09.249~256(07-087).fm

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1 [ ] w Á wz (J. Kor. Inst. Met. & Mater.) Vol. 46, No.4, pp. 249~256 (2008) 3' p rl w"m v ;O0 Ÿ w p e w 1 Á x 1 Á w 1 Á½k 2 Á½ x 1, * 1 û w œw 2w» Ÿ ù q Effect of oxygen partial pressure on the optical and structural properties of Al doped ZnO thin films prepared by RF magnetron sputtering method Seung Wook Shin 1, Hyeon Soo Park 1, Jong-Ha Moon 1, Tae Won Kim 2, and Jin Hyeok Kim 1 1 Department of Materials Science and Engineering, Chonnam National University, Gwangju , South Korea 2 Nanoelectronic Team, Gwangju Research Center Korea Institute of Industrial Technology Abstract : 0.5 wt% Al doped ZnO thin films (AZO) were prepared on glass substrates using RF magnetron sputtering method. Thin films were grown at substrate temperature of 250 o C, RF power of 75W, working pressure of 10 mtorr, by changing the O 2 /Ar pressure ratio from 0% to 16.7%. The effects of oxygen partial pressure during the deposition process on structural and optical properties of the films were investigated using XRD, SEM, AFM, EPMA and UV-visible spectroscopy. All the AZO thin films were grown as hexagonal wurtzite phase with the c-axis preferred out-of-plane orientation. The surface roughness and grain size of AZO films decreased with increasing oxygen ratio from 10.6 nm to 3.2 nm and 94.9 nm to 30.9 nm, respectively. On the other hand, the transmittance and band gap energy of the AZO films increased from 84.7% to 92.6% and 3.24 ev to 3.28 ev, respectively with increasing the O 2 /Ar pressure ratio. (ReceivedG October, 2007) Keywords : AZO, thin film, Oxygen ratio, Transparent conducting oxide (TCO), sputtering 1. n y (transparent conducting oxide) w» p ƒ Ÿ w Ÿ n, k d (window layer), ƒ sq v (flat panel display), w š [1]. n 1907 CdOƒ z ƒ, SnO 2 In 2 O 3 ƒ. ITO (indium tin oxide) SnO 2 Cn v k n y w û» w ùkü, 3.5 ev ˆ š, ƒ Ÿ n [2]. p wš, ITO ITO w In Sn ƒƒ šƒ, ITO w n y šƒ. ww *Corresponding author : Jin Hyeok Kim [Tel: , jinhyeok@chonnam.ac.kr] ƒƒ ƒ n y ƒ š, t ZnO [3]. ZnO ITO w e ƒ w, š, ITO w, t w ƒƒ wš, v w w ƒ š. w ZnO ITO w v v n» q k d (window layer) w, p w [4]. p, ZnO 3 B, Al, Ga v k w k, ˆ w. [5] w ZnO CVD (chemical vapor deposition) [6], sol-gel [7], MBE (molecular beam epitaxy) [8], PLD (pulsed laser deposition) [9]. ù t RF p rl. w RF p rl rl v,»q,, rl q, š ƒ -249-

2 250 Á x Á wá½k Á½ x œ y g j»,, w y k p w. AZO (Al v ZnO) w w w, v,»q,, r l q w, š w. w š w w r, Tsuji Hirohashi 0%~3%¾ ƒ g Al 3wt% v AZO w z 400 o C, œ» 4 w. AZO z w, ƒ ƒ w w ƒ w š, ƒ 0% Ω cm.. w, c- w ww š, z w, AZO j»ƒ 100~150 nm w [10]. Chang 8~15%¾ ƒ g Al 2wt% v AZO w, p ƒ 12% ƒ c- w š, rl q ƒ 100 W ƒ û p šw. [11] Yim Lee 0~100%¾ ƒ j, Al 3wt% v AZO w, ƒ 50% ƒ û t e» RMS (17.5 nm) FWHM (0.32 ) o š, ƒ ƒ w w Ω cm. 1.2 Ω cm¾ ƒw. šw. w Ÿw p ƒ 50% ƒ n šw [12]. w» š š y AZO Al 2~3 wt% v jš, y g AZO w z,» p. w, Al v ƒ û (1 wt% w) w š AZO, t, Ÿw p w ƒ š ƒ. AZO Al v ƒ û, ü ƒ, j»ù e» n w. RF p rl w Al 0.5 wt% v AZO k w, š y AZO n, t, Ÿw p y w. 2. x RF p rl w»q (Microscope Slide, made in Germany, 1.25 mm 1.25 mm) AZO g.»q t» w» w m, k, v v g, ƒƒ 3 q» w w z ƒ w g. AZO k Al 2 O 3 (99.99%, 0.25 g), ZnO (99.99%, g) yww 24 w z g ƒ x z 900 C 3 w o w. rl ü AZO k»q š k z» œ mtorr¾ z -6»q 250 C o w. ƒ š ƒ w š, š ƒ 40 sccm š jš ƒ 0, 2, 4, 6, 8 sccm y g, ü ƒ 0, 4.8, 9, 13, 16.7%ƒ w. œ 10 mtorr, rl q 75 W š g. j», AZO k t w» w pre-sputtering 5 wš 20 w. AZO w X- z» (X-ray diffractometer : X' pert PRO, Philips, Eindhoven, Netherlands) w w š, Ì t x x (Field Emission Scanning Electron Microscopy, FE-SEM : Model, JSM-6701F) w w, EPMA (Electron Probe Micro Analyzer, EPMA- 1600, SHIMADZU, Japan) w AZO Al v w. AFM (atomic force microscopy, Digital Instrument, nanoscope III) w AZO t e» w š, n ˆ y, UV-VIS spectroscopy (Cary 100, Varian, Mulgrave, Australia) w 300~800 nm q n rp w w. 3. š 3.1 y c- y 1 œ 10 mtorr,»q 250 o C, rl q 75 W, AZO

3 w Á wz 46«4y ( ) 251 Fig. 1. XRD θ-2θ scans of the AZO thin films grown by RF magnetron sputtering method changing O 2 /Ar pressure ratio ranging from 0% to oxygen 16.7% XRD z ql. AZO (0002) vj (2θ = 34.38, 2002 JCPS-international Center for Diffraction Data) ùkû, XRD z vj ƒ 0% 9%¾ ƒw ƒ ƒ 13% w. AZO c- w w š, c- w y y. rl ZnO c- w w. ZnO p, ZnO w (0001) ƒ û t», rl AZO c- w w [13]. Park Kang rl 0%~20%¾ ƒ k, c- (0002) ww šw š [14], Sayago Aleixandre ƒ 7.5%~15% [15]. Yoon Choi ƒ 0%~100% c- w w, rl w re-sputteringz š w [13]. w, Meng Santos ƒ 9.7%~ 45% c- w w w w, rl ƒ ƒw AZO œœ ƒ AZO (residual compressive stress)ƒ ƒw» š w [16]. k, rl ƒ ƒw AZO c- w y w w. ZnO yw p ü œœ w. rl ƒ ƒw ƒ ZnO ü œœ š, ZnO yw š ZnO ü w š, c- w w. w ƒ ü w rl v ü yƒ w ƒw. rl ƒ ƒ w rl w wš, r l. š rl AZO ƒ w, c- k. w x re-sputteringx w [13]. x rl ƒ ƒ AZO œœ ƒ, yw, c- w ƒw. ƒ rl ü y y ƒ ƒw rl r l j (re-sputteringx ), ƒ wš AZO ww c- w w. 2 œ 10 mtorr,»q 250 o C, rl Fig. 2. (a) 2θ value and (b) the inter-planar distance of (0002) planes of the AZO thin films grown by RF magnetron sputtering method changing O 2 /Ar pressure ratio ranging from 0% to oxygen 16.7%.

4 252 신승욱 박현수 문종하 김태원 김진혁 링 파워 75 W일 때, 산소 분압비에 따른 AZO (0002)피 크의 2θ값 (a)과 AZO박막의 c-axis방향의 면간 거리 값 (b)의 변화를 보여 주는 그래프이다. AZO (0002) 피크의 2θ값은 아르곤 가스가 100%일 때와 비교하여 챔버 내에 미량의 산소가 유입되어 산소 분압비가 4.8%가 되었을 때, 2θ값이 에서 로 감소하였으며, 면간 거리 값 이 nm에서 nm로 증가하였다. AZO 박막 에서 2θ 값의 변화는 브래그 법칙 (2dsin θ = nλ)에 의해 AZO 박막의 c-axis 방향 (0002)의 면간 거리의 변화와 관 련이 있으며, 일정한 조건에서 회절이 발생된다고 하면 면 간 거리와 2θ는 서로 반비례 관계이다. 따라서, 스퍼터 과 정에서 산소가 들어가면 산소가 들어가지 않는 경우 보다 AZO 박막 내에 산소 공공이 산소로 채워지게 되고 산소가 산소 공공을 채우면 산소 공공이 있던 자리에 빈 공간을 채우려는 압축응력이 작용하던 것이 없어서 면간 거리가 증가하게 된다 [16]. 한편, 산소 분압비가 4.8% 이상으로 계속 증가 할수록 2θ값이 에서 로 증가 하였으며, 면간 거리는 nm에서 nm로 감소 하였다. AZO 박막 내 에 산소 공공 자리를 산소가 계속 채워가면서, AZO 박막 의 구성원소 사이에서 각 원소의 자리를 유지하려는 인력 이 작용하게 된다. AZO 박막 구성 원자간에 인력이 작용 하게 되면, 면간 거리는 산소가 미 소량 있을 때 보다 상 대적으로 증가하게 되고, 브래그 법칙의 2θ와 면간 거리의 관계에 의해서 2θ 값은 감소 하게 된다. 3.2 산소 분압비 변화에 따른 AZO박막 표면 변화 그림 3은 공정 압력 10 mtorr, 기판 온도 250 C, 스퍼터 링 파워 75 W일 때, 산소 분압비에 따른 AZO 박막의 단 면 SEM 이미지 (a~e)와 AZO박막의 두께 변화 (f)를 보 여주는 그래프다. 산소 분압비가 증가 함에 AZO 박막의 두께가 866 nm에서 555 nm로 감소 한 것을 잘 보여준다. 이러한 결과는 선행 연구 결과와 잘 일치 한다 [13,14]. 스퍼터링 과정에서 산소 분압비가 증가 할수록 AZO 박 막의 두께가 감소하는 이유는 반응가스의 질량을 고려할 때, 아르곤 ( g/mol) 이 산소 (15.99 g/mol) 보다 몰 o SEM images (a~e) and the graph showing the change in the thickness of the AZO thin films grown by RF magnetron sputtering method changing O2/Ar pressure ratio ranging from 0% (a) to oxygen 16.7% (e). Fig. 3.

5 대한금속 재료학회지 제46권 제4호 (2008년 4월) 당 질량이 크기 때문이다. 스퍼터 챔버 내의 반응 가스가 RF 건 (gun)에 의해 플라즈마가 만들어지면, 플라즈마 내 에 이온화된 반응가스는 AZO 타겟과 반응하여 스퍼터 입 자를 생성하고, 이 때 스퍼터 입자가 생성되는 양을 스퍼 터링율 (sputtering yield)이라 한다. 스퍼터 입자가 생성되 는 구동력은 플라즈마 내에 이온화된 반응가스의 운동에너 지이고, 그 반응 가스의 운동 에너지는 (1/2)mv 이며, 아르 곤 가스가 산소 가스보다 질량이 크므로 챔버 내에 아르곤 가스만으로 스퍼터링 입자가 생성될 때 보다 상대적으로 챔버 내에 산소 분압비가 증가하면 스퍼터링율이 감소하게 된다. 그리고 스퍼터 입자는 플라즈마 내부를 통과하여 기 판에 증착 되고, 이 때 증착되는 스퍼터 입자의 운동에너 지는 증착율과 비례한다. 즉, 스퍼터 입자의 운동 에너지는 챔버 내에 반응 가스의 질량에 비례하며, 스퍼터링 과정에 서 산소 분압비가 증가하면, 스퍼터링율과 스퍼터 입자의 운동에너지가 반응가스의 질량 차이에 의해 감소 하게 되 고, 그림 3. (a)~(e)sem 이미지에서 관찰 할 수 있듯이 AZO 박막의 두께가 감소한다 [18, 19]. 그림 4는 공정 압력 10 mtorr, 기판 온도 250 C, 스퍼터 링 파워 75 W일 때, 산소 분압비 변화에 따라 제조된 2 o 253 박막들의 표면을 관찰한 AFM 이미지 (a~e)와 표면 거칠기 RMS값 및 결정 입자 크기 (f)를 도식적으로 표현 한 것이다. AFM 이미지 (a~e)에서는 산소 분압비가 증가 함에 따라 AZO 박막의 표면의 거칠기가 10.6 nm에서 3.2 nm로 감소 하였고, 결정 입자 크기 역시 94.9 nm에서 30.9 nm로 감소한 것을 관찰 된다. 이는 기존에 보고된 선 행 연구 결과와 잘 일치하는 것이다 [20,21,22]. 이런 결과는 앞에서 언급 했던 것과 같이 산소와 아르곤 가스의 질량 차이 때문에 스퍼터링 과정에서 산소가 유입 되면 아르곤 100% 있을 경우 보다 스퍼터링율 (sputtering yelid)과 스퍼터 입자의 운동 에너지가 감소한다. 스퍼터링 과정에서 산소가 유입된 경우 적은 운동 에너지를 갖는 스 퍼터링 입자가 기판에 증착 될 때 더 작은 속도로 증착 하 므로, 상대적으로 높은 운동에너지로 가지고 많은 스퍼터 입자가 증착 되는 경우 보다 더 평탄한 박막으로 성장 하 게 된다 [18]. 이런 이유로 산소 분압비가 증가 할수록 AZO 박막의 표면의 거칠기 정도 (RMS)는 감소하게 된다. 결정 입자 크기 역시 RMS값과 비슷한 결과를 나타났다. 앞에서 언급 했던 것과 같이 스퍼터링 과정에서 산소 분 압비가 증가함에 따라 플라즈마 내에 이온화가 되지 않은 AZO AFM images (a~e) and the graph (f) showing the change in grain size ( ) and surface roughness ( ) of the AZO thin films grown by RF magnetron sputtering method changing O2/Ar pressure ratio ranging from 0% (a) to oxygen 16.7% (e). Fig. 4.

6 254 Á x Á wá½k Á½ x ƒ w, rl š rl jš AZO w ww j»ƒ [13]. 3.3 y AZO Ÿw p y 5 (a) œ 10 mtorr,»q 250 o C, rl q 75 W š» k ZnO y k AZO UV-VIS rp n v. ZnO w Al 0.5 wt% v, q nm nm w, ƒ 16.7% nm w. B-M effect w. B-M effect q ˆ š ùk ü z q w, ˆ ƒw, ƒwš Blue shift w. q ƒw, ˆ w wš, Red shift w. (α) (1). I=I 0 e- αt (1)» I n» š, I 0 n z», α š t Ì. n (T) I/I 0, 5(a)ƒ n ùkü Fig. 5. UV-visible transmission spectra (a) and plot of (αhν) 2 vs photon energy (b) and band gap energy (c) and the average transmission value (d) in the wavelength range between 470 nm and 550 nm of the AZO thin films grown by RF magnetron sputtering method changing O 2 /Ar pressure ratio ranging from 0% to oxygen 16.7%

7 w Á wz 46«4y ( ) 255. ˆ (2). α =(hν E g ) 1/ 2 (2)» h v j, ν Ÿ [23]. 5 (b) (c) œ 10 mtorr,»q 250 o C, rl q 75 W AZO (αhv) 2 vs Ÿ (photon energy) (b) v ˆ y (c) v. ZnO w Al 0.5 wt% v ˆ ƒ 3.18 ev 3.24 ev ƒ w. ƒ ƒ w ˆ ƒ ƒ w, 16.7% 3.28 ev ùkþ. ZnO Al v w ˆ ƒ ƒw Al v w. ZnO y w j n-type, Zn : O ƒ 1:1-x ZnO ü œœ w. ZnO ƒƒ 3 B,Al,Ga,In v j 2+ Zn v ƒƒ 3 ey. ZnO 2+ Zn ey ƒƒ 3 v (Al ) œœ 3+ w. ZnO ƒ ƒw, B-M effect w ˆ (3) w ƒw. E g = h 2 n 2/3 /(8m e *π 2/3 ) (3)» E g ˆ, m e s³ š, n [23]. w, ZnO ƒ 3 Al v j Zn 2+ Al 3+ ey ƒ š, ƒ ƒwš, (3) w ˆ ƒw. 5(a) y 5(c) ˆ y e w. ƒ ƒ w ˆ ƒ ƒw w B-M effect e w. Al v EPMA w w ƒ 0% AZO ü Al 0.4wt% v y w. 5 (d) œ 10 mtorr,»q 250 o C, rl q 75 W AZO n q 470 nm l 550 nm s³ n ùkü v. ZnO w Al 0.5 wt% v n 85.4% 84.7% w. w ZnO Al v w ƒ s³ n w ƒ. rl ƒ ƒ w, n 84.7% 93.63% ƒ w š, ƒ 90% n ùkü. ƒ 13% ƒ n (93.63%) ùkü [22]. w rl ƒ ƒ AZO Ì RMS w. AZO n w Ìù t e» ƒ w, AZO n ù n ƒw. w AZO c- w, w w n ƒw wt% Al v ZnO RF p r l w ü 0, 2, 4, 6, 8 sccm (0, 4.8 9, 13, 16.7%) y j w z,, t, Ÿw p w. AZO c- w w. rl ƒ ƒ w AZO Ì (866 nm~555 nm), t e» RMS (10.6 nm~3.2 nm), j» (94.9 nm ~30.9 nm)ƒ w š, ƒ ƒ w n (84.7% ~92.6%) ˆ (3.24 ev~3.28 ev) ƒ w. û w w w. REFERENCES 1. J. Springer, B. Rech, W. Reetz, J. Muller, M. Vanecek, Solar Energy Materials and Solar Cells 85,1 (2005). 2. K. L. Chopra, S. Major, D. K. Pandya, Thin Solid Films 102, 1 (1983). 3. Z. C. Jin, I. Hamberg, C. G. Granqvist, Journal of Applied Physics 64, 5117 (1988). 4. D. H. Zhang, T. L. Yang, J. Ma, Q. P. Wang, R. W. Gao, H. L. Ma, Applied Surface Science 158,43 (2000).

8 256 Á x Á wá½k Á½ x 5. C. Agashe, O. Kluth, J. Hupkes, U. Zastrow, B. Rech, M. Wuttig, Journal of Applied Physics 95,1911 (2004). 6. T. Shiosaki, S. Ohnishi, A. Kawabata, Journal of Applied Physics 50, 3113 (1979). 7. K. F. Cai, E. Muller, C. Drasar, A. Mrotzek, Materials Science and Engineering B 104, 45 (2003). 8. T. Ohgaki, Y. Kawamura, T. Kuroda, N. Ohashi, Y. Adachi, T. Tsurumi, F. Minami, H. Haneda, Electroceramics in Japan Vi 248, 91 (2003). 9. K. Matsubara, P. Fons, K. Iwata, A. Yamada, S. Niki, Thin Solid Films, (2002). 10. T. Tsuji, M. Hirohashi, Applied Surface Science 157,47 (2000). 11. J. F. Chang, C.C. Shen, M.H. Hon, Ceramics International 29, 245 (2003). 12. K. Yim, Korean journal of Materials Research 15, 518 (2005). 13. K. H. Yoon, J.W. Choi, D.H. Lee, Thin Solid Films 302, 116 (1997). 14. M. K. Kang, and D. H. Kim, Korean journal of Materials Research 16, 449 (2006). 15. I. Sayago, M. Aleixandre, L. Ares, M. J. Fernandez, J.P. Santos, J. Gutierrez, M.C. Horrillo, Applied Surface Science 245, 273 (2005). 16. M. P. d. S. Li-Jian, Vacuum 46, 1001 (1995). 17. T. K. Subramanyam, B.S. Naidu, S. Uthanna, Physica Status Solidi a-applied Research 173, 425 (1999). 18. S. H. B. Amrani, Catatysis Today 89, 331 (2004). 19. D. U. Lee, and S. Nam, J. Kor. Institute of Electrical and Electronic Material Engineers 13, 617 (2000). 20. J. Bin Lee, S. H. Kwak, H. J. Kim, Thin Solid Films 423, 262 (2003). 21. I. Sayago, M. Aleixandre, A. Martinez, M. Fernandez, J.P. Santos, J. Gutierrez, I. Gracia, M.C. Horrillo, Synthetic Metal 148, 37 (2005). 22. K. Yim, C. Lee, Crystal Research and Technology 41, 1198 (2006). 23. K.H. Kim, K.C. Park, D.Y. Ma, Journal of Applied Physics 81,7764 (1997).

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