디스플레이제조장비및시장동향 한국정보디스플레이학회장비연구회 권상직 경원대학교전자 전기정보공학부교수
Display Class DISPLAY 소개 Electronic Information Displays CRT Flat Panel Display Projection Emissive Display Non Emissive Display Cathode Ray Tube Light Valve FED VFD PDP OLED ELD LED LCD ECD DMD DC Type AC Type Hybrid Type
LCD PDP 시장전략 Diagonal Size 3 5 10 20 30 40 50 100 TFT-LCD M/S 99% 12,112 LCD 공략방향 PDP 공략방향 Revenue(M$) STN-LCD M/S 94% 2,234 TFT-LCD M/S 68% 1,174 TFT-LCD M/S 98% 7,168 Cellular phone CNS Note PC Monitor» SRI 조사 Application PDP M/S 97% 4,218 TFT-LCD M/S 84% 1,382 TV Projection
디스플레이세계시장전망 (Unit: 억 $) 1,200.0 1,000.0 800.0 평판디스플레이 CRT 600.0 400.0 200.0 0.0 2003 2003 2004 2004 2005 2005 2006 2006 2007 2007 2008 2008 2009 2009 2010 2010 CRT 195.8 175.8 155.2 140.2 129.1 121.4 114.6 97.3 FPD 413.5 584.8 645.1 727.0 809.3 876.6 927.9 956.5 계 609.3 760.5 800.3 867.2 938.4 998.0 1,042.5 1,053.7 Source: 디스플레이뱅크 05
FPD 용도별시장전망 1,200.0 1,000.0 800.0 600.0 기타 DSC 핸드폰용산업용모니터 TV 용노트북용모니터용 (Unit: 억 $) 400.0 200.0 0.0 2003 2004 2005 2006 2007 2008 2009 2010 2003 2004 2005 2006 2007 2008 2009 2010 CAGR 모니터용 131.8 191.0 205.6 192.2 192.0 179.4 175.6 163.3 3.1% 노트북용 73.8 97.5 75.7 70.5 72.0 76.5 74.3 70.3-0.7% TV 용 54.0 102.9 152.0 249.8 315.9 359.6 393.5 419.1 34.0% 산업용모니터 5.7 8.8 9.3 9.2 9.0 9.5 9.8 10.0 8.3% 핸드폰용 108.1 134.0 143.0 140.1 146.7 164.3 178.4 187.4 8.2% DSC 8.9 12.1 14.4 15.2 16.7 18.6 19.6 20.2 12.4% 기타 31.1 38.4 45.1 49.9 57.1 68.7 76.7 86.2 15.7% 계 413.5 584.8 645.1 726.9 809.3 876.6 927.9 956.5 12.7% 기타 : 10.4 이상사이즈의어플리케이션 ( 대형기타 ) 과 VFD,EL등의소형어플리케이션을말함. Source: 디스플레이뱅크 05
TV 세계시장전망 LCD 는 35 인치이하의중소형, PDP 는 42 인치이상의대형 TV 시장을선도할것으로예측됨 (Unit : Million set) PDP LCD PTV Total TV Market 174.6 5.9 (3%) 28% 72% 180.8 9.4 (5%) 37% 1% 62% 185.1 14.2 (7%) 50% 4% 46% 198.7 18.6 (9%) 56% 6% 38% 207.1 22.6 (11%) 58% 11% 31% 211.4 27.8 (13%) 56% 18% 26% 03 04 05 06 07 08 Source: LG Analysis based on Each Research Data ( 04, 1Q~ 2Q) 7/29 Kyungwon Univ.
TFT-LCD Panel 구조 TFT-LCD 컬러 TFT-LCD panel 구조 ( 직시형, 투과형 ) LCD Panel 회로부품 TCP TFT 편광판 PCB LDI Chassis Backlight Unit
Cell 구조및기본원리 Black Matrix Common Electrode C/F Substrate Color Filter Glass Passivation Liquid Crystal a-si:h Polyimide Film Spacer Insulator Drain Gate Source Pixel Electrode Stg. Cap. TFT Substrate V=0 V=±V off
Cell 제조공정순서 C/F Input Cleaning PI printing Rubbing Seal print + + Spacer coating TFT Input Align and solidification Module Fab. Inspection Seal LC injection Cutting
TFT-Array 제조공정기술 Process Flow for TFT-Array Glass Sub. Gate Elec. Active (Insulator & a-si) Data Elec. Pass. & Via Pixel Elec. Patterning Patterning Patterning Patterning Patterning (Deposition & Patterning Process in Detail) (Depo n) (Cleaning) (PR Coating) (Exposure) (Develop) (Etch) (PR Strip) (Insp.) PECVD R F (Wet Etch) H H H Si H H N H H H Si Si Si N N N H H 대체공정개발 DC SPUTTER Ar+ Al Al Al Al Al Al Ar+ (Dry Etch) PLASMA F O Si Gas RF Si TARGET SUBSTRATE SiF 4
박막공정기술 Sputtering Cr, Al, Ta, W, Mo ITO (Reactive Sputtering) Ar Ion + Surface Implanted Ion Reflected Ion + Target Material - Secondary Electrons Sputtered Atoms Sputtering Target Ar+ Plasma Ar+ Plasma RF-Power 13.56MHz 기판 Heater 기판 Vacuum Chamber Kyungwon Univ.
반응 Gas PECVD (Plasma Enhanced Chemical Vapor Deposition) RF-Power 13.56MHz Plasma (SiH4, N2O, H2, Ar) Gas In SiH* SiH2* Ar+ H+ NO* SiOx e- a-si : SiH 4 + H 2 n+ a-si : SiH 4 + H 2 + PH 3 SiN x : SiH 4 + NH 3 + H 2 SiO x : SiH 4 + N 2 O 공정 Parameters RF power 기판온도, Chamber 압력 반응 gas 유량과혼합비 전극과기판간의거리 Gas Out TFT-Array 기판 Kyungwon Univ.
Photolithography 공정기술 Photolithography ( 사진공정 ) Pre-Bake Spin Coating Soft-Bake Align & Exposure Develop Hard-Bake 도포 노광 현상 Glass 기판 u.v. Glass 기판 Cr Pattern PR 박막 MASK PR 박막 PR Inspection Glass 기판 박막 Kyungwon Univ.
Color Filter 제조기술 Color Filter 구조 TFT-Array 기판 Color-Filter 기판 ~0.1mm R G B R G R G B R G R G B ~0.3mm R G B R G Sub-Pixel 단위화소 (Dot) 2 Red 5 평탄화막 (Over Coat) 6 공통전극 (ITO) 3 Green 4 Blue Glass 기판 1 BM(Black Matrix) Kyungwon Univ.
MASK (Stripe Pattern) u.v. Cr: 1500A CrO x : 500A BM 노광 Negative Color PR(Green) CF Glass 기판 Destructive interference Red Green 현상 & Bake u.v. MASK (Stripe Pattern) 노광 Negative Color PR(Red) MASK (Stripe Pattern) u.v. Negative Color PR(Blue) 노광 Red 현상 & Bake BM Red Green 현상 & Bake Blue
LC Assembly 공정기술 Printing 에의한 LC Alignment Layer 형성공정 Dispenser 배향막 (T<1000A ) 기판 Roller Roller 회전방향 PI 수지판 Stage 이동
Rubbing 에의한 LC Alignment 형성 Rubbing 방향 (TFT-Array 기판 ) Rubbing 방향 (CF 기판 ) Roller 회전방향 6 O clock 최적시야각 N: Rubbing 횟수 l : Rubbing Depth(mm) R: Roller r.p.m. r: Roller 반경 (mm) V: Rable 이동속도 (mm/sec) 배향막 기판 이동
Spacer 형성기술 습식법 건식법 N 2 Gas Solvent Spacer Color Filter 기판 Color Filter 기판
Seal Print 형성기술 Screen Print 법 Dispense 법 Screen Mask Sealant Sealant Dispenser TFT-Array 기판 배향막 Seal 배향막 Seal TFT-Array 기판 TFT-Array 기판 액정주입구
Align and Hot Press Hot Press (~180 ) 상하판 Align 열압착 : Sealant Curing Cell Gap Control: Spacer C/F 기판 Seal Short Spacer TFT-Array 기판
LC Injection 진공 Chamber V LCD 패널 진공 Pump Seal V 액정 주입구 N2 진공 Chamber V LCD Cell N2 Vacuum Pump V 액정 Kyungwon Univ.
New LC assembly techniques Vacuum LC drops CF plate Patterned spacers Photolithographic spacers - improved cell gap control Drop filling - much faster, better utilization of LC Plate-to-plate alignment and assembly in vacuum TFT plate Printed seal
PDP 구조및기본원리 Structure (Front Glass Substrate) PDP (Back Glass Substrate) Bus Electrode Protection Layer(MgO) Sustain Electrode Dielectric Layer Barrier Rib Dielectric Layer Phosphor(R,G,B) Under Layer Address Electrode AC Operation Visible Light Dielectric Layer Protection Layer(MgO) Barrier rib Phosphor (R,G,B) Front Glass Substrate[*] Plasma UV Visible Light Bus Electrode Sustain Electrode Address Electrode Dielectric Layer Back Glass Substrate Under Layer
Panel 제조공정순서 General PDP Process Glass ID Mark Cleaning ITO DFR Expose Develop Etching Strip Bus Elect. Print Dry Expose Print Dry Front Plate Inspection Insulator O/S Print P. Dry Review Fire Repair DFR Fire MgO Layer Cutting Laser MgO Exhaust/Seal Attach/Exh. Aging Attach Aging Sealing 1st. Exh./Gas Expose Develop Fire Glass ID Mark Cleaning Address Elect. Print Dry Expose Develop Fire Inspection O/S P. Repair Rear Plate Barrier Rib Dry Clean Lami Expose Develop Protective Layer Etch Inspection Rib Review Repair Phosphor Print (R) Dry (R) Print (G) Dry (G) Print (B) Dry (B) Fire P. 검사 Seal Seal Disp. Dry Pre-baking Cutting Laser
투명전극형성공정 Kyungwon Univ.
보조전극형성공정 Kyungwon Univ.
유전체 -MgO 형성공정 유전체 MgO Ion-Plating Sputtering E-Beam
Barrier-Rib 형성공정 Screen Screen Printing Printing Sandblasting Sandblasting Method Method Method Etch Etch Method Photolithography Photolithography Method Method Glass Paste Glass Paste Etching Glass Paste Photosensitive Glass Paste Screen Printing Resist Resist Exposure Sandblast etching Develop Repetition (10-15 회 ) Strip Stripping of Resist Firing
형광체형성공정 막형성방법 Pattern 인쇄법 주재료 R, G, B 형광체 Paste 사용재료 부재료 - 감광성 Paste 법 Dry Film 법 R, G, B 감광성 Ag Paste R, G, B 형광체 Green Sheet 현상액 현상액
Seal/Exhaust/Gas Fill 공정 Process Flow 일체형설비개략도
Aging 및 Assembly 공정 Panel Aging Sustain(Z) Scan(Y) + + + + + + - - - - - - Address(X) Assembly COF 압착 Panel PCB + 방열판 Module Aging 검사
FPD Process Innovation Trend Kyungwon Univ. Multi-cell process for Mass Production Lead Time Reduction for Cost Reduction Mask-less Process for Large Screen Size High Resolution Process for Full HD
액정배향막형성방법 IB&DLC Alignment Method Conventional Rubbing Method rubbing roll Kaufman Ion gun shutter substrate Polyimide Gas inlet glass 러빙법의문제점해결 ( 먼지, 정전기등 ) 대형 glass 에적용가능, 생산비용절감 멀티도메인가능 Pumping out Laser 를이용한 AM 의 Poly 화 Laser Beam Silicon Substrate
상압플라즈마장비응용 Cleaning Ashing Etching Gas Flow (N 2 +Air) Cooling Jacket H.V Electrode N O2 + + - N2 - O2 - O N O N2 + N2 Ceramic Electrode N2 N O2 N2 O2 O O2 Increasing of C-O Effective Cleaning by High O N O C O O N O Bond O Density & Various Radicals C C C C H C C C H H C O C C C C C C Substrate C C C C C C
ITO Direct Patterning using Laser Beam Photo Lithography ITO Laser Patterning PR Coating Exposure Develop Etching Strip Glass PR ITO PR PR PR ITO ITO ITO Glass Glass Glass Glass ITO Electrode Patterning using Nano Silver Ink-jetting Mask-less Lead Time Nozzle Ink Drop Full HD Mask-less
Phosphor Dispensing using Fine Nozzle R Dispensing G Dispensing B Dispensing for Large Size Lead Time Vacuum Sealing Process MgO- 실장일체형 Hole Mounting a glass tube after sealing Sealing in the air PDP Panel Tip-Off Unit GAS Front Glass MgO 성막 Rear Glass Firing 배기 Gas 주입 Tip-off TMP Alignment Lead Time High Performance Kyungwon Univ.
디스플레이산업규모 FPD 장비시장현황 반도체 LCD 의세계전체시장은 2,680 억불규모 한국은 14.1% 비중점유 217 억불 반도체 9.8% 2,200 억불 LCD 160 억불 42% 480 억불 04 년국내총수출중반도체 LCD 는 15.6% 비중 반도체 265 억불 10.4% LCD 132 억불 총수출 2,538 억불 5.2%
세계시장동향 반도체 LCD 세계시장은매년두자리수로빠르게성장중 ( 단위 : 억불 ) 반도체전체 비메모리 메모리 LCD 2003 1,664 1,339 325 340 2004 2,129 1,656 473 492 2005 2,095 1,653 443 522 장비는노광, 박막증착, 식각장비중심으로빠르게성장 반도체장비시장은 LCD 에비해 3 4 배수준 ( 단위 : 억불 ) 01 02 03 04 05 비중 ( 04) 반도체장비 245.9 195.0 221.9 353.1 334.9 Stepper 18.6%, CVD 17.6% Dry Etch 16.4% LCD 장비 20.3 28.6 61.6 110.7 82.3 Stepper 24.8%, Dry Etch 14.5% Clean 8.8%
국가별디스플레이장비시장비중 한국및대만이최대디스플레이장비시장으로부상 일본은설비투자위축으로급격히감소 01 02 03 04 05 한국 15.2 33.5 45.8 46.3 50.4 대만 31.7 33.5 36.1 40.3 37.5 일본 53.0 18.3 18.1 8.5 5.4 기타 - 14.7 0.1 7.2 6.7 자료 : 삼성전자 ( 단위 : %)
국내시장동향 디스플레이장비 04 년국내디스플레이장비시장규모는약 50 억불수준 이중국내장비업체가약 10 억불규모를공급 국내시장점유율 : 약 25% 구분 전체 2003 2004 2005 ( 단위 : 억원, %) 국내업체국내업체국내업체전체전체공급규모공급규모공급규모 시장규모 33,360 5,004 52,800 13,300 45,720 13,716 국산화율 (%) - 15-25 - 30 자료 : KODEMIA (2004. 12)
중소기업기술개발의현주소 국내중소기업의기술개발수준 (LCD) 기술격차 Litho 10년 외자선진사 국내협력사 Lens 설계 / 제작, 광원기술등핵심기술미확보상태 Etch, CVD Sputter 3 년 5 년 대규모투자에따른개발비부담이큼, 공동개발을통한기술격차줄여나가고있음 검사설비 세정 / 자동화 동등 동등 국산화완료부분으로외자대비동등수준이며일부는우수함
주요업체 일본 TEL 한국 ADP (dry etcher) 미국 AKT 한국주성 Eng. (PECVD) 미국 AMAT 한국 KDNS, 케이씨텍 업체별 04 매출실적 국내업체는외국업체에비하여 1/50 의영세한수준 93,000 ( 단위 : 억불 ) 54,000 1,600 1,600 2,000 AMAT( 미 ) TEL( 일 ) 주성 Eng. 케이씨텍 KDNS < 외국업체 > < 국내업체 > Kyungwon Univ.
결론 Kyungwon Univ. 주요전공정장비의실용화로디스플레이경쟁력강화 Photo, Etching, Deposition etc. LCD, PDP 의생산성향상, 효율증대를위한신개념공정장비의개발필요 Mask-less, Ink-jet, Direct patterning, etc. 장비산업의성장잠재력확충 수요기업의국산장비활용확대 장비산업발전인프라구축 산 학 관 간의장비개발집적화센터를통한중 장기적연구역량강화