THE JOURNAL OF KOREAN INSTITUTE OF ELECTROMAGNETIC ENGINEERING AND SCIENCE. vol. 29, no. 6, Jun , [6]. E- [9],[10]. E- 3D EM(electromagnetic),,

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1 THE JOURNAL OF KOREAN INSTITUTE OF ELECTROMAGNETIC ENGINEERING AND SCIENCE Jun.; 29(6), ISSN (Print) ISSN X (Online) E- E-Band Bond-Wire Modeling and Matching Network Design 김기목 강현욱 이우석 최두헌 양영구 Kimok Kim Hyunuk Kang Wooseok Lee Doohun Choi* Youngoo Yang 요약 E-,. 3D EM,. WR GHz LNA. 4.5 db, 3.12 db, P 1dB 2.2 db ±1.07 db. Abstract In this paper, we present E-band bond-wire modeling and a matching network to compensate for the effect of the bond-wire. The impedance of the bond-wires is extracted using three-dimensional electromagnetic simulation. The matching network was designed using a simple structure. The implemented matching network was verified with a commercial GHz LNA IC and an interconnection based on the WR-12 waveguide. The matching network increases the transmission coefficient of the system by up to 4.5 db, power gain by up to 3.12 db, P 1dB by up to 2.2 db, and improves the gain flatness by ±1.07 db. Key words: E-Band, Bondwire, Matching Network, Millimeter Wave System. 서론 77 GHz 5 backhaul E- [1] [5]. E- RF bare die PCB(printed circuit board),. [6].. E-. R-L-C [7],[8]. E ( )(No. C ). (School of Information and Communication Engineering, Sungkyunkwan University) *( ) (iu Plus Co., Ltd.) Manuscript received November 30, 2017 ; Revised January 3, 2018 ; Accepted May 23, (ID No S) Corresponding Author: Youngoo Yang ( yang09@skku.edu) c Copyright The Korean Institute of Electromagnetic Engineering and Science. All Rights Reserved. 401

2 THE JOURNAL OF KOREAN INSTITUTE OF ELECTROMAGNETIC ENGINEERING AND SCIENCE. vol. 29, no. 6, Jun , [6]. E- [9],[10]. E- 3D EM(electromagnetic),,., LNA(low noise amplifier) WR-12.. 본드와이어모델링 1 Ansys HFSS(High Frequency Structure Simulator) 3D EM. RF signal, via,.,. 1 mil 2, V [11]. RF 100 μm, 200 μm, 60 μm. 3D EM 2. 2(a) 3D EM. (a) (a) Equivalent circuit model of bondwire (b) (b) Inductance of bondwire according to frequency 그림 1. 3D EM Fig. 1. Structure of bondwire for 3D EM simulation. (c) (c) Impedance variation by bondwire model 그림 2. Fig. 2. Simulation result of bondwire model. 402

3 E- RL k. shunt RC., RLC 2(b). 60 GHz 0.26 nh, 90 GHz 4.0 nh. 3D EM 2(c). 50 Ω RF signal 100 Ω. 50 Ω. 4(b).., 83.1 Ω, λ/6.. 4(b). 0.1 db, 0.7 db.. 정합회로설계및시뮬레이션 3, RF, 50 Ω. Keysight ADS(Advanced Design System) Momentum tool EM. 100 Ω 50 Ω E- 75 GHz 70.7 Ω, λ/ Ω λ/4,. 4(a) 70.7 Ω λ/4 (a) (a) Reflection coefficient by matching network (b) (b) Transmission coefficient by matching network 그림 3. Fig. 3. Designed matching network. 그림 4. Fig. 4. Simulation result of the designed matching network. 403

4 THE JOURNAL OF KOREAN INSTITUTE OF ELECTROMAGNETIC ENGINEERING AND SCIENCE. vol. 29, no. 6, Jun ±0.25 db ±0.12 db.. 제작및검증 Taconic ( ) 2.2, 5 mil TLY UMS 71 GHz 86 GHz GaAs MMIC(Gallium Arsenide Monolithic Microwave IC) LNA CHA F, - [12]. 6 RF. LNA PCB V, GHz WR-12, (a) S-parameter. 86 GHz 4.5 db, GHz,. P 1dB 7(b) db( 1.2 db), P 1dB 4.2 db( 1 db). ±1.91 db ±0.84 db ±1.07 db. 그림 5. Fig. 5. Photograph of implemented matching network. (a) (a) Photograph of implemented waveguide module (b) LNA (b) Photograph of matching network compensating LNA bondwire 그림 6. Fig. 6. System for matching network verification. 1.. 결론 E- 3D EM, 표 1. Table 1. Summary of matching network performance. Improvement points Average improvement Maximum improvement Transmission coefficient [db] Gain [db] P 1dB [dbm] Gain flatness [db] ±

5 E- References (a) (a) Transmission coefficient and reflection coefficient (b) P 1dB (b) Gain and P 1dB 그림 7. Fig. 7. Measured performances.. LNA WR Ω, λ/ Ω 50 Ω. 86 GHz 4.5 db, 3.12 db( 1.2 db), P 1dB 2.2 db( 1 db), ±1.07 db. [1] B. Dehlink, H. D. Wohlmuth, H. P. Forstner, H. Knapp, S. Trotta, and K. Aufinger, et al., "A highly linear SiGe double-balanced mixer for 77 GHz automotive radar applications," in IEEE Radio Frequency Integrated Circuits (RFIC) Symposium, San Francisco, CA, 2006, p. 4. [2] I. Kallfass, G. Eren, R. Weber, S. Wagner, D. Schwantuschke, and R. Quay, et al., "High linearity active GaN- HEMT down-converter MMIC for E-band radar applications," in th European Microwave Integrated Circuit Conference, Rome, Oct. 2014, pp [3] J. Hasch, E. Topak, R. Schnabel, T. Zwick, R. Weigel, and C. Waldschmidt, "Millimeter-wave technology for automotive radar sensors in the 77 GHz frequency band," in th European Microwave Integrated Circuit Conference, Rome, Mar. 2012, pp [4] U. Pfeiffer, D. Goren, "A 23-dBm 60-GHz distributed active transformer in a silicon process technology," IEEE Transactions on Microwave Theory and Techniques, vol. 55, no. 5, pp , May [5] D. Zhao, S. Kulkarni, and P. Reynaert, "A 60-GHz outphasing transmitter in 40-nm CMOS," IEEE Journal of Solid-State Circuits, vol. 47, no. 12, pp , Dec [6] Y. Zhang, D. Zhao, and P. Reynaert, "A flip-chip packaging design with waveguide output on single-layer alumina board for E-band applications," IEEE Transactions on Microwave Theory and Techniques, vol. 64, no. 4, pp , Mar [7] A. Sutono, N. G. Cafaro, J. Laskar, and M. M. Tentzeris, "Experimental modeling, repeatability investigation and optimization of microwave bond wire interconnects," IEEE Transactions on Advanced Packaging, vol. 24, no. 4, pp , Nov [8] F. Alimenti, P. Mezzanotte, L. Roelli, and R. Sorrentino, "An equivalent circuit for the double bonding wire interconnection," in 1999 IEEE MTT-S International Microwave Symposium Digest(Cat. No.99CH36282), Anaheim, 405

6 THE JOURNAL OF KOREAN INSTITUTE OF ELECTROMAGNETIC ENGINEERING AND SCIENCE. vol. 29, no. 6, Jun CA, USA, Aug. 1999, vol. 2, pp [9] B. LaMeres, S. P. Khatri, "Broadband impedance matching for inductive interconnect in VLSI packages," in 2005 International Conference on Computer Design, Oct. 2005, pp [10] B. B. Adela, P. van Zeijl, and A. B. Smolders, "Bondwire impedance compensation using a series transmission line section," in th European Conference on Antennas and Propagation(EuCAP), Davos, Apr. 2016, pp [11] S. K. Yun, H. Y. Lee, "Parasitic impedance analysis of double bonding wires for high-frequency integrated circuit packaging," IEEE Microwave and Guided Wave Letters, vol. 5, no. 9, pp , Sep [12],,,,, "E- E- -,", : ( ) : [ 주관심분야 ] RF Power Amplifier Design, Automotive Radar Transceiver Design, Passive Circuit : ( ) : ( ) : ( ) : : [ 주관심분야 ] Microwave, RF Power Amplifier, Radar Sensor : ( ) : [ 주관심분야 ] High-Efficiency RF Power Amplifier, Broadband and Linearization Techniques : ( ) : [ 주관심분야 ] High-Efficiency RF Power Amplifier, Broadband Power Amplifier and Passive Circuit : ( ) : ( ) : : Skyworks Solutions Inc., Senior Electronic Engineer : [ 주관심분야 ], /, 406