2002. 4. 4.
DISPLAY CLASS Electronic Information Displays CRT Flat Panel Display Projection Emissive Display Non Emissive Display Cathode Ray Tube Light Valve FED VFD PDP OLED ELD LED LCD ECD DMD DC Type AC Type Hybrid Type 1
DISPLAY TFT-LCD panel (, ) LCD Panel TCP TFT PCB LDI Chassis Backlight Unit 2
(Front Glass Substrate) Bus Electrode Protection Layer(MgO) (Back Glass Substrate) Sustain Electrode Dielectric Layer Visible Light Dielectric Layer Dielectric Layer Barrier Rib Phosphor(R,G,B) Address Electrode Under Layer Protection Layer(MgO) Barrier rib Phosphor (R,G,B) Front Glass Substrate[*] Plasma UV Visible Light Bus Electrode Sustain Electrode Address Electrode Dielectric Layer Back Glass Substrate Under Layer [*] : 90 o 3
Faceplate Transparent Conductor (+500V) Phosphor Dot Spacer Electrons Emitter Holland et al. (1987) Baseplate (non-conductive) Insulator 4
Barium Oxide Sealing canister Cathode N 2 Organic Layer Adhesives Anode(ITO) C HTL S ETL Substrate EML A R G B 5
DISPLAY TFT-Array Photolithography Etching Assembly 6
(Cleaning) 7
Etching( ) 8
α * ADI: after development inspection * ACI: after cleaning inspection *AOI: Automated Optical Inspection 9
Alignment Layer Print Assembly Dispenser (T<1000 ) Roller Roller PI Stage Alignment Layer Print 10
Rubbing (TFT-Array ) Rubbing (CF ) Rubbing Roller 6 O clock N: Rubbing l : Rubbing Depth(mm) R: Roller r.p.m. r: Roller (mm) V: Rable (mm/sec) Stage 11 Rubbing Strength (R.S.) = N l {1 + 2π r (R/60) / V}
Spacer Spray N 2 Gas Solvent Spacer Color Filter Color Filter (a) (b) 12
Seal Print (Screen MASK ) Screen Mask Sealant TFT-Array Seal TFT-Array 13
N2 Chamber V LCD Cell N2 Vacuum Pump V 14
Seal & Cell-gap Control Seal Short Seal Seal Spacer End Seal (uv sealant) 15
Back Light Unit Conventional CCFL TFT-LCD backlight AG/AR coating Lamp TAC: inverter TAC: 16
17
Flat Lamp 18
Anode (ITO) ANODE PLATE Diamond film (Diamond FEAs) Conductive ball Cathode addressing line (ITO, row) Phosphor dot electrons CATHODE PLATE spacer Mo gate line (columns) Mo cathode line (rows) ACF 19
PDP PDP Panel Tip-Off Unit GAS { µ 20
squeeze paste sus screen spueezing velocity clearance attack angle pressure screen 21
22
OLED Treatment(Cleaning) of ITO/Substrate Patterning of Transparent Anode Metals Formation of Emissive Layers(Charge Transport Layers) Deposition of Cathode Metals Patterning of Cathode Metals Encapsulation Connection of Driving circuit with display panel 23
Thin Film Formation Organics : Vacuum deposition 1. In-line Type - Easy to install more chamber - Easy maintenance Loading chamber EV1 EV2 Mask stock chamber Mask change/ alignment chamber EV3 Unload chamber 2. Cluster Type - Easy back and forth process - Parallel process 24
DISPLAY Wet Cleaner Stripper PR Spin Coater PR Coating Dry Etcher SPUTTER PECVD Photo Aligner LCD Glass Cutter Screen Printer PDP Vacuum Sealing PDP, FED ELD In-Line OLED 25
α-step Nanospec. Ellipsometer 4-Point Probe Hall Measurement UV-Spectro photometer AFM XRD,,, 26
,, PL PDP CL CRT, FED, VFD EL OLED Automatic Prober All FPD System DC Test System Open-Short Tester CD SEM Automatic Inspection System LCD Laser Repair LCD EMI DP 27
PDP / FED 2005 65 / 27 : 40% 40~60 HDTV 5~15 $400/ 15% MgO Crack 450 500 C Glass 15 24 Poor Throughput Poor Vacuum Level outgassing MgO 28
FED µ 29
PDP PDP/FED Panel Tip-Off Unit GAS TEMP. { µ ( 24 hours) Too Long Time!! TIME 30
Pressure Ratio Conductance Ratio P 4 /P 2 C 1 /C tot C 1 /C 3 = 9.4 10-3 /3.0 10-6 = 3.1 10 3 This means that, even though P 2 will be 1.0 10-6 torr, P 4 will be at least 3.0 10-3 torr. 20 (508mm) 40 (1,016mm) 35 (903mm) P 2 C 3 C 1 C 2 P 3 P 4 P 1 31
PDP/FED Frit : 350 C No bubble & No crack : 3 Soda-lime Compatible He/Ne/Xe - 10-7 torr 350 C 5 Sealing Gas Fill / Hole-off He/Ne/Xe Differential pumping Flat Disk NEG Differential pumping PDP Tubeless // Local Gas Filling 2 32
a Date : 2000. 4. 19. First for the World b 33
Compariaion of the Sealing Temperature Cycles Temp.( C) Plate Sealing Pumping through Exhausting Tube Conventional FVIS(plate sealing) FVIS(hole seal-off) Plate Sealing on Vac. / Gas-Fill / Hole-Off Gas Fill / Tip-Off Time.(hour) 34