1. (Plating)? PCB (Connection) Hole 2. (Plating Process) Desmear Black-Hole Panel Dry-Film Dry-Film Pattern
(De-Smear) Smear [Smear ] : Smear Hole Wall 100%
(Smear)
1. Desmear 2. Black-hole
3. Shadow Drill Hole >Si O - GLASS >Si = O GLASS >C O - EPOXY Cleaner/Conditioner Hole Charge Carbon-black black Shadow 3. Shadow Cleaner/Conditioner Shadow Shadow Fixer Micro-Etching
(Electro Copper Plating) 1. (Electro Copper Plating) 2. (Electro Solder Plating)
(Electro Copper Plating) 3. DC & Reverse Pulse 4. DC & Reverse Pulse DC DC Pulse(2 ) 0 _ 0 _
(Electro Copper Plating)
(Electro Copper Plating)
(Electro Copper Plating) 6. (PLATING PROCESS)
(Electro Copper Plating) ² ² ² ²
(Electro Copper Plating) 8. TROUBLE SHOOTING GUIIDE (Burning)
(Electro Copper Plating) 8. TROUBLE SHOOTING GUIIDE (STREAKING)
1. (Etching) - / Cu. 2. (CuCl 2 Etching) - Tenting, (HCl), (H 2 O 2 ), (H 2 O), Cu ² - D/F 3. (Alkali Etching) [ (Alkali Etching) ] - ² - D/F
1. (Develope) - PCB (Ultra-Violet), (NaCO 3 ) (KCO 3 ),. (Break Point) : Break Point ½ Setting 2. (Strip) & Break Point D/F 1/2 ~ 2/3. Setting Setting, 1/2 2/3. PCB 1/2 B.P PCB 1/2 Spray Off. 1/2,, B.P 1/2 - Resist, Etching Resist Plating Etching Resist Dry-Film. - (NaOH) (KOH) D/F ( COOH) OH - D/F.