앰코는고객의기대를뛰어넘는고객의기대를넘어서는무결점서비스 앰코만의품질마인드로최고의제품과서비스를고객에게제공하여비즈니스경쟁력을증대시킵니다. QualityFIRST 비전 성공적인디자인, 제품개발과인증을추구한다. 무결점의제품과서비스를제공한다. 모든조직은완벽한무결점을실행한다. Qu

PRODUCT Line Card Enabling the Future 반도체 패키징, 설계, 조립 및 테스트 서비스 분야의 세계 최대 공급업체 중 하나인 앰코는 차세대 제품을 현실로 만들어 줍니다. 어셈블리 설계 테스트 본 문서의 모든 콘텐츠는 저작권법에 따라 무단복제 및 배포를 금지하며, 제공된 정보의 정확성을 보장하지는 않습니다. 앰코는 본 문서의 정보사용에 따른 특허나 라이선스 등과 관련된 어떠한 형태의 피해에 대해서도 책임을 지지 않습니다. 본 문서는 앰코의 제품보증과 관련하여 표준판매약관에 명시된 것 이상으로 확대하거나 변경하지 않습니다. 앰코는 사전고지 없이 수시로 제품 및 제품정보를 변경할 수 있습니다. 앰코의 이름 및 로고는 Amkor Technology, Inc.의 등록상표입니다. 그 외 언급된 모든 상표는 각 해당 회사의 자산입니다. 2018, Amkor Technology Incorporated. All Rights Reserved. DS820C 5/18 2018년 6월 www.amkor.com 연락처 : ATKQnA@amkor.co.kr 제품정보 : www.amkor.com

앰코는고객의기대를뛰어넘는고객의기대를넘어서는무결점서비스 앰코만의품질마인드로최고의제품과서비스를고객에게제공하여비즈니스경쟁력을증대시킵니다. QualityFIRST 비전 성공적인디자인, 제품개발과인증을추구한다. 무결점의제품과서비스를제공한다. 모든조직은완벽한무결점을실행한다. QualityFIRST 문화

목차 04 05 14 25 26 28 29 위치 Laminate 05...PBGA 05...CABGA 07...FCBGA frame 14...PDIP 14...PowerSOP 3 15...SOT-23/TSOT 15...SSOP/QSOP 16...TSOP 16...TSSOP/MSOP Power 25...PSMC 25...SOD123-FL 25...SOD128-FL 25...TO-220 25...TO-220F 25...TO-220FP 25...TO-220SMD 08...Stacked CSP 09...fcTMV 09...fpfcMEP 17...SOIC 17...ExposedPad TSSOP/ MSOP/SOIC/SSOP 18...LQFP 19...TQFP 20...ExposedPad LQFP 25...TO-251 25...DPAK 25...TO-252JEITA 25...TO-263 25...TO-263 (7-pin) 25...HSON8 25...Mini-HVSON (8-pin) 10...fcCSP 13...fcSCSP 20...ExposedPad TQFP 21...MQFP 22...PLCC 22...FusionQuad 23...MLF 25...HVSON (8-pin) 25...SO8-FL 25...TSON8-FL 25...TOLL 25...LFPAK Wafer Bump, Wafer Level Processing & Die Services 26...WLCSP Die Processing 26...Wafer Bump (8 & 12 ) 27...Turnkey Process Flow MEMS & Sensors 28...Cavity MEMS 28...Molded Cavity 28...Cavity LF Test 29...Major IC Testers 29...Wafer Prober 30...Package Test Handler 30...Strip Test/Film Frame Handler 30...Discrete/Power Test 31...Wafer Probe Roadmap 31...Package Test Roadmap PnP 32...Package Test Roadmap Film Frame 32...Package Test Roadmap Strip 33...Package Test Roadmap Gravity 33...Package Test Roadmap Turret 33...Burn In Oven 33...End Of Line (EOL) Services 34...Amkor by the Numbers 35...Worldwide Sales Offices

글로벌 앰코 전략적으로 위치한 생산기지 및 고객지원센터 영업사무소 및 고객지원센터 본사 어셈블리 및 테스트 시설 영업사무소, 고객지원센터, 어셈블리 및 테스트 시설 대한민국 인천 독일 뮌헨 대한민국 서울 프랑스 아르샹 일본 후쿠이, 후쿠오카, 하코다테, 키츠키, 쿠마모토, 우즈키 중국 베이징 포르투갈 포르토 일본 도쿄 중국 상하이 중국 선전 대한민국 광주 보스턴 산호세 템피 어바인 샌디에이고 대만 주베이 댈러스 오스틴 대만 룽탄 대만 신주 필리핀 문틴루파 필리핀 비난 라구나 말레이시아 쿠알라룸푸르 싱가포르 공장 코드 범례 앰코는 전 세계적으로 22개의 어셈블리 및 테스트 제조시설을 보유하고 있습니다. 다음의 제품 도표는 서로 다른 패키지가 어느 시설에서 제조되는지를 나타냅니다. 중화권 C3...Shanghai T1, T6...Taoyuan City T3, T5...Hsinchu 일본 JFI...Fukui (JG) JFO...Fukuoka (JH) JHD...Hakodate (JB) JKM...Kumamoto (JL) JKT...Kitsuki (JI) JUK...Usuki (JJ) 대한민국 K4...Gwangju K3, K5...Incheon 필리핀 P1...Muntinlupa City P3, P4...Binan Laguna 말레이시아 M1...Kuala Lumpur 포르투갈 ATEP...Porto Automotive capability에서 대부분 사용할 수 있는 패키지입니다. 패키지는 실제 크기로 표시되지 않고 사용 가능한 패키지를 나타냅니다. 문의 : 앰코 영업팀(asales@amkor.co.kr) Amkor Product Line Card 2018년 6월 4

Laminate 패키지 앰코가가진 laminate 패키지기술의뛰어난기능은, 향상된전기적및열성능이요구되는고전력및고속 IC에이점을제공합니다. Laminate 패키지는 leadframe 기판위에플라스틱또는테이프 laminate 기판을사용하는 BGA 설계를사용하고, 주변부가아닌패키지바닥에전기연결부를배치합니다. 기판의바닥면에고르게분포된범프가시스템보드에전기연결을제공합니다. 이 BGA 형식은 leadframe 패키지보다낮은열저항, 낮은인덕턴스및많은상호연결을 제공합니다. 향상된전기적, 열적성능을요구하는고전력및고속 IC가앰코 laminate 패키지기술의고기능성으로부터도움을받습니다. Laminate 패키지는 microprocessors/controllers, gate arrays, memory, chipsets, analog, Flash, SRAM, DRAM, ASIC, DSP, RF 디바이스및 PLD와같은고성능어플리케이션에이상적인솔루션입니다. PBGA Packages Package Dimensions PBGA Legend: Max full array ball count shown contact Amkor for custom BGA pattern availability. and Pitch Package Outline Size 0.8 mm 1.0 mm 1.27 mm 19 x 19 529 324 K4, P3 DS520 21 x 21 400 K4, P3 DS520 23 x 23 484 289 K4, P3 DS520 25 x 25 576 K4, P3 DS520 27 x 27 676 400 K4, P3 DS520 29 x 29 780 K4, P3 DS520 31 x 31 900 576 K4, P3 DS520 35 x 35 1156 729 K4, P3 DS520 37.5 x 37.5 1296 841 K4, P3 DS520 40 x 40 1521 957 K4, P3 DS520 PBGA CABGA Packages Package Dimensions CABGA Size and Pitch 0.4 mm 0.5 mm 0.65 mm 0.8 mm 1 mm 1.27 mm 2.5 x 2.5 36 P3 DS550 3 x 3 49 25 20 K4, P3 DS550 3.5 x 3.5 34, 49 36 C3, K4, P3, JKT DS550, DSJD405 4 x 4 49, 64 40, 41, 48,49 24 C3, K4, P3 DS550 4.5 x 4.5 72, 81 JKT DSJD405 5 x 5 97, 100 44, 48, 56, 57, 62, 64, 65, 68, 72, 76, 80, 81 49 25 C3, K4, P3, JKT DS550, DSJD405 5.5 x 5.5 78, 99 JKT DSJD405 6 x 6 76 48, 56, 64, 80, 84, 86, 88, 92 49, 58 36 C3, K4, P3, JKT DS550, DSJD405 6 x 6 96, 140, 155 96, 97, 100, 101, 105, 111, 112, 113, 120, 121 64 C3, K4, P3, JHD, JKT DS550, DSJD405 7 x 7 187, 191 64, 86, 100, 104, 107, 116 64, 80 48, 49, 64 C3, K4, P3, JKT DS550, DSJD405 7 x 7 209, 211, 256 121, 128, 132, 137, 142, 143, 144, 154, 160 81, 84, 137 C3, K4, P3, JKT DS550, DSJD405 8 x 8 121, 252 56, 80, 100, 108, 112, 113, 120 105 52, 64, 80, 81 C3, K4, P3 DS550 8 x 8 308 124, 128, 132, 133, 144, 160, 161, 164, 176, 180 121, 140 C3, K4, P3, JHD, JKT DS550, DSJD405 8 x 8 195, 196, 208, 219, 225 C3, K4, P3 DS550 CABGA Amkor Product Line Card 2018 년 6 월 5

CABGA Packages (Cont.) Package Dimensions CABGA and Pitch Size 0.4 mm 0.5 mm 0.65 mm 0.8 mm 1 mm 1.27 mm 9 x 9 296, 383 128, 156, 188, 201, 220, 225, 265 109, 121, 141, 144 81, 100 C3, K4, P3, JKT, JHD DS550, DSJD405 10 x 10 216, 360, 384 173, 179, 180 164, 170 96, 100, 104, 120, 121, 128, 144 81 C3, K4, P3, JKT DS550, DSJD405 10 x 10 387, 396, 409 181, 192, 200, 216, 221, 224, 225, 233, 235, 240 183 C3, K4, P3, JKT, JHD DS550, DSJD405 10 x 10 424, 454 244, 257, 267, 268, 273, 277, 284, 285, 289, 292, 296, 297, 328 196 C3, K4, P3 DS550, DSJD405 10 x 10 456 336, 345, 346 C3, K4, P3 DS550 11 x 11 432, 440, 452 204, 223 165, 177, 192, 196 128, 132, 144, 169 100 C3, K4, P3, JHD, JKT DS550, DSJD405 11 x 11 476, 576 256, 280, 289, 305, 321, 324, 337, 361, 416 200, 208, 225, 241 C3, K4, P3, JKT DS550, DSJD405 12 x 12 216, 487, 547 236, 244, 260, 272, 291, 308, 337, 343 177 144, 160, 168, 179 121 C3, K4, P3, JHD DS550, DSJD405 12 x 12 560, 569, 617 385, 388, 424 193, 208 180, 192, 196 C3, K4, P3, JHD, JKT DS550, DSJD405 12 x 12 697, 714, 745 213, 241 C3, K4, P3, JKT DS550, DSJD405 13 x 13 276 240, 248, 273 C3, K4, P3 DS550 13 x 13 281, 286, 289, 325, 280, 281, 282, 289, 337, 341, 345 294 145 C3, K4, P3, JHD, JKT DS550, DSJD405 13 x 13 356, 368, 385, 400, 401, 420, 424 328, 336, 348 177, 193, 201, 224, 225 144 C3, K4, P3, JHD, JKT DS550, DSJD405 13 x 13 505 361 256 C3, K4, P3, JHD DS550, DSJD405 14 x 14 270 169, 220 304, 332, 345 233, 256 166, 169 C3, K4, P3 DS550 14 x 14 683 409, 456, 480, 516, 521, 538, 562, 616 379, 387, 400 C3, K4, P3, JHD DS550, DSJD405 15 x 15 418 393, 464, 543, 586, 603 339, 349, 351 208, 209, 217, 220, 228, 233, 240, 255, 260, 261, 265, 280, 288, 289 C3, K4, P3, JHD, JKT DS550, DSJD405 15 x 15 352, 368 319, 324 160, 176, 196 C3, K4, P3, JHD DS550, DSJD405 16 x 16 430, 609, 624 304, 324, 360, 423, 426, 445, 477 280, 285 174, 225 C3, K4, P3, JHD DS550, DSJD405 17 x 17 281, 457 256, 268, 272, 292, 293 199, 208, 224, 228, 252, 256 136, 164 C3, K4, P3, JKT DS550, DSJD405 17 x 17 540, 604, 608 508, 521, 532, 600 308, 316, 318, 320, 324, 326, 358, 364, 399, 400 256 C3, K4, P3, JHD, JKT DS550, DSJD405 18 x 18 842, 906 JHD DSJD405 19 x 19 321 JHD DSJD405 21 x 21 449, 490, 537 JHD DSJD405 23 x 23 552 324, 352, 484 JKT DSJD401, DSJD405 27 x 27 416, 456, 484, 516 256 JKT DSJD401 31 x 31 564, 613, 620, 640, 641, 704 421 JKT DSJD401 35 x 35 814, 868, 1012 484 JKT DSJD401 CABGA Amkor Product Line Card 2018 년 6 월 6

FCBGA Packages Package Dimensions FCBGA Size and Pitch 0.4 mm 0.5 mm 0.65 mm 0.8 mm 1 mm 1.27 mm 12 x 12 841 529 289 196 121 K4, T3 DS831 13 x 13 961 625 361 225 144 K4, T3 DS831 14 x 14 1156 729 400 256 169 K4, T3 DS831 15 x 15 1296 841 484 289 196 K4, T3 DS831 16 x 16 1521 961 529 361 225 K4, T3 DS831 17 x 17 625 400 256 K4, T3 DS831 19 x 19 784 484 324 K4, T3 DS831 21 x 21 961 625 400 K4, T3 DS831 23 x 23 1156 672, 729 484 K4, T3, JHD DS831, DSJD406 25 x 25 1369 900 572 K4, T3 DS831 27 x 27 873, 1024, 1089 625, 676 360 K4, T3, JHD, JKM DS831, DSJD406 29 x 29 1225 729, 784 K4, T3, JHD, JKM DS831, DSJD406 31 x 31 1369 900 304 K4, T3, JHD, JKM DS831, DSJD406 33 x 33 1600 961, 1020, 1024 K4, T3, JHD, JKM DS831, DSJD406 35 x 35 1764 924, 1089, 1152, 1156 K4, T3, JHD, JKM DS831, DSJD406 37.5 x 37.5 2025 1278, 1296, 1369 784 K4, T3, JHD, JKM DS550, DSJD405 40 x 40 1444, 1521 900 K4, T3, JHD DS550, DSJD405 42.5 x 42.5 1681 K4, T3, JHD DS550, DSJD405 45 x 45 1936 K4, T3 DS550 47.5 x 47.5 2116 K4, T3, JHD DS550, DSJD405 50 x 50 2401 K4, T3 DS831 52.5 x 52.5 2601 K4 DS831 55 x 55 2916 K4 DS831 57.5 x 57.5 3136 K4 DS831 60 x 60 3481 K4 DS831 62.5 x 62.5 3645 K4 DS831 65 x 65 4096 K4 DS831 Full Array Ball s (ball count shown indicates maximum package size produced to date) FCBGA Amkor Product Line Card 2018 년 6 월 7

Stacked CSP (SCSP) Packages Package Dimensions Stacked CSP (S-CSP) Size and Pitch 0.4 mm 0.5 mm 0.6 mm 0.65 mm 0.75 mm 0.8 mm 1 mm 1.27 mm 2 mm Package Outline 3 x 3 25 K4 DS573 3.5 x 3.5 48, 49 K4 DS573 4 x 4 81 41, 48 K4 DS573 4.5 x 4.5 40, 60 K4 DS573 5 x 5 97 56, 64, 65, 72, 76, 77, 81 49 K4 DS573 6 x 6 140 64, 76, 84, 96, 97, 100, 121 49, 64 K4 DS573 6 x 8 181 54 63 48 K4 DS573 6.2 x 7.2 96 K4 DS573 6.6 x 6.9 105 K4 DS573 7 x 7 209, 211 84, 117, 121, 143, 144, 160, 169 98 64, 81, 84 81 49 C3, K4 DS573 7 x 10 52, 210 81 C3, JKT DS573 7.5 x 7.5 210 K4 DS573 8 x 8 252 113, 120, 128, 160, 161, 176, 196, 208, 225 105, 140 92, 100 64 C3, K4 DS573 8 x 9 153 130 K4 DS573 8 x 9.2 44 K4 DS573 8 x 10 130 JKT 8 x 11 56, 88 C3, K4 DS573 8 x 11.6 73 K4 DS573 8 x 12 66,67,74 44 K4 DS573 9 x 7 56 K4 DS573 9 x 9 296 128, 204, 216, 225, 236 124, 144, 160 121 81, 100 K4 DS573 9 x 11 165 63, 103, 105 C3, K4 DS573 9 x 12 132, 192 107, 130 JKT 10 x 10 360, 387 173, 180, 216, 259, 268, 328, 345 196 144 100, 121, 128, 144 409 C3, K4 DS573 10 x 11 153 63 JKT 10 x 12 79, 88 K4 DS573 10 x 13 63 64 C3 DS573 10 x 13.5 149 JKT 10 x 14 96 K4 DS573 10.5 x 10.5 316 K4 DS573 10.5 x 13 107, 137 C3, K4, JKT DS573 11 x 8 133 72, 88, 107, 133 K4 DS573 11 x 11 432 225, 256 200 144, 169 468 K4 DS573 11 x 11.5 134 K4 DS573 11 x 13 105, 135 C3, K4 DS573 11 x 13.5 162 K4 DS573 11 x 14 225 JKT 11.5 x 11.5 134 K4 DS573 11.5 x 13 153, 162, 221 134 K4, JKT DS573 Stacked CSP (S-CSP) Amkor Product Line Card 2018 년 6 월 8

Stacked CSP (SCSP) Packages (Cont.) Package Dimensions Size and Pitch 0.4 mm 0.5 mm 0.6 mm 0.65 mm 0.75 mm 0.8 mm 1 mm 1.27 mm 2 mm Package Outline 12 x 12 216 168, 228, 260, 272, 277, 289, 318, 385 208 117, 128, 144, 160, 161, 168, 179, 196 C3, K4 DS573 Stacked CSP (S-CSP) 12 x 16 132, 169 224 K4, JKT DS573 12 x 17 60 K4 DS573 12 x 18 169 199 100, 224 132 K4, JKT DS573 13 x 13 289, 325, 341, 401, 417 294 225 144 K4 DS573 14 x 14 270 220, 240, 348, 409, 516 151, 152, 300 134 C3, K4 DS573 14 x 18 169 52, 53, 152 100, 152 52 K4, JKT DS573 14 x 22 119 K4 DS573 15 x 15 543 160, 272 208, 255, 289 196 K4 DS573 17 x 17 208, 256 256 K4 DS573 19 x 19 361, 484 260, 324 K4 DS573 Stacked CSP (S-CSP) fctmv Packages Nominal Package Dimensions fctmv *Simulated Results @ 100 MHz Size BGA Size Ball Package Height Ball Pitch Tray Matrix Units Per Tray Package Outline 9.9 x 5.9 180 0.25 180 0.68 0.5 9 x 32 288 K4 595217PO 12 x 12 569 0.25 569 1.15 0.4 9 x 21 189 K4 438336PO 12 x 12 745 0.27/0.25 745 0.78 0.40/0.566 8 x 21 168 K4 452573PO 14 x 14 31 0.25/0.25 031 0.728 0.40/0.40 8 x 19 152 K4 740428PO 17.25 x 17.10 272 N/A 272 0.82 0.772 6 x 15 90 K4 528556PO fctmv fpfcmep Packages Nominal Package Dimensions fpfcmep N/A *Simulated Results @ 100 MHz Size BGA Size Ball Package Height Ball Pitch Tray Matrix Units Per Tray Package Outline 12.4 x 12.4 892 0.22 mm 892 0.58 mm max 0.35 (0.27) 8 x 20 160 K4 12.4 x 12.4 917 0.22 mm 917 0.58 mm max 0.35 (0.27) 8 x 20 160 K4 12.7 x 12 885 0.22 mm 885 0.64 mm max 0.35 (0.27) 8 x 20 160 K4 15.2 x 15 994 0.22 mm 994 0.67 mm max 0.40 (0.27) 7 x 17 119 K4 15.6 x 15 994 0.24 mm 994 0.64 mm max 0.40 (0.27) 7 x 17 119 K4 15.6 x 15 990 0.22 mm 990 0.67 mm max 0.40 (0.27) 7 x 17 119 K4 fpfcmep Amkor Product Line Card 2018 년 6 월 9

fccsp Packages Nominal Package Dimensions fccsp 17 *Simulated Results @ 100 MHz Size BGA Size Ball Package Height Ball Pitch Tray Matrix Units Per Tray Package Outline 2 x 2.8 24 0.3 24 0.17 0.4 14 x 35 490 C3, K4 744167PO0C DS577 2 x 4 32 0.3 32 0.17 0.4 14 x 35 490 C3, K4 718064PO0B DS577 2.21 x 3.05 17 N/A 17 N/A 0.5 14 x 35 490 C3, K4 No POD DS577 3 x 3 40 0.25 40 1.15 max. 0.4 14 x 35 490 C3, K4 652316PO DS577 3 x 7.5 53 0.5 53 1.2 0.5 14 x 26 364 C3, K4 607973PO0A DS577 3 x 8 48 0.5 48 1.15 0.65 14 x 26 364 C3, K4 610538PO DS577 3.2 x 2.8 21 LGA 21 0.88 0.4 14 x 35 490 C3, K4 421994PO DS577 4 x 4 21 LGA 21 0.9 0.5 14 x 35 490 C3, K4 480926PO DS577 4.2 x 3.3 44 0.3 44 0.93 0.4 14 x 26 364 C3, K4 N7170-1 DS577 5 x 5 32 LGA 32 LGA 0.72 0.4 14 x 35 490 P3 795863PO DS577 5 x 5 33 LGA 33 0.9 0.5 14 x 35 490 C3, K4 463062PO0A DS577 5 x 5 36 LGA 36 LGA 0.72 0.4 14 x 35 490 P3 787208PO DS577 5 x 5 39 LGA 36 0.72 0.4 14 x 35 490 C3, K4 6439789PO DS577 5 x 5 64 0.3 64 0.88 0.7 N/A N/A C3, K4 500693PO0B DS577 5 x 5 44 LGA 44 0.72 0.4 14 x 35 490 P3 787184PO DS577 5 x 6 53 LGA 53 1.1 0.4 14 x 35 490 C3, K4 411115PO DS577 5 x 6 102 0.3 102 0.74 0.5 N/A N/A C3, K4 434380PO0A DS577 5 x 6 102 0.25 102 0.73 0.452 min. 13 x 31 403 C3, K4 437557PO DS577 5 x 7 97 0.25 97 1.00 max. 0.5 14 x 26 364 C3, K4 568933PO DS577 5 x 7 136 0.3 136 0.88 0.4 14 x 26 364 C3, K4 VN041-1 DS577 5.3 x 5.25 36 LGA 36 0.72 0.5 N/A N/A C3, K4 477833PO0A DS577 5.4 x 6.2 152 0.3 152 0.9 0.4 14 x 26 364 C3, K4 637713PO DS577 5.5 x 6.51 NA 0.15 216 0.52 216 12 x 34 408 C3 NT90-PB420-1 DS577 6 x 6 81 0.3 81 0.85 0.5 13 x 33 429 C3, K4 568993PO DS577 6 x 6 105 0.2 105 0.889 max. 0.46/0.65 12 x 29 348 C3, K4 684126PO DS577 6 x 6 105 0.3 105 0.92 0.5 14 x 35 490 C3, K4 VN346-1 DS577 6 x 6 121 0.3 121 0.73 0.5 14 x 35 490 C3, K4 412011PO DS577 6 x 6.6 364 NA NA 1 NA 14 x 26 364 C3, K4 N9650-1 DS577 6.12 x 6.43 NA 0.22 253 0.6 0.35 11 x 28 308 K4 NT90-PB315-1 DS577 6.2 x 7.8 196 0.25 196 1.00 max. 0.4 12 x 25 300 C3, K4 358233PO DS577 6.5 x 6.5 97 0.25 97 0.77 0.4 10 x 26 260 C3, K4 488013PO DS577 6.5 x 6.5 144 0.3 144 1 0.5 N/A N/A C3, K4 429130PO0A DS577 6.6 x 5.8 56 0.5 56 1.17 0.8 12 x 28 336 C3, K4 656455PO DS577 6.6 x 6.6 195 0.3 195 0.8 0.4 N/A N/A C3, K4 442617PO0A DS577 6.7 x 8 136 0.3 136 1.49 0.5 12 x 25 300 C3, K4 607179PO DS577 6.8 x 6.2 90 0.3 90 0.88 0.7 10 x 26 260 C3, K4 481017PO0A DS577 6.9 x 7.8 326 0.2 326 0.82 max. 0.4 10 x 26 260 C3, K4 742710PO DS577 7 x 7 40 LGA 40 0.97 0.5 10 x 26 260 P3 766847PO DS577 7 x 7 64 0.5 64 1.11 0.8 N/A N/A C3, K4 487086PO DS577 7 x 7 64 0.5 64 1.596 0.8 N/A N/A C3, K4 495076PO DS577 7 x 7 64 0.5 64 1.506 0.8 N/A N/A C3, K4 496907PO DS577 7 x 7 191 0.3 191 0.95 0.4 10 x 26 260 C3, K4 VK575-1 DS577 7 x 7 196 0.3 196 0.88 0.5 10 x 26 260 C3, K4 577133PO DS577 7 x 7 256 0.3 256 0.93 0.4 N/A N/A C3, K4 429501PO0A DS577 fccsp Amkor Product Line Card 2018 년 6 월 10

fccsp Packages (Cont.) Nominal Package Dimensions fccsp *Simulated Results @ 100 MHz Size BGA Size Ball Package Height Ball Pitch Tray Matrix Units Per Tray Package Outline 7 x 7.5 277 0.3 277 0.82 0.4 12 x 29 348 C3, K4 438217PO DS577 7 x 9 208 0.3 208 1 0.4 N/A N/A C3, K4 445259PO0A DS577 7 x 9 252 0.3 252 0.92 0.5 13 x 25 325 C3, K4 675144PO DS577 7.4 x 8.2 302 0.2 302 0.79 0.4 10 x 26 260 C3, K4 757705PO DS577 7.5 x 7.5 221 0.3 221 0.82 0.4 10 x 26 260 C3, K4 409303PO DS577 7.5 x 8.5 324 0.3 324 0.82 0.4 10 x 26 260 C3, K4 562538PO DS577 7.8 x 7.8 251 0.3 251 0.88 0.4 10 x 26 260 C3, K4 N2703-1 DS577 8 x 6.5 53 LGA 50 1.1 0.4 10 x 26 260 C3, K4 476666PO DS577 8 x 8 69 0.8 69 2.91 0.8 10 x 26 260 C3, K4 87180PO DS577 8 x 8 165 0.3 165 0.76 0.5 12 x 29 348 C3, K4 638236PO DS577 8 x 8 188 0.3 188 0.9 0.5 N/A N/A C3, K4 492338PO DS577 8 x 13 135 0.46 135 2.36 0.8 N/A N/A C3, K4 670744PO DS577 8 x 13.5 253 0.5 253 1.32 0.5/0.6 10 x 17 170 C3, K4 468833PO DS577 8.1 x 8.1 157 0.3 157 0.99 0.5 10 x 26 260 C3, K4 604909PO DS577 8.4 x 9.2 NA 0.22 506 0.81 0.35 9 x 24 216 K4 734426PO DS577 8.5 x 10.5 479 0.2 479 0.8 0.4 22 x 10 220 C3, K4 647400PO DS577 8.5 x 11 269 0.3 269 0.84 0.5 10 x 21 210 C3, K4 497854PO DS577 8.6 x 7.7 76 0.4 76 0.94 0.8 12 x 28 336 C3, K4 559715PO DS577 8.8 x 8.8 176 0.3 176 0.88 0.7 10 x 26 26 C3, K4 NT90-Y5378-1 DS577 9 x 9 256 0.30mm 256 0.90 0.50 10 x 26 260 P3 613775PO DS577 9.5 x 7.5 314 0.3 314 0.84 ±0.10 0.4 10 x 21 210 C3, K4 472295PO0D DS577 10 x 10 69 0.5 69 1.16 1 8 x 23 184 C3, K4 443458PO DS577 10 x 10 69 1 69 2.91 1 8 x 23 184 C3, K4 303399PO DS577 10 x 10 116 0.3 116 1.05 0.8 N/A N/A C3, K4 406269PD0A DS577 10 x 10 144 0.46 144 1.91 0.8 8 x 21 168 C3, K4 464793PO DS577 10 x 10 144 0.5 144 1.4 0.8 8 x 23 184 C3, K4 686544PO DS577 10 x 10 235 0.3 235 0.86 ±0.10 0.5 8 x 23 184 C3, K4 431863PO0A DS577 10 x 10 284 0.3 284 0.98 0.5 8 x 21 168 C3, K4 344519PO DS577 10 x 10 297 0.3 297 1 0.5 8 x 21 168 C3, K4 N3944-1 DS577 10 x 10 391 0.3 391 1 0.4 8 x 23 184 C3, K4 611696PO DS577 10 x 10 424 0.25 424 0.95 max. 0.4 8 x 21 168 C3, K4 438402PO DS577 10 x 10 454 N/A 454 N/A 0.4 8 x 21 168 C3, K4 No POD DS577 10 x 10 521 0.3 521 0.86 ±0.10 0.4 8 x 21 168 C3, K4 451777PO0B DS577 10 x 10.5 268 0.3 268 0.86 ±0.10 0.5 8 x 20 160 C3, K4 461677PO0A DS577 10.6 x 10.6 54 0.45 54 0.85 0.65 8 x 21 168 C3, K4 715264PO DS577 10.7 x 10.7 337 0.2 337 0.889 max. 0.46/0.65 9 x 21 189 C3, K4 617598PO DS577 10.9 x 10.9 469 0.3 469 0.9 0.4 8 x 21 168 C3, K4 636373PO DS577 10.9 x 10.9 469 0.3 469 0.9 0.4 8 x 21 168 C3, K4 710371PO DS577 11 x 8 300 0.3 300 0.84 0.4 N/A N/A C3, K4 439355PO0A DS577 11 x 11 169 0.4 169 0.85 0.8 8 x 22 176 C3, K4 679034PO DS577 11 x 11 325 0.3 325 0.91 0.5 8 x 22 176 C3, K4 583696PO DS577 11 x 11 361 0.3 361 0.89 0.5 8 x 22 176 C3, K4 695725PO DS577 11 x 11 576 0.3 576 1.05 0.4 8 x 22 176 C3, K4 N2970-1 DS577 fccsp Amkor Product Line Card 2018 년 6 월 11

fccsp Packages (Cont.) Nominal Package Dimensions fccsp *Simulated Results @ 100 MHz Size BGA Size Ball Package Height Ball Pitch Tray Matrix Units Per Tray Package Outline 11 x 11.8 599 0.25 599 0.90 max. 0.4 8 x 21 168 K4 850159PO DS577 11 x 11.8 566 0.25 599 0.90 max. 0.4 8 x 21 168 K4 824554PO DS577 11 x 13.5 325 0.3 325 1.06 0.5 8 x 17 136 C3, K4 606183PO DS577 11.7 x 11.6 539 0.3 539 0.9 0.4 9 x 21 189 C3, K4 558280PO DS577 11.7 x 11.7 492 0.3 492 0.9 0.4 9 x 21 189 C3, K4 640560PO DS577 11.8 x 11 491 0.25 491 0.90 max. 0.4 8x21 168 K4 816866PO DS577 11.8 x 12.2 680 0.25 680 0.90 max. 0.4 8x19 152 K4 814369PO0A DS577 12 x 12 121 0.5 121 1.51 1 8 x 21 168 C3, K4 339265PO DS577 12 x 12 121 0.6 121 1.82 1 8 x 19 152 C3, K4 408392PO DS577 12 x 12 121 0.6 121 2.09 max. 1 9 x 21 189 C3, K4 613853PO DS577 12 x 12 121 0.64 121 2.57 1 8 x 20 160 C3, K4 585453PO DS577 12 x 12 288 0.3 288 1.30 max. 0.67 8 x 20 160 C3, K4 434097PO DS577 12 x 12 424 0.3 424 1.05 0.5 9 x 21 189 C3, K4 VB699-2 DS577 12 x 12 424 0.3 424 1.05 0.5 9 x 21 189 C3, K4 VB699-5 DS577 12 x 12 425 0.3 425 1.05 0.5 N/A N/A C3, K4 491076PO DS577 12 x 12 488 0.3 488 0.96 0.4 8 x 21 168 C3, K4 697685PO DS577 12 x 14 821 0.3 821 0.94 0.4 7 x 20 140 C3, K4 685510PO DS577 12.1 x 13.3 597 0.3 597 0.9 0.4 7 x 17 117 C3, K4 629993PO DS577 12.2 x 9.8 486 0.25 486 1.00 max. 0.4 8 x 24 192 C3, K4 360006PO DS577 12.6 x 12.6 669 0.25 669 1.00 max. 0.4 8 x 19 152 C3, K4 359715PO DS577 13 x 10 517 0.3 517 1.673 0.5 8 x 24 192 C3, K4 548093PO DS577 13 x 13 144 0.5 144 1.51 1 8 x 20 160 C3, K4 452287PO DS577 13 x 13 225 0.46 225 1.89 max. 0.8 8 x 20 160 C3, K4 481847PO DS577 13 x 13 357 0.4 357 1.62 0.7 7 x 17 119 C3, K4 500908PO0C DS577 13 x 13.4 771 0.25 771 0.90 max. 0.4 7 x 17 119 K4 802710PO0B DS577 13 x 13.4 873 0.25 873 0.90 max. 0.4 7 x 17 119 C3, K4 751666PO DS577 13.3 x 12.1 570 0.3 570 0.9 0.4 7 x 20 140 C3, K4 591657PO DS577 13.3 x 12.1 570 0.3 570 0.9 0.4 7 x 20 140 C3, K4 654178PO DS577 13.3 x 12.1 600 0.3 600 0.9 0.4 7 x 20 140 C3, K4 710373PO DS577 13.8 x 13.8 288 0.5 288 1.62 0.7 7 x 17 119 C3, K4 NT90-NH568-1 DS577 13.9 x 12.3 255 0.4 255 1.29 max. 0.8 7 x 17 119 C3, K4 446695PO DS577 14 x 12 720 0.3 720 0.15 0.4 8 x 17 136 C3, K4 769163PO0A DS577 14 x 12 727 0.3 727 0.15 0.4 8 x 17 136 C3, K4 NT90-P1720-1- rev-a DS577 14 x 12 760 0.3 760 0.96 0.4 8 x 17 136 C3, K4 700025PO DS577 14 x 14 617 0.3 617 1.21 0.5 7 x 17 119 C3, K4 465801PO DS577 14 x 14 617 0.3 617 0.91 0.5 7 x 17 119 C3, K4 473925PO DS577 14 x 14 625 0.3 625 0.98 0.5 7 x 17 119 C3, K4 751921PO DS577 15 x 15 195 0.6 195 1.8 1 7 x 18 126 C3, K4 607829PO DS577 15 x 15 484 0.4 484 1.22 max. 0.65 7 x 17 119 C3, K4 617815PO DS577 15 x 15 990 N/A 990 N/A 0.40(0.50) 7 x 18 126 C3, K4 No POD DS577 15 x 15 992 N/A 992 N/A 0.4 7 x 17 119 C3, K4 No POD DS577 16 x 16 536 0.3 536 1.35 0.5 6 x 15 90 C3, K4 637699PO DS577 17 x 17 358 0.46 358 1.7 max. 0.8 N/A N/A C3, K4 358903PO DS577 fccsp Amkor Product Line Card 2018 년 6 월 12

fcscsp Packages Nominal Package Dimensions fcscsp *Simulated Results @ 100 MHz Size BGA Size Ball Package Height Ball Pitch Tray Matrix Units Per Tray Package Outline 6.7 x 4 110 0.25 110 1.26 0.4 11 x 35 385 C3, K4 658535PO DS577 7.2 x 7.2 736 0.135 736 0.6 0.35 10 x 24 240 K4 NT90-PC105-1 DS577 7.2 x 7.4 347 0.135 347 0.6 0.35 10 x 26 260 K4 NT90-P6103-1 DS577 7.6 x 7.8 385 0.135 385 0.65 0.35 10 x 24 240 K4 NT90-P0194-1 DS577 8.6 x 8.2 333 0.25 333 1.00 max. 0.4 10 x 26 260 C3, K4 487887PO DS577 9 x 9 383 0.25 383 1.11 max. 0.4 10 x 26 260 C3, K4 446263PO DS577 9 x 8.2 441 N/A 441 N/A 0.35 10 x 26 260 C3, K4 No POD DS577 8.6 x 8.4 443 0.195 443 0.75 max. 0.35 9 x 23 207 C3, K4 638413PO DS577 9.9 x 8.6 460 0.25 460 0.65 max. 0.4 8 x 22 176 C3, K4 612182PO DS577 11 x 11.4 852 0.18 852 0.66 0.35 8 x 20 160 K4 0850865PO DS577 12 x 12 640 0.25 640 1.08 0.4 9 x 21 189 C3, K4 690104PO DS577 13 x 11.5 775 N/A 775 N/A 0.35(0.65) 8 x 21 168 C3, K4 No POD DS577 fcscsp Amkor Product Line Card 2018 년 6 월 13

frame 패키지 frame 패키지는오랫동안산업표준이었습니다. 앰코의가장인기있는전통적인 leadframe 패키지유형중하나는 SOIC (Small Outline Integrated Circuit) 와 QFP (Quad Flat Pack) 이며, 일반적으로 Dual 및 Quad 제품으로알려져있습니다. frame 패키지는 wirebond 또는 flip chip 기술을사용하여 die 를 leadframe 패키지 carrier에연결합니다. 많은생산량을가진이패키지는, 크기와무게를줄이면서최적의성능을요구하는휴대용오디오, 비디오및통신장치와같은최종제품에이상적입니다. Dual 패키지는소비자제품및자동차제품에사용되는 memory, analog IC, microcontrollers에서일반적으로사용됩니다. 이패키지는특히낮은핀수의디바이스에서경쟁력있는제조비용으로다양한 packaging 기능을제공합니다. Quad 패키지는 ASIC, DSP, microcontroller 및 memory IC에서광범위하게사용되며, 중간및낮은핀수 IC를위한저렴한비용의신뢰성있는솔루션을제공하는광범위한개방형및폐쇄형 tools를포함합니다. MicroFrame QFN 패키지는 copper leadframe 기판이있는 CSP (Chip Scale Package) 근처에캡슐화된플라스틱입니다. 이패키지는패키지바닥주변 lead를사용하여 PWB에전기적으로연결하며, ExposedPad 기술을열향상시켜제공합니다. 뛰어난열적, 전기적성능외에도 MLF 패키지는크기, 무게및성능이중요한모든적용에이상적인선택입니다. PDIP Packages Nominal Package Dimensions (mils) PDIP Shoulder Width Width Length Thickness Standoff Pitch JEDEC Pad Size Electrical Performance Bulk Capacitance (pf) Resistance (mω) Package Outline 8 300 252 365 130 15 100 MS-001 P1 00290 DS397 14 300 252 750 130 15 100 MS-001 P1 00291 DS397 16 300 252 750 130 15 100 MS-001 P1 30170 DS397 PDIP PowerSOP 3 (PSOP3) Packages Nominal Package Dimensions PSOP3 *Simulated Results @ 100 MHz Width Length Thickness Standoff Overall Height Pitch Tip-to-Tip JEDEC Pad Size 20 11.0 15.9 3.15 0.20 3.35 1.27 14.2 MO-166 7.5 x 7.9 Electrical Performance* 3.130 1.540 Bulk Capacitance (pf) 1.990 0.604 Resistance (mω) 30.6 9.42 Package Outline P1 41013 DS320 24 11.0 15.9 3.15 0.20 3.35 1.00 14.2 MO-166 P1 41013 DS320 30 11.0 15.9 3.15 0.20 3.35 0.80 14.2 MO-166 P1 41013 DS320 36 11.0 15.9 3.15 0.20 3.35 0.65 14.2 MO-166 P1 41013 DS320 44 11.0 15.9 3.15 0.20 3.35 0.65 14.2 MO-166 P1 41013 DS320 PSOP3 Amkor Product Line Card 2018 년 6 월 14

SOT-23/TSOT Packages Nominal Package Dimensions Width Length Thickness Overall Height Pitch Tip-to-Tip JEDEC/EIAJ Package Outline 3 1.3 2.9 0.90 0.98 0.95/1.9 2.40 SOT346/TO-236/SC-59 P1 471228 DS581 SOT-23 4 1.3 2.9 0.90 0.98 1.92 2.40 SOT143/TO-253 P1 471228 DS581 5 1.6 2.9 1.15 1.23 0.95/1.9 2.80 MO-178 P1 471229 DS581 6 1.6 2.9 1.15 1.23 0.95 2.80 MO-178 P1 471229 DS581 SOT-23 8 1.6 2.9 1.15 1.23 0.65 2.80 MO-178 P1 471229 DS581 TSOT (TSOP) 3 1.6 2.9 0.88 0.96 0.95/1.9 2.75 N/A P1 353251/41211 DS581 5 1.6 2.9 0.88 0.96 0.95 2.75 MO-193 P1 353251/41211 DS581 6 1.6 2.9 0.88 0.96 0.95 2.75 MO-193 P1 353251/41211 DS581 8 1.6 2.9 0.88 0.96 0.65 2.75 MO-193 P1 353251/41211 DS581 TSOT (TSOP) SSOP/QSOP Packages Nominal Package Dimensions (inches unless otherwise specified) SSOP 14/16 20 24 28 Width 5.3 mm (209 mil) 5.3 mm (209 mil) 5.3 mm (209 mil) 5.3 mm (209 mil) Length Thickness Standoff Overall Height Pitch Tip-to-Tip JEDEC Pad Size Electrical Performance* Bulk Capacitance (pf) Resistance (mω) Package Outline 6.2 mm 1.73 mm 0.13 mm 1.86 mm 0.65 mm 7.80 mm MO-150 P1 32289 DS360 7.2 mm 1.73 mm 0.13 mm 1.86 mm 0.65 mm 7.80 mm MO-150 3.9 x 5.4 2.260 0.958 0.395 0.209 19.0 9.10 P1 32289 DS360 8.2 mm 1.73 mm 0.13 mm 1.86 mm 0.65 mm 7.80 mm MO-150 P1 32289 DS360 10.2 mm 1.73 mm 0.13 mm 1.86 mm 0.65 mm 7.80 mm MO-150 3.9 x 5.1 2.510 0.928 0.463 0.206 21.5 9.57 P1 32289 DS360 SSOP QSOP 16 0.150 0.194 0.058 0.006 0.064 0.0250 0.236 MO-137 P1 32864 DS360 QSOP *Simulated Results @ 100 MHz Amkor Product Line Card 2018 년 6 월 15

TSOP Package Nominal Package Dimensions TSOP I *C3 factory production targeted for stacked memory die. Width Length Thickness Standoff Overall Height Pitch Tip-to-Tip JEDEC/ JEITA Pad Size Electrical Performance Bulk Capacitance (pf) Resistance (mω) Package Outline 28 8 11.8 1.0 0.05~0.20 1.2 max 0.55 13.4 ATM 796692 DS330 32 8 11.8 1.0 0.05~0.20 1.2 max 0.4~0.6 13.4 ATM 612634 DS330 32 8 18.4 1.0 0.05~0.20 1.2 max 0.5 20 ATM 794069 DS330 48 12 18.4 1.0 0.05~0.20 1.2 max 0.5 20 MS-142/ EIAJ ED-7311-1 C3, ATM 35406 DS330 TSOP I TSSOP/MSOP Packages Nominal Package Dimensions TSSOP MSOP *Simulated Results @ 100 MHz Width Length Thickness Standoff Overall Height Pitch Tip-to-Tip JEDEC Pad Size Electrical Performance* Bulk Capacitance (pf) Resistance (mω) Package Outline 8 4.4 3.0 0.90 0.10 1.00 0.65 6.4 MO-153 1.470 0.725 0.224 0.177 13.7 7.5 P1 38118 DS350 14 4.4 5.0 0.90 0.10 1.00 0.65 6.4 MO-153 P1 38118 DS350 16 4.4 5.0 0.90 0.10 1.00 0.65 6.4 MO-153 P1 38118 DS350 20 4.4 6.5 0.90 0.10 1.00 0.65 6.4 MO-153 P1 38118 DS350 24 4.4 7.8 0.90 0.10 1.00 0.65 6.4 MO-153 P1 38118 DS350 28 4.4 9.7 0.90 0.10 1.00 0.65 6.4 MO-153 2.100 0.713 0.368 0.180 16.1 6.8 P1 38118 DS350 38 4.4 9.7 0.90 0.10 1.00 0.50 6.4 MO-153 P1 38118 DS350 8 3.0 3.0 0.85 0.10 0.95 0.65 5.0 MO-187 P1 37830 DS350 10 3.0 3.0 0.85 0.10 0.95 0.50 5.0 MO-187 P1 37830 DS350 TSSOP MSOP Amkor Product Line Card 2018 년 6 월 16

SOIC Packages Nominal Package Dimensions (inches) SOIC Narrow SOIC Wide *Simulated Results @ 100 MHz Width Length Thickness Standoff Overall Height Pitch Tip-to-Tip JEDEC Pad Size Electrical Performance* Bulk Capacitance (pf) Resistance (mω) Package Outline 8 0.150 0.194 0.058 0.006 0.064 0.050 0.236 MS-012 P1 00019 DS370 14 0.150 0.342 0.058 0.006 0.064 0.050 0.236 MS-012 P1 00019 DS370 16 0.150 0.391 0.058 0.006 0.064 0.050 0.236 MS-012 P1 00019 DS370 8 0.208 0.208 0.071 0.004 0.075 0.050 0.311 N/A 3.6 x 2.3 1.25 0.718 0.263 0.218 8.2 5.1 P1 336420 DS370 16 0.300 0.407 0.092 0.009 0.101 0.050 0.406 MS-013 P1 00020 DS370 18 0.300 0.456 0.092 0.009 0.101 0.050 0.406 MS-013 P1 00020 DS370 20 0.300 0.505 0.092 0.009 0.101 0.050 0.406 MS-013 P1 00020 DS370 SOIC Narrow SOIC Wide ExposedPad TSSOP/MSOP/SOIC/SSOP Packages Nominal Package Dimensions epad TSSOP epad MSOP N/A Width Length Thickness Standoff Overall Height Pitch Tip-to-Tip JEDEC Pad Size Electrical Performance* Center Corner Package Outline 8 4.4 3.0 0.90 0.10 1.00 0.65 6.40 MO-153 P1 38118 DS571 14 4.4 5.0 0.90 0.10 1.00 0.65 6.40 MO-153 P1 38118 DS571 16 4.4 5.0 0.90 0.10 1.00 0.65 6.40 MO-153 3.0 x 3.0 1.58 2.28 P1 38118 DS571 20 4.4 6.5 0.90 0.10 1.00 0.65 6.40 MO-153 3.0 x 4.2 1.68 2.45 P1 38118 DS571 24 4.4 7.8 0.90 0.10 1.00 0.65 6.40 MO-153 P1 38118 DS571 28 4.4 9.7 0.90 0.10 1.00 0.65 6.40 MO-153 3.0 x 5.5 1.70 2.65 P1 38118 DS571 38 4.4 9.7 0.90 0.10 1.00 0.50 6.40 MO-153 P1 38118 DS571 8 3.0 3.0 0.85 0.10 0.95 0.65 5.00 MO-187 1.73 x 2.39 1.50 2.20 P1 37830 DS571 10 3.0 3.0 0.85 0.10 0.95 0.50 5.00 MO-187 P1 37830 DS571 epad TSSOP epad MSOP epad SOIC 8 3.9 4.9 1.47 0.05 1.52 1.27 6.00 MS-012 P1 50396 DS571 16 3.9 9.9 1.47 0.05 1.52 1.27 6.00 MS-012 P1 50396 DS571 epad SOIC epad SSOP 36 7.6 10.3 2.28 0.05 2.45 0.50 10.40 MO-271 P1 469970 DS571 epad SSOP *Simulated Results @ 100 MHz Amkor Product Line Card 2018 년 6 월 17

LQFP Packages Nominal Package Dimensions LQFP *Simulated Results @ 100 MHz Size Thickness Pitch Form Standoff Foot Length Tip-to-Tip JEDEC Tray Matrix Units Per Tray Pad Size Electrical Performance* Bulk Capacitance (pf) Resistance (mω) Package Outline 7 x 7 32 1.4 0.8 1 0.1 0.6 9 MS-026 10 x 25 250 5 x 5 0.904 0.211 9.2 P1, JKM, JUK, 34604/ DS232, 0.799 0.202 7.8 JFO JMD3S072286 DSJD408 7 x 7 48 1.4 0.5 1 0.1 0.6 9 MS-026 10 x 25 250 5 x 5 1.110 0.962 0.225 0.200 13.8 12.0 P1, JKM, JUK, 34604/ JFO JMD4S071223 DS232, DSJD408 7 x 7 64 1.4 0.4 1 0.1 0.6 9 MS-026 10 x 25 250 P1, JUK, JFO 34604/ JMD3S072288 DS232, DSJD408 10 x 10 44 1.4 0.8 1 0.1 0.6 12 MS-026 8 x 20 160 P1, JUK, JFO 34607/ JMD3S072296 DS232, DSJD408 10 x 10 52 1.4 0.65 1 0.1 0.6 12 MS-026 8 x 20 160 P1, JUK, JFO 34607/ JMD3S072289 DS232, DSJD408 10 x 10 64 1.4 0.5 1 0.1 0.6 12 MS-026 8 x 20 160 P1, JKM, JUK, 34607/ JFO JMD4S071225 DS232, DSJD408 10 x 10 80 1.4 0.4 1 0.1 0.6 12 MS-026 8 x 20 160 JUK 34607/ JMD3S072302 DS232, DSJD408 12 x 12 64 1.4 0.65 1 0.1 0.6 14 7 x 17 119 JUK JMD3S072290 DSJD408 12 x 12 80 1.4 0.5 1 0.1 0.6 14 MS-026 7 x 17 119 P1, JKM, JUK 51023/ JMD3S072297 14 x 14 52 1.4 1 1 0.1 0.6 16 MS-026 6 x 15 90 P1 DS232 DS232, DSJD408 14 x 14 64 1.4 0.8 1 0.1 0.6 16 MS-026 6 x 15 90 P1 473945 DS232 14 x 14 80 1.4 0.65 1 0.1 0.6 16 MS-026 6 x 15 90 P1, JUK 473945/ JMD3S072292 DS232, DSJD408 14 x 14 100 1.4 0.5 1 0.1 0.6 16 MS-026 6 x 15 90 8 x 8 2.300 1.520 0.419 0.322 26.3 17.8 P1, JKM, JUK 473945/ JMD4S072050 DS232, DSJD408 14 x 14 120/128 1.4 0.40/0.40 1 0.1 0.6 16 MS-026 6 x 15 90 473945/ P1, JKM, JUK JMD3S072293/ DS232, JMD3S072298 DSJD408 16 x 16 120 1.4 0.5 1 0.1 0.6 18 6 X 15 90 JUK JMD3S072294 DSJD408 16 x 16 144 1.4 0.4 1 0.1 0.6 18 6 X 15 90 JUK JMD3S072295 DSJD408 14 x 20 100 1.4 0.65 1 0.1 0.6 16.0 x 22.0 MS-026 6 x 12 72 P1 45373 DS232, DSJD408 14 x 20 128 1.4 0.50 1 0.1 0.6 16.0 x 22.0 MS-026 6 x 12 72 P1, JKM 45373/ JMD3S072304 DS232, DSJD408 20 x 20 128 1.4 0.5 1 0.1 0.6 22 MS-026 5 x 12 60 P1 473996 DS232 20 x 20 144 1.4 0.5 1 0.1 0.6 22 MS-026 5 x 12 60 8.5 x 8.5 6.430 4.230 1.100 1.070 62.9 52.6 P1, JKM, JUK, 473996/ JFO JMD3S072299 DS232, DSJD408 20 x 20 176 1.4 0.4 1 0.1 0.6 22 MS-026 5 x 12 60 P1, JKM, JUK 473996/ JMD3S072300 DS232, DSJD408 24 x 24 160 1.4 0.5 1 0.1 0.6 26 MS-026 4 x 10 40 P1 32780 DS232 24 x 24 176 1.4 0.5 1 0.1 0.6 26 MS-026 4 x 10 40 8 x 8 9.510 5.200 1.270 1.340 89.0 64.0 P1, JKM, JUK, 32780/ JFO JMD3S072301 DS232, DSJD408 24 x 24 216 1.4 0.4 1 0.1 0.6 26 MS-026 4 x 10 40 P1, JKM, JFO 32780/ JMD3S072310 DS232, DSJD408 28 x 28 208 1.4 0.5 1 0.1 0.6 30 MS-026 4 x 9 36 11 x 11 9.670 1.380 86.2 6.190 1.210 64.8 P1, JFO 34514/ JMD3S072311 DS230, DS232 28 x 28 256 1.4 0.4 1 0.1 0.6 30 MS-026 4 x 9 36 P1, JFO 34514/ JMD3S072312 DS230, DS232 LQFP Amkor Product Line Card 2018 년 6 월 18

TQFP Packages Nominal Package Dimensions TQFP *Simulated Results @ 100 MHz Size Thickness Pitch Form Standoff Foot Length Tip-to-Tip JEDEC Tray Matrix Units Per Tray Pad Size Electrical Performance* Bulk Capacitance (pf) Resistance (mω) Package Outline 5 x 5 32 1.0 0.5 1 0.1 0.6 7 MS-026 12 x 30 360 P1 40138 DS230 7 x 7 32 1.0 0.8 1 0.1 0.6 9 MS-026 10 x 25 250 5 x 5 0.904 0.211 9.2 0.799 0.202 7.8 P1, JFO 32770 DS230 7 x 7 48 1.0 0.5 1 0.1 0.6 9 MS-026 10 x 25 250 5 x 5 1.110 0.962 0.225 0.200 13.8 12.0 P1, JFO 32770 DS230 7 x 7 64 1.0 0.4 1 0.1 0.6 9 MS-026 10 x 25 250 P1, JFO 32770 DS230 10 x 10 44 1.0 0.8 1 0.1 0.6 12 MS-026 8 x 20 160 P1, JFO 32772 DS230 10 x 10 52 1.0 0.65 1 0.1 0.6 12 MS-026 8 x 20 160 P1, JFO 32772 DS230 10 x 10 64 1.0 0.5 1 0.1 0.6 12 MS-026 8 x 20 160 P1, JFO 32772 DS230 10 x 10 80 1.0 0.4 1 0.1 0.6 12 MS-026 8 x 20 160 P1 32772 DS230 12 x 12 80 1.0 0.5 1 0.1 0.6 14 MS-026 7 x 17 119 P1 32774 DS230 12 x 12 100 1.0 0.4 1 0.1 0.6 14 7 x 17 119 JKM JMD3S061011 DSJD408 14 x 14 52 1.0 1 1 0.1 0.6 16 MS-026 6 x 15 90 P1 DS230 14 x 14 64 1.0 0.8 1 0.1 0.6 16 MS-026 6 x 15 90 P1 473943 DS230 14 x 14 80 1.0 0.65 1 0.1 0.6 16 MS-026 6 x 15 90 P1 473943 DS230 14 x 14 100 1.0 0.5 1 0.1 0.6 16 MS-026 6 x 15 90 8 x 8 14 x 14 120/128 1.0 0.40/0.40 1 0.1 0.6 16 MS-026 6 x 15 90 P1, JKM 16 x 16 144 1.0 0.4 1 0.1 0.6 18 MS-026 6 x 15 90 P1, JKM 20 x 20 144 1.0 0.5 1 0.1 0.6 22 MS-026 5 x 12 60 8.5 x 8.5 2.300 1.520 6.430 4.230 0.419 0.322 1.100 1.070 26.3 17.8 62.9 52.6 P1 473943 DS230 473943/ JMD3S072280 335487/ JMD3S072281 DS230, DSJD408 DS230, DSJD408 P1 473979 DS230 20 x 20 176 1.0 0.4 1 0.1 0.6 22 MS-026 5 x 12 60 P1 473979 DS230 TQFP Amkor Product Line Card 2018 년 6 월 19

ExposedPad LQFP Packages Nominal Package Dimensions Exposed Pad LQFP Size Thickness *JEDEC Standard Test Boards Tested @ 1W with die attach pad soldered to PCB Pitch Form Standoff Foot Length Tip-to-Tip JEDEC Tray Matrix Units Per Tray Pad Size Electrical Performance* Loop Center Loop Corner Package Outline 7 x 7 48 1.4 0.5 1 0.1 0.6 9 10 x 25 250 JUK DS231 10 x 10 44 1.4 0.8 1 0.1 0.6 12 8 x 20 160 P1 430273 DS231 10 x 10 52 1.4 0.65 1 0.1 0.6 12 8 x 20 160 P1 430273 DS231 10 x 10 64 1.4 0.5 1 0.1 0.6 12 8 x 20 160 7.5 x 7.5 3.04 3.78 P1 430273 DS231 14 x 14 52/64 1.4 1.00/0.80 1 0.1 0.6 16 6 x 15 90 P1 DS231 14 x 14 80 1.4 0.65 1 0.1 0.6 16 6 x 15 90 P1 473945 DS231 14 x 14 100 1.4 0.5 1 0.1 0.6 16 6 x 15 90 10.3 x 10.3 2.57 3.32 P1 473945 DS231 14 x 14 128 1.4 0.4 1 0.1 0.6 16 6 x 15 90 P1 473945 DS231 14 x 20 100 1.4 0.65 1 0.1 0.6 16.0 x 22.0 6 x 12 72 P1 DS231 14 x 20 128 1.4 0.5 1 0.1 0.6 16.0 x 22.0 6 x 12 72 P1 DS231 20 x 20 128 1.4 0.5 1 0.1 0.6 22 5 x 12 60 P1 473996 DS231 20 x 20 144 1.4 0.5 1 0.1 0.6 22 5 x 12 60 7 x 7 4 5 P1, JKM, JFO 473996/JMD3S072329 DS231 20 x 20 176 1.4 0.4 1 0.1 0.6 22 5 x 12 60 P1 473996 DS231 24 x 24 160 1.4 0.5 1 0.1 0.6 26 4 x 10 40 P1 32780 DS231 24 x 24 176 1.4 0.5 1 0.1 0.6 26 4 x 10 40 10 x 10 5 6 P1, JKM, JFO 32780/JMD4S060056 DS231 24 x 24 216 1.4 0.4 1 0.1 0.6 26 4 x 10 40 P1 32780 DS231 28 x 28 208 1.4 0.5 1 0.1 0.6 30 4 x 9 36 11 x 11 6 7 P1, JFO 34514/JMD4S040721 DS231 28 x 28 256 1.4 0.4 1 0.1 0.6 30 4 x 9 36 P1, JFO 34514/JMD4S071468 DS231 Exposed Pad LQFP ExposedPad TQFP Packages Nominal Package Dimensions Exposed Pad TQFP Size Thickness *JEDEC Standard Test Boards Tested @ 1W with die attach pad soldered to PCB Pitch Form Standoff Foot Length Tip-to-Tip JEDEC Tray Matrix Units Per Tray Pad Size Electrical Performance* Loop Center Loop Corner Package Outline 5 x 5 32 1.0 0.5 1 0.1 0.6 7 12 x 30 360 P1 40579 DS231 7 x 7 32 1.0 0.8 1 0.1 0.6 9 10 x 25 250 P1 32770 DS231 7 x 7 48 1.0 0.5 1 0.1 0.6 9 10 x 25 250 5 x 5 2.29 2.81 P1, JKM 32770/JMD3S072313 DS231 7 x 7 64 1.0 0.4 1 0.1 0.6 9 10 x 25 250 P1 32770 DS231 10 x 10 44 1.0 0.8 1 0.1 0.6 12 8 x 20 160 P1 32772 DS231 10 x 10 52 1.0 0.65 1 0.1 0.6 12 8 x 20 160 P1 32772 DS231 10 x 10 64 1.0 0.5 1 0.1 0.6 12 8 x 20 160 7.5 x 7.5 3.04 3.78 JFO, JUK 32772/JMD3S072314 DS231 10 x 10 80 1.0 0.4 1 0.1 0.6 12 8 x 20 160 P1 32772 DS231 12 x 12 80 1.0 0.5 1 0.1 0.6 14 7 x 17 119 JFO JMD3S072315 14 x 14 52/64 1.0 1.00/0.80 1 0.1 0.6 16 6 x 15 90 P1 DS231 14 x 14 80 1.0 0.65 1 0.1 0.6 16 6 x 15 90 P1 473943 DS231 14 x 14 100 1.0 0.5 1 0.1 0.6 16 6 x 15 90 10.3 x 10.3 2.57 3.32 P1, JKM, JUK, JFO 473943/JMD3S072316 DS231 14 x 14 120 1.0 0.4 1 0.1 0.6 16 6 x 15 90 P1 473943 DS231 14 x 14 128 1.0 0.4 1 0.1 0.6 16 6 x 15 90 JKM JMD3S072319 16 x 16 144 1.0 0.4 1 0.1 0.6 18 6 x 15 90 P1, JKM 335487/JMD3S072320 DS231 20 x 20 128 1.0 0.5 1 0.1 0.6 22 5 x 12 60 P1 473979 DS231 20 x 20 144 1.0 0.5 1 0.1 0.6 22 5 x 12 60 7 x 7 4 5 P1 473979 DS231 20 x 20 176 1.0 0.4 1 0.1 0.6 22 5 x 12 60 JKM 473979/JMD3S072321 DS231 Exposed Pad TQFP Amkor Product Line Card 2018 년 6 월 20

MQFP Packages Nominal Package Dimensions MQFP *Simulated Results @ 100 MHz Size Thickness Pitch Form Standoff Tip-to-Tip JEDEC Tray Matrix Units Per Tray Pad Size Electrical Performance* Bulk Capacitance (pf) Resistance (mω) Package Outline 10 x 10 44 2.00 0.80 1.60 0.15 13.20 MS-022 6 x 16 96 7.4 x 7.4 1.660 0.322 19.8 1.460 0.342 17.0 P1 DS232 10 x 10 52 2.00 0.65 1.60 0.15 13.20 MS-022 6 x 16 96 P1 DS232 10 x 10 64 2.00 0.50 1.60 0.15 13.20 MS-022 6 x 16 96 P1 DS232 10 x 10 44 2.00 0.80 1.95 0.15 13.90 MS-112 6 x 16 96 P1 DS232 10 x 10 52 2.00 0.65 1.95 0.15 13.90 MS-112 6 x 16 96 P1 DS232 10 x 10 64 2.00 0.50 1.95 0.15 13.90 MS-112 6 x 16 96 P1 DS232 14 x 14 52 2.67 1.00 1.60 0.15 17.20 MS-022 6 x 14 84 P1 DS232 14 x 14 64 2.67 0.80 1.60 0.15 17.20 MS-022 6 x 14 84 P1 DS232 14 x 14 80 2.67 0.65 1.60 0.15 17.20 MS-022 6 x 14 84 P1 DS232 14 x 14 100 2.67 0.50 1.60 0.15 17.20 MS-022 6 x 14 84 P1 DS232 14 x 14 52 2.67 1.00 1.95 0.15 17.90 MS-112 6 x 14 84 P1 DS232 14 x 14 64 2.67 0.80 1.95 0.15 17.90 MS-112 6 x 14 84 P1 DS232 14 x 14 80 2.67 0.65 1.95 0.15 17.90 MS-112 6 x 14 84 P1 DS232 14 x 14 100 2.67 0.50 1.95 0.15 17.90 MS-112 6 x 14 84 P1 DS232 14 x 20 64 2.71 1.00 1.60 0.33 17.2 x 23.2 MS-022 6 x 11 66 P1 DS232 14 x 20 80 2.71 0.80 1.60 0.33 17.2 x 23.2 MS-022 6 x 11 66 P1 DS232 14 x 20 100 2.71 0.65 1.60 0.33 17.2 x 23.2 MS-022 6 x 11 66 P1 DS232 14 x 20 128 2.71 0.50 1.60 0.33 17.2 x 23.2 MS-022 6 x 11 66 11.0 x 11.0 9.29 1.694 1.227 0.501 200.0 0.150 P1 DS232 14 x 20 64 2.71 1.00 1.95 0.23 17.9 x 23.9 MS-112 6 x 11 66 P1 DS232 14 x 20 80 2.71 0.80 1.95 0.23 17.9 x 23.9 MS-112 6 x 11 66 P1 DS232 14 x 20 100 2.71 0.65 1.95 0.23 17.9 x 23.9 MS-112 6 x 11 66 P1 DS232 14 x 20 128 2.71 0.50 1.95 0.23 17.9 x 23.9 MS-112 6 x 11 66 P1 DS232 28 x 28 120/128 3.37 0.80/0.80 1.30 0.13 30.6 MS-029 3 x 8 24 P1 DS232 28 x 28 144/160 3.37 0.65/0.65 1.30 0.13 30.6 MS-029 3 x 8 24 P1 DS232 28 x 28 208 3.37 0.50 1.30 0.13 30.60 MS-029 3 x 8 24 9.86 3.723 7.945 2.948 0.937 0.325 P1 DS232 28 x 28 256 3.37 0.40 1.30 0.13 30.60 MS-029 3 x 8 24 P1 DS232 28 x 28 120/128 3.37 0.80/0.80 1.30 0.33 30.6 MS-029 3 x 8 24 P1 DS232 28 x 28 208 3.37 0.50 1.60 0.33 31.20 MS-022 3 x 8 24 P1 DS232 28 x 28 256 3.37 0.40 1.60 0.33 31.20 MS-022 3 x 8 24 P1 DS232 32 x 32 240 3.40 0.50 1.30 0.38 34.60 MS-029 3 x 8 24 12.7 x 12.7 16.84 7.87 9.480 1.513 217.5 0.543 P1 DS232 32 x 32 240 3.40 0.50 1.30 0.32 34.60 MS-029 3 x 8 24 P1 DS232 MQFP Amkor Product Line Card 2018 년 6 월 21

PLCC Packages Nominal Package Dimensions (inches unless otherwise specified) PLCC *Simulated Results @ 100 MHz Pkg Type Size Size (inches) Thickness (inches) Pitch (inches) JEDEC Qty Per Tube Pad Size Electrical Performance* Bulk Capacitance (pf) Resistance (mω) 13.5 11.1 Package Outline 20 8.9 x 8.9.352 x.352 0.152 0.05 MS-018 46 3.7 x 3.7 2.110 0.596 1.780 0.583 P1 00060 DS232 28 11.5 x 11.5.452 x.452 0.152 0.05 MS-018 37 6.6 x 6.6 P1 00060 DS232 44 16.6 x 16.6.652 x.652 0.152 0.05 MS-018 26 8.89 x 8.89 2.900 0.893 17.8 Square 2.140 0.681 13.7 P1 00060 DS232 52.752 x.752 0.152 0.05 MS-018 23 P1 00060 DS232 68.952 x.952 0.150 0.05 MS-018 18 P1 00060 DS232 84 29.3 x 29.3 1.152 x 1.152 0.150 0.05 MS-018 15 10.8 x 10.8 10.900 6.840 1.780 1.750 57.6 43.2 P1 00060 DS232 Rectangular 32.452 x.552 0.109 0.05 MS-016 30 P1 00061 DS232 PLCC FusionQuad Packages Nominal Package Dimensions FusionQuad Size Total Max IO Number Possible Dual Row Land Single Row Land Peripheral Max Die Pad Size 0.4 pitch 0.5 pitch 0.4 pitch 0.5 pitch 0.4 pitch 0.5 pitch 0.4 pitch 0.5 pitch Pkg Pad Size Electrical Performance* 10 x 10 164 132 148 116 88 64 5.3 5.3 P1 DS587 12 x 12 200 164 176 140 108 80 6.5 6.5 P1 DS587 14 x 14 228 192 204 168 128 100 7.3 7.5 176 ld 6.5 x 6.5 5.99 1.42 0.82 0.23 209 81 P1 DS587 16 x 16 264 224 236 196 148 120 8.5 8.7 P1 DS587 20 x 20 316 264 280 228 184 144 9.7 10 P1 DS587 24 x 24 356 296 320 260 224 176 9.7 10 P1 DS587 *Simulated Results @ 100 MHz Note : Above are estimates only. 모든옵션에대해상세설계가아직구현되지않았습니다. Actual pin counts are pad size dependent. Bulk Capacitance (pf) Resistance (mω) Package Outline FusionQuad Amkor Product Line Card 2018 년 6 월 22

MicroFrame MLF /QFN/SON/DFN Packages Nominal Package Dimensions MicroFrame MLF /QFN/SON/DFN Size MLF /QFN/ SON/DFN s Pitch Dual Row Pitch Electrical Performance* Bulk Capacitance (pf) Resistance (mω) 1 x 1 4, 6 0.35, 0.65 0.052 0.078 2.4 C3, P3 DS572 2 x 2 4, 6, 8, 10, 12 0.50, 0.65 0.46 0.134 2 C3, P3 DS572 3 x 3 4, 6, 8, 10, 12 0.8, 0.65, 0.5, 0.4, 0.35, 0.3 0.564 0.531 0.203 0.220 141.8 138.9 C3, P1, P3 DS572 3 x 3 16 0.65, 0.5, 0.4, 0.35, 0.3 C3, P1, P3 DS572 3 x 3 20, 24 0.5, 0.4, 0.35, 0.3 C3, P1, P3 DS572 4 x 4 8, 10, 12, 14 1.00, 0.8, 0.65, 0.5, 0.4, 0.35, 0.3 0.044 0.189 1.9 C3, P1, P3, JFO DS572 4 x 4 16, 18 0.8, 0.65, 0.5, 0.4, 0.35, 0.3 C3, P1, P3, JFO DS572 4 x 4 20 0.65, 0.5, 0.4, 0.35, 0.3 C3, P1, P3, JFO DS572, DSJD409 4 x 4 24, 28 0.5, 0.4, 0.35, 0.3 C3, P1, P3, JFO DS572, DSJD409 4 x 4 32 0.4, 0.35, 0.3 C3, P1, P3, JFO DS572, DSJD409 4 x 4 40 0.35, 0.3 C3, P1, P3 DS572 5 x 5 8, 10, 16 1.00, 0.8, 0.65, 0.5, 0.4, 0.35, 0.3 C3, P1, P3, JFO DS572 5 x 5 20, 24 0.8, 0.65, 0.5, 0.4, 0.35, 0.3 0.048 0.144 2.2 C3, P1, P3, JFO DS572 5 x 5 28 0.65, 0.5, 0.4, 0.35, 0.3 C3, P1, P3, JFO DS572 5 x 5 32, 36 0.5, 0.4, 0.35, 0.3 C3, P1, P3, JFO DS572, DSJD409 5 x 5 40 0.4, 0.35, 0.3 C3, P1, P3, JFO DS572, DSJD409 5 x 5 44 0.5 C3, P1, P3 DS572 5 x 5 52 0.5 C3, P1, P3 DS572 6 x 5 18, 24 0.8, 0.65, 0.5, 0.4, 0.35, 0.3 C3, P1, P3 DS572 6 x 5 36 0.5, 0.4, 0.35, 0.3 C3, P1, P3 DS572 6 x 5 42 0.4, 0.35, 0.3 C3, P1, P3 DS572 6 x 6 16, 20 1.00, 0.65, 0.5, 0.4, 0.35, 0.3 C3, P1, P3, JFO DS572 6 x 6 26, 28 0.65, 0.5, 0.4, 0.35, 0.3 C3, P1, P3 DS572 6 x 6 *Simulated Results @ 12 GHz. Values dependent on specific die and wire configurations. 30, 32, 36, 40, 44, 48 0.5, 0.4, 0.35, 0.3 0.052 0.175 2.5 C3, P1, P3, JFO DS572 6 x 6 52 0.4, 0.35, 0.3 C3, P1, P3, JFO DS572 6 x 6 56, 60, 64 0.35, 0.3 C3, P1, P3 DS572 6 x 6 44, 60, 68 0.5 C3, P1, P3 DS572 6 x 8 8 1.27 P3, JHD DS572, DSJD409 7 x 7 24, 32 0.8, 0.65, 0.5, 0.4, 0.35, 0.3 C3, P1, P3, JFO DS572 7 x 7 36 0.65, 0.5, 0.4, 0.35, 0.3 C3, P1, P3, JFO DS572 7 x 7 44, 48 0.5, 0.4, 0.35, 0.3 1.766 1.194 0.326 0.289 315.1 234.5 C3, P1, P3, JFO DS572 7 x 7 56 0.4, 0.35, 0.3 C3, P1, P3, JFO DS572 7 x 7 68 0.35, 0.3 C3, P1, P3 DS572 7 x 7 80 0.3 C3, P1, P3 DS572 7 x 7 76 0.5 C3, P1, P3 DS572 7 x 7 84 0.5 C3, P1, P3 DS572 MicroFrame MLF /QFN/SON/DFN Amkor Product Line Card 2018 년 6 월 23

MicroFrame MLF /QFN/SON/DFN Packages (Cont.) Nominal Package Dimensions Size MLF /QFN/ SON/DFN s Pitch Dual Row Pitch Electrical Performance* Bulk Capacitance (pf) Resistance (mω) 8 x 8 4 2.00, 1.42, 0.8, 0.65, 0.5, 0.4, 0.35, 0.3 C3, P1, P3 DS572 MicroFrame MLF /QFN/SON/DFN 8 x 8 16 1.42, 0.8, 0.65, 0.5, 0.4, 0.35, 0.3 C3, P1, P3 DS572 8 x 8 32, 36 0.8, 0.65, 0.5, 0.4, 0.35, 0.3 C3, P1, P3 DS572 8 x 8 40 0.65, 0.5, 0.4, 0.35, 0.3 C3, P1, P3 DS572 8 x 8 52, 56 0.5, 0.4, 0.35, 0.3 C3, P1, P3 DS572 8 x 8 64 0.4, 0.35, 0.3 P3, JKM DS572, DSJD409 8 x 8 68, 76 0.35, 0.3 C3, P1, P3 DS572 8 x 8 88, 92 0.3 C3, P1, P3 DS572 8 x 8 84, 92, 100 0.5 C3, P1, P3 DS572 9 x 9 36 0.8, 0.65, 0.5, 0.4, 0.35, 0.3 C3, P1, P3 DS572 9 x 9 44, 48 0.65, 0.5, 0.4, 0.35, 0.3 C3, P1, P3 DS572 9 x 9 60, 64 0.5, 0.4, 0.35, 0.3 C3, P1, P3 DS572 9 x 9 76 0.4, 0.35, 0.3 0.051 0.129 2.4 C3, P1, P3, JFO DS572, DSJD409 9 x 9 88 0.35, 0.3 C3, P1, P3 DS572 9 x 9 104 0.3 C3, P1, P3 DS572 9 x 9 100, 108, 116 0.5 C3, P1, P3 DS572 10 x 10 44 0.8, 0.65, 0.5, 0.4, 0.35, 0.3 C3, P1, P3 DS572 10 x 10 52, 56 0.65, 0.5, 0.4, 0.35, 0.3 C3, P1, P3 DS572 10 x 10 64, 68, 72 0.5, 0.4, 0.35, 0.3 2.179 1.475 0.518 0.409 337.5 250.8 C3, P1, P3 DS572 10 x 10 88 0.4, 0.35, 0.3 C3, P1, P3 DS572 10 x 10 100 0.35, 0.3 C3, P1, P3 DS572 10 x 10 116, 120 0.3 C3, P1, P3 DS572 10 x 10 132 0.5 C3, P1, P3 DS572 11 x 11 132 0.3 0.766 0.277 0.462 0.342 28.4 9.4 C3, P1 DS572 11 x 11 148 0.5 C3, P1 DS572 12 x 12 48 0.8, 0.65, 0.5, 0.4, 0.35, 0.3 C3, P1 DS572 12 x 12 60 0.65, 0.5, 0.4, 0.35, 0.3 C3, P1 DS572 12 x 12 84, 88 0.5, 0.4, 0.35, 0.3 C3, P1 DS572 12 x 12 100, 108 0.4, 0.35, 0.3 C3, P1 DS572 12 x 12 124 0.35, 0.3 C3, P1 DS572 12 x 12 144 0.3 C3, P1 DS572 12 x 12 148 0.5 0.802 0.279 0.479 0.342 30.5 9.4 C3, P1 DS572 MicroFrame MLF /QFN/SON/DFN 12 x 12 156, 164 0.5 0.787 0.276 0.468 0.332 30.4 9.8 C3, P1 DS572 13 x 13 164, 172 0.5 0.497 0.208 0.325 0.318 20.0 7.7 C3 DS572 *Simulated Results @ 12 GHz. Values dependent on specific die and wire configurations. Amkor Product Line Card 2018 년 6 월 24

Power Packages 앰코의 Power 패키지포트폴리오는자동차, 통신및산업을포함한다양한시장과애플리케이션을제공합니다. 전력에민감한모바일애플리케이션에최적화된앰코의고성능전력장치에는패키지 carrier로서 leadframe을사용하며, 주로 wirebond 상호연결기술을사용합니다. 대부분제품은 copper clip interconnect 를사용하여전력장치에가장잘알려진전기적특성을제공합니다. 전기적, 열적개선에중점을둔기술을이용하는이패키지는, 고급전력 packaging, 고급 copper clip 연결및모듈이포함됩니다. Power Packages Nominal Package Dimensions Power Package Width Length Thickness Overall Height Pitch Tip-to-Tip JEDEC/JEITA Package Outline PSMC 2 4.4 6.1 1.1 1.1-6.5 ATM DS616 PSMC 3 4.4 6.1 1.1 1.1 2.13 6.5 ATM 816867PO DS617 SOD123-FL 2 1.6 2.6 0.98 0.98 3.5 ATM 798980PO DS614 SOD128-FL 2 2.4 3.8 0.98 0.98 4.7 ATM 798800PO DS613 TO-220 3 10.0 9.6 4.6 2.54 28.2 JFI JMD4S071901 DSJD410 TO-220F 3 10.0 15.0 4.5 2.54 28.5 JFI JMD4S071902 DSJD411 TO-220FP 3 10.0 15.0 4.5 2.54 28.0 ATM 0850289PO DS610 TO-220SMD 3 10.2 8.5 4.6 2.54 12.5 JFI JMD4S071903 DSJD412 TO-251 3 6.5 5.5 2.3 2.3 13.7 JFI JMD4S071904 DSJD413 DPAK 3 6.5 6.1 2.3 2.3 9.8 JEDEC JFI JMD4S071870 DSJD414 TO-252JEITA 3 6.5 5.5 2.3 2.3 9.5 JEITA JFI JMD4S071905 DSJD415 TO-263 3 10.0 9.15 4.45 2.04/3.04 15.25 JFI JMD4S071906 DSJD416 TO-263 (7-pin) 7 10.0 8.5 4.8 1.27 12.5 JFI JMD4S071907 DSJD417 HSON8 8 5.0 5.4 1.45 1.45 1.27 5.15 x 6.0 JFI JMD4S071910 DSJD407 Mini-HVSON (8-pin) 8 3.15 3.0 0.9 0.9 0.65 3.3 x 3.3 JFI JMD4S071909 DSJD403 HVSON (8-pin) 8 5.0 5.4 1.0 1.0 1.27 5.15 x 6.0 JFI JMD4S071908 DSJD402 SO8-FL 6 4.9 5.75 1.0 1.0 1.27 6.1 JEDEC ATM 746796PO DS611 SO8-FL 8 5.0 5.0 0.95 0.95 1.27 6.0 JEITA ATM DS611 SO8-FL 8 4.9 5.75 1.0 1.0 1.27 6.1 JEDEC ATM 808389PO DS611 TSON8-FL 8 3.1 3.1 0.85 0.85 0.65 3.3 JEDEC ATM 815788PO DS612 TSON8-FL 8 3.1 3.1 0.75 0.75 0.65 3.3 JEDEC ATM 817927PO DS612 TOLL 8 9.9 10.4 2.3 2.3 1.2 11.7 JEDEC ATM 777240PO (w/kelvin pin) 777275PO (w/o Kelvin pin) LFPAK 4 4.9 3.95 1.05 1.05 1.27 6.0 JEDEC JFI DS619 DS618 Power Amkor Product Line Card 2018 년 6 월 25

Wafer Bump, Wafer Level Processing & Die Processing Services 앰코는여러전략적위치 ( 한국, 중국, 대만 ) 에서 electroplated solder, Cu pillar technologies 및 Wafer Level Chip Scale Packaging (WLCSP) 분야의첨단기술능력을제공합니다. 당사의생산기지는주요파운드리와인접해독보적으로자리잡고있기때문에고객이통합된물류센터를통해출시시간을단축할수있습니다. 다이와기판사이의전기적, 기계적연결은 flip chip 패키지구조의가장중요한요소중하나입니다. Cu pillar, lead-tin 및 leadfree solder는이러한연결 또는 bump 를형성하는데사용되며, 다이에대한우수한접착성, 최소저항및높은조립수율을나타내야합니다. Solder bump 및 Cu pillar는 thin film metal deposition, plating 또는 ball loading 기술을사용하여형성됩니다. 앰코는디바이스와최종제품의 motherboard가 solder로직접연결되는, Wafer Level Chip Scale Packaging (WLCSP) 를제공합니다. WLCSP의 full turnkey solution은 wafer bumping (with or without pad Redistribution Layer or RDL), wafer level final test, device singulation and packing in tape and reel 등을포함하고있습니다. 다이의엑티브면을보호하는 PBO나 PI 같은유전층위에형성된앰코의견고한 Under Bump Metallurgy (UBM) 은가혹한보드레벨조건에서도견딜수있도록신뢰성있는인터커넥션솔루션을제공합니다. WLCSP 패키지제품군은가장작은 form factor와 high end RF WLAN combo chips에서 FPGA, power management, Flash/EEPROM, integrated passive networks 및표준성능을활용하는동시에광범위한반도체장치유형에적용됩니다. WLCSP Die Processing Services (8 & 12 ) Product Type UBM Type Solder Composition Repassivation Ball Size Pitch/Sphere Diameter Die Thickness Bump Height RDL Trace/ Space Available Option WLCSP BoR (2 mask) CSP nl (4 mask) CSP n3 (3 mask) CSP nl BoR (Bump on Repassivation) CSP nl + RDL (Bump on Redistribution) CSP n3 + RDL (Bump on Redistribution) 8 : K4, T5, C3 12 : K4, K5, T1, C3 Ni/Au, Nickel based, Thick copper UBM Pb-free SAC alloys (Plated) Sn/Ag Pb-free Cu pillar PBO, PI, Low cure polymers 4~300 0.18~70 mm 2 0.50 mm/0.30 mm 0.40 mm/0.25 mm 0.30 mm/0.20 mm (0.15 mm Sphere Diameter is available) 150 μm to 450 μm 0.5 mm Pitch : 250 μm 0.4 mm Pitch : 210 μm 0.3 mm Pitch : 170 μm CSP nl : 12/12 μm CSP n3 : 15/15 μm Backside lamination (black) Carrier Tape : 7 or 13 reels WLCSP Reliability Package Level Board Level Preconditioning at Level 1 85 C/85% RH, 168 hours, reflow @ 260 C peak Temp Cycle -55 C/+125 C, 1000 cycles High Temp Storage 150 C, 1000 hours Temp Cycle -40 C/+125 C, 15 min. ramp rate, 500 cycles Drop Test JEDEC condition B (1500G), 100 drops Reliability Wafer Bump (8 & 12 ) Product Type Low Alpha Repassivation Repassivation Opening Typical Production Bump Height Seed Layer Pad Pitch Lower Limit Wafer Example Wafer Bump Solder Bumping RP Cu Pillar BOP Solder Bumping BOP Cu Pillar RDL SnAg Plating Bump with or without Redistribution Cu Pillar Plating Bump with or without Redistribution 8 : K4, T5, C3 12 : K4, K5, T1, C3 8 : K4, T5, C3 12 : K4, K5, T1, C3 All available as low alpha <0.002 cts/hr/cm 2 ) PBO, PI, Low cure polymers PBO : Min. 15 μm PI : Min. 25 μm 150 μm array : 70 μm 125 μm peripheral : 75 μm Ti/Cu, TiW/Cu Solder bump : Array 150 μm pitch/75 μm UBM (min) Micro bump : Array 40 μm pitch/20 μm UBM (min) Cu pillar bump: Staggered 80 μm pitch/30 μm UBM (min) Wafer Bump Solder Bumping RDL 63Sn/37Pb Plating Bump with or without Redistribution 12 : T1 Amkor Product Line Card 2018 년 6 월 26

Turnkey Process Flow - CSP nl WLCSP WLP Test DPS ff ff ff ff Design services available Layout Mask tooling Wafer RDL patterning and bumping (ball sphere loaded or plated) Automated Optical Inspection (AOI) for best in class quality assurance Wafer map generation Inspect & Clean PBO or PI 1 RDL Sputter Deposition Resist Processing Cu RDL Plating Resist & Seed Metal Removal PBO or PI 2 UBM Sputter Deposition Resist Processing Cu or Ni-based UBM Resist & Seed Metal Removal Ball Place ff ff ff ff Final Probe Test software and hardware development Probe card design, service and support Test program transfer Wafer sort for RF, memory, logic and analog applications ff ff ff Backgrind Backside Lamination Laser Mark Singulation Tape & Reel AOI Strong emphasis on singulated device edge quality for all Si nodes Shipping material design and supply management Drop ship to final customer available Amkor Product Line Card 2018 년 6 월 27

MEMS & Sensors 앰코는마이크로전자기계시스템 (MEMS) 및마이크로광학전자기계시스템 (MOEMS) 패키징분야의최대아웃소스공급업체로, 세계시장을선도하는기업입니다. MEMS (Microelectromechanical Systems) 는우리의실생활을감지하거나조작할수있는초소형센서입니다. MEMS 는마치 integrated circuit (IC) device 의제작과유사하게 micro machining processes 를이용해 만들어집니다. 장치가비슷해보이지만, standard IC 패키지솔루션은종종호환되지않습니다. 앰코는웨이퍼레벨을포함한모든패키지플랫폼에걸쳐 cavity, non-cavity 및 hybrid 솔루션을광범위하게보유하고있습니다. 모든제품에제공되는패키지구성과재료선택은 total sensing solution 의기능및성능에중요한역할을할수있습니다. Cavity MEMS Packages Open Tool Available ( Builds) Width Length Thickness Pkg Type Lid Type Die Qty Inter-connect POD Dwg Unit Dwg 8 2 2 0.8 Cavity LGA Metal Multi-die WB P3 TBD TBD 8 4 4 0.9 Cavity LGA Metal Multi-die WB P3 643113PO TBD 8 5 5 1 Cavity LGA Metal Multi-die WB P3 TBD TBD 8 7 7 1 Cavity LGA Metal Multi-die WB P3 647876PO 647874UD 8 4 3 1 Cavity LGA L2L Multi-die WB P3 698505P0 698275UD MEMS 8 5 2 1 Molded Cavity LGA Polymer Multi-die WB K4 774373PO 774370UD MEMS 22 6.8 4.9 1.35 Cavity LGA Polymer Multi-die WB K4 792161PO 792160UD 20 6 6 1.9 Cavity LF Polymer Multi-die WB P3 610182PO 640993UD MEMS/Sensor Package Standards Package Type Overmolded Exposed Die Surface Cavity Package Molded Cavity Package frame SOIC/MLF ChipArray LGA/FPBGA Amkor Product Line Card 2018 년 6 월 28