1 Memory PKG DIP * DUAL IN-LINE PACKAGE PIN PKG LEAD LEAD PITCH 100 MIL (254mm), PKG WIDTH 300/400/600 MIL (PIN HOLE WIDTH ), PIN 6-64 P-DIP C-DIP SDIP SK-DIP SIP * PLASTIC DIP MOLD ( ) PLASTIC( EPOXY COMPOUND) DIP * CERAMIC DIP CERAMIC DIP LEAD, BODY, CAP, GLASS (SEALING) 8-42 PIN * SHRINK DIP P-DIP LEAD PITCH 70 MIL (1778 mm) * SKINNY DIP P-DIP PKG WIDTH 600MIL PKG 300MIL * SINGLE IN-LINE PACKAGE LEAD PKG PCB PKG LEAD PITCH 100 MIL 2-23 PIN
1 Memory SSIP ZIP (VDIP) * SHRINK SIP LEAD PITCH 70 MIL SIP * ZIG-ZAG IN-LINE PACKAGE (VETICAL DIP) SIP PKG LEAD, ZIG-ZAG FORMING LEAD PITCH 100 MIL SOP * SMALL OUTLINE PACKAGE PKG GULL-FORM LEAD PKG LEAD PITCH 50 MIL(127 mm) 8-44 PIN SSOP * SHRINK SOP LEAD PITCH 10/08/065/05 mm SOP 8-80 PIN
1 Memory SOJ * SMALL OUTLINE J-LEADED PACKAGE SOP LEAD J FORMING PKG LEAD PITCH 50 MIL 20-40 PIN SOI SVP (VPAK) * SMALL OUTLINE I-LEADED PACKAGE SOP/SOJ, LEAD I FORMING * SURFACE VERTICAL PACKAGE SIP LEAD PKG, FORMING SOJ 1/7, ZIP 1/3 LEAD PITCH 05/065 mm 24-32 PIN TI VPAK, FIJITSU SVP SHP TI VPAK FUJITSU SVP * SURFACE HORIZONTAL PACKAGE SOP LEAD PIN, PCB PKG
1 Memory TSOP * THIN SOP 50 MIL, LEAD PITCH 50 MIL SOP EIAJ PKG LEAD TSOP I, TSOP II TYPE I 06/055/05 mm PITCH, SOLDER TYPE II PITCH 127 mm TSOP II TSSOP * THIN SHRINK SOP PKG BODY 10 mm, PITCH 065/05 mm TSOP 8-32 PIN TI JAPAN UTSOP VSOP USO SON * ULTRA THIN SOP PKG BODY 065 mm TSOP FUJITSU * VERY SOP SONY, FUJITSU, MITSUBISHI SSOP * ULTRA SMALL OUTLINE PACKAGE * SMALL OUTLINE NON-LEADED PKG FUJITSU CSP LEAD PKG ( QFN)
1 Memory FP PFP QFP * FLAT PACKAGE QFP SOP PKG * PLASTIC FLAT PACKAGE * QUAD FLAT PACKAGE PKG 4 GULL-WING LEAD PIN PKG PLASTIC, CERAMIC, METAL PLASTIC LEAD PITCH 10/08/065/05/04/03 mm, 065 mm 232 PIN, 05 mm 304 PIN EIAJ 065 mm QFP, 05 mm FINE PITCH QFP PKG BODY 20-36mm QFP, 140mm LQFP 10 mm TQFP PQFP CQFP TQFP MQFP * PLASTIC QFP * CERAMIC QFP * THIN QFP PCB 127 mm (50MIL), BODY 10mm QFP LEAD PITCH 08/065/06/05 mm, PIN 44-256 * METRIC QFP JEDEC QFP LEAD PITCH 10-065mm, BODY 38-20 QFP
1 Memory LQFP QFI QFN * LOW PROFILE QFP BODY 14 mm QFP * QUAD FLAT I-LEADED PACKAGE LEAD QFP (BUTT LEAD) MSP (MINI SQUARE PKG) QFP, LEAD PITCH 127 mm, PIN 18-68 * QUAD FLAT NON-LEADED PACKAGE LCC, QFN EIAJ PKG PAD LEAD QFP, CERAMIC PLASTIC, LCC CERAMIC PLASTIC QFN GLASS EPOXY PCB LOW COST PITCH 127/065/05mm QTP (QTCP) MQUAD * QUAD TAPE CARRIER PACKAGE TAB TCP 4 LEAD QTP EIAJ * METAL QUAD Al BASE CAP GLASS SEALING QFP 25-28 W OLIN
1 Memory BQFP * QFP WITH BUMPER QFP 4 BUMPER LEAD BENT PITCH 25 MIL (0635 mm) PIN 84-196 FQFP GQFP HQFP PQ QFJ * FINE PITCH QFP PITCH 05 mm QFP * QFP WITH GUARD RING LEAD PIN RING LEAD BENT QFP RING LEAD GULL-FORM PCB MOTOROLA PITCH 05 mm, PIN 256/208 * QFP WITH HEAT SINK QFP HEAT SINK * POWER QUAD QFP BODY HEAT SINK PKG * QUAD FLAT J-LEADED EIAJ PLCC
1 Memory LCC * LEADELESS CHIP CARRIER CERAMIC SUBSTRATE PAD LEAD PKG CERAMIC QFN QFN-C PLCC * PLASTIC LEADED CHIP CARRIER PLASTIC QFJ PLASTIC LCC PITCH 127 mm, PIN 84 PIN CLCC * CERAMIC LEADLED CHIP CARRIER CERAMIC QFJ QFJ-G PKG J-FORM LEAD PITCH 127 mm J-LCC PCLP * J-LEADED CHIP CARRIER BULL-EYES-CAP CERAMIC QFJ * PRINTED CIRCUIT BOARD LEADLESS PACKAGE, FUJITSU PLASTIC QFN PITCH 05/04 mm
1 Memory PGA * PIN GRID ARRAY PKG LEAD PIN PIN PKG PPGA CPGA LGA SUBSTRATE MULTI-LAYER CERAMIC PITCH 254/127 mm, PIN 64-447 * PAD GRID ARRAY PGA PIN PAD PKG * PLASTIC PGA SUBSTRATE PCB, EPOXY CHIP SEALING LOW COST PGA * CERAMIC PGA * LAND GRID ARRAY (PAD GRID ARRAY) PIGGY BACK * SOCKET CERAMIC PLASTIC PKG DIP, QFP, QFN
1 Memory BGA SBGA PBGA CBGA * BALL GRID ARRAY PCB SOLDER BALL ARRAY PKG CHIP, MOLD SEALING 200 PIN PKG, QFP LEAD 200 PIN QFP 500 PIN HI-PIN PKG * PAD ARRAY CARRIER (PAC) * GLOBE TOP PAC (GPAC) * OVER MOLDED PAD ARRAY CARRIER (OMPAC) * SUPER BGA ANAM HI-SPEED, HI-POWER PERFO-RMANCE COPPER HEATSINK CHIP BGA * PLASTIC BGA LOW COST SUBSTRATE EPOXY * CERAMIC BGA MBGA * METAL BGA OLIN BGA, ANODIZED ALUMINIUM SUBSTRATE THIN FILM CIRCUIT BGA
1 Memory u-bga TBGA mbga C2 BGA LBGA * MICRO BGA TESERA CHIP-SIZED PKG, HI I/O, BGA * TAPE BGA TAB BGA PKG * MINI BGA FLIP CHIP SOLDER BALL DIAMETER 10 MIL, PITCH 20 MIL SANDIA NATIONAL LABORATORIES BGA MCM * CONDUCTION COOLED BGA SGS THOMSON,, PKG COPPER HEAT SLUG 5 WATT, SYSTEM BOARD COPPER PLANE * LEADFRAME BGA HITACHI,L/F SUBSTRATE LOW COST PKG
1 Memory MCM * MULTI CHIP MODULE CHIP 1 PKG SUBSTRATE MCM-L (EPOXY ),MCM-C ( GLASS CERAMIC), MCM-D ( ALUMINIUM) MCM-L LOW COST, MCM-C HIC, MCM-D COST TAB TCP * TAPE AUTOMATED BONDING BARE CHIP, FILM LEAD CHIP * TAPE CARRIER PACKAGE TAB CHIP TAPE PKG TAB QFP FINE PITCH, COB PKG, LCD CHIP PITCH 025 mm, 500 PIN LEAD 2 DTCP, 4 QTCP PCB LEAD CUT FORM
1 Memory CSP FC COB COG KGD * CHIP SCALE PACKAGE CHIP 120% PKG COG, BLP, u-spring * FLIP CHIP BARE CHIP BOND PAD BUMP, PCB PKG * CHIP ON BOARD BARE CHIP, PCB CHIP WIRE BOND PACKAGING * CHIP ON GLASS FLIP CHIP, SUBSTRATE GLASS LCD * KNOWN GOOD DIE WAFER LEVEL BURN, FUNCTIONAL TEST CHIP CHIP DIE LOC * LEAD ON CHIP CHIP L/F INNER LEAD PKG, COL PKG ACCESS TIME PKG
1 Memory COL BLP * CHIP ON LEAD LOC L/F CHIP PKG * BOTTOM LEADED PACKAGE, CSP, )LG JEDEC PKG PKG PAD LEAD, SOJ 2 CHIP BOND PAD C-BLP (CENTER),S-BLP(SIDE), 3-D BLP(STACKED) TYPE APPLICATION FUJITSU SON PKG, HI-PIN, PCB PKG
1 Memory u-spring * MICRO SPRING FORMFACTOR LG CSP WF LEVEL GOOD DIE GOLD WIRE BONDING SPRING Au/Ni PLATING, PKG, PCB SOLDER FLIP CHIP, REPAIR, PCB PAD PCB FLEXIBILITY Au Au Ni Au TiW 1995 96 97 98 99 00 01 I/O PKG Technology Trend High-end FlipPAC TM Tape BGA Mid range FlipPAC TM M 2 BGA TM PBGA M 2 CSP TM QFP iquad Family FBGA RamPAC TM EconoCSP TM LQFP TQFP ubga FlashPAC TM SOP, SSOP, TSOP, TSSOP Surface Mount Fine Pitch / Thin Modules/System