산업공정부문 Non-CO2가스의 감축 전략 연구

기본연구보고서 17-13 www.keei.re.kr 산업공정부문 Non-CO2 가스의 감축 전략 연구 기본 연구보고서 17-13 산업공정부문 Non-CO2 가스의 감축 전략 연구 유동헌 KOREA ENERGY ECONOMICS INSTITUTE 7,000원 울산광역시 중구 종가로 405-11 TEL I 052. 714. 2114 ZIP I 44543 ISBN 978-89-5504-643-4

참여연구진 연구책임자 : 외부참여 : 선임연구위원유동헌 RCC 조경오 그린폴라리스명소영

< 요약 > 1. 연구필요성및목적 2030 UN 3,080 2,270. 206. NF 3 70 1,652. IPCC 1996. IPCC 2006 2023. 2021. 2006 NF 3. NF 3 2030. HFCs. 요약 i

NF 3 NF 3. HFCs,. NF 3 HFCs. 2. 연구내용 NF 3 NF 3, -. NF 3 2030. HFCs. HFCs., (,, ).,. ii

3. 결론및정책제언 PFCs SF 6 NF 3, NF 3. NF 3. ( / ), 2013 2015 2016 2014. 2030 NF 3, 6,228~6,245. NF 3 CVD -, (, ). NF 3 (LCD). NF 3 (NF 3 / ) 2011. CVD NF 3 2030 0.25%~5%. NF 3, NF 3 요약 iii

NF 3. CVD - 200mm (Old fab). LCD NF 3 1). CVD NF 3. NF 3 ( -, ) NF 3. NF 3. (, fab, NF 3 ). HFCs. ( = ). HFCs GWP 1),.,. iv

HFCs. HFCs GWP GWP HFCs.. 10 EU GWP ( ). R&D. 요약 v

ABSTRACT 1. Background and objectives of the study When designing a basic roadmap for the submission of a 2030 greenhouse gas reduction target to the United Nations, the Korean government set the goal to replace the existing refrigerants with environmentally friendly ones in the electrical and electronic industry and the automobile industry, in order to reduce greenhouse gas emissions by 3,080 thousand tons and 2,270 thousand tons, respectively. While aiming to cut greenhouse gas emissions through the new energy industry, the government planned to reduce emissions by additional 2,060 thousand tons by switching to eco-friendly refrigerants. In addition, by replacing the existing fluorine gas with NF or non-greenhouse gases, the semiconductor and display industries are expected to reduce their emissions by 70 thousand tons and 1,652 thousand tons, respectively. Like other developing countries, Korea currently develops greenhouse gas inventories based on the 1996 IPCC Guidelines under the Framework Convention on Climate Change. However, the Korean government announced that it will replace them with the IPCC Guidelines 2006, which will be applied to publish official statistics in 2023. In other words, the new Guidelines will be applied starting from 2021 emission statistics. With this update, the NF gas needs to be included in the emissions calculation. Abstract i

As for now, the NF gas is not a target gas for inventory reporting and thus is not considered in the 2030 greenhouse gas reduction roadmap. Under these circumstances, emissions from process gases and HFCs consumption in the semiconductor and display industries are estimated without considering special alternatives. The use of NF gas, which is adopted as an alternative to the existing fluorine gas in the semiconductor and display industries, cannot exclude the possibility of related emissions; accordingly, a countermeasure is needed. Furthermore, in the case of Korea, HFCs are mostly used as refrigerants, and despite the lack of technological and economic alternatives, the international community is demanding their reduction. This project aims to draw a greenhouse gas reduction strategy, resulting from the consumption reduction of NF gas in the semiconductor and display industries and of HFCs refrigerants. 2. Research Summary As the NF 3 gas used in the semiconductor and display industries exhibits different emission probabilities depending on the technology used, the in-situ plasma cleaning and the remote plasma cleaning methods were used to estimate the greenhouse gas emission potential. Moreover, after it was used, the NF 3 gas was divided into two cases depending on whether a reduction technology is employed or not. Then, the 2030 greenhouse gas emissions were estimated. ii

Regarding HFCs refrigerants, the Kigali Amendment to the Montreal Protocol determined a global reduction schedule. As Korea ratified the Montreal Protocol, once the Kigali Amendment comes into force, the country has to prepare a roadmap for reducing HFCs according to the defined schedule. Advanced countries regulate refrigerants(e.g., Car Air Conditioning and Domestic Refrigerators) before Korea does regardless of the reduction schedule of Korea, which has the status of developing country. Accordingly, the refrigerant regulation system in developed countries (mainly exporting white goods) was reviewed, and the actual use of refrigerants was briefly analyzed. 3. Research Results and Policy Suggestions The purchase of NF 3 gas in the semiconductor industry has been steadily increasing with the increase in semiconductor production. Taking this change in the purchase volume as a purchase unit(purchase volume /semi-conductor production area), a slight decrease after 2013 in terms of simple area emerged. After a massive rebound in 2015, in 2016 it went back to the 2014 level. As for the mask layer weighted area, it has decreased since 2009, with a steady decline since 2011 (excluding 2015). When the NF 3 gas purchase volume of the semiconductor industry in 2030 reflects such changes, it is estimated to be 6,228 ~ 6,245 tons. In order to reduce NF 3 gas emissions in the industry, it is first necessary to replace the in-situ plasma cleaning method with the remote plasma Abstract iii

cleaning system in CVD(Chemical Vapor Deposition); second, reduction facilities(thermal abatement, Catalytic abatement, and Plasma abatement) need to be installed and operated. The NF 3 gas is also used as a process gas in the display industry. Unlike semiconductors, it is also used in the etching process of some production lines(lcd). With the recent increase in display production, the NF 3 gas purchase volume is growing rapidly. As a consequence gas purchase unit (NF 3 gas consumption volume/production area) has recorded a sharp rise since 2011. In 2030, gas emissions from the use of the remote plasma cleaning system in the display industry will be in the range of 0.25% ~ 5% of the purchase volume. Emissions reduction, due to the use of the NF 3 gas in the semiconductor and display industries is summarized as follows: although there is the possibility of NF 3 gas emissions, most emissions will not occur if reduction facilities operate normally. However, for the 200 mm semiconductor production line (Old fab), which uses an in-situ plasma reactor in the CVD cleaning process among semiconductor companies, the possibility of employing a reduction technology is limited due to space issues. As for the display industry, the NF 3 gas is used in some etching lines including small to medium LCDs. However, the introduction of a reduction facility is necessary, since the available reduction technology has not been adopted. iv

The greenhouse gas reduction option has been considered for the use of NF 3 gas in CVD cleaning in the semiconductor and display industries. The use of in-situ plasma cleaning technology has the disadvantage of low NF 3 gas decomposition rates. On the other hand, with the remote plasma cleaning technology, NF 3 gas emissions are negligible, as N and F are separated before injecting gas into the cleaning process reactor(chamber). However, because of the presence of undecomposed gas, the adoption of a reduction technology is essential to reduce greenhouse gas emissions regardless of the type of reactor used for cleaning. In addition to implementing regulations for the adoption of reduction technologies(e.g., a requirement to introduce a new fab reduction technology and an NF 3 gas emission regulation), it is also necessary to design an incentive policy that facilitates the adoption of reduction technologies on the existing production lines. Greenhouse gas reductions due to refrigerant consumption can vary depending on how inventory is prepared for HFCs consumption. The methods of inventory compilation include the currently adopted emission estimation standard (consumption of the year = emissions of the year) and the actual emission estimation standard. Although the strategy for reducing GHG emissions from HFCs consumption should change depending on how the inventory is calculated, it is necessary to induce refrigerant replacement with HFCs with low GWP, or to force the use of natural refrigerants, because leaks can occur during use. To sum up, switching HFCs consumption patterns from high Abstract v

GWP refrigerants to low GWP or natural refrigerants is the surest way to reduce GHG emissions from HFCs consumption. The substitution of refrigerants involves the process of finding the optimal combination of refrigerant gas and equipment based on technology. With a schedule of about 10 years, it is necessary to set up a roadmap (by year and use) for refrigerant substitution, as well as appropriate regulation for the introduction of systems with low GWP or natural refrigerants, such as the EU's refrigerant policy. In addition to the current R&D policy, it is also necessary to establish an evaluation system to ascertain regulation compliance. vi

제목차례 제 1 장서론 1 제2장산업공정온실가스의특성 5 1 5 1. 5 2. HFCs 8 2 12 1. 12 2. HFCs 21 제3장몬트리올의정서회의결과분석과선진국의 HFCs 규제동향 29 1 29 1. 29 2. 31 2 HFCs 34 1. (EU) 34 2. 38 3. 41 제 4 장산업공정부문 Non-CO 2 가스감축대안 45 차례 i

1 45 1. NF 3 45 2. NF 3 47 3. 47 4. 51 2 HFCs 56 제 5 장결론및정책건의 61 참고문헌 73 ii

표차례 < 2-1> 8 < 2-2> HFCs 9 < 2-3> HFCs 10 < 2-4> HFCs 11 < 2-5> 12 < 2-6> 14 < 2-7> ( ) 20 < 2-8> HFCs, 27 < 3-1> 33 < 3-2> 37 < 3-3> GWP 41 < 3-4> 43 < 3-5> 44 < 4-1> 48 < 4-2> 48 < 4-3> 52 < 4-4> GWP 57 < 5-1> 2030 NF 3 64 < 5-2> 2030 NF 3 67 차례 iii

그림차례 [ 2-1] / 6 [ 2-2] 7 [ 2-3] 15 [ 2-4] - 16 [ 2-5] 18 [ 3-1] EU 35 [ 3-2] HFCs 36 [ 3-3] 39 [ 3-4] 40 [ 4-1] NF 3 46 [ 4-2] LCD/OLED NF 3 46 [ 4-3] GWP 58 [ 5-1] NF 3 61 [ 5-2] NF 3 62 [ 5-3] NF 3 63 [ 5-4] 65 [ 5-5] NF 3 65

제 1 장서론 2030 BaU 37% UN 2),. UN 2016,. (2015 1 ) 1 (2015~2017 ). HFCs. (, PFCs, SF 6 ).. 2017 (NF 3 ). 3) 2) Submission by the Republic of Korea, Intended Nationally Determined Contribution (http://www4.unfccc.int/ndcregistry/publisheddocuments/republic%20of%20korea% 20First/INDC%20Submission%20by%20the%20Republic%20of%20Korea%20on%20 June%2030.pdf, : 2017.10.31) 3) NF 3. 제 1 장서론 1

NF 3 (IPCC 1996 ) IPCC 2006. IPCC 2006 2023. 2006. 4) 2021., HFCs HFCs. HCFCs. HFCs HCFCs.,. 2. 3 HFCs., 4) (2014), p.13 2

.. 4 non-co 2. 5. 제 1 장서론 3

제 2 장산업공정온실가스의특성 제 1 절국내주요배출원별온실가스배출현황,. IPCC 1996, IPCC GPG(Good Practice Guidance) 2000, 2006. 5) IPCC. 3 / CO 2, / CO 2 / CO 2. 6) CO 2. 1. 온실가스배출추이 2014 (LULUCF 7) ) 690.6 tco 2 eq. 0.8%. LULUCF 2013 0.9% 648.1 tco 2 eq.. 8) 5) (2016), p.28 6) (2016), p.24 7), (Land Use, Land Use Change and Forestry) 제 2 장산업공정온실가스의특성 5

, ([ 2-1] ).. [ 그림 2-1] 배출원 / 흡수원별온실가스배출량및흡수량 : (2016), p.40 가. 에너지기인배출.. 2014 599.3 tco 2 eq. 2013 1.2%., 1990 1997 1998 8) (2016) 6

. 2014 1998 ([ 2-2] ). 9)10) [ 그림 2-2] 에너지부문온실가스배출량추이 : (2016), p.58 나. 산업공정배출 2014 54.6 tco 2 eq. 7.9%, 2013 5.0%. 11),,. 98%(2014 ). 9) (2016), p.58 10) (2016). 11) (2016), p.64 제 2 장산업공정온실가스의특성 7

CO 2 HFCs, PFCs, SF 6. NF 3.. < 표 2-1> 산업공정부문온실가스배출량추이 ( : tco 2eq.) 1990 1995 2000 2005 2010 2014 2A 18.2 31.5 28.6 28.1 30.9 33.2 2B 0.3 3.5 7.2 11.2 0.7 0.9 2C 0.1 0.1 0.1 0.2 0.3 0.4 2E SF 6 1.0 2.6 3.2 6.4E-05 1.3E-04-2F SF 6 0.2 6.0 10.3 14.8 22.1 20.1 19.7 43.8 49.6 54.3 54.0 54.6 : (2016), p.65 2. HFCs 소비및반도체 디스플레이업온실가스배출 가. HFCs 소비 HFCs HFCs. HFC 2 HFCs (< 2-2> ). 8

, HFCs HFC-134a HFC-152a 2. < 2-2>, HFC-134a HFC-152a HFC-23 HFC-32. < 표 2-2> HFCs 가스별수입량추이 2010 2011 2012 2013 2014 HFC-23 7,555 8,120 16,895 17,060 78,530 HFC-32-454,080 1,045,440 1,308,100 872,360 HFC-125-892,430 699,570 1,331,459 907,750 HFC-134a 2,061,637 4,955,071 6,183,784 5,819,911 6,034,914 HFC-152a 11,060 11,060-8,690-404A 536,980 434,394 588,765 557,764 674,071 407C 41,400 163,396 211,332 392,919 457,237 408A 13,625 17,440 13,080 9,483 23,344 410A 2,014,490 2,006,908 2,289,211 2,476,827 3,557,549 507A 9,080 6,352 70,880 210,349 85,795 508B - - - 27 18 : : (2016) ( : kg) HFCs < 2-4>., 2015 HFC-134a R-410A... 제 2 장산업공정온실가스의특성 9

< 표 2-3> HFCs 소비에의한배출량추이 ( : tco 2eq.) 2010 2011 2012 2013 2014 HFC-23 240 246 310 325 399 HFC-32 3 3 3 4 5 HFC-134a 7,835 7,649 8,372 7,754 8,044 HFC-152a 10 10 9 13 91 : HFC-23 HFC-32 : (2016) < 표 2-4> HFCs 가스별수입량추이 ( : ) 2012 2013 2014 2015 3,200 3,200 2,613 2,664 HFCs R-134a R-410A 300 300 362 385 3,100 3,200 4,234 3,035 6,600 6,700 7,209 6,084 2,500 2,600 5,013 5,262 1,200 1,500 1,200 1,200 3,700 4,100 6,213 6,462 : (2016) 10,300 10,800 13,422 12,546 나. 반도체 디스플레이업 12) 12),. 10

., ( ). < 2-5> 13), 71%(2014 ) SF 6. SF 6. NF 3, 2012 3, 2. < 표 2-5> 반도체및액정표시장치제조공정배출추이 ( : tco 2eq.) 2010 2011 2012 2013 2014 8,344 7,997 8,183 8,826 9,744 HFC-23 240 246 310 325 399 HFC-32 3 3 3 4 5 PFC-14(CF 4) 1,228 1,120 1,405 1,487 1,663 PFC-116(C 2F 6) 749 631 541 568 510 PFC-218(C 3F 8) 219 216 196 135 105 PFC-318c(C 4F 8) 69 104 125 131 149 SF 6 5,836 5,677 5,601 6,178 6,914 : (2016) 13) 제 2 장산업공정온실가스의특성 11

제 2 절감축관점에서의공정온실가스특성 PFCs,, NF 3., HFCs. HFCs HFCs GWP HFCs. HFCs. 1. 반도체 디스플레이업종의공정가스사용특성 가. 불화가스 14) 사용공정개요 ( ) (etching) (deposition). 15). 14) PFCs, HFCs, NF 3 SF 6. 15) (Heat Transfer Fluids, HTF) IPCC 2006. 12

1) (etching) (wet etching) (dry etching). (, HF ),..., RF(radio frequency) 16). 17), < 2-6>. 16) 17) (2002) 제 2 장산업공정온실가스의특성 13

< 표 2-6> 플라즈마소스가스 (Organic materials) O 2, SF 6, CF 4 (Polysilicon) CCl 4, CF 4, NF 3, SF 6 (Silicon Dioxide) CF 4, C2F 6, C3F 8, CHF 3 (Silicon Nitride) CF 4, C2F 6, CHF 3, SF 6 (Aluminum) CCl 4, Cl 2, BCl 3 (Titanium) C 2ClF 4, CF 4 (Tungsten) Cl 2 : (2002), p.41 2) (deposition), (thin film). (Chemical Vapor Deposition, CVD) (Physical Vapor Deposition, PVD). 18). 18) LG Polymer Journal(2014) 14

[ 그림 2-3] 증착방법분류 : LG Polymer Journal(2014) (chamber).. 19) (SiH 4 ) (SiO 2 ) (H 2 ). SiO 2.. 19) LG Polymer Journal(2014) 제 2 장산업공정온실가스의특성 15

(plasma cleaning),. 20), NF 3, CF 4, C 2 F 6, SF 6. - (In-situ Plasma Cleaning) (Remote Plasma Cleaning). 21) - [ 2-4] CVD (CF 4, C 2 F 6, NF 3 ) RF. [ 그림 2-4] 인 - 시투플라즈마클리닝개념도 RF 플라즈마 공정반응기 클리닝가스 NF 3 C 2 F 6 / O 2 CF 4 / O 2 : Xing Chen et al.(2003) 기판 (substrate) 20) A. Fridman(2008) 21) Xing Chen et al.(2003) 16

-,,.. 22) (2006) RFSC(Radio Frequency Source Chamber) NF 3 55~75%., -., (NF 3 ) RF (, ) ([ 2-5] ). / 99%, 23)24). 22) Xing Chen et al.(2003) 23) A. Fridman(2008) 24) (2006) RPSC NF 3 95~99% 제 2 장산업공정온실가스의특성 17

[ 그림 2-5] 리모트플라즈마클리닝개념도 반응성가스발생기 플라즈마아님 공정반응기 불소 (F) 원자 클리닝가스 기판 (substrate) - NF 3 - C 2 F 6 / O 2 - 기타 : Xing Chen et al. (2003) 나. 불화가스사용과배출 1) 1980,. CVD. CF 4, C 2 F 6, C 3 F 8, c-c 4 F 8, c-c 4 F 8 O, C 4 F 6, C 5 F 8, CHF 3, CH 2 F 2, NF 3, SF 6.,. EPA, 18

10~80%. 25) CVD. 26), CVD 80%, 20%. 27) CVD 45%, 55%. 2) (Flat Panel Display) LCD(Liquid Crystal Display) OLED(Organic Light Emitting Diode). 28), LCD 98%(2014 ). 29) 25) U.S. EPA, Semiconductor Industry 26) 150mm 2000 200mm., CVD C2F6 - (in-situ) CVD. (U.S. EPA(2013a), p.iv-140) 27) 300mm,, CVD NF 3. (U.S. EPA(2013a), p.iv-140). 28) PDP PDP, 2014 PDP. 29) 제 2 장산업공정온실가스의특성 19

LCD. 30) < 표 2-7> 세계디스플레이시장및전망 ( 면적기준 ) ( : 10 m 2 ) 2015 2016 2017 2020 2021 2022 2023 2024 LCD 1,742 1,836 1,950 2,229 2,278 2,337 2,396 2,477 ( ) 98.4 97.8 97.0 94.5 93.7 92.9 92.2 91.6 OLED 25 40 58 128 152 177 201 226 ( ) 1.4 2.1 2.9 5.4 6.2 7.0 7.7 8.4 2 2 2 2 2 2 2 2 ( ) 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 1,769 1,877 2,009 2,359 2,431 2,515 2,600 2,705 : (2017), (TFT, thin-film transistor) CVD. CF 4, C 2 F 6, C 4 F 8, CHF 3, SF 6, NF 3. 31)., 30) OLED, LCD. 31) WLICC(2011) 20

23%, 77% CVD. 32) 2. 냉매사용용도별 HFCs 종류 IPCC 6. 33) 6. : :,, (cold storage), (chiller) :,, (reefer), : - (air-to-air),, (chiller) 34) :,,, 32) U.S. EPA(2013a) 33) IPCC NGGIP(2006), p.7.43 34) (,,, ) (air conditioning). -. 제 2 장산업공정온실가스의특성 21

(CFCs HCFCs). CFCs HCFCs, HFCs. HFCs. 35), HFC-134a, CFC-12. HCFC-22 HFCs R-407C 36) R-410A 37), R-404A 38) R-507A 39) R-502 40) HCFC-22. CFCs HCFCs HFCs, HFCs GWP HFCs. HFCs. 가. 가정용냉동 냉장장치 41) 15~20. 100 0.05~0.25kg. 35) HFCs 3 36) HFC-32/HFC-125/HFC-134a 37) HFC-32/HFC-125 38) HFC-125/HFC-143a/HFC-134a 39) HFC-125/HFC-143a 40) HCFC-22/CFC-115 41) Duarte et al.(2015), p.210. 22

HFCs 2010 2%. CFCs(R-12) HFC-134a R-600a. 75% R-600a, 42) (95%) R-600a R-134a. R-600a. 나. 상업용냉동 냉장시스템 43)44). (1 ~14 ) (-12 ~-20 ). 2006 546, HCFCs 55%, CFCs 30%, HFCs 15%. 15~20, 0.5~20kg. 45) R-22, HFC-134a, HFC-404A, HFC-407C 46), HFC-507A, HFC-410A. 42) U.S. EPA(2010b) 43),, 44) Duarte et al.(2015), pp.209-210. 45) 46) 제 2 장산업공정온실가스의특성 23

R-290( ), R-600a( ), R-1270( ), R-717( ) 47), R-744(CO 2 ), (HFCs HFOs R-290 R-600a ). 다. 산업공정용설비,. 20~60,000kg,. (R-717)... CO 2. 48) 라. 이동형냉동 냉장시스템 (Mobile Air Conditioning, MAC),,,. MAC R-12 HFC-134a. 0.8kg, 0.6kg, 1.5kg, 5~12kg. 47) 48) S. Sawalha, (2010) 24

MAC HFC-134a GWP HFC-152a 49). HFO-1234yf. SNAP 50) (light-duty) HFO -1234yf, R-744(CO 2 ), HFC-152a. HFO-1234yf HFC-152a. 51)52) R-404A HFC-134a. (5~10 ) CO 2 53) HFCs HFCs. HFOs. 54), CO 2 /. (cold-air). 55) 49) HFC-134a GWP 1430 HFC-152a GWP 124 50) Significant New Alternatives Policy 51) U.S. EPA(2013b) 52) Duarte et al.(2015) 53) CO 2.(Pedersen, 2012) 54) Duarte et al.(2015) 55) Pedersen(2012) 제 2 장산업공정온실가스의특성 25

마. 공조시스템 ( 고정형에어컨 ) 11% (Unitary Air - Conditioning, UAC) UAC 60%(2010 ) R-22. 56) 2000 R-410A R-407C, 2010 UAC 39%. ( ) 15. 2010 UAC R-290( ), R-744(CO 2 ), HFC-32 HFO-1234yf UAC. - CFCs, HCFCs HFCs. 57) 56) HCFCs (, R-22) GWP HFCs (U.S. EPA, 2010a). 57) Duarte et al.(2015) 26

< 표 2-8> HFCs 가스용도별생산량, 수입량및수출량정보 2010 2011 2012 2013 2014 - - - 24.0 34.0 - - - - 3.6 HFC-23 7.6 8.1 16.9 17.1 78.5 32.9 23.4 65.2 442.8 215.0-74.4 80.5 77.4 94.5 HFC-32-454.1 1,045.4 1,308.1 872.4-5.1 5.4 5.8 6.0 HFC-43-10mee - - 1.2 1.2 4.2-892.4 699.6 1,331.5 907.8 HFC-125 62.6 65.1 266.1 243.4 364.8 - - - 12.2-2,061.6 4,997.1 6,471.7 5,834.9 6,034.9 HFC-134a - - - - 112.6 18.6 22.0 18.1 19.0 39.6-42.0 288.0 15.0-11.1 11.1-8.7 - HFC-152a - - - 0.0 571.6 - - - 10.3 40.8-0.8-2.2 1.5 HFC-227ea 41.5 18.2 20.5 - - - - 0.1 4.4 30.7 HFC-236fa - - - - 10.0 HFC-245fa - - - - 498.5 HFC-365mfc - - 1.3 58.4 408.0 404A 537.0 434.4 588.8 557.8 679.8 - - - - 5.7 407C 41.4 163.4 211.3 392.9 457.2 408A 13.6 17.4 13.1 9.5 23.3 410A 2,014.5 2,006.9 2,425.2 2,527.8 3,557.7 - - 136.0 51.0 0.113 507A 9.1 6.4 70.9 210.3 87.8 - - - - 2.0 508B - - - 0.027 0.018 : (2016) ( : ) 제 2 장산업공정온실가스의특성 27

제 3 장몬트리올의정서회의결과분석과선진국의 HFCs 규제동향 제 1 절몬트리올의정서당사국회의결과분석 1. 키갈리당사국회의결정배경 HFCs 2009 21 58). 59)60) 2 61) HFCs. 19 CFCs HCFCs HFCs.,. 2010 22 HFCs, 62)63) 2011 23 58). 59) UNEP/OzL.Pro.21/8 60) Earth Negotiation Bulletin Vol.19 No.73 61) (FSM) (Mauritius) 62) Earth Negotiation Bulletin Vol.19 No.79 63) UNEP/OzL.Pro.22/9 제 3 장몬트리올의정서회의결과분석과선진국의 HFCs 규제동향 29

OACG(ODS Alternatives Contact Group). 64)65) 24 HFCs. 66)67) HFCs. 106. 2013 25 HFCs.. 68)69) HFCs (Discussion Group on HFCs Management)., HFCs,, Contract group. OEWG(Open-ended Working Group) 33 (discussion group). 2013 9 G20 64) Earth Negotiation Bulletin Vol.19 No.86 65) UNEP/OzL.Conv.9/7-UNEP/OzL.Pro.23/11 66) UNEP/OzL.Pro.24/10 67) Earth Negotiation Bulletin Vol.19 No.93 68) Earth Negotiation Bulletin Vol.19 No.100 69) (2016) 30

., 2014 11 26. 70)71) HFCs.,. 2015 UAE 27 HFCs, 2016 28 HFCs ⅩⅩⅦ/1 72). 73)74) 2. 키갈리당사국회의결과 75)76) 2016 10 28, HFCs (Kigali Amendment). HFCs., 70) Earth Negotiation Bulletin Vol.19 No.107 71) (2016) 72) Dubai pathway on HFCs 73) Earth Negotiation Bulletin Vol.19 No.110 74) UNEP/OzL.Pro.27/13 75) Earth Negotiation Bulletin Vol.19 No.126 76) Clark and Wagner(2016) 제 3 장몬트리올의정서회의결과분석과선진국의 HFCs 규제동향 31

1 : 20 ( ) UN, 2019 1 1. 20 90 2 Article 5 ( ) 1 : Article 5 ( 137 ) 2 :,,,,,,,,, 3 non-article 5 (50 ) 1 : non-article 5 (45 ) 2 :,,,, 4 HFCs I : HFCs (HFC-23 HFO 77) ) II : HFC-23 5 HFCs 2019 1 1 6 2033 1 1,. HFCs HFCs,,. 77) HFCs GWP, HFCs. 32

2020 3, 2029, 2019. < 표 3-1> 키갈리개정의정서에따른그룹별감축단계 Article 5 1 ( ) non-article 5 1 ( ) 2020, 2021, 2022 2011, 2012, 2013 2020, 2021, 2022 HFCs + HCFCs 65% 2011, 2012, 2013 HFCs + HCFCs 15% 2024~ 1 2019 10% 1 2029 10% 2 2024 40% 2 2035 30% 3 2029 70% 3 2040 50% 4 2034 80% 4 2045 80% 5 2036 85% : Clark and Wagner(2016),,. R-600a, HFO-1234yf. 제 3 장몬트리올의정서회의결과분석과선진국의 HFCs 규제동향 33

제 2 절주요선진국의 HFCs 규제동향 1. 유럽연합 (EU) 78)79) EU CFCs HCFCs (ODS) (ODS Regulation) 80) HFCs (F-gas Regulation). (EC 517/2014) 2030 GWP (CO 2 eq.) 2/3. 6 6 3 ([ 3-1] 1~3), 3 ([ 3-1] 4~6). EU 2006 HFCs 2010. 81) 78) (REGULATION (EU) No 517/2014) 79) Linde AG(2014) 80) (REGULATION (EC) No 1005/2009) 81) 2030 1.5GtCO 2eq, 2050 5GtCO 2eq. (D. Brack, 2015; EC, Climate Action Fluorinated greenhouse gases). 34

[ 그림 3-1] EU 의불화가스규정구성요소 : Shecco(2016), p. 18 가. HFCs 단계별감축 (Phase-down of bulk HFCs) HFCs 2030 2009~2012 (CO 2 eq. ) 79% ([ 3-2] )., 6. 82) 82) 15 제 3 장몬트리올의정서회의결과분석과선진국의 HFCs 규제동향 35

1 HFCs 2 (feedstocks) HFCs 3 CVD ( ) 4 [ 그림 3-2] HFCs 단계별감축수준및일정 : Shecco(2016), p. 18 나. 신규기기에서고GWP HFCs 사용금지 (HFC bans in new equipment) 83) GWP. EU < 3-2>. 83) 11 1 36

< 표 3-2> 신규기기에대한불화가스제한내용 (Domestic refrigerators and freezers) (Refrigerators and freezers for commercial use) (Stationary refrigeration equipment) ( 40kW) (Centralised refrigeration systems for commercial use with capacity 40kW ) (Movable room air-conditioning appliances ) ( <3kg) (Single split air-conditioning systems containing <3kg of F-gases) : D. Brack(2015), p. 7 F-gas GWP (1 1 ) 150 2015 2500 2020 150 2022 2500 2020 150 2022 150 2020 750 2025 다. 서비스및유지보수금지 (Servicing ban on HFCs with GWP 2500) 84) 2020 1 1, 40tCO 2 eq. GWP 2500.,. 1 2-50 (equipment) 3 2030 1 1 (reclaimed or recycled). 84) 13 3 제 3 장몬트리올의정서회의결과분석과선진국의 HFCs 규제동향 37

, EU. 2006 (Mobile Air-Conditioning, MAC) (MAC Directive, EC 40/2006). MAC 3. 85) 1 2008 6 1 GWP 150. 2 2011 1 1 GWP 150. 86) 3 2017 1 1 EU GWP 150.,. 2. 일본 1) HFCs 87), 88), 89), 90), 2002 ODS HFCs. 85) EC, Growth 86) HFO-1234yf, 2012 HFC-134a. 87) 88) 89) 90) 38

[ 그림 3-3] 몬트리올의정서와교토의정서관련일본의법률 : T. OKADA(2015),, (heat-pump washer-dryers).. (2013, 2015 ). 2) HFCs EU GWP. 제 3 장몬트리올의정서회의결과분석과선진국의 HFCs 규제동향 39

2 2 (CFCs, HCFCs, HFCs). [ 그림 3-4] 냉매관련일본법률변화 : T. OKADA(2015), GWP GWP/. GWP (< 3-3> ). 40

< 표 3-3> 법률에서지정한지정제품의냉매목표 GWP (GWP) GWP HFC-410A(2090) HFC-32(675) 750 2018 ( ) (11 ) HFC-410A(2090) 750 2020 HFC-134a(1430) 150 2023 (1.5kw ) (50,000, ) Dust blowers ( ) HFC-404A(3920) HFC-410A(2090) HFC-407C(1774) CO 2 (1) HFC-404A(3920) (10 ) HFC-134a(1430) HFC-152a(124) CO 2 (1), DME (1) 1,500 2025 100 2019 10 2019 : Ministry of the Environment (2016) 3. 미국 2013 6 (Climate Action Plan, CAP) HFCs. HFCs (CAA) 612 SNAP(Significant New Alternatives Policy). 91) 91) U.S. EPA, Overview of SNAP 제 3 장몬트리올의정서회의결과분석과선진국의 HFCs 규제동향 41

SNAP, ( ). GWP,,,,,. SNAP, GWP GWP. GWP. EU. 2. < 3-4>. 42

< 표 3-4> 냉매사용기기별수용가능냉매정보 https://www.epa.gov/snap/substitutes-centrifugal-chillers https://www.epa.gov/snap/substitutes-positive-displacement-chillers https://www.epa.gov/snap/substitutes-industrial-process-refrigeration / / / / : Ministry of the Environment (2016) https://www.epa.gov/snap/substitutes-cold-storage-warehouses https://www.epa.gov/snap/substitutes-commercial-ice-machines https://www.epa.gov/snap/substitutes-household-refrigeratorsand-freezers https://www.epa.gov/snap/substitutes-ice-skating-rinks https://www.epa.gov/snap/substitutes-industrial-process-air-co nditioning https://www.epa.gov/snap/substitutes-industrial-process-refrig eration https://www.epa.gov/snap/substitutes-motor-vehicle-air-condit ioning https://www.epa.gov/snap/substitutes-residential-and-light-co mmercial-air-conditioning-and-heat-pumps https://www.epa.gov/snap/substitutes-residential-dehumidifiers https://www.epa.gov/snap/substitutes-refrigerated-transport https://www.epa.gov/snap/retail-food-refrigeration https://www.epa.gov/snap/substitutes-vending-machines https://www.epa.gov/snap/substitutes-very-low-temperature-re frigeration https://www.epa.gov/snap/substitutes-water-coolers 제 3 장몬트리올의정서회의결과분석과선진국의 HFCs 규제동향 43

< 표 3-5> 냉매이용장비종류및적용범위 / / ( ) 60 ~ 6,000 (RT) 3 ~ 510 (RT) 3 ~ 2,000 (RT) 3 ~ 510 (RT) - - / (chilled kitchen drawers), (wine coolers), / / (,,, ) / - - (stand-alone equipment), (remote condensing units),, - / - -62 : U.S. EPA, SNAP, Chillers; U.S. EPA, SNAP, Refrigeration and Air Conditioning 44

제 4 장산업공정부문 Non-CO 2 가스감축대안 제 1 절반도체 디스플레이업종공정가스감축대안 ( ) ( ),, ( ). 1. 반도체 디스플레이생산과 NF 3 가스소비특성 step step 92). NF 3. NF 3 ([ 4-1], [ 4-2] ). NF 3. 92) (1999) 제 4 장산업공정부문 Non-CO 2 가스감축대안 45

[ 그림 4-1] 반도체업종웨이퍼생산면적및 NF 3 구매량추이 : [ 그림 4-2] 디스플레이업종 LCD/OLED 생산면적및 NF 3 구매량추이 : 46

2. 생산공정에서 NF 3 가스의중요성 2010 NF 3. NF 3,.. NF 3.. NF 3 1 (, ) 2. NF 3. 3. 반도체업온실가스감축옵션 (PFCs) 6 (< 4-1> ). 6, POU(point-of-use) 93). 93) POU EOP(End-of-pipe). 제 4 장산업공정부문 Non-CO 2 가스감축대안 47

POU.. < 표 4-1> 반도체업감축옵션별설치분야및감축률 (New fab) (Old fab) 95% 99% - - 97% - - NF 3 95% - - 77% - - - 54% - - - : U.S. EPA(2013a), p.iv-134 < 표 4-2> 반도체업감축옵션별비용 ( :, 2010, tco 2eq.) 7 7 11,404 5,702 658 329 7 7 13,813 6,907 911 455 7 7 3,629 1,815 104 52 NF 3 22 11 3,005 9,201 1,215 3,375 22 11 n.a. 1,180 n.a. 64 22 11 n.a. 109 n.a. -129 : 1. : U.S. EPA(2013a), p.iv-135 48

가. 열분해 (Thermal abatement systems) CVD.. 94) (Old fab). 나. 촉매감축 (Catalytic abatement systems)., < 4-1> 99% ( / ). 95). 다. 플라즈마감축 (Plasma abatement systems) 96).,. 94) U.S. EPA(2013a), p.iv-135 95) U.S. EPA(2013a), p.iv-136 96) U.S. EPA(2013a), p.iv-136 제 4 장산업공정부문 Non-CO 2 가스감축대안 49

(tool). 라. NF 3 리모트반응기세정 (NF 3 remote chamber clean) NF 3 NF 3 CVD ( - ). 97). 마. 가스대체 (Gas replacement) 98) GWP GWP. CVD NF 3. C 4 F 8 (GWP 10300) C 3 F 8 (GWP 8830) C 2 F 6 (GWP 12200). C 4 F 8 (C 2 F 6 ) GWP CVD. 바. 공정최적화 (Process optimization). CVD 97) U.S. EPA(2013a), p.iv-137 98) U.S. EPA(2013a), p.iv-138 50

,. 99) CVD 100) C 2 F 6 CF 4 C 3 F 8, C 4 F 8, C 4 F 8 O, NF 3. 101) C 2 F 6 NF 3, 2000. CVD (endpoint detection). C 2 F 6, (throughput) 10~56%. 102). 4. 디스플레이업온실가스감축옵션 6. POU. SF 6.. 99) U.S. EPA(2013a), p.iv-139 100) 1999 101) S. Laurie(2005) 102) S. Laurie(2005) 제 4 장산업공정부문 Non-CO 2 가스감축대안 51

< 표 4-3> 디스플레이업감축옵션 77%, 95%, 99% 97% NF 3 95% 77% : U.S. EPA(2013a), p.iv-195 가. 중앙집중식감축 (Central abatement systems, CAS) 103) (CAS) SF 6. CAS.. 2 CDM ( #3440 #3333), SF 6. NF 3. 104) 103) U.S. EPA(2013a), p.iv-195 104) LGD(LG ) SDC( ). 52

. CAS (capital cost) 450, (O&M cost) 250. 나. 열분해감축 (Thermal abatement systems) CVD (< 4-3> ).. 105)106) (capital cost) 570,,,. (facility level) (operating cost) 328,860. 107). OLED, NF 3. LGD. 105) U.S. EPA(2013a), p.iv-195 106). 107) U.S. EPA(2013a), p.iv-195 제 4 장산업공정부문 Non-CO 2 가스감축대안 53

다. 촉매감축 (Catalytic abatement systems) 108) < 4-3> CVD.. (capital cost) 690.,,, (facility level) (annual cost) 455,280., NF 3. 라. 플라즈마감축 (Plasma abatement systems). 109)110). LG,. (capital cost) (facility) 1.8. (annual operation cost) 1,190. 111) 108) U.S. EPA(2013a), p.iv-195 109). 110) U.S. EPA(2013a), p.iv-196 111) tool tool 51,850 (U.S. EPA, 2013a). 54

마. NF 3 리모트반응기세정 (NF 3 remote chamber clean) NF 3 (NF 3 ). 112) NF 3 (Ar) NF 3 (disassociation). (water scrubber). 113)114) NF 3 NF 3 3% (, ). (2006), RPSC(Remote Plasma Source Chamber) NF 3 95% 99%. 115) 바. 가스대체 (Gas replacement) CVD. NF 3 SF 6. 116) PFCs COF 2, NF 3 F 2, HF NOx (ESH) 117). 112) IPCC(2006), p.6.18 113) S. Laurie(2005) 114) A. Fridman(2008) 115) (2006), p.542 116) U.S. EPA(2013a), p.iv-196 제 4 장산업공정부문 Non-CO 2 가스감축대안 55

제 2 절몬트리올의정서대응 HFCs 냉매감축대안. (,,,, ).. EU EU.,. HFO-1234yf HFC-134a. HFCs HCFCs.,.. HFCs 117) S. Laurie(2005) 56

EU - (Öko-Recherche) 118) HFCs - HFCs 2/3,. 119) < 표 4-4> 냉매용도별저 GWP 및자연냉매대안 HFCs GWP NIK / HFC-134a HFO-1234yf R-600a : R-404A, HFC-134a R-448A, R-449A R-454A R-744, R-290 / : R-404A, HFC-134a R-448A, R-449A, (, R-454A) R-744 : R-404A, HFC-134a HFO-1234yf (, R-455A) R-290, R-744 R-404A, HFC-134a : HFO-1234ze, HFO-1233zd R-717, R-744 / R-404A, HFC-134a R-452A R-744 R-410A HFC-32, (, R-454B) R-290 118) EU EU 119) B. Zeiger et al.(2014) 제 4 장산업공정부문 Non-CO 2 가스감축대안 57

, VRF HFCs GWP NIK R-410A HFC-134a, R-410A HFC-32, (, R-450A) (, R-454B) HFO-1234ze, HFO-1233zd, R-514A, HFC-32, R-450A R-290, R-717 HFC-134a HFO-1234yf R-744 : 1. 2. NIK(Not-in-Kind) HFC 3. VRF : Variable Refrigerant Flow : UNEP, OzonAction Kigali Fact Sheet 4 < 4-4> HFCs ( 列 ),. [ 4-3] GWP 1000 GWP. [ 4-3] Ultra-low. [ 그림 4-3] GWP 크기에따른냉매분포 : UNEP, OzonAction Kigali Fact Sheet 3 58

Ultra-low. R-290( ) R-600a (,, ). HFOs (water chillers) GWP. 120) 1, 2, 3 ( ), 4 4,. HFCs. 1 HFCs CFCs HCFCs. ( ) 2 GWP HFCs GWP (,, ).. 3. CFCs HCFCs HFCs HFCs. 120) UNEP, OzonAction Kigali Fact Sheet 4 제 4 장산업공정부문 Non-CO 2 가스감축대안 59

4 2 3 R&D,. 5.,.. 60

제 5 장결론및정책건의 NF 3 PFCs SF 6. [ 5-1] NF 3. - NF 3. (Old fab) - NF 3 NF 3. [ 그림 5-1] 반도체 디스플레이업 NF 3 가스사용방식 - NF 3, NF 3 (IPCC Guideline 2006). 제 5 장결론및정책건의 61

Old fab(200 mm ) PFCs NF 3 NF 3. NF 3 95~99%(Laurie, 2005), - 25~45% (U.S. EPA, 2010c). [ 그림 5-2] 반도체 디스플레이업 NF 3 가스사용공정별배출률 NF 3. [ 5-3] ( / ), 2013 2015 2016 2014. Mask Layer(ML) 2009 2011 (2015 ). 62

2030 NF 3, 6,228~6,245 (< 5-1> ). NF 3-2030 75% (4,671~4,684 tnf 3 = 80,341~80,565 tco 2 eq). [ 그림 5-3] 반도체 NF 3 가스구매원단위추이 - 2030 3.75% (234 tnf 3 = 4,025 tco 2 eq). NF 3 0.25~0.01% (6~16 tnf 3 = 107~268 tco 2 eq). 제 5 장결론및정책건의 63

NF 3 -, (, ). < 표 5-1> 반도체업 2030 년 NF 3 가스구매량추정 2016 2017 2030 NF 3 (kg/m 2 ) NF 3 ( ) ( m 2 ) 2.84 2.83 2.83 3 (2013,2014,2016) ML 1.61 1.53 0.79 2011~2016 3,630 3,785 6,245 - ML 3,630 3,815 6,228-1,277 1,377 2,206 - ML 2,254 2,494 7,919 - : 2017 ( Mask Layer(ML) / ), NF 3 NF 3 (LCD). 121) [ 5-4], 2012 LCD OLED. NF 3 (NF 3 / ) 2011 ([ 5-5] ). 121) 2017 7 64

[ 그림 5-4] 디스플레이종류별생산추이 ( : m 2 ) [ 그림 5-5] 디스플레이 NF 3 구매원단위 제 5 장결론및정책건의 65

2030 2030 NF 3. NF 3. 1 ( NF 3 ) 0.5~1.2 (2004 ) 2 2011 2018 ( ) 3 NF 3 122) NF 3 122) SF 6 NF 3 66

< 표 5-2> 디스플레이업 2030 년 NF 3 가스구매량추정 NF 3 0.458 1.235 2016 89,982 m 2 NF 3 4,295 tnf 3 2030 95,607 m 2 NF 3 4,418 tnf 3 4,627 tnf 3 : 2016, 2018, NF 3 2030 5%(221~231 tnf 3 = 3,800~3,979 tco 2 eq), 0.25%(11~12 tnf 3 = 190~199 tco 2 eq). NF 3, NF 3 NF 3. NF 3. CVD - 200mm (Old fab). 제 5 장결론및정책건의 67

LCD NF 3 123). CVD LCD ( ). NF 3. - NF 3 NF 3. 124) (abatement technologies). NF 3 NF 3 (, fab, NF 3 ),. HFCs. 123),.,. 124) (chamber) N F. 68

( = ).,.... HFCs. GWP HFCs.. 125). HFCs GWP GWP=0 HFCs. HFCs GWP GWP HFCs. < 4-4>, ( ),. 125),. 제 5 장결론및정책건의 69

, (, ) HFC-134a R-600a. R-600a., ( ),. (R-744) (R- 717). 126) SAC/VRF 127)., (R-404A),.,., HFC-134a.. (, HFO - 1234yf).. 126) (HFO ) (, 2016) 127) SAC: System Air Conditioner/VRF: Variable Refrigerant Flow(,,, ) 70

( ) /. HFCs. 2030 206 10 EU GWP ( ) R&D. HFCs T/F. T/F,, R&D.,,.. 제 5 장결론및정책건의 71

참고문헌 < >, 2014. 2006 IPCC, 2006. NF 3, 19(6), pp.535~543., 2016.. S. Sawalha,. 2010.., 39(4), 45-50., 2002., (R.C. Jaeger, Introduction to Microelectronic Fabrication 2nd Ed.), 1999., 1999 1, p.34, 2016.. 2017., 2017. 2, 2016. ( )., 2016. IGSD : HFC, p.24, 2016.. 참고문헌 73

D. Brack, 2015. National Legislation on Hydrofluorocarbons Xing Chen, William Holber, Paul Loomis, Evelio Sevillano and Shou-Qian Shao, MKS Instruments, and Scott Bailey and Michael Goulding, STMicroelectronics, 2003. Advances in Remote Plasma Sources For Cleaning 300mm and Flat Panel CVD System, Semiconductor Magazine, August 2003. M. V. Duarte, L. C. Pires, P. D. Silva and P. D. Gaspar, 2015. Current and Future Trends of Refrigerants Development, Handbook of Research on Advances and Applications in Refrigeration Systems and Technologies A. Fridman, 2008. Plasma Chemistry, Cambridge University Press. IPCC Guideline 2006 IPCC NGGIP(National Greenhouse Gas Inventories Programme), 2006. 2006 IPCC Guidelines for National Greenhouse Gas Inventories, Vol. 3 Industrial Processes and Product Use, p.7.43 S. Laurie, 2005. Reduction of Perfluorocompound(PFC) Emissions: 2005 State-of-the Technology Report, International SEMATECH Manufacturing initiative(ismi). Laurie S., 2005 Linde AG, 2014. Guide to updated EU f-gas regulation (517/2014) Shecco, 2016. F-GAS Regulation shaking up the HVAC&R Industry T. OKADA, 2015. Standards and Codes on HPMP in Japan in Regional Technical Meeting on Codes and Standards in relation to the Montreal Protocol in Dubai, UAE 74

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層保護法 概要 (https://www.env.go.jp/press/cfc_conf01/ref02.pdf, : 2018. 1. 25) 回収 破壊法 概要 (http://www.env.go.jp/earth/ozone/cfc/law/kaisei/, : 2018. 1. 25) 家電 法 (http://www.meti.go.jp/policy/it_policy/kaden_recycle/, : 2018. 1. 25) 自動車 法 (http://www.meti.go.jp/policy/mono_info_service/ mono/automobile/ automobile_recycle/about/recycle/recycle.html#q01, : 2018. 1. 25) 80

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