Fine Pitch Probing 3. High Precision Accuracy(Uniformity & Pitch) 4. Recycling 5. Pad Test 6. Contact Force. 7. Damage. 8. Pin.(Soft Brush Cleaning or Tape Cleaning) 9. Pin Inspection.
Vertical Probe Card Technology(Micro Cube) Micro Cube Pin 1. Pin Material:Ni Au(0.3 ) / HV500 2. Thickness: 1)24 : Pitch 40 2)20 : Pitch 40 3)12 : Pitch 20~25 3. Pin Height:5.4 4. Pin Length:8.446 5. Pin Accuracy: 1.5 6. Pin Force: Stroke 10 30 50 70 100 20 1.0 2.6 4.1 5.7 8.0 Pin Force(g) 24 1.1 2.8 4.4 6.1 8.6 12 4.0 Mechanical Specification 1. Testable Pitch: 25 2. Available Target Pad Size: 20 3. Pin Uniformity: 5 4. Pin Pitch Accuracy: 4 5. Life Time: 300,000 6. Setting Stroke: 60 Full Stroke:100
Vertical Probe Card Technology(Micro Cube) Needle Type Scratch Damage. Damage. Fine Pitch PAD. Contact Force. Cleaning Cycle. Fine Pitch Test. Pin Repair. Micro Cube Type. Damage (12 15 ).. Fine Pitch Test. Pin Repair. Wire Type Fine Pitch Contact Reliability. M/C Interface (Stroke ) Repair. Cleaning.
Vertical Probe Card Technology(Tubeless) 1.,, 1) Spring Diameter : 0.14, 0.1, 0.07, 0.05 ( ) 2) Total Length : 3.4, 3.0 3) Contact Edge : 10 ~ 100
Vertical Probe Card Technology(Tubeless) Spring Plunger 1(Contact Point) Plunger 2(Interface Point)
Vertical Probe Card Technology(Tubeless) 2. 1) Contact Spring. 2) Probe Plunger Plunger. Interface Probing 3) Spring Pin, 4) Pin.
Vertical Probe Card Technology(Tubeless)
Vertical Probe Card Technology(Tubeless) 3. 1) Pitch -100 (Matrix) : -80 (Matrix) : Matrix Pad Target 80 Pitch Test Spring Diameter 50 2) Pin -144Pin / Pitch 120 /Memory/Build up PCB Interface ( ) -4700Pin / Pitch 200 / MCM / Pin Interface ( ) -4700Pin / Pitch150 / Pin Interface ( ) Probe Card PCB Interface FPC, Pin Pitch.
Vertical Probe Card Technology(Tubeless) 1) Tubeless Pin - :.Plunger : SK ( ).Spring : Music Wire(SWPA) - : Ni 2, Cu 4, Au 0.3 - Spring :.67 X 20 / 0.14.67 X 15 / 0.10.67 X 15 / 0.07.(? ) / 0.05 :
Vertical Probe Card Technology(Tubeless) 4.. 1) Tubeless Pin -Plunger Contact :. 0.1(Pin Diameter 0.14 ). 0.06(Pin Diameter 0.10 ). 0.04(Pin Diameter 0.07 ). 0.01~0.15(Pin Diameter 0.10 / 0.07 / 0.05 ) -Pin Length : 3.0 ~ 3.4 ( ) - : 300m - : 1A -Contact Force : 3.0g ~ 10g(0~300 ) :Pin Diameter :3.5g Initial Force. ex) 8.3g / 200 / Pin Diameter 0.14
Vertical Probe Card Technology(Tubeless) 2) -Damage Size : 20 ~ 40(Probe Mark Size) -Scratch : (Vertical Probing) -Stroke : 200 ~300 (Max) -Cleaning : Tape(3M ) -Life Time : 1000,000 -Height Accuracy : 10 -Position Accuracy : 10 -Insulator Material : Sumika Super(S-1000)
Vertical Probe Card Technology Benefits 1. Repair : 2. Running Cost : Repair Time / Pin 8-3. Long Life Life Time 4. Pin Contamination : M/C MTBF / 5. Pad Damage : Die Shrink 6. Pad Contact Reliability 7. YLD 8. Fine Pitch
Vertical Probe Card Technology 1. Multi Chip Probe Card Cost Down Target Pitch : 40 (Matrix) 2. Array Pad Chip Probe Card Flipchip Wafer Test Probe Card Wafer Level Target Pitch : 80 (Matrix)-Tubeless Pin 3. High Function Contact Pin High Speed High Density Fine Pitch
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