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1 Jurnal f the Krean Ceramic Sciety Vl. 44, N. 2, pp. 116~123, Effects f Sintering Cnditins n the Electrical Cnductivity f 1wt% Y 2 O 3 -Dped AlN Ceramics Wn-Jin Lee,*, ** Sung-Min Lee,* Kwang-B Shim,** and Hyung-Tae Kim* *Krea Institute f Ceramic Engineering and Technlgy, Seul , Krea **Department f Materials Science and Engineering, Hanyang University, Seul , Krea (Received December 4, 2006; Accepted January 11, 2007) 1wt% Y 2 O 3 ƒ AlN» *, **Á * Á Ÿ **Á½xk* * ( )»» q **w w œw ( ; ) ABSTRACT Electrical prperties f AlN ceramics sintered with 1 wt% Y 2 O 3 have been investigated. Frm the impedance spectrscpy, electrical cnductivity f grain bundary was fund t be much lwer than that f grain. DC cnductivity measurement shwed the electrde plarizatin effects caused by blcking electrde. The heat-treatment at 1700 C f the specimen sintered at 1850 C transfrmed cntinuus grain bundary phases alng triple bundary junctins int islated particles in grain crners. The heat-treatment induced decreases bth in grain and grain bundary cnductivity, and in DC electrical cnductivities. Frm the analysis n the transference number, inic cnductivity was shwn t be mre dminant than electrn cnductivity, which was due t in cmpensatin mechanism during xygen incrpratin int grain. Key wrds : AlN, Electrstatic chuck (ESC), DC cnductivity, Impedance spectrscpy, Inic cnductivity 1. ƒ 320 W/m K y (aluminum nitride) œ r ³ w s v w š. p w AlN»qt» g r ñ»» p w w.» w r š j» j i ) i r š w ƒ wš V š ƒw w» w r š w w. 3,6,7) w - x 10 9 ~10 13 Ω cm w wš V ƒw. w ƒ t wš w r» w r š w w.» - x f w ƒ y Crrespnding authr : Sung-Min Lee smlee@kicet.re.kr Tel : Fax : œ» š» w š. 1-5) ù y œ w ƒ w w. AlN carbthermal AlN 9-11) w. Carbthermal œ AlN 1wt% z ƒ sw. Y 2 O 3 w AlN Al 2 O 3 Y 2 O 3 ƒ w YAG Yttrium-Aluminate x wš, ù 0.5 wt% mw AlN ü š š. 12) 3AlN X Al 2 O 3 2Al Al + 3O N + V Al ey AlN» e w w w ) z d w ù galvanic cell mw AlN» w š 13,15) ƒ ƒ w v Ÿ» Al œ (vacancy) w (1) 116
2 1wt% Y 2 O 3 ƒ AlN» ) ù» y w ƒƒ w w p m» blcking z w ¾ ƒ w w. AlN Y 2 O 3 1wt% ƒw w» y wš y ü» v Ÿ w wš w. w DC w AlN»» w. w k AlN»» ƒ AlN» e w w š wš w. 2. x AlN (Grade F, Tkuyama Sda C. Ltd., Japan) w 0.8 wt%, s³ 1.3 µm. Y 2 O 3 (Grade C, H.C. Starck, Germany) w. Y 2 O 3 1wt% ƒw AlN g š 20 yw, w w. yw p w e j w š z 80 C 20 k z ù w w 40 mesh ƒ w yw w. ƒ e 40 mm wš» ƒ w C y 1850 C ¾ k z 3 20 MPa ƒ w z ¾ þw. w 1850 C w r óù z ƒ w 1700 C 5 wš ¾ þw r w. r w» w š X- diffractmeter(d/max-2500/pc, Rigaku, Japan) 40 kv, 200 ma 1.2 /min e 10~80 ¾ z ql d w. 2 s yw x y w» w FE-SEM(JSM-7600F, Jel, Japan) BSE (Back-scattered electrn) w. 2 x w w» w 200 kev n x (STEM; Tecnai TM F20, FEI Cmpany, U.S.A.) w. WDS(wavelength dispersive X-ray spectrscpy) EPMA(Electrn Prbe Micr Analyzer, JXA-8200, Jel, Japan) w ü w w. 1 µm j» spt w üš, z ƒ 3 3 wš s³ t Fig. 1. Guarded electrde methd. r w. Ÿ (laser flash methd) (25 C) d w. š» w r t e sw. d wš w xr ƒ¾ š w» r t t w» w guarded electrde w DC, AC» p d w (Fig. 1). d w AlN Ì 0.5 mm ƒœwš r p(dhc-8083(t)-2, Daej) r sw z» 850 C, 20 w x w. 10 V/mm w 150~400 C DC w ƒ 1000 d w. v v»(si 1260, slatrnanalytical, UK) w d w. 10 MHz-10 Hz¾ OSC level 0.1 V, 10 Hz-1 mhz¾ OSC level 1 V, 25~300 C 10 mhz-10 MHz, 300~400 C 1 mhz~10 MHz q d w. ü w w Zview(Versin 2.9c, Scribner Assciates, Inc.)v curve fittingw w. 3. š Y 2 O 3 1wt% ƒwš 1700 C 3 w r, 1850 C 3 w r, š 1850 C 3 z 1700 C w r Fig. 2 ùkü. r AlN YAG(Y 3 Al 5 O 12 ) α-al 2 O 3 swwš š r 2 intensity w. w AlN carbthermal 0.8 wt% w wš, ƒ xide xk š ƒ w 1wt% Y 2 O 3 ƒ Al 2 O 3 Y 2 O 3 w š. ƒ 1760 C w š k w š». ù þƒ Fig. 3 k YAG α-al 2 O 3 44«2y(2007)
3 이원진 이성민 심광보 김형태 118 Fig. 2. X-ray diffractin patterns f the specimens sintered at (a) 1700 C, (b) 1850 C, and (c) 1850 C and then heat treated at 1700 C. Fig. 3. Phase diagram f Y O -Al O binary system. 22) 의 석출을 예상할 수 있다. 소결조건의 차이에 따라 AlN 입자크기 뿐만 아니라 이 차상의 형태도 매우 다르게 나타났다. Fig. 4(a)는 1700C 에서 3시간 소결한 시편의 미세구조를 보여주고 있다. 입 계가 뚜렷하게 형성되어 있고 결정립끼리는 직접접촉을 하고 있는 것으로 보인다. YAG상의 분포를 BSE 이미지 로 관찰한 결과 2차상은 입자 사이의 코너에 고립된 형 태로위치하고 있었다 C에서 3시간 소결한 시편은 1700 C에서 소결한 시편에 비해서 입자 크기가 크게 증 가한 것을 볼 수 있었고 삼중점(triple junctin)을 따라 연 속적인 2차상의 모습을 관찰할 수 있었다(Fig. 4(b)). 이는 액상소결 과정 중에 삼중점을 따라 형성된 액상이 빠른 한국세라믹학회지 Fig. 4. SEM micrgraphs (backscattered electrn images) f the specimens sintered at (a) 1700 C, (b) 1850 C, and (c) 1850 C and then heat treated at 1700 C. 냉각 과정 중에 그대로 유지된 것으로 판단된다. Fig. 4(c) 는 1850 C에서 소결하고 1700 C에서 5시간 동안 열처리 한 시편의 미세구조를 보여주고 있다 C에서 소결한 시편과 비슷한 입자크기를 가지고 있었지만 1700 C에서 소결한 시편과 유사하게 입자 코너에서 불연속적인 2차 상 입자를 형성하고 있었다. 즉, 1700C에서 3시간 소결한 시편과 1850C에서 소결하고 1700C에서 5시간 열처리한 시편은 입자 형상은 유사하지만 입자 크기가 다르고, 1850 C 에서 소결한 시편과 1850 C에서 소결하고 1700 C에서 5
4 1 wt% Y O 2 3 첨가계 AlN 세라믹스의 소결 조건에 따른 전기전도도 Fig Vlume resistivity f the specimens sintered at (a) 1700 C, (b) 1850 C, and (c) 1850 C and then heat treated at 1700 C. Fig. 5. TEM images shwing grain bundary phases in the the specimens sintered at (a) 1700 C, (b) 1850 C, and (c) 1850 C and then heat treated at 1700 C. 시간 열처리한 시편은 입자 크기는 유사하지만 입자형상 이 다르게 나타났다. 2차상의 형상을 투과전자현미경으로 관찰한 결과(Fig. 5) 1700C에서 소결한 시편과 1850C에서 소결하고 1700C 에서 열처리한 시편은 2차상이 볼록(cnvex)한 형태를 유 지하고 있다(Fig. 5(a),(c)) C에서 소결한 시편의 경 우 2차상이 삼중점을 따라 존재하지만 Fig. 5(b)에서 보이 듯이 이면각이 0 보다 커서 입계면으로 액상의 침투는 일어나지 않은 것으로 판단되었다. 10 V/mm 전계하에서 각각 시편의 직류 저항을 1000 sec 동안 측정하였다(Fig. 6). 체적저항은 시간에 따라 급격히 증가하다가 일정 시간이 흐른 뒤에 포화되었다. 이는 전 하 운반자(charge carrier)가 전극에서 blcking되어 전류 흐름이 점차로 차단되는 전극에 의한 분극효과로 판단된 다. 본 연구에서는 은 전극을 사용하였으므로 전자의 흐 름은 전극과 시편의 계면에서 방해 받지 않는데 비하여 이16) 온의 흐름은 전극에 의해서 제한될 수 있다. Jang과 Chi 의 연구처럼 AlN의 주요 전하 운반자가 Al 자리의 공극 (vacancy)인 이온결함인 경우 나타날 것으로 예상되는 결 과이다. 따라서 직류 저항측정의 초기에는 이온과 전자 이동이 전체 전류 흐름에 기여하나 이온의 흐름이 점차 로 전극에 의하여 제한되다가 최종적으로 전자에 의한 이 동만이 전류 흐름에 기여하는 것으로 볼 수 있다. 다만 이것은 전극에서 석출물의 생성과 소멸처럼 이온의 surce 와 sink가 없다는 가정을 전제로 한 것이다. Fig. 6의 결 과가 비교적 저온인 150 C에서 측정된 것을 감안하면 이 러한 가정이 비교적 잘 적용되리라 판단된다. 시간에 따 른 전류의 흐름의 변화를 보면 1700 C 소결한 시편과 1850C 소결하고 1700C에서 열처리한 시편의 경우 비슷 한 형태를 보이지만 1850C에서 3시간 소결한 시편은 비 교적 짧은 시간안에 전류의 흐름이 포화되는 것을 알 수 있다. 이는 전하운반자의 농도 및 이동도가 소결 및 열처 리 조건에 따라 크게 달라짐을 의미한다. 측정주파수 f에 따른 커패시턴스 Cp와 그에 따른 유전 율 ε을 저항과 커패시터의 병렬연결을 가정하고 복소 임 피던스(Zreal, Zimag.)로부터 다음의 식을 사용하여 계산하였다. Z imag. Cp = Z 2 )2πf( Zreal imag. Fig. 7에 (2) 보이듯이 유전율은 크게 주파수 범위에 따라 제 44 권 제 2호(2007)
5 120 Á Á Ÿ Á½xk Fig. 7. Dielectric cnstants as a functin f frequency measured at 150 C. 3ƒ. 1 MHz z m AlN 9 z. ù 1850 C w r 10 4 Hz z , 10 2 Hz w w xrü ƒ» ƒ w w. š q» w q 10 4 Hz, 10 2 Hz w w z w. w k v Ÿ ü w w wš w. Fig. 8(a) 150 C d w 1850 C r v rp y š. ü w w w 1rder j ùkùš w ü w w 1rder ƒw š C w r ü w 1850 C r 10 4 ùkûš d w w w (Fig. 8(b)). w w» t wš y y w (Fig. 9) C w r» y y 0.87 ev š, 1850 C w r 1850 C wš w r y y ƒ ƒƒ 0.60 ev 0.61 ev w ƒ š. y y ƒ ü»» ƒ w w. d ù w 1700 C w r w 1850 C w r y y ƒ 0.71 ev š 1850 C wš w r 0.76 ev. y y ƒ w r Fig. 8. Cmplex impedance spectrum measured at 150 C f the specimens sintered at (a) 1850 C and 1850 C and then heat treated at 1700 C and at (b) 1700 C. p ù». AlN ü w ƒ. 12,17-21) š (1) Al vacancy x wš w w x phnn scattering site w û. 12) Al vacancy w w» w. Table 1 EPMA w AlN ü w d w š. ƒ AlN ü w ûš ƒ w. š y ù ü sw ƒ Y 2 O 3»» q. w 1700 C w wz
6 1wt% Y 2 O 3 ƒ AlN» 121 Fig. 9. Variatins f (a) grain and (b) grain bundary cnductivities with temperatures. Table 1. Oxygen Cncentratin in Grains and Thermal Cnductivity Sample name 1700 C 1850 C 1850 C- H.T C Oxygen cncentratin (wt%) Standard deviatin (%) Thermal cnductivity (W/m K) w j w ùkû. 2 xk w» 2 j w» q. Fig. 10(a) 10 V/mm w 1000 sec z» ùküš y y w C r 1850 C wš 1700 C w r 1000 sec ü» ƒ w w w. 300 C Fig. 10. Variatins f (a) DC cnductivity f specimens and (b) calculated transference numbers with temperatures. š l r 1700 C r 1850 C wš 1700 C w r w» y y š. w 1850 C r 1850 C z 1700 C w r y œ w transference number DC w w l w Fig. 10(b)., y œ w û. v Ÿ w DC d w ww 1wt% Y 2 O 3 ƒ ƒ AlN w» ƒ ù blcking w z ƒ w ùkû. w ƒ ùš blcking z ƒ ùkù š q d w j ì y œ ƒ» w DC w w w j w. ƒ û r š w r 44«2y(2007)
7 122 Á Á Ÿ Á½xk w j û ù š r w w r w w. w AlN w ƒ intrinsicw dnr w extrinsicw j w w. AlN ü w (1) inic cmpensatin (3) electrnic cmpensatin» w ƒ w. 1 Al 2 O 3 --O 2 + 2Al Al + 2O N +2e 2 Fig. 10 AlN inic cmpensatin» ƒ electrnic cmpensatin» w inic cmpensatin electrnic cmpensatin w š w. ùkù y w m w ù ƒ û inic cmpensatin w ù w. ƒ AlN w» blcking z š w w. m fq l w ƒ ƒ z. 3,4) ù ƒ ƒ w z š w ƒz ƒ š ) ƒw r š (chucking) y w š w (dechucking) kinetics ü y kinetics». p - z w z mw» y ww q. 4. v Ÿ AlN w w j w w ùkû C w r 2 ƒ š š r w 2 š ë 1700 C w r w ƒ y w C w r z w r ƒ w. (3) ƒ» w š DC» w j w C w r 1700 C w ü w j w w DC j û 1700 C r w. ƒ ƒ k š w transference number w AlN w ƒ w» j y w. w l AlN w w r š w w w. REFERENCES 1. R. Atkinsn, A Simple Thery f the Jhnsen-Rahbek Effect, Brit. J. Appl. Phys., 2 [2] (1969). 2. T. Watnabe, T. Kitabayashi, and C. Nakayama, Electrstatic Frce and Absrptin Current f Alumina Electrstatic Chuck, Jpn. J. Appl. Phys., (1992). 3. T. Watnabe, T. Kitabayashi, and C. Nakayama, Relatinship Between Electrical Resistivity and Electrstatic Frce f Alumina Electrstatic Chuck, Jpn. J. Appl. Phys., (1993). 4. J. van Elp, P. T. M. Giesen, and A. M. M. de Grf, Lwthermal Expansin Electrstatic Chuck Materials and Clamp Mechanisms in Vacuun and Air, Micrelectrnic Eng., (2004). 5. G. Kalkwski, S. Risse, G. Harnisch, and V. Guyent, Electrstatic Chucks fr Lithgraphy Applicatins, Micrelectrnic Eng., (2001). 6. J. C. Bang, Fabricatin f Brsilicate Glass-Cated Electrstatic Chucks(in Krean), J. Micrelectrnics & Packaging Sc., 9 [1] (2002). 7. G. Kalkwski, S. Risse, and V. Guyent, Electrstatic Chuck Behavir at Ambient Cnditins, Micrelectrnic Eng., (2002). 8. G. Kalkwski, S. Risse, S. Müller, and G. Harnisch, Electrstatic Chucks fr EUV Masks, Micrelectrnic Eng., (2006). 9. C. M. Whang, W. J. Jeng, and S. W. Chi, Synthesis f Aluminum Nitride Pwder frm Aluminum Hydrxide by Carbthermal Reductin-Nitridatin(in Krean), J. Kr. Ceram. Sc., 31 [8] (1994). 10. W. S. Jung, Synthesis f Aluminum Nitride Pwders and Whiskers frm a (NH 4 )[Al(edta)] 2H 2 O Cmplex under a Flw f Nitrgen(in Krean), J. Kr. Ceram. Sc., 39 [3] (2002). 11. S. K. Yang and J. B. Kang, Synthesis f Aluminum Nitride Whisker by Carbthermal Reactin I. Effect f Fluride Additin(in Krean), J. Kr. Ceram. Sc., 41 [2] (2004). 12. G. A. Slack, Nnmetallic Crystals with High Thermal Cnductivity, J. Phy. Chem. Slids, (1973). w wz
8 1wt% Y 2 O 3 ƒ AlN» R. W. Francis and W. L. Wrrell, High Temperature Electrical Cnductivity f Aluminum Nitride, J. Electrchem. Sc., 123 [3] (1976). 14. M. Yahagi and K. S. Gt, Inic Cnductivity f AlN Cntaining Y 2 O 3 r Al 2 O 3 at K, J. Jpn. Inst. Metal, 47 [5] (1983). 15. M. Zulfequar and A. Kumar, Electrical Cnductivity and Dielectric Behavir f Ht-Pressed AlN, Adv. Ceram. Mat., 3 [4] (1988). 16. S. A. Jang and G. M. Chi, Electrical Cnductin in Aluminum Nitride, J. Am. Ceram. Sc., 76 [4] (1993). 17. K. Kmeya, Effect f Varius Additives n Sintering f AlN, Ygy-Kykai-Shi, 89 [6] (1981). 18. L. Weisenbach, J. A. S. Ikeda, and Y. M. Chiang, Distributin f Oxygen and Sintering Aids in AlN with High Thermal Cnductivity, Advances in Ceramics, (1987). 19. T. Takahashi, N. Iwase, A. Tsuga, and M. Nagata, Prperties and Reliability f AlN Ceramics fr Pwer Devices, Advanced in Ceramics, 26 [159] (1987). 20. W.-J. Kim, D. K. Kim, and C. H. Kim, Mrphlgical Effect f Secnd Phase n the Thermal Cnductivity f AlN Ceramics, J. Am. Ceram. Sc., 79 [3] (1996). 21. H. Nakan, K. Watari, H. Hayashi, and K. Urabe, Micrstructural Characterizatin f High-Thermal-Cnductivity Aluminum Nitride Ceramic, J. Am. Ceram. Sc., 85 [12] (2002). 22. J. Jamnik and J. Maier, Treatment f the Impedance f Mixed Cnductrs Equivalent Circuit Mdel and Explicit Apprximate Slutins, J. Electrchem. Sc., 146 [11] (1999). 23. J. Jamnik and J. Maier, Generalised Equivalent Circuits fr Mass and Charge Transprt: Chemical Capacitance and Its Implicatins, Phy. Chem. Chem. Phys., (2001). 24. W. Lai and S. M. Haile, Impedance Spectrscpy as a Tl fr Chemical and Electrchemical Analysis f Mixed Cnductr: A Case Study f Ceria, J. Am. Ceram. Sc., 88 [11] (2005). 25. Phase Diagrams fr Ceramists, Fig «2y(2007)
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